CN106019646A - Substrate assembling apparatus and substrate assembling method using the same - Google Patents

Abstract

The invention relates to a substrate assembling device and a substrate assembling method using the device, which can eliminate the lamination error caused by the size error of the upper substrate and the lower substrate, so that the upper substrate and the lower substrate can be laminated with high precision. The substrate assembly device has: a lower platform (4), which keeps the lower substrate (K2); an upper platform (3), which has a plurality of split driving parts (31); a plurality of bonding pins (8), which can be connected with the bonding pin flat plate ( 8a) Displace in the vertical direction together to keep the upper substrate (K1); the up and down action mechanism (80) makes the bonding pin plate (8a) move vertically; and the actuator (32) makes the division driving part (31) displace , in the state where the bonding pin flat plate (8a) and the split driving part (31) have been displaced with the same displacement, the upper substrate ( K1 ) held on the bonding pin ( 8 ) is attached to the lower platform ( 4) The lower substrate (K2) further presses the upper substrate (K1) and the lower substrate (K2) by the divided drive unit (31) in a displaced state.

Description

Substrate mounting device and substrate mounting method using the same

technical field

The present invention relates to a substrate mounting device and a substrate mounting method using the substrate mounting device.

Background technique

In Patent Document 1, it is described that "In the present invention, the driving part for connecting and detaching and the driving part for attaching and detaching are controlled by the control part, and one of the first holding member or the bonding pin or The two sides move relatively close to the second holding member, so that the first workpiece and the second workpiece are bonded. , the adhesive pin is moved in a direction away from the first workpiece, so that the peripheral portion of the part of the first workpiece that is adhered and held by the adhesive pin contacts with the rigid abutment surface along with the peeling of the adhesive pin. The shape is held by contacting the rigid abutment surface. Therefore, when the first workpiece is pressurized by the first holding member and when the adhesive pin is peeled off from the first workpiece, the deformation of the first workpiece can be suppressed to a minimum” ( See paragraph 0007).

Patent Document 1: Japanese Patent No. 5654155

Contents of the invention

The workpiece laminating device (substrate mounting device) described in Patent Document 1 is configured to suppress detachment of the bonding equipment for laminating the first workpiece (upper substrate) and the second workpiece (lower substrate) from the first holding member (upper stage). Deformation of the first workpiece at time.

However, in order to bond the first workpiece and the second workpiece with high precision, it is necessary to align the first workpiece and the second workpiece before bonding.

In Patent Document 1, it is described that "it is preferable to place one of the first holding member 1 or the second holding member 2 in the XYθ direction relative to the other immediately before the first workpiece W1 and the second workpiece W2 are bonded together. Adjustment movement is performed to perform alignment (alignment) of the first workpiece W1 and the second workpiece W2" (see paragraph 0020), but a specific alignment method is not described.

In addition, in the adjustment movement in the XYθ direction, the positional deviation between the first workpiece and the second workpiece can be adjusted, but the lamination error (pitch deviation) caused by the dimensional error generated during production or the like cannot be eliminated.

An object of the present invention is to provide a substrate mounting device and a substrate mounting method using the device that can eliminate bonding errors caused by dimensional errors between the upper substrate and the lower substrate and bond the upper substrate and the lower substrate with high precision.

In order to solve the above-mentioned problems, the present invention provides a substrate mounting device and a substrate mounting method using the same. The substrate mounting device has: a lower platform having a lower substrate surface for holding a lower substrate; A plurality of divided driving parts of the divided flat parts facing the lower substrate surface; a plurality of bonding pins are arranged corresponding to the divided flat parts, and can be displaced in a direction perpendicular to the corresponding divided flat parts. Keeping the upper substrate; a vacuum chamber capable of accommodating the lower platform, the upper platform, and the bonding pins in a vacuum environment; a first driving mechanism, making the bonding pins and the upper platform face the lower platform Travel; a plurality of base parts, install more than one of the bonding pins; the second driving mechanism makes a plurality of the base parts independently vertically move relative to the split plane part; a third driving mechanism makes a plurality of The divided driving part is independently displaced toward the lower substrate surface; the first suction unit is connected to the vacuum suction hole dug in the bonding pin; and the second suction unit is connected to the vacuum suction hole formed on the lower substrate surface. The suction holes are connected, and the adhesive pins are displaced together with the base part by a displacement amount set for each of the base parts to hold the upper substrate. The amount of displacement corresponding to the amount of displacement is displaced. The base part is equipped with the bonding pin corresponding to the split plane part of the split drive part. Under the vacuum environment in the vacuum chamber, the The lower platform holds the lower substrate, and the first drive mechanism drives the upper substrate held by the adhesive pins to attach to the lower substrate, and the lower substrate and the upper substrate are attached. At the time point when it is closed, the second driving mechanism is driven to draw the bonding pin from the split plane portion, and the first driving mechanism is driven to pass through the displaced state. The division drive unit presses the upper substrate and the lower substrate.

According to the present invention, it is possible to provide a board mounting device and a board mounting method using the device that can eliminate bonding errors due to dimensional errors of the upper board and the lower board and attach the upper board and the lower board with high precision. Accordingly, it is possible to effectively correct the deviation of the mark pitch due to the dimensional error between the upper substrate and the lower substrate, and perform bonding.

Description of drawings

FIG. 1 is a diagram showing a substrate mounting device.

Fig. 2 is a diagram showing a support pin.

Fig. 3 is a diagram showing the configuration of the upper platform.

FIG. 4 is a diagram showing the upper substrate surface of the upper platform.

FIG. 5 is a diagram illustrating an adhesive pin.

FIG. 6 is a diagram showing the upper substrate surface of the upper stage, and is a diagram showing an example of an arrangement of bonding pins.

Fig. 7(a) is a diagram showing the lower platform, and Fig. 7(b) is a cross-sectional view under Sec1-Sec1.

FIG. 8 is a diagram illustrating a step of bonding substrates by a substrate mounting device.

9 is a diagram showing marks for adjusting the bonding position of the upper substrate and the lower substrate, (a) is a diagram showing an upper mark attached to the upper substrate, and (b) is a diagram showing a lower marking attached to the lower substrate. Logo illustration.

10 is a diagram showing a state of adjusting the offset between the upper mark on the upper substrate and the lower mark on the lower substrate, (a) is a diagram showing the offset in the XY axis direction, and (b) is a diagram showing the adjustment of the XY axis A diagram of the state of the offset in the direction.

Fig. 11 is a diagram showing the state of adjusting the deviation of the upper mark of the upper substrate and the lower mark of the lower substrate, (a) is a diagram showing the deviation around the Z axis, (b) is a diagram showing the adjustment around the Z axis A diagram of the state of the axis offset.

12 is a diagram showing a state where the deviation between the first upper mark and the first lower mark is within a predetermined range, (a) is a diagram showing a state where the first upper mark is at the center of the first lower mark, (b ) is a diagram showing a state where the first upper mark is shifted from the center of the first lower mark.

Fig. 13 is a diagram showing a state in which the offset between the upper substrate and the lower substrate is reduced by changing the amount of displacement of the bonding pin plate, and (a) is a diagram showing a state in which the first upper mark and the first lower mark are shifted , (b) is a diagram showing a state in which the deviation between the first upper mark and the first lower mark is reduced (a state in which the mark pitch deviation between the upper substrate and the lower substrate is corrected).

FIG. 14( a ) is a diagram showing a state where the split drive unit is displaced according to the shape of the upper substrate, and FIG. 14( b ) is a diagram showing a state where the upper stage presses the upper and lower substrates.

Fig. 15 is a diagram showing a design modification example, (a) is a diagram showing a state in which the displacement amount of the bonding pin attached to one bonding pin plate is different, and (b) is a diagram showing the corresponding A diagram of the structure of a bonded pin.

Fig. 16 is a diagram showing another example of design modification, (a) is a diagram showing a state where four divided driving parts correspond to one bonding pin plate, (b) shows a state where one divided driving part corresponds to three A diagram of the state of a slab of adhesive pins.

Fig. 17 is a diagram showing another design modification example, (a) is a diagram showing a design modification example in which all adhesive pins are mounted on one adhesive pin flat plate, (b) is a diagram showing an upper platform with an integrated structure. A diagram of a design modification example of .

Symbol Description

1: substrate assembly device; 3: upper platform; 3a: upper substrate surface; 4: lower platform; 4a: lower substrate surface; 5: vacuum chamber; 5a: upper chamber; 5b: lower chamber; 8: bonding pin; 8a : Adhesive pin plate (base part); 8b: Adhesive part; 8c: Vacuum suction hole; 8d: Gas supply unit; 10: Camera device; 20: Z-axis drive mechanism (first drive mechanism); 31: Split drive Part; 31a: split plane part; 32: actuator (third drive mechanism); 41: moving mechanism; 43: suction hole; 80: up and down action mechanism (second drive mechanism); 100: control device; K1: up Base plate; K2: lower base plate; Mk1: first upper mark (upper mark); Mk2: first lower mark (lower mark); P2: vacuum pump (first suction unit); P3: vacuum pump (second suction unit).

detailed description

Hereinafter, a substrate mounting apparatus and a substrate mounting method according to an embodiment of the present invention will be described in detail with reference to the drawings as appropriate. In addition, in each drawing shown below, the same code|symbol is attached|subjected to a common member, and overlapping description is abbreviate|omitted suitably.

