CN105992493A - Heat radiation device and assembling method thereof - Google Patents
Heat radiation device and assembling method thereof Download PDFInfo
- Publication number
- CN105992493A CN105992493A CN201510068813.9A CN201510068813A CN105992493A CN 105992493 A CN105992493 A CN 105992493A CN 201510068813 A CN201510068813 A CN 201510068813A CN 105992493 A CN105992493 A CN 105992493A
- Authority
- CN
- China
- Prior art keywords
- fan
- heat abstractor
- loading plate
- size
- main part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 11
- 230000005855 radiation Effects 0.000 title abstract 2
- 239000012943 hotmelt Substances 0.000 claims description 21
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Structures Of Non-Positive Displacement Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat radiation device comprises a fan and a bearing plate, the fan comprises a fan frame, the fan frame comprises a base plate and a side plate which is formed by extending from the periphery of the base plate upwardly in an integrated manner, a bearing part is formed by being protruded out of the external side of the side plate, a protruded column is formed by being protruded upwardly out of the upper surface of the bearing part, one end of the bearing plate protrudes outwardly to form a connection part, through holes are formed in the connection part, and the fan is fixed to the bearing plate via hot melting of the protruded volume and the connection part.
Description
Technical field
The present invention relates to a kind of heat abstractor and assemble method thereof.
Background technology
Along with the performance of electronic product constantly strengthens, amount of heat can be produced during its work and affect its normal operation, therefore electronic equipment, such as various multimedia equipments and notebook computer, is required for that heat dissipation equipment of good performance is matched to be dispersed to ensure its good working order by its heat in time.
General heat abstractor includes a fan and the loading plate being connected with fan.Described loading plate and fan upper cover major part are made by aluminum and are structure as a whole, and are fixed together with fan frame further by screw.But, in the heat abstractor of this structure, fan and loading plate are both needed to adopt and are screwed, and screw consumption is bigger, relatively costly, and described fan upper cover makes described fan lid high, so that heat abstractor holistic cost is bigger with loading plate die sinking cost with the aluminium formula structure of bearing substrate one.
Summary of the invention
In view of this, it is necessary to a kind of heat abstractor with low cost is provided.
A kind of heat abstractor, including a fan and a loading plate, described fan includes a fan frame, described fan frame includes base plate, extends, from base portion peripheral upwards one, the side plate formed, protruding out formation one supporting part outside described side plate, described supporting part upper surface upwards protrudes out and is formed with projection, and described loading plate one end outward is formed with connecting portion, it is formed with through hole on described connecting portion, carries out hot melt by described projection and connecting portion between described fan and loading plate and fix.
A kind of assemble method of heat abstractor, its step is as follows:
Thering is provided a fan frame, the sidewall of described fan frame to be formed with a supporting part, described supporting part upper surface upwards protrudes out and is formed with two grades and meets portion and at two grades of two projections connect between portion;
A loading plate, described loading plate one end is provided to stretch out and be formed with a junction, described connecting portion is formed with through hole;
Thering is provided a kind of thermofusion device, described thermofusion device has a hot melt head;
Utilize thermofusion device that fan and loading plate are carried out hot melt to fix.
In heat abstractor of the present invention, described fan lid and absolute construction and material that loading plate is non-integral, reduce manufacturing cost;And described fan is fixed by hot melt fixed part with loading plate, not only has good stability but also with low cost, be conducive to producing in batches, improve the performance of product and reduce cost.
Accompanying drawing explanation
Fig. 1 is the three-dimensional assembly diagram of heat abstractor of the present invention.
Fig. 2 is the three-dimensional exploded view of heat abstractor described in Fig. 1.
Fig. 3 is the partial enlarged drawing of heat abstractor shown in Fig. 1.
Fig. 4 is the exploded view of partial enlarged drawing in heat abstractor described in Fig. 3.
Fig. 5 is that heat abstractor shown in Fig. 3 is along the sectional view of V-V section.
Fig. 6-10 is that heat abstractor of the present invention assembles fixing flow chart.
Figure 11 is that heat abstractor shown in Figure 10 is along the sectional view of XI-XI section.
Main element symbol description
Fan | 100 |
Loading plate | 200 |
Thermofusion device | 300 |
Fan frame | 10 |
Impeller | 20 |
Fan lid | 30 |
Base plate | 11 |
Side plate | 12 |
Fixing foot | 122 |
Supporting part | 123 |
Protruding | 1210 |
Lug | 121 |
Shelves meet portion | 123a |
Projection | 123b |
Cavity | 1230 |
Main part | 1231 |
Top | 1232b |
Bottom | 1232a |
Inwall | 1232c |
Outer wall | 1232d |
Location division | 1233 |
Auxiliary section | 1233b |
Outer surface | 1233c |
End face | 1233a |
Air inlet | 31 |
Connect ring | 32 |
Connecting portion | 220 |
Through hole | 221 |
Main body | 310 |
Ennation | 320 |
End face | 321 |
Groove | 322 |
Hot melt head | 323 |
First service portion | 3231 |
Second service portion | 3232 |
First joint face | 3230 |
End face | 3233 |
Sidewall | 3234 |
Second joint face | 3235 |
Fixed part | 1232 |
Following detailed description of the invention will further illustrate the present invention in conjunction with above-mentioned accompanying drawing.
Detailed description of the invention
As it is shown in figure 1, heat abstractor of the present invention includes the loading plate 200 that a fan 100 and one end are fixed on fan 100.
Please also refer to Fig. 2, described fan 100 includes a fan frame 10, the impeller 20 that is contained in fan frame 10 and the fan lid 30 being connected with fan frame 10.
Described fan frame 10 is the framework of an arc, it include base plate 11, from base plate 11 periphery upwards one elongation moulding side plate 12.
Described side plate 12 is the annular plate of a side opening, and it is formed multiple lug 121, fixing foot 122 and a supporting part 123.
Described lug 121 is the semicircle platform protruded out towards outside from side plate 12 top.The top that the upper surface of described lug 121 is connected fan lid 30 with side plate 12 is coplanar.The upper surface middle part of described lug 121 protrudes out vertically upward and forms cylindrical projection 1210, for fixed fan lid 30.
Described fixing foot 122 is also the circular platform formed from side plate 12 outward, and it is for fixing fan 100 with corresponding electronic equipment.The upper surface of described fixing foot 122 is less than the upper surface of described lug 121.Described fixing foot 122 and described lug 121 interval are arranged.
Please also refer to shown in Fig. 3-5, described supporting part 123 is the horizontal plate body protruded out outside side plate 12, and its upper surface be connected with side plate 12 fan lid 30 one end end faces coplanar, be used for coordinating and fix loading plate 200 thereon.The two ends of described supporting part 123 upper surface upwards protrude out and are formed with two grades and meet portion 123a and at two grades of two projection 123b connect between portion 123a.
Described projection 123b is the hollow cylinder that vertical bearing portion 123 upper surface upwards protrudes out, and it includes the outside upwardly extending fixed part 1232 of a main part 1231 and main body 1231 top.Described main part 1231 is internal has a cavity 1230.Described fixed part 1232 includes 1232a bottom, top 1232b, tilts the inwall 1232c extended, and the outer wall 1232d of the arc extended towards 1232a edge, bottom from top 1232b from top 1232b towards cavity 1230 periphery.
Described fan lid 30 with base plate 11 all in tabular and be oppositely arranged.The middle part of fan lid 30 is provided with the air inlet 31 of a circle.Described fan lid 30 outer ledge outward are formed with multiple connection ring 32.Described connection ring 32 is connected to be fixed with fan frame 10 by fan lid 30 with lug 121, protruding 1210 cooperations.
Described loading plate 200 is positioned at fan 100 side and is connected with described side plate 12, and it is the plate body being made up of aluminum, for carrying the electronic component in electronic equipment or electronic equipment.The extension of described loading plate 200 one end is formed with a junction 220.It is formed with through hole 221 on described connecting portion 220.The size of the bottom 1232a being smaller in size than described fixed part 1232 of described through hole 221.
Described loading plate 200 is fixed by hot melting way with fan 100, it is more than the size of described through hole 221 by the size of the bottom 1232a of the fixing rear described fixed part 1232 of hot melt, and then makes described fixed part 1232 be covered on fixed via 221 on described through hole 221.Described through hole 221 be sheathed on main part 1231 outer after described connecting portion 220 be located in two grades and connect between portion 123a, thus described connecting portion 220 is fixed between supporting part 123 and fixed part 1232 by described fixed part 1232.
In heat abstractor of the present invention, described fan 100 is connected with the fixing of loading plate 200, it is to fix in the way of hot melt between fixed part 1232 and connecting portion 220, eliminate fan 100 and adopt, with loading plate 200, the screw cost being screwed and produce, make in the present invention the fixing not only good stability of hot melt between fan 100 and loading plate 200 but also with low cost, be conducive to producing in batches.Described fan lid 30 and loading plate 200 use the absolute construction of non-integral so that fan lid 30 and the independent molding of loading plate 200, reduce further the manufacturing cost of heat abstractor.