【Example】

FIG. 1 is a diagram showing a substrate mounting device.

The substrate mounter 1 is a device for assembling substrates such as liquid crystal panels by bonding the upper substrate K1 (glass substrate) and the lower substrate K2 (glass substrate) carried in by a conveyance device 200 such as a robot in vacuum. The substrate mounting apparatus 1 is controlled by a control device 100 .

The substrate mounting apparatus 1 includes a stage 1 a and an upper frame 2 . The stand 1a is placed on an installation surface (the ground or the like). The upper frame 2 is provided above the stand 1a so as to be movable up and down.

The upper frame 2 is attached to the first drive mechanism (Z-axis drive mechanism 20 ) attached to the stand 1 a via a load cell 20 d.

The substrate mounting apparatus 1 includes an upper stage 3 and a lower stage 4 . The lower stage 4 is attached to the stage 1a via a moving means (XYθ moving means 40). The XYθ moving member 40 is configured to be independently movable in directions of two axes (X axis, Y axis) perpendicular to each other with respect to the stage 1a. In addition, the XYθ moving member 40 is configured to be rotatable around the Z axis with respect to the stage 1a. As the XYθ moving member 40 , a member using a ball bearing or the like fixed in the Z-axis direction and freely movable in the XY-axis direction can be used.

In addition, in the substrate mounting apparatus 1 of the present embodiment, the direction of the upper frame 2 with respect to the stage 1a is defined as the Z-axis direction (vertical direction). In addition, the direction of one axis perpendicular to the Z axis is referred to as the X-axis direction (horizontal direction), and the direction of one axis perpendicular to the Z-axis and the X-axis is referred to as the Y-axis direction (vertical direction).

In addition, the upper platform 3 and the lower platform 4 are rectangular with the Y-axis direction and the X-axis direction as the vertical and horizontal directions. In addition, the plane of the upper stage 3 (upper substrate surface 3 a ) and the plane of the lower stage 4 (lower substrate surface 4 a ) face each other.

The upper frame 2 is attached to the stand 1 a via a Z-axis drive mechanism 20 . The Z-axis drive mechanism 20 has a ball screw mechanism 20b for vertically moving a ball screw shaft 20a extending in the Z-axis direction (vertical direction). The ball screw shaft 20a is rotated by the electric motor 20c, and moves up and down by the ball screw mechanism 20b.

The electric motor 20 c is controlled by the control device 100 , and the upper frame 2 is displaced (moves up and down) according to calculations of the control device 100 .

The upper platform 3 is fixed to the upper frame 2 via a plurality of upper shafts 2a, and the upper frame 2 and the upper platform 3 move up and down integrally. Around the upper platform 3, an upper chamber 5a is arranged. The upper chamber 5 a is disposed so as to be open at the lower side (the side of the stand 1 a ) and cover the upper side and the side surfaces of the upper platform 3 .

The upper chamber 5 a is installed on the upper frame 2 via the suspension mechanism 6 . The suspension mechanism 6 has a support shaft 6 a extending downward from the upper frame 2 and a locking portion 6 b formed by expanding the lower end of the support shaft 6 a in a flange shape.

Moreover, the hook 6c is provided in the upper cavity 5a. The hook 6c freely moves up and down around the support shaft 6a. Moreover, the hook 6c is engaged with the locking part 6b at the lower end of the support shaft 6a.

The upper shaft 2a passes through the upper cavity 5 . The space between the upper shaft 2a and the upper chamber 5 is sealed by a vacuum seal (not shown).

When the upper frame 2 moves upward (moves upward), the hook 6c engages with the locking portion 6b of the support shaft 6a, and the upper chamber 5a moves upward together with the upper frame 2 . In addition, when the upper frame 2 moves downward (moves downward), the hook 6c moves downward by its own weight, and the upper chamber 5a moves downward accordingly.

In addition, a lower chamber 5 b is arranged around the lower platform 4 . The lower chamber 5b is supported by a plurality of lower shafts 1b attached to the stand 1a. The lower shaft 1b protrudes into the lower cavity 5b. The space between the lower chamber 5b and the lower shaft 1b is sealed by a vacuum seal (not shown).

The lower chamber 5b is disposed so as to open upward (the side of the upper frame 2 ) and cover the lower side and side surfaces of the lower platform 4 .

The XYθ moving member 40 is mounted on the lower shaft 1b protruding into the lower chamber 5b to support the lower platform 4 .

With regard to the upper chamber 5 a and the lower chamber 5 b, the mutual opening portions are closed to form the vacuum chamber 5 . That is, the upper chamber 5a moved downward is engaged with the lower chamber 5b from above, and the opening of the lower chamber 5b is closed by the upper chamber 5a. Moreover, the connection part of the upper chamber 5a and the lower chamber 5b is sealed by the sealing part (not shown), and the airtightness of the vacuum chamber 5 is ensured.

In addition, the upper frame 2 can move further downward than the state where the upper chamber 5a and the lower chamber 5b are in contact. Thus, from the state where the downward movement of the upper chamber 5a is restricted by the lower chamber 5b, the upper frame 2 moves downward, and the engagement between the locking portion 6b and the hook 6c in the suspension mechanism 6 is released. The upper chamber 5a is placed on the lower chamber 5b by its own weight. In addition, an upper stage 3 and a lower stage 4 are arranged inside the vacuum chamber 5 .

In the substrate mounting apparatus 1, a vacuum pump P0 is provided. The vacuum pump P0 is connected to the vacuum chamber 5 and exhausts the air in the vacuum chamber 5 to make the inside of the vacuum chamber 5 vacuum. That is, when the vacuum pump P0 is driven, the inside of the vacuum chamber 5 becomes a vacuum environment. The vacuum pump P0 is controlled by the control device 100 .

The upper platform 3 moves down together with the upper frame 2 which moves down inside the vacuum chamber 5 . By such downward movement of the upper table 3, the upper substrate K1 held on the upper table 3 and the lower substrate K2 held by the lower table 4 are bonded and pressed. If the inside of the vacuum chamber 5 is in a vacuum state, the upper substrate K1 and the lower substrate K2 are bonded together by vacuum.

In addition, as described above, the upper platform 3 is fixed to the upper frame 2 via the plurality of upper shafts 2a. Therefore, the load when the upper base plate K1 and the lower base plate K2 are pressed by the upper platen 3 is detected by the load cell 20d. The detection signal of the load cell 20d is input to the control device 100 .

Fig. 2 is a diagram showing a support pin.

As shown in FIG. 2 , the upper frame 2 is provided with a plurality of support pins 7 . The support pin 7 is a tubular member extending in the vertical direction, and is provided so as to be movable up and down independently of the upper table 3 . All support pins 7 are mounted on one support base 7a, and all support pins 7 move up and down simultaneously. The support base 7a is disposed between the upper chamber 5a and the upper platform 3 . The support base 7a moves up and down by a not-shown vertical movement mechanism (a ball screw mechanism, etc.). The up and down movement mechanism is controlled by the control device 100 .

The support pins 7 are arranged above the upper substrate surface 3 a of the upper platform 3 , and protrude downward from the upper substrate surface 3 a when moving downward relative to the upper platform 3 .

In addition, the support pin 7 has a hollow tubular shape in which the hollow portion 7a1 communicates with the hollow portion 7a1 of the support base 7a. A vacuum pump P1 is connected to the hollow portion 7a1 of the support base 7a. When the vacuum pump P1 is driven, the hollow portion 7a1 becomes vacuum, and the upper substrate K1 is vacuum-adsorbed to the support pin 7 . The vacuum pump P1 is controlled by the control device 100 . That is, according to the instruction of the control device 100 , the vacuum pump P1 is driven and the upper substrate K1 is vacuum-adsorbed to the support pin 7 .

Fig. 3 is a diagram showing the configuration of the upper platform. FIG. 4 is a diagram showing the upper substrate surface of the upper platform.

As shown in FIG. 3 , the upper platform 3 includes a back plate 30 and a split driving unit 31 .

The back plate 30 is attached to the upper shaft 2 a and moves up and down integrally with the upper frame 2 . The back plate 30 is a plate-shaped member arranged in parallel to the lower substrate surface 4 a (see FIG. 1 ) of the lower platform 4 . In addition, the back plate 30 faces the lower substrate surface 4a.

The division drive unit 31 divides the upper substrate surface 3a. In other words, the upper substrate surface 3a is formed by a planar portion (divided planar portion 31a) formed on the split drive unit 31 to face the lower substrate surface 4a (see FIG. 1 ) of the lower stage 4 . In addition, the divided drive unit 31 is arranged such that the divided flat portion 31 a is on the side of the lower substrate surface 4 a. As shown in FIG. 4, in this embodiment, the upper substrate surface 3a is divided into nine. That is, the upper table 3 is composed of nine divided drive units 31 . In addition, the upper substrate surface 3a is divided into nine divided flat parts 31a.

As shown in FIG. 3 , an actuator 32 (third drive mechanism) is attached to the back plate 30 . The actuator 32 displaces (moves up and down) the split drive unit 31 relative to the back plate 30 . The actuator 32 has a rod 32 a extending in a direction (vertical direction) perpendicular to the back plate 30 . The actuator 32 incorporates, for example, a motor (not shown), and displaces the rod 32 a in the axial direction (vertical direction) by a ball screw mechanism. The actuator 32 is controlled by a control device 100 (see FIG. 1 ).

The split drive unit 31 is attached to the rod 32 a of the actuator 32 .

For example, as shown in FIG. 4 , rods 32 a are attached to the four corners (or the vicinity of the four corners) of the rectangular divided drive unit 31 . In addition, a bearing (not shown) is interposed between the lever 32 a and the divided drive unit 31 , and the lever 32 a is rotatably attached to the divided drive unit 31 .

When the rod 32a is moved up and down by the actuator 32, the split drive unit 31 is displaced (moved up and down) in the vertical direction with respect to the back plate 30 according to the displacement of the rod 32a. Each split drive unit 31 can move up and down independently without interfering with each other.

In addition, since the back plate 30 faces the lower substrate surface 4a (see FIG. 1 ), the actuator 32 displaces (vertically moves) the divided drive unit 31 in the vertical direction relative to the lower substrate surface 4a. In other words, the actuator 32 displaces the divided driving portion 31 toward the lower substrate surface 4 a.

In this manner, the substrate mounting apparatus 1 of this embodiment has nine divided drive units 31 that can move up and down independently. In addition, the upper substrate surface 3 a formed by the divided flat portion 31 a of each divided drive unit 31 is deformable.

FIG. 5 is a diagram illustrating an adhesive pin.

As shown in FIG. 5 , the upper frame 2 is provided with a plurality of bonding pins 8 . The bonding pin 8 is a tubular member extending in the vertical direction, and is provided so as to be movable up and down independently of the upper table 3 and the support pin 7 . The up and down movement of the bonding pin 8 is a movement perpendicular to the upper substrate surface 3a.

The bonding pins 8 are arranged above the upper substrate surface 3 a, and protrude downward from the upper substrate surface 3 a when moving downward relative to the upper table 3 . In addition, the bonding pin 8 moves upward and is drawn in from the upper substrate surface 3a. In this embodiment, the state where the bonding pin 8 does not protrude from the upper substrate surface 3a (the split plane portion 31a shown in FIG. 3 ), that is, the state where the amount of protrusion of the bonding pin 8 is zero (or less) This is the state where the bonding pin 8 is pulled in from the upper substrate surface 3a. Then, the bonding pin 8 moves downward to protrude from the upper substrate surface 3a. In addition, the amount of protrusion of the bonding pin 8 represents the amount of protrusion of the bonding pin 8 from the upper substrate surface 3 a (dividing plane portion 31 a ) (the same applies hereinafter).

The bonding pins 8 are attached to a plurality of bonding pin flat plates 8a (base portions). One or more bonding pins 8 are attached to the bonding pin flat plate 8a. The bonding pin flat plates 8 a can move up and down independently of each other (movement perpendicular to the upper substrate surface 3 a ).

The adhesive pin 8 has an adhesive portion 8b at the tip.

In addition, the adhesive pin 8 has a hollow tubular shape, and a vacuum suction hole 8c is dug in the center. The vacuum suction hole 8c communicates with a negative pressure chamber 8a1 formed as a hollow portion of the bonding pin plate 8a. The first suction unit (vacuum pump P2) is connected to the negative pressure chamber 8a1 of the bonding pin plate 8a. Therefore, the first suction means (vacuum pump P2) is connected to the vacuum suction hole 8c of the bonding pin 8 via the negative pressure chamber 8a1.

When the vacuum pump P2 is driven and the vacuum suction hole 8c is in a vacuum state, the bonding pin 8 vacuum-suctions the upper substrate K1, and then attaches and holds the vacuum-suctioned upper substrate K1 to the bonding portion 8b (adhesive holding). The bonding pins 8 hold the upper substrate K1 in a state protruding from the upper substrate surface 3 a.

The vacuum pump P2 is controlled by the control device 100 . The upper substrate K1 is sucked to the bonding pins 8 by vacuum in accordance with an instruction from the control device 100, and bonded to the bonding portion 8b.

A gas supply unit 8d is connected to the negative pressure chamber 8a1 of the bonding pin plate 8a. The gas supply unit 8 d is controlled by the control device 100 . The gas supply unit 8d is driven in accordance with an instruction from the control device 100 to supply a predetermined gas (air, nitrogen, etc.) to the negative pressure chamber 8a1. The negative pressure chamber 8a1 and the vacuum suction holes 8c are pressurized by the gas supplied from the gas supply unit 8d, and the upper substrate K1 stuck on the bonding portion 8b is peeled off from the bonding portion 8b.

Each bonding pin flat plate 8a is provided with a second drive mechanism (up-and-down motion mechanism 80). The vertical motion mechanism 80 includes a ball screw shaft 81 that is rotatably supported by the mounting portion 80 a and extends in the Z-axis direction, an electric motor 83 that rotates the ball screw shaft 81 , and a motor that moves up and down by the rotating ball screw shaft 81 . Ball screw mechanism 82 . The mounting portion 80a is fixed to the upper frame 2 . The ball screw shaft 81 is rotated by the electric motor 83 to move the ball screw mechanism 82 up and down. In addition, the ball screw mechanism 82 is attached to the bonding pin plate 8a. The bonding pin plate 8 a moves up and down integrally with the ball screw mechanism 82 that moves up and down by the rotation of the ball screw shaft 81 .

The up and down movement mechanism 80 is controlled by the control device 100 , and according to the instruction of the control device 100 , the bonding pin plate 8 a and the bonding pin 8 move up and down.

The attachment part 80a is attached to the upper frame 2, and moves up and down integrally with the upper frame 2. As shown in FIG. In addition, as described above, the upper platform 3 moves up and down integrally with the upper frame 2 . The upper frame 2 moves up and down by the Z-axis driving mechanism 20 (see FIG. 1 ), and when the upper frame 2 moves downward, the upper platform 3 and the mounting portion 80a move toward the lower platform 4 (see FIG. 1 ). The vertical movement mechanism 80 is attached to the mounting part 80a, and the bonding pin plate 8a (bonding pin 8) moves up and down according to the vertical motion of the mounting part 80a. Therefore, the Z-axis driving mechanism 20 (first driving mechanism) has a function of advancing the bonding pin 8 and the upper table 3 toward the lower table 4 .

FIG. 6 is a diagram showing the upper substrate surface of the upper stage, and is a diagram showing an example of an arrangement of bonding pins.

As an example, as shown in FIG. 6 , in this embodiment in which 81 adhesive pins 8 are provided on the upper platform 3 , nine adhesive pins 8 are attached to one adhesive pin plate 8 a. In addition, the substrate mounting apparatus 1 (see FIG. 1 ) of this embodiment has nine bonding pin flat plates 8a.

In addition, in this embodiment, one bonding pin flat plate 8 a is arranged correspondingly to one divided drive unit 31 . For example, nine bonding pins 8 are arranged corresponding to the split plane portion 31 a of one split drive unit 31 . In addition, the nine bonding pins 8 arranged in one split driving portion 31 (split flat portion 31 a ) are attached to one bonding pin flat plate 8 a provided corresponding to the split driving portion 31 .

In addition, four vertical movement mechanisms 80 are provided on one bonding pin flat plate 8a. For example, vertical movement mechanisms 80 are provided at the four corners of a rectangular bonding pin plate 8a. The nine bonding pin plates 8a can be vertically moved independently of each other by the vertical movement mechanism 80. FIG.

The bonding pin flat plate 8 a is provided so as not to interfere with the divided drive unit 31 , and can independently move up and down with respect to the divided drive unit 31 . Thereby, the bonding pin 8 attached to one bonding pin flat plate 8a can be displaced in the vertical direction with respect to the corresponding divided flat part 31a.

Thus, the vertical movement mechanism 80 (second drive mechanism) of this embodiment is configured to independently vertically move a plurality (nine) of bonding pin plates 8a (perpendicular movement with respect to the upper substrate surface 3a).

In addition, the vertical movement mechanism 80 can displace the bonding pin flat plate 8a according to the displacement amount set for each bonding pin flat plate 8a. Accordingly, the bonding pins 8 can hold the upper substrate K1 (see FIG. 1 ) in a state displaced together with the bonding pin flat plates 8 a by the displacement amount set for each bonding pin flat plate 8 a.

(a) of FIG. 7 is a figure which shows a lower platform, (b) is a cross-sectional view of Sec1-Sec1.

As shown in (a) of FIG. 7 , the lower platform 4 is accommodated inside the lower cavity 5 b opened upward. The bottom and sides of the lower platform 4 are surrounded by the lower cavity 5b. Between the lower platform 4 and the lower chamber 5b, gaps Gx, Gy are formed in the lateral direction (X-axis direction) and longitudinal direction (Y-axis direction), respectively. In addition, the lower part of the lower stage 4 is supported by a plurality of XYθ moving parts 40 . In (a) of FIG. 7 , the lower stage 4 supported by nine XYθ movable members 40 is illustrated, but the number of XYθ movable members 40 supporting the lower stage 4 is not limited.