The present invention also provides for the assemble method of a kind of heat abstractor described above, and its step is as follows:
Step one: as shown in Figure 6 a, it is provided that fan frame 10.Described fan frame 10 include base plate 11, from base plate 11 periphery upwards one elongation moulding side plate 12, described side plate 12 is formed a supporting part 123.The two ends of described supporting part 123 upper surface upwards protrude out and are formed with two grades and meet portion 123a and at two grades of two projection 123b connect between portion 123a.
Please also refer to Fig. 7, described projection 123b is the cylinder of hollow, has cavity 1230 inside it.Described projection 123b includes that a main part 1231 and main body 1231 top upwardly extend and in the location division 1233 gradually tapered up.Described main part 1231 size uniform everywhere, the size of described location division 1233 is certainly connected one end with main part 1231 and starts to be gradually reduced.Described location division 1233 includes an end face 1233a, tilts the auxiliary section 1233b extended from end face 1233a towards cavity 1230, and tilts to extend and connected to the outer surface 1233c of described main part 1231 tip edge from end face 1233a.
Step 2: as shown in Figure 8 a, it is provided that loading plate 200, described loading plate 200 one end stretches out and is formed with a junction 220, described connecting portion 220 is formed with through hole 221.The size of described through hole 221 size more than or equal to described location division 1233 and the size less than described main part 1231.Described loading plate 200 is a plate body being made up of aluminum.
Step 3: such as Fig. 9, it is provided that a kind of thermofusion device 300.Described thermofusion device 300 includes the ennation 320 that a main body 310 and autonomous agent 310 end face extend vertically upwards.Described ennation 320 farther includes end face 321, and described end face 321 offers groove 322.
Described groove 322 bottom surface upwards protrudes out and is formed with hot melt head 323, and described hot melt head 323 includes one first service portion 3231 and the second service portion 3232 upwardly extended from the first service portion 3231 top vertical and encloses and be located at the second service portion 3232 and the first joint face 3230 of the first service portion 3231 junction.
Described first service portion 3231 arcwall face, it is towards the cambered surface upwards protruded out in the middle part of groove 322 from groove 322 edge.Described second service portion 3232 is column, and it includes an end face 3233, sidewall 3234 and connects the second joint face 3235 of described end face 3233 and sidewall 3234.Described end face the 3233, second joint face 3235 coordinates described auxiliary section 1233b and in beneficially hot melt head 323 is pressed into described projection 123b.
Step 4: as shown in figs. 10-11, utilizes thermofusion device 300 that with loading plate 200, fan 100 is carried out hot melt and fixes.
When described fan 100 is fixed with loading plate 200 hot melt, the through hole 221 on described connecting portion 220 docks with the location division 1233 on projection 123b, and the location division 1233 of projection 123b penetrates through hole 221.Subsequently thermofusion device 300 is pressed in projection 123b along the cavity 1230 of projection 123b, first service portion 3231 of described hot melt head 323 and the second service portion 3232 are pressure bonded to the location division 1233 of projection 123b, and described location division 1233 turns to groove 322 outward at high temperature hot melt and under described first service portion 3231 effect
In, thus between the main part 1231 of described connecting portion 220 and described projection 123b, form a hot melt fixed part 1232.
Described hot melt fixed part 1232 turns up towards connecting portion 220 from the main part 1231 of described projection 123b and covers described through hole 221 edge.Described fixed part 1232 includes 1232a bottom, top 1232b, tilts the inwall 1232c extended from top 1232b towards cavity 1230 periphery, and extends the arc outer wall 1232d formed towards 1232a edge, bottom from top 1232b.Described inwall 1232c is the surface of similar inclination, and described outer wall 1232d is similar arcwall face.Connecting portion 220 is fixed by described fixed part 1232 with described projection 123b, prevents connecting portion 220 from separating with supporting part 123, and then makes to be fixed between loading plate 200 and fan 100 well.
Claims (10)
1. a heat abstractor, including a fan and a loading plate, described fan includes a fan frame, described fan frame includes base plate, extends, from base portion peripheral upwards one, the side plate formed, protruding out formation one supporting part outside described side plate, described supporting part upper surface upwards protrudes out and is formed with projection, and described loading plate one end outward is formed with connecting portion, it is formed with through hole on described connecting portion, carries out hot melt by described projection and connecting portion between described fan and loading plate and fix.
2. heat abstractor as claimed in claim 1, it is characterised in that: described projection includes the outside upwardly extending fixed part of a main part and main body top, has a cavity in described main part, and described through hole is sheathed on outside described main part.
3. as claimed in claim 2 heat abstractor, it is characterised in that: described fixed part includes bottom one, top, tilt the inwall extended towards cavity periphery from top, and extends the outer wall of the arc formed towards bottom margin from top.
4. heat abstractor as claimed in claim 1, it is characterised in that: the size of the bottom being smaller in size than described fixed part of described through hole, and then make described fixed part lid set on described through hole and then be fixed.
5. an assemble method for heat abstractor, its step is as follows:
Thering is provided a fan frame, the sidewall of described fan frame to be formed with a supporting part, described supporting part upper surface upwards protrudes out and is formed with two grades and meets portion and at two grades of two projections connect between portion;
A loading plate, described loading plate one end is provided to stretch out and be formed with a junction, described connecting portion is formed with through hole;
Thering is provided a kind of thermofusion device, described thermofusion device has a hot melt head;
The connecting portion of loading plate is directed at and is placed on described projection, utilize thermofusion device that fan and loading plate are carried out hot melt and fix.
6. the assemble method of heat abstractor as claimed in claim 5, it is characterised in that: described projection is the cylinder of hollow, has cavity inside it.
7. the assemble method of heat abstractor as claimed in claim 5, it is characterised in that: described projection includes that a main part and main body top upwardly extend and in the location division gradually tapered up.
8. the assemble method of heat abstractor as claimed in claim 7, it is characterised in that: described main part size uniform everywhere, the size of described location division is certainly connected one end with main part and starts to be gradually reduced.
9. the assemble method of heat abstractor as claimed in claim 5, it is characterised in that: the size of the described through hole size more than or equal to described location division and the size less than described main part.
10. the assemble method of as claimed in claim 5 heat abstractor, it is characterised in that: described hot melt head includes one first service portion and the second service portion upwardly extended from the first service portion top vertical and encloses and be located at the second service portion and the first joint face of the first service portion junction.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510068813.9A CN105992493A (en) | 2015-02-10 | 2015-02-10 | Heat radiation device and assembling method thereof |
TW104106452A TWI615552B (en) | 2015-02-10 | 2015-03-02 | Heat dissipation device and method of assemblely |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510068813.9A CN105992493A (en) | 2015-02-10 | 2015-02-10 | Heat radiation device and assembling method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN105992493A true CN105992493A (en) | 2016-10-05 |
Family
ID=57041028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510068813.9A Pending CN105992493A (en) | 2015-02-10 | 2015-02-10 | Heat radiation device and assembling method thereof |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN105992493A (en) |
TW (1) | TWI615552B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108425863A (en) * | 2017-02-14 | 2018-08-21 | 台达电子工业股份有限公司 | Heat radiation module |
CN113374736A (en) * | 2020-03-10 | 2021-09-10 | 神讯电脑(昆山)有限公司 | Anti-falling fan strengthening structure |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM339902U (en) * | 2008-03-27 | 2008-09-01 | Chaun Choung Technology Corp | Heat dissipating fan |
US20080253083A1 (en) * | 2007-04-11 | 2008-10-16 | Kabushiki Kaisha Toshiba | Electronic apparatus |
CN103573671A (en) * | 2012-07-27 | 2014-02-12 | 富瑞精密组件(昆山)有限公司 | Fan base and manufacturing method thereof |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4119008B2 (en) * | 1998-06-23 | 2008-07-16 | 株式会社東芝 | Circuit component cooling device and electronic device |
JP4327320B2 (en) * | 2000-01-07 | 2009-09-09 | 株式会社東芝 | Electronics |
TWI476573B (en) * | 2011-08-30 | 2015-03-11 | Sy Thermal Inc | Heat dissipating structure for laptop |
TWI537480B (en) * | 2012-07-09 | 2016-06-11 | 建準電機工業股份有限公司 | Blower fan |
-
2015
- 2015-02-10 CN CN201510068813.9A patent/CN105992493A/en active Pending
- 2015-03-02 TW TW104106452A patent/TWI615552B/en not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080253083A1 (en) * | 2007-04-11 | 2008-10-16 | Kabushiki Kaisha Toshiba | Electronic apparatus |
TWM339902U (en) * | 2008-03-27 | 2008-09-01 | Chaun Choung Technology Corp | Heat dissipating fan |
CN103573671A (en) * | 2012-07-27 | 2014-02-12 | 富瑞精密组件(昆山)有限公司 | Fan base and manufacturing method thereof |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108425863A (en) * | 2017-02-14 | 2018-08-21 | 台达电子工业股份有限公司 | Heat radiation module |
CN115370597A (en) * | 2017-02-14 | 2022-11-22 | 台达电子工业股份有限公司 | Method of forming heat dissipation module |
CN113374736A (en) * | 2020-03-10 | 2021-09-10 | 神讯电脑(昆山)有限公司 | Anti-falling fan strengthening structure |
Also Published As
Publication number | Publication date |
---|---|
TW201640029A (en) | 2016-11-16 |
TWI615552B (en) | 2018-02-21 |
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
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AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20190215 |
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