The XYθ moving part 40 supports the lower table 4 freely displaceably in the X-axis direction and the Y-axis direction. With such a configuration, the lower platform 4 is disposed freely displaceable in the X-axis direction and the Y-axis direction with respect to the lower chamber 5b.

In addition, at the lower platform 4, a moving mechanism 41 is installed. The moving mechanism 41 has a shaft portion 41b connected to an end side of the lower table 4, and a drive portion 41a for displacing the shaft portion 41b in the axial direction. The drive part 41a displaces the shaft part 41b in the axial direction by, for example, a ball screw mechanism.

As shown in Fig. 7(a), three moving mechanisms 41 are connected to the lower platform 4. The shaft portion 41b of one moving mechanism 41 extends in the X-axis direction, and the shaft portions 41b of the two moving mechanisms 41 extend in the Y-axis direction. extended in the axial direction.

The shaft portion 41b extending in the X-axis direction is connected to the vicinity of the center portion of the end side of the lower platform 4 . The lower table 4 is displaced in the X-axis direction (horizontal direction) by the displacement of the shaft portion 41b extending in the X-axis direction.

In addition, the two shaft portions 41b extending in the Y-axis direction are connected to the vicinity of the end of the end side on the same side of the lower platform 4 . When the displacement amounts of the two shaft portions 41b extending in the Y-axis direction are equal, the lower table 4 is displaced in the Y-axis direction (longitudinal direction). In addition, when the displacements of the two shafts 41b extending in the Y-axis direction are different, with regard to the lower table 4, the side with a larger displacement of the shafts 41b has a larger displacement on the Y-axis than the side with a smaller displacement. The displacement is performed in the direction, so the rotation around the Z axis.

In this way, the lower platform 4 connecting the three moving mechanisms 41 can perform displacement in the X-axis direction (horizontal direction), displacement in the Y-axis direction (vertical direction), and rotation around the Z-axis.

The three moving mechanisms 41 are controlled by the control device 100 . The control device 100 gives commands to the three moving mechanisms 41 to appropriately displace the shaft portion 41 b and displace the lower table 4 .

In addition, an elevator 42 is provided on the lower platform 4 . The elevator 42 is extended so as to cross the lower platform 42 in, for example, the X-axis direction. The elevator 42 moves up and down as shown by a black arrow in FIG. 7( b ) by a lifting device 42 a such as a ball screw mechanism. The lifting device 42a is controlled by the control device 100 . When the lower substrate K2 (see FIG. 1 ) is conveyed by the conveyance device 200 (refer to FIG. 1 ), the control device 100 drives the elevator 42 to place the lower substrate K2 on the lower table 4 .

In addition, alignment windows 4b are formed at the four corners of the rectangular lower platform 4 . As shown in FIG. 7( b ), the alignment window 4 b is a through hole penetrating through the plane of the lower stage 4 (lower substrate surface 4 a ). The imaging unit housing tube 10a enters the alignment window 4b from below. As for the imaging unit housing tube 10a, the lower surface of the lower chamber 5b is formed to protrude upward in a cylindrical shape, and a transparent member 10b is fitted into the front end thereof. The imaging device 10 for imaging the lower substrate K2 (see FIG. 1 ) held by the lower stage 4 is accommodated in the imaging unit housing tube 10a.

Four imaging devices 10 are provided on the lower platform 4 , and data (image data) captured by each imaging device 10 is input to the control device 100 . In addition, the number of imaging devices 10 provided on the lower platform 4 is not limited.

The lower substrate surface 4a of the lower stage 4 is a plane on which the lower substrate K2 (see FIG. 1 ) is held. In addition, the moving mechanism 41 displaces the lower stage 4 in the X-axis direction, the Y-axis direction, and around the Z-axis along the lower substrate surface 4 a.

An imaging window 4c is formed near the two alignment windows 4b. The imaging window 4c is formed in the same shape as the alignment window 4b. The second imaging unit storage tube (not shown) enters the imaging window 4c from below. The second imaging unit storage tube is formed identically to the imaging unit storage tube 10a. A second imaging device (not shown) is accommodated in the second imaging unit housing tube. The second imaging device images the lower substrate K2 (see FIG. 1 ) held by the lower stage 4 , and the image data is input to the control device 100 . In addition, in (a) of FIG. 7, the structure which provided the 2nd imaging device in the lower platform 4 was shown in figure, but the number of the 2nd imaging device is not limited.

A plurality of suction holes 43 are drilled in the lower substrate surface 4 a of the lower platform 4 . The suction hole 43 is connected to the second suction means (vacuum pump P3). When the vacuum pump P3 is driven, the placed lower substrate K2 (see FIG. 1 ) is sucked and held by the lower stage 4 (lower substrate surface 4 a ). The vacuum pump P3 is controlled by the control device 100 .

FIG. 8 is a diagram illustrating a step of bonding substrates by a substrate mounting device. Referring appropriately to FIGS. 1 to 7 , the process of bonding the substrates by the substrate mounting apparatus 1 will be described.

The first process (step 1) is an upper substrate loading process.

In the upper substrate loading step, the control device 100 moves the upper frame 2 upward to move the upper chamber 5 a and the upper table 3 upward. As a result, the vacuum chamber 5 is opened.

When the upper substrate K1 is conveyed between the upper platform 3 and the lower platform 4 by the conveying device 200 , the control device 100 moves the support pin 7 down until it touches the upper substrate K1 , and drives the vacuum pump P1 . The upper substrate K1 is attracted to the support pins 7 by vacuum.

When the conveying device 200 exits, the control device 100 moves the support pin 7 upwards so that the upper substrate K1 is in close contact with the upper substrate surface 3 a of the upper platform 3 .

Then, the control device 100 provides a command to the vertical movement mechanism 80 to move the adhesive pin plate 8a downward and drive the vacuum pump P2. The upper substrate K1 is vacuum-suctioned by the bonding pins 8 moving down together with the bonding pin plate 8a, and the bonding portion 8b at the tip is attached to the upper substrate K1. After that, the control device 100 moves down the bonding pin flat plate 8a in the state where the upper substrate K1 is attached to the bonding pins 8, and separates the upper substrate K1 from the upper substrate surface 3a.

At this time, the control device 100 moves each bonding pin flat plate 8a downward so that the displacement amount of the bonding pin flat plate 8a becomes the displacement amount set for each bonding pin flat plate 8a. Details of the amount of displacement of the bonding pin plate 8a will be described later.

Furthermore, the control device 100 displaces (moves downward) the divided drive unit 31 corresponding to each bonding pin plate 8a relative to the back plate 30 by the same displacement amount as the displacement amount set for the bonding pin plate 8a.

The second step (step 2) is a lower substrate loading step.

When the lower substrate K2 is carried into between the upper platform 3 and the lower platform 4 by the conveying device 200 , the control device 100 moves the elevator 42 upward to receive the lower substrate K2 . When the transport device 200 exits, the control device 100 moves the elevator 42 downward to place the lower substrate K2 on the lower substrate surface 4 a of the lower stage 4 . In addition, the control device 100 drives the vacuum pump P3 to suction and hold the lower substrate K2 on the lower substrate surface 4 a of the lower stage 4 .

After that, the control device 100 drives the Z-axis driving mechanism 20 to move the upper frame 2 downward, and the upper chamber 5 a and the upper platform 3 move downward. The upper cavity 5a and the lower cavity 5b are engaged and the vacuum cavity 5 is closed. Inside the vacuum chamber 5, an upper stage 3, a lower stage 4, support pins 7, and bonding pins 8 are disposed.

In the control device 100 , when the vacuum chamber 5 is closed, the vacuum pump P0 is driven to vacuum the inside of the vacuum chamber 5 . Driven by the vacuum pump P0, the inside of the vacuum chamber 5 becomes vacuum, so the vacuum chamber 5 accommodates the upper platform 3, the lower platform 4, the support pin 7 and the bonding pin 8 in a vacuum environment.

In addition, the lower substrate K2 is coated with necessary substances such as sealant, liquid crystal, spacers, and paste materials in another process before being loaded into the substrate mounter 1 (between the upper stage 3 and the lower stage 4 ).

The third step (step 3) is a bonding position adjustment step.

In the bonding position adjustment process, the control device 100 drives the moving mechanism 41 to displace the lower table 4 to adjust the bonding position. Details of the bonding position adjustment step will be described later.

The fourth step (step 4) is a bonding step of bonding the upper substrate K1 and the lower substrate K2 together. Details of the bonding step will be described later.

The fifth step (step 5) is an unloading step.

In the carrying-out process, the control device 100 injects gas such as nitrogen gas into the vacuum chamber 5 in a vacuum state to increase the pressure in the vacuum chamber 5 to atmospheric pressure. Since the inside of the vacuum chamber 5 is pressurized to atmospheric pressure, the upper substrate K1 and the lower substrate K2 are uniformly pressed (pressurized) until they become the same size according to the amount of spacers and liquid crystals coated on the substrate (lower substrate K2) in advance. Defined voids (cell voids). The control device 100 drives the gas supply unit 8d to supply gas to the vacuum adsorption hole 8c. At this point in time, the upper substrate K1 is not held by the bonding pins 8 , so the gas supplied to the vacuum suction holes 8 c is supplied into the vacuum chamber 5 . The control device 100 measures the air pressure in the vacuum chamber 5 with an air pressure sensor (not shown), and stops the gas supply unit 8 d when the air pressure in the vacuum chamber 5 rises to atmospheric pressure. Then, the control device 100 moves the upper frame 2 upward. Thus, the vacuum chamber 5 is opened.

Thereafter, the bonded upper substrate K1 and lower substrate K2 are carried out from the substrate mounting apparatus 1 by the transport unit 200 .

The substrate mounting apparatus 1 of this embodiment uses the five steps (step 1 to step 5) shown in FIG. 8 as main steps to bond the upper substrate K1 and the lower substrate K2 together.

The control apparatus 100 adjusts the bonding position of the upper board|substrate K1 and the lower board|substrate K2 in the bonding position adjustment process (step 3) shown in FIG. The bonding position adjustment step (step 3) in this example will be described.

9 is a diagram showing marks for adjusting the bonding position of the upper substrate and the lower substrate, (a) is a diagram showing an upper mark attached to the upper substrate, and (b) is a diagram showing a lower marking attached to the lower substrate. Logo illustration. In addition, FIGS. 10 and 11 are diagrams showing a state of adjusting the deviation of the upper mark of the upper substrate and the lower mark of the lower substrate. (a) of FIG. It is a figure which shows the state which adjusted the offset in the XY-axis direction. In addition, (a) of FIG. 11 is a figure which shows the offset around a Z-axis, (b) is a figure which shows the state which adjusted the offset around a Z-axis.

The shapes of the marks (upper marks and lower marks) attached to the upper substrate K1 and the lower substrate K2 are not limited. For example, regarding the upper mark, as shown in (a) of FIG. 9, a first upper mark Mk1 of a black square is added to the reference position of the upper substrate K1, and a second upper mark of a black square is added near the first upper mark Mk1. Mk1a. In addition, regarding the lower mark, as shown in FIG. 9 (b), a first lower mark Mk2 in the shape of a square frame is added to the reference position of the lower substrate K2, and a second lower mark Mk2 in the shape of a square frame is added near the first lower mark Mk2. Logo Mk2a.

The second upper mark Mk1a is a black rectangle smaller in size than the first upper mark Mk1. In addition, the second lower mark Mk2a has a square frame shape having the same size as the first lower mark Mk2 or a larger size than the first lower mark Mk2.

In addition, the reference position of the upper substrate K1 to which the first upper mark Mk1 is added is set according to, for example, the distance from the edge of the upper substrate K1. As an example, the first upper mark Mk1 is added at a position separated by a predetermined length from the edge of the upper substrate K1. Similarly, the first lower mark Mk2 is added at a position separated by a predetermined length from the edge of the lower substrate K2.

In the case where the first upper mark Mk1 is a black square as shown in FIG. 9( a ) and the first lower mark Mk2 is a square frame as shown in FIG. When the first upper mark Mk1 (black square) is within the frame of the first lower mark Mk2 (square frame), it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within a predetermined range.

In addition, the alignment window 4b of the lower stage 4 shown in (a) of FIG. 7 is formed corresponding to the reference position of the upper board|substrate K1 and the lower board|substrate K2.

In addition, when the second upper mark Mk1a is a black square as shown in (a) of FIG. 9 and the second lower mark Mk2a is a square frame as shown in FIG. ) When the second upper mark Mk1a (black square) is within the frame of the second lower mark Mk2a (square frame), it is determined that the rough adjustment of the position of the lower substrate K2 relative to the upper substrate K1 is completed.

In addition, the imaging window 4c of the lower stage 4 shown in FIG.

The control device 100 (see FIG. 1 ) adjusts the bonding positions of the upper substrate K1 and the lower substrate K2 in two stages in the bonding position adjustment step shown in FIG. 8 .

In the bonding position adjustment process, the control device 100 first displaces the lower stage 4 so that the second upper mark Mk1a is arranged within the frame of the second lower mark Mk2a. At this time, the control device 100 displaces the lower stage 4 based on the image data input from the second imaging device not shown, and arranges the two second upper marks Mk1a within the frames of the second lower marks Mk2a. The control device 100 determines that the rough adjustment of the position of the lower substrate K2 with respect to the upper substrate K1 is completed when the two second upper markers Mk1a enter the frame of the second lower marker Mk2a.

After the control device 100 (see FIG. 1 ) determines that the rough adjustment of the position of the lower substrate K2 relative to the upper substrate K1 has been completed, as shown in FIG. If it is outside the frame of the first lower mark Mk2 (square frame) of the lower substrate K2, the control device 100 determines that the deviation between the upper substrate K1 and the lower substrate K2 is outside the predetermined range. Then, the control device 100 finely adjusts the position of the lower substrate K2 relative to the upper substrate K1.

The control device 100 (see FIG. 1 ) gives instructions to the movement mechanism 41 (see FIG. 7( a )) of the lower table 4 to displace the lower table 4 . The control device 100 gives commands to the moving mechanism 41 of the lower table 4 to move the lower table 4 (see FIG. 7( a )) in the X-axis direction (Dx) and the Y-axis direction (Dy). Then, as shown in (b) of FIG. 10 , when all four first upper marks Mk1 are arranged within the frame of the first lower mark Mk2, the control device 100 determines that the upper marks (first upper marks Mk1) and The lower mark (first lower mark Mk2 ) is in the predetermined positional relationship and the deviation between the upper substrate K1 and the lower substrate K2 is within the predetermined range, and the fine adjustment is completed.

In addition, as shown in (a) of FIG. 11 , when the first lower mark Mk2 is displaced in the direction rotated around the Z axis relative to the first upper mark Mk1 , the movement of the lower stage 4 by the control device 100 The mechanism 41 (see (a) of FIG. 7 ) provides a command to rotate the lower table 4 (see (a) of FIG. 7 ) around the Z axis (Rz). Then, as shown in (b) of FIG. 11 , when all the four first upper marks Mk1 are arranged within the frame of the first lower mark Mk2, the control device 100 determines that the upper marks (first upper marks Mk1) and The lower mark (first lower mark Mk2 ) is in the predetermined positional relationship and the deviation between the upper substrate K1 and the lower substrate K2 is within the predetermined range, and the fine adjustment is completed.

In this way, the control device 100 (see FIG. 1 ) performs rough adjustment based on the second upper mark Mk1a and the second lower mark Mk2a and the first upper mark Mk1 and the first lower mark in the bonding position adjustment process shown in FIG. 8 . The fine adjustment of the mark Mk2 adjusts the bonding position of the upper substrate K1 and the lower substrate K2.

Then, the control device 100 of this embodiment determines that the first upper mark Mk1 and the first lower mark Mk2 are in a predetermined positional relationship when the first upper mark Mk1 is arranged within the frame of the first lower mark Mk2 .

In addition, in the bonding position adjustment process, the control device 100 (see FIG. 1 ) performs image processing on image data input from the imaging device 10 (see FIG. 7( b )) to extract the first upper mark Mk1 and the first lower mark Mk1 . The position and shape of the mark Mk2 give instructions to the moving mechanism 41 (see FIG. 7( a )) so that the first upper mark Mk1 moves toward the frame of the first lower mark Mk2.

The control device 100 extracts the positions and shapes of the first upper mark Mk1 and the first lower mark Mk2 in image processing such as multivalued processing.

12 is a diagram showing a state where the deviation between the first upper mark and the first lower mark is within a predetermined range, (a) is a diagram showing a state where the first upper mark is at the center of the first lower mark, (b ) is a diagram showing a state where the first upper mark is shifted from the center of the first lower mark.

In the control device 100 of this embodiment (see FIG. 1 ), as shown in FIG. 10(b) and FIG. 11(b), the first upper mark Mk1 (black square) is arranged on the first lower mark Mk2 (square frame). When it is within the frame of , it is determined that the deviation between the upper substrate K1 and the lower substrate K2 is within a predetermined range.

The first upper mark Mk1 and the first lower mark Mk2 are attached to the reference positions of the upper substrate K1 and the lower substrate K2, respectively. Therefore, when there is no dimensional difference (dimensional error) between the upper substrate K1 and the lower substrate K2 as shown in (a) of FIG.

However, if an error (dimensional error, etc.) occurs during the production of the upper substrate K1 and the lower substrate K2, an error occurs in the reference positions of the upper substrate K1 and the lower substrate K2. Then, if there is an error in the reference positions of the upper substrate K1 and the lower substrate K2, none of the four first upper marks Mk1 is arranged at the center of the first lower mark Mk2. Thus, the state where the first upper mark Mk1 is not arranged at the center of the first lower mark Mk2 is referred to as a mark pitch misalignment (mark pitch misalignment between the upper substrate K1 and the lower substrate K2).

In the control device 100 (see FIG. 1 ) of this embodiment, as shown in FIG. 12( b ), even if none of the four first upper marks Mk1 is the center of the first lower mark Mk2 , that is, even if the upper substrate K1 and the lower In the state where the mark pitch is shifted on the board K2, when all the four first upper marks Mk1 are arranged within the frame of the first lower mark Mk2, it is determined that the deviation between the upper board K1 and the lower board K2 is within a predetermined range. .

However, if the upper substrate K1 and the lower substrate K2 are bonded together in this state, a slight misalignment occurs between the upper substrate K1 and the lower substrate K2.

Therefore, when the control device 100 (see FIG. 1 ) of the substrate mounting apparatus 1 of this embodiment moves down the bonding pins 8 in the upper substrate carrying-in process (step 1) shown in FIG. The pin plate 8a changes the displacement amount of the downward movement to reduce the deviation of the upper base K1 and the lower base K2. Thereby, the mark pitch deviation of the upper substrate K1 and the lower substrate K2 is effectively corrected.

Fig. 13 is a diagram showing a state in which the offset between the upper substrate and the lower substrate is reduced by changing the amount of displacement of the bonding pin plate, and (a) is a diagram showing a state in which the first upper mark and the first lower mark are shifted , (b) is a diagram showing a state where the misalignment between the first upper mark and the first lower mark is reduced (the state where the misalignment of the mark pitch between the upper substrate and the lower substrate is corrected).

In addition, in (a) and (b) of FIG. 13 , the position of the first lower mark Mk2 is indicated by a dotted line.

As shown in (a) of FIG. 13 , when the displacements of all bonding pin flat plates 8 a are equal, the protrusions of all bonding pins 8 are equal, so the upper substrate K1 that is attracted (held) by the bonding pins 8 becomes Planar. That is, the upper substrate K1 is held by the bonding pins 8 in a state parallel to the upper substrate surface 3 a. At this time, if a dimensional error occurs in the upper substrate K1 and the lower substrate K2 due to a dimensional error generated during production or the like, the first upper mark Mk1 may be shifted from the center of the first lower mark Mk2. That is, the mark pitch may be shifted between the upper substrate K1 and the lower substrate K2.

For example, as shown in (b) of FIG. 13 , if the amount of displacement of the bonding pin plate 8a increases on the end side to which the first upper mark Mk1 is added, the upper substrate K1 is closer to the upper platform 3 at the center than at the end side. The slightly bent state is held by the bonding pin 8 .

If the upper substrate K1 is bent in this way, the end of the upper substrate K1 will be slightly closer to the center, so the first upper mark Mk1 added near the end will be slightly closer to the center. Therefore, the upper substrate K1 is held by the bonding pin 8 in a state where the first upper mark Mk1 is close to the center of the first lower mark Mk2 .

In this way, if the upper substrate K1 is held by the bonding pins 8 in a state where the first upper mark Mk1 is close to the center of the first lower mark Mk2, the fine adjustment in the bonding position adjustment process shown in FIG. As shown in (b) of 13, the first upper mark Mk1 approaches the center of the first lower mark Mk2 with high precision. Then, the slight misalignment that occurs during bonding of the upper substrate K1 and the lower substrate K2 is reduced, thereby correcting the misalignment of the mark pitch between the upper substrate K1 and the lower substrate K2 and reducing the misalignment of the mark pitch.

Errors (dimensional errors, etc.) generated when the upper substrate K1 and the lower substrate K2 are produced are approximated in the same production lot. That is, the magnitude of the shift of the first upper mark Mk1 with respect to the first lower mark Mk2 of the lower substrate K2 is approximated for each production lot of the upper substrate K1 and the lower substrate K2.

Therefore, if the displacement amount of the bonding pin plate 8a is set for each production lot of the upper substrate K1 and the lower substrate K2, the first upper mark Mk1 can be brought close to the first lower mark Mk2 as long as the production lot does not change. center of. In addition, the control device 100 (see FIG. 1 ) may be configured to displace the bonding pin plate 8a by a preset displacement amount.

For example, a manager of the substrate mounting apparatus 1 (see FIG. 1 ) sets the amount of displacement of the bonding pin plate 8a for each production lot of the upper substrate K1 and the lower substrate K2. The substrate mounting apparatus 1 of the present embodiment has nine bonding pin flat plates 8a, so the amount of displacement is set for each bonding pin flat plate 8a.

When the displacement amount set in this way is input to the control device 100 (see FIG. 1), the control device 100 moves each bonding pin flat plate 8a according to the set displacement amount in the upper substrate loading process (see FIG. 8). Displacement is performed relative to the back plate 30 (see FIG. 3 ). Each bonding pin flat plate 8a moves down by the set displacement amount.

In addition, Fig. 13(b) shows a state in which the displacement amount of the adhesive pin flat plate 8a arranged in the center is smaller than the displacement amount of the adhesive pin flat plate 8a arranged on the end side, but it can also be set as a state in which the adhesive pin flat plate 8a arranged in the center The displacement amount of the bonding pin flat plate 8a is larger than the displacement amount of the bonding pin flat plate 8a disposed on the end side.

In addition, in FIG. 13( b ), the displacement amount of the bonding pin plate 8a changes in the X-axis direction, but it can also be set in a state where the displacement amount of the bonding pin plate 8a changes in the Y-axis direction.

After the control device 100 (see FIG. 1 ) has adjusted the bonding positions of the upper substrate K1 and the lower substrate K2 in the bonding position adjustment process (step 3) shown in FIG. 8 , the bonding process (step 3) shown in FIG. 8 is executed. 4) The upper substrate K1 and the lower substrate K2 are bonded together. The bonding step (step 4) in this example will be described.

(a) of FIG. 14 is a diagram showing a state in which the split drive unit is displaced according to the shape of the upper substrate, and (b) is a diagram showing a state in which the upper stage presses the upper and lower substrates.

As described above, the control device 100 (see FIG. 1 ) of this embodiment changes the displacement amount of the bonding pin flat plate 8 a in the upper substrate loading step (step 1) shown in FIG. 8 , as shown in FIG. 13( b ). As shown, slightly bend the upper substrate K1.

And after the control apparatus 100 (refer FIG. 1) adjusted a bonding position in a bonding position adjustment process, the bonding process shown in FIG. 8 was performed (step 4).

In the bonding process, the control device 100 drives each divided driving unit 31 according to the displacement amount corresponding to the displacement amount of the adhesive pin flat plate 8a on which the adhesive pin 8 is attached corresponding to the divided plane part 31a of each divided driving unit 31. Perform displacement. In the present embodiment, the control device 100 makes each split drive unit 31 move by the same displacement amount as the displacement amount of the adhesive pin flat plate 8a on which the adhesive pin 8 is attached corresponding to the split planar portion 31a of each split drive unit 31. Perform displacement.

The control device 100 (refer to FIG. 1 ) controls the actuator 32 (refer to FIG. 3 ) to move the split drive unit 31 downward to separate from the back plate 30 . At this time, the control device 100 moves the split drive unit 31 downward by the same displacement amount as the corresponding bonding pin flat plate 8a. Therefore, as shown in (a) of FIG. 14 , the bonding pin plate 8 a and the split drive unit 31 corresponding to the bonding pin plate 8 a are displaced (moved downward) by the same amount. The split drive unit 31 is displaced according to the deformation of the upper substrate K1 , and the upper substrate surface 3 a of the upper stage 3 is deformed into the shape of the upper substrate K1 held by the bonding pins 8 .

Afterwards, the control device 100 (see FIG. 1 ) drives the Z-axis driving mechanism 20 (see FIG. 1 ), and the upper frame 2 (see FIG. 1 ) is further moved downward, so that the upper platform 3 shown in (a) of FIG. 14 and The bonding pin plate 8a (bonding pin 8) moves downward. Thereby, as shown in FIG. 14( b ), the upper substrate K1 held by the bonding pins 8 and the lower substrate K2 held by the lower table 4 are bonded together.

As shown in (a) of FIG. 14 , the control device 100 drives the Z-axis drive mechanism 20 (refer to FIG. 1 ) in a state where the split drive unit 31 is displaced. The upper table 3 (the back plate 30 and the split drive unit 31 ) moves downward together with the upper frame 2 (see FIG. 1 ). Then, as shown in (b) of FIG. 14 , the upper substrate K1 held by the adhesive pins 8 and the lower substrate K2 held by the lower stage 4 are pressed by the upper stage 3 (divided drive unit 31 ) and the lower stage 4 to bond them together. . At this time, the split drive unit 31 presses the upper substrate K1 and the lower substrate K2 in a displaced state.

Therefore, the upper substrate K1 and the lower substrate K2 are bonded together in a state (shape) in which the first upper mark Mk1 of the upper substrate K1 approaches the center (shape) of the first lower mark Mk2 of the lower substrate K2 . Thereby, the deviation of the mark pitch between the upper substrate K1 and the lower substrate K2 in the bonding process is suppressed, and errors occurring in the bonding of the upper substrate K1 and the lower substrate K2 are reduced.

In addition, in (a) and (b) of FIG. 14 , the amount of deformation of the upper substrate K1 is greatly illustrated for easy understanding of the description. Actually, the amount of deformation of the upper substrate K1 is small, and the amount of displacement of the split driving portion 31 is also small. Therefore, even if the upper substrate K1 and the lower substrate K2 are bonded together in a state where the split drive unit 31 has been displaced (a state in which it has moved downward from the back plate 30), the amount of deformation of the upper substrate K1 is small, and the upper substrate K1 and the lower substrate K2 are bonded together. The lower substrate K2 is bonded with high precision without causing a gap or the like.

When the control device 100 detects that the upper substrate K1 and the lower substrate K2 are bonded by the detection signal input from the load cell 20d (refer to FIG. 1 ), at this point in time, the control device 100 drives the vertical movement mechanism 80 to pull in the upper substrate K1 from the upper substrate surface 3a. Bonding pin 8. At this time, the control device 100 stops the vacuum pump P2 (see FIG. 5 ), drives the gas supply unit 8d to supply gas to the vacuum suction hole 8c, and peels the upper substrate K1 from the adhesive portion 8b. Then, the control device 100 drives the Z-axis driving mechanism 20 to further move the upper frame 2 downward, and press the upper substrate K1 and the lower substrate K2 through the upper platform 3 . The control device 100 stops the downward movement of the upper frame 2 when it determines that a predetermined load has occurred between the upper table 3 and the lower table 4 based on the detection signal input from the load cell 20d.

The inside of the vacuum chamber 5 is vacuumed, and the upper substrate K1 and the lower substrate K2 are bonded under a predetermined load under the vacuum environment in the vacuum chamber 5 . By the pressurization at this time, the sealant coated in advance on the lower substrate K2 is properly pressed, and the vacuum of the liquid crystal portion coated in the frame surrounded by the sealant is maintained.

Thereafter, the sealant is temporarily cured by irradiating ultraviolet rays from a UV (ultraviolet) irradiation device (not shown) so that the positions of the upper substrate K1 and the lower substrate K2 do not shift.

In addition, as described above, the dimensional errors of the upper substrate K1 and the lower substrate K2 are approximated in the same production lot, and the displacement amount of the bonding pin plate 8a is set for each production batch of the upper substrate K1 and the lower substrate K2. Therefore, it is also possible to maintain a configuration in which the division drive unit 31 is displaced by the displacement amount equal to the displacement amount set for the bonding pin plate 8a during the period when the production lot of the upper substrate K1 and the lower substrate K2 does not change. state. For example, it may be configured such that the control device 100 (see FIG. 1 ) maintains the divisional drive unit 31 in accordance with the sum and each production lot while the production lot of the upper substrate K1 and the production lot of the lower substrate K2 do not change. The second corresponding adhesive pin plate 8a is displaced by an amount equal to the displacement amount.

With such a configuration, as long as the production lots of upper substrate K1 and lower substrate K2 do not change, control device 100 (see FIG. 1 ) does not need to displace divisional drive unit 31 every time a bonding process is performed.

As described above, the substrate mounting apparatus 1 (see FIG. 1 ) of this embodiment changes the bonding pins 8 (see FIG. 5 ) for each bonding pin plate 8a (see FIG. 5) can reduce minute deviations (mark pitch deviations) caused by dimensional errors and the like that occur when the upper substrate K1 and the lower substrate K2 are produced. Therefore, it is possible to correct the deviation of the mark pitch between the upper substrate K1 and the lower substrate K2, and reduce the deviation of the mark pitch.

In addition, in the substrate mounting apparatus 1 of the present embodiment, the division drive unit 31 (see FIG. 3 ) is adapted to the adhesive pin 8 (see FIG. ) is displaced by the same amount of displacement. Accordingly, the shape of the upper substrate surface 3 a (see FIG. 3 ) of the upper stage 3 is equal to the shape of the upper substrate K1 held by the bonding pins 8 . Then, in the bonding process (refer to FIG. 8 ), the upper substrate K1 is pressed against the lower substrate K2 through the upper substrate surface 3a having the same shape, so there is no mark pitch deviation in the bonding process, and the upper substrate K1 and the lower substrate K1 The substrate K2 is bonded with high precision.

In addition, the present invention is not limited to the above-described embodiments. For example, the above-described embodiments are described in detail to explain the present invention easily, and are not necessarily limited to having all the configurations described.

In addition, a part of the structure of a certain example can be replaced with the structure of another example, and the structure of another example can also be added to the structure of a certain example.

In addition, this invention is not limited to the said Example, The design can be changed suitably in the range which does not deviate from the summary of invention.

Fig. 15 is a diagram showing a design modification example, (a) is a diagram showing a state in which the displacement amount of the bonding pin attached to one bonding pin plate is different, and (b) is a diagram showing the corresponding A diagram of the structure of a bonded pin. In addition, FIG. 16 is a diagram showing another design modification example, (a) is a diagram showing a state where four divided driving parts correspond to one bonding pin plate, and (b) shows a state where one divided driving part corresponds to A diagram of the state of 3 bonded pin plates.

As shown in FIG. 6 , one bonding pin flat plate 8 a is driven by four up and down motion mechanisms 80 . In addition, as shown in FIG. 4 , one divided drive unit 31 is supported by four rods 32 a (actuator 32 shown in FIG. 3 ).

Therefore, it is possible to change the movement amounts of the four vertical movement mechanisms 80 on one bonding pin flat plate 8a. Similarly, the displacement amount of the rod 32 a can be changed for each actuator 32 supporting one divided drive unit 31 .

Moreover, as shown in (a) of FIG. 15, the displacement amount of the bonding pin 8 attached to the one bonding pin flat plate 8a can be set as the state which differs. In this case, the upper substrate K1 held by the bonding pins 8 can be variously deformed (curved). Furthermore, it is also possible to displace the split drive unit 31 from the back plate 30 in accordance with the displacement amount of one adhesive pin 8 .

Therefore, as shown in (a) of FIG. 15 , it is possible to appropriately displace the split drive unit 31 from the back plate 30 to incline the split planar portion 31 a with respect to the back plate 30 , and to make the shape of the upper substrate surface 3 a consistent with the shape of the upper substrate K1. match. Thereby, it is possible to more effectively reduce minute misalignment that occurs during bonding of the upper substrate K1 and the lower substrate K2. Furthermore, the mark pitch deviation of the upper substrate K1 and the lower substrate K2 is more effectively corrected.

In addition, as shown in (b) of FIG. 15 , it is also possible to have a configuration in which one vertical movement mechanism 80 is provided at one bonding pin 8 . That is, it is also possible to have a structure in which one bonding pin 8 is attached to one bonding pin flat plate 8a. Furthermore, one divided drive unit 31 may be provided with one actuator 32 corresponding to one bonding pin 8 . In the case of this structure, different displacement amounts can be set for each bonding pin 8 , and the upper substrate K1 held by the bonding pins 8 can be deformed (curved) more variously. Furthermore, the control device 100 (refer to FIG. 1 ) can displace each split drive unit 31 in accordance with the displacement amount of the bonding pin 8 so that the shape of the upper substrate surface 3 a (refer to FIG. 5 ) of the upper stage 3 is consistent with that of the upper substrate. The shape of K1 matches.

In this case, if a vacuum pump P2 (see FIG. 5 ) is connected to each bonding pin 8 , the upper substrate K1 can be vacuum-suctioned by each bonding pin 8 .

In addition, the present embodiment is configured to include nine bonding pin flat plates 8a, but the number of bonding pin flat plates 8a is not limited. The number of bonding pin flat plates 8 a can be appropriately changed according to, for example, the number of bonding pins 8 . In addition, the shape of the bonding pin flat plate 8a and the arrangement of the bonding pins 8 on one bonding pin flat plate 8a are not limited, either.

For example, the bonding pins 8 may be arranged in a row on the elongated bonding pin flat plate 8a extending in the X-axis direction (or the Y-axis direction).

In addition, the number of bonding pins 8 provided in one bonding pin flat plate 8a is not limited, either. A different number of bonding pins 8 may be provided for each bonding pin flat plate 8a.

In addition, in the present embodiment, as shown in FIG. 6 , one divided drive unit 31 corresponds to one bonding pin flat plate 8 a. Not limited to this configuration, as an example shown in (a) of FIG. 16 , a plurality of (in an example of FIG. An adhesive pin plate 8a. In addition, as an example shown in (b) of FIG. 16 , it may be configured such that one divided drive unit 31 corresponds to a plurality (three in an example of (b) of FIG. 16 ) of bonding. Pin plate 8a.

In addition, the shape of one divided driving unit 31 is not limited to a rectangle (square, rectangle). Although not shown, it may be an upper table 3 (see FIG. 1 ) combined with a frame-shaped split drive unit with an open center. In addition, a divided driving unit (not shown) having various shapes such as a triangle and a trapezoid may be used.

In addition, the Z-axis drive mechanism 20 (refer to FIG. 1 ) that moves the upper frame 2 up and down, the up-and-down movement mechanism 80 (refer to FIG. 5 ) that drives the bonding pin plate 8a, and the moving mechanism 41 that drives the lower platform 4 (refer to FIG. 7 ). (a)), the drive mechanism such as the actuator 32 (see FIG. 3 ) is not limited to the ball screw mechanism. All or part of these driving mechanisms may be constituted by other mechanisms such as air cylinders or linear motors.

In addition, the upper substrate K1 (see FIG. 1 ) and the lower substrate K2 (see FIG. 1 ) bonded by the substrate mounter 1 (see FIG. 1 ) are mainly glass substrates, which easily cause errors corresponding to changes in ambient temperature. For example, in order to reduce the error generated by the upper substrate K1 and the lower substrate K2 due to the temperature change when the inside of the vacuum chamber 5 (see FIG. 1 ) becomes vacuum, it may also be configured to have an upper stage 3 (see FIG. 1 ) and a lower substrate. The stage 4 (refer to FIG. 1 ) is a heating device (heater) that heats to suppress the temperature drop of the upper substrate K1 and the lower substrate K2. Conversely, it is also possible to use a Peltier element or the like to suppress the temperature rise of the upper substrate K1 and the lower substrate K2. According to such a structure, the error which arises in the upper board|substrate K1 and the lower board|substrate K2 by a temperature change is reduced, and the bonding precision of the upper board|substrate K1 and the lower board|substrate K2 improves. Thus, it is possible to effectively reduce the occurrence of the mark pitch shift of the upper substrate K1 and the lower substrate K2 due to temperature changes.

Fig. 17 is a diagram showing another design modification example, (a) is a diagram showing a design modification example in which all adhesive pins are attached to one adhesive pin plate, (b) is an upper platform showing an integral structure Drawings of examples of design changes that are available.

As shown in FIG. 6, the substrate mounting apparatus 1 (see FIG. 1) of this embodiment has nine bonding pin flat plates 8a. In addition, nine bonding pins 8 are attached to one bonding pin flat plate 8a. It is not limited to this structure, For example, as shown in (a) of FIG. 17, you may make it the structure which attaches all the bonding pins 8 to one bonding pin flat plate 8a.

In addition, as shown in (a) of FIG. 17 , a configuration may be adopted in which vertical movement mechanisms 80 are provided at the four corners of the rectangular bonding pin flat plate 8 a.

According to this structure, the displacement amount of the bonding pin 8 can be set as the state which differs by changing the movement amount of the four up-and-down movement mechanisms 80. FIG. Furthermore, each split drive unit 31 can be displaced from the back plate 30 (see FIG. 3 ) in accordance with the displacement amount of the bonding pin 8, and in this state, the upper substrate K1 (see FIG. 1 ) and the lower substrate K2 (see FIG. 1 ) can be displaced. Refer to Figure 1) for bonding.

In addition, as shown in FIG. 4 , nine divisional drive units 31 are provided on the upper stage 3 of the substrate mounting apparatus 1 (see FIG. 1 ) of this embodiment. The structure is not limited to this, and the upper platform 3 may be integrally constructed as shown in (b) of FIG. 17 . That is, the upper platform 3 may not be provided with the split drive unit 31, but the upper platform 3 may be formed of a single steel plate or the like. In this case, if the rods 32a of the actuator 32 (refer to FIG. 3 ) are installed at the four corners of the rectangular upper platform 3, the upper platform can be adjusted by changing the displacement of the four rods 32a. The platform 3 is properly inclined. Therefore, it is possible to properly incline the upper table 3 according to the displacement amount of the bonding pin 8, and to bond the upper substrate K1 (see FIG. 1 ) and the lower substrate K2 (see FIG. 1 ) in this state.

Claims (8)

1. A substrate assembly device, characterized in that it has: a lower platform having a lower substrate surface holding the lower substrate; an upper platform having a plurality of divided driving parts formed with a divided plane part facing the lower substrate surface; a plurality of bonding pins are arranged corresponding to the split plane parts, and can be displaced in a direction perpendicular to the corresponding split plane parts to hold the upper substrate; a vacuum chamber capable of accommodating the lower platform, the upper platform and the bonding pins in a vacuum environment; a first drive mechanism for moving the bonding pin and the upper platform toward the lower platform; a plurality of base parts, and more than one of the bonding pins are installed; a second driving mechanism for independently vertically moving the plurality of base parts relative to the split plane parts; a third drive mechanism for independently displacing the plurality of divided drive units toward the lower substrate surface; The first suction unit is connected to the vacuum suction hole dug in the bonding pin; and the second suction unit is connected to the suction hole formed on the lower substrate surface, the bonding pin is displaced together with the base portion by a displacement amount set for each of the base portions to hold the upper substrate, Furthermore, each of the split driving parts is displaced by a displacement amount corresponding to a displacement amount of the base part on which the adhesive pins arranged corresponding to the split plane parts of the split driving part are attached. , Under the vacuum environment in the vacuum chamber, the lower substrate is held by the lower stage, and the first drive mechanism drives the upper substrate held by the bonding pins to the lower substrate. substrate, when the lower substrate and the upper substrate are bonded together, the second driving mechanism drives the bonding pins to be drawn in from the split plane portion, and the first driving mechanism The mechanism is driven to press the upper substrate and the lower substrate by the division driving part in a displaced state. 2. The substrate mounting apparatus according to claim 1, wherein: The divided driving part presses the upper substrate and the lower substrate in a state displaced by the same displacement amount as that of the base part, and the base part to which the divided driving part is mounted. Divide the adhesive pin corresponding to the planar portion. 3. The substrate mounting apparatus according to claim 1 or 2, wherein: In a state where the upper substrate is held by the bonding pins, a bonding position of the upper substrate and the lower substrate is adjusted. 4. The substrate mounting apparatus according to claim 3, characterized in that, comprising: a moving mechanism for displacing the lower platform along the lower substrate surface; an imaging device for imaging the upper mark attached to the upper substrate and the lower mark attached to the lower substrate; and a control device that performs image processing on image data input from the imaging device to extract the upper mark and the lower mark, The control device provides instructions to the moving mechanism according to the extracted positions of the upper mark and the lower mark, so as to displace the lower platform so that the upper mark and the lower mark are at specified positions Further, the base body is displaced according to the displacement amount set for each of the base body parts, and the bonding position of the upper substrate and the lower substrate is adjusted. 5. The substrate mounting apparatus according to any one of claims 1 to 4, characterized in that, The adhesive pin is a tubular member in which the vacuum suction hole is drilled, has an adhesive portion at the tip, and vacuum suctions the upper substrate to stick to the adhesive portion for holding. 6. The substrate mounting apparatus according to claim 5, wherein: A gas supply unit for supplying a predetermined gas to the vacuum adsorption hole is provided. 7. A substrate assembly method, which is a substrate assembly method performed by a control device of a substrate assembly device, wherein the substrate assembly method is characterized in that it includes: In the upper substrate carrying process, a plurality of bonding pins are displaced toward the upper substrate carried in between the upper stage and the lower stage in the state where the vacuum chamber is separated into an upper chamber and a lower chamber, and the bonding pins are driven. The first suction unit connected to the vacuum suction holes of the above-mentioned adhesive pins vacuum-suctions the upper substrate, and sticks the upper substrate to the adhesive part provided at the front end of the adhesive pins, wherein , the vacuum chamber is capable of accommodating the upper platform having a plurality of divided driving parts pressing the upper substrate and the lower substrate and the lower platform holding the lower substrate in a vacuum environment; The lower substrate carrying process is to drive the second suction unit connected to the suction hole formed on the lower substrate surface of the lower platform, so that the lower substrate carried between the upper platform and the lower platform is sucked onto the lower substrate. the lower substrate surface, and then engage the upper cavity and the lower cavity to close the vacuum cavity, so that the inside of the vacuum cavity becomes a vacuum; a bonding position adjustment step of displacing the lower stage along the surface of the lower substrate so as to be attached to the top of the upper substrate in a state where the bonding portions of the bonding pins are bonded to each other. The mark is in a predetermined positional relationship with the lower mark attached to the lower substrate in a state of being adsorbed to the surface of the lower substrate; In the attaching step, the bonding pins in the state where the upper substrate is pasted are moved toward the lower stage holding the lower substrate to bond the upper substrate and the lower substrate, and then attach the upper substrate to the lower substrate. The bonding pin is introduced from the split plane part, and then the upper platform is moved toward the lower platform, and the upper substrate and the lower substrate are pressed by the upper platform; and In the unloading process, the pressure in the vacuum chamber is increased to atmospheric pressure to open the vacuum chamber, In the upper substrate carrying-in step, the plurality of base portions to which one or more of the bonding pins are mounted is displaced relative to the split plane portion by an amount of displacement set for each of the base portions. independently performing a vertical motion, sticking the upper substrate to the bonding portion of the bonding pin displaced together with the base portion, In the attaching step, the upper substrate and the lower substrate are pressed by the upper stage after the split drive unit has been displaced by the displacement amount corresponding to the displacement amount of the base portion, respectively. The bonding pins arranged correspondingly to the split plane portions of the split drive portion are attached to the base portion. 8. The substrate mounting method according to claim 7, wherein: In the attaching step, the control device presses the upper substrate and the lower substrate by the upper stage after the split drive unit has been displaced by a displacement amount equal to the displacement amount of the base portion, respectively. The process of wherein the base body portion is mounted with the bonding pin corresponding to the split plane portion of the split drive portion.