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CN105990735A - Charging conenctor combination member - Google Patents

Charging conenctor combination member Download PDF

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Publication number
CN105990735A
CN105990735A CN201610148643.XA CN201610148643A CN105990735A CN 105990735 A CN105990735 A CN 105990735A CN 201610148643 A CN201610148643 A CN 201610148643A CN 105990735 A CN105990735 A CN 105990735A
Authority
CN
China
Prior art keywords
molding part
contact area
charge connector
inner molded
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610148643.XA
Other languages
Chinese (zh)
Inventor
金廷勋
崔元种
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tyco Electronics AMP Korea Co Ltd
Original Assignee
Tyco Electronics AMP Korea Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics AMP Korea Co Ltd filed Critical Tyco Electronics AMP Korea Co Ltd
Publication of CN105990735A publication Critical patent/CN105990735A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/40Securing contact members in or to a base or case; Insulating of contact members
    • H01R13/405Securing in non-demountable manner, e.g. moulding, riveting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035Plated dielectric material
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/502Bases; Cases composed of different pieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46Bases; Cases
    • H01R13/52Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
    • H01R13/521Sealing between contact members and housing, e.g. sealing insert

Landscapes

  • Telephone Set Structure (AREA)
  • Connector Housings Or Holding Contact Members (AREA)

Abstract

The invention discloses a charging connector combination member having a function of preventing water. The charging connector combination member comprises a molding part, a contact part which comprises a contact area which is arranged on the modling part and is configured to electrically connected to a corresponding main body, a welding area which is arranged under the molding part and is configured to be installed on a printed circuit board (PCB) and to be electriclaly connected to the printed circuit board, and an insulation cap portion which is configured to couple to the modling part.

Description

充电连接器组合件 Charging Connector Assembly

相关申请的交叉引用Cross References to Related Applications

本申请要求2015年3月16日在韩国知识产权局提交的韩国专利申请号10-2015-0035806的优先权权益,其公开通过引用结合于本文。 This application claims the benefit of priority from Korean Patent Application No. 10-2015-0035806 filed in the Korean Intellectual Property Office on March 16, 2015, the disclosure of which is incorporated herein by reference.

技术领域 technical field

示范性实施例涉及具有简单结构和防水功能的充电连接器组合件。 Exemplary embodiments relate to a charging connector assembly having a simple structure and a waterproof function.

背景技术 Background technique

通常,终端包含语音通话功能、视频通话功能、信息输入/输出(I/O)功能以及数据存储功能。由于新近的功能的多样化,各种内容可通过终端来访问。因此,终端也可包含实现个人信息的存储或信用支付处理的存储媒介功能以及拍摄照片或视频、播放音乐文件或视频文件、玩游戏以及接收广播的其他复杂功能。综合性地提供这类功能以实现多媒体装置。 Generally, a terminal includes a voice call function, a video call function, an information input/output (I/O) function, and a data storage function. Due to the recent diversification of functions, various contents can be accessed through the terminal. Therefore, the terminal may also include a storage medium function that realizes storage of personal information or credit payment processing and other complex functions of taking photos or videos, playing music files or video files, playing games, and receiving broadcasts. Such functions are comprehensively provided to realize a multimedia device.

当在终端中提供许多附加功能时,连接器可用于与外围装置的连接以及数据I/O。连接器可包含与外围装置接口的I/O端口或使用户能够传送终端的数据(必要时)的通用串行总线(USB)端口。外围装置可包含例如耳机、远程控制和电视机(TV)。 While many additional functions are provided in the terminal, the connector can be used for connection with peripheral devices as well as data I/O. The connector may include an I/O port to interface with a peripheral device or a Universal Serial Bus (USB) port to enable a user to transfer data of the terminal if necessary. Peripherals may include, for example, headphones, remote controls, and televisions (TVs).

同时,终端包含用于充电的充电连接器组合件。现有充电连接器组合件需要防水结构。 Meanwhile, the terminal contains a charging connector assembly for charging. Existing charging connector assemblies require a waterproof structure.

发明内容 Contents of the invention

示范性实施例提供可增强充电连接器组合件的防水效率的充电连接器组合件。 Exemplary embodiments provide a charging connector assembly that may enhance waterproof efficiency of the charging connector assembly.

本文中旨在实现的技术任务不限于前述,并且未提到的其他技术任务也应由本领域的技术人员从下面的描述可清楚地理解。 Technical tasks intended to be achieved herein are not limited to the foregoing, and other technical tasks not mentioned should also be clearly understood by those skilled in the art from the following description.

根据一方面,存在一种充电连接器组合件,其包含:模制部分(mold portion);接触部分,其包含设置在模制部分上并且配置成电连接到对应实体(counterpart entity)的接触区;焊接区,其设置在模制部分之下以及配置成安装到印刷电路板(PCB)并且与其电连接;以及绝缘盖部分,其配置成覆盖模制部分的顶表面、暴露接触部分以及因此防止湿气流进接触部分中。 According to an aspect, there is a charging connector assembly comprising: a mold portion; a contact portion comprising a mold portion disposed on the mold portion and configured to be electrically connected to a counterpart entity) contact area; solder area, which is provided under the molded part and is configured to be mounted to and electrically connected to a printed circuit board (PCB); and an insulating cover part, which is configured to cover the top surface of the molded part, exposing The contact part and thus the ingress of moisture into the contact part is prevented.

接触部分可包含以插脚(pin)形状提供的多个内部模制物(mold),并且模制部分可包含多个内部模制物接纳部分,内部模制物分别通过该多个内部模制物接纳部分并且因此被接纳。金属材料的涂层可镀在内部模制物的整个表面上,并且内部模制物的顶表面可形成接触区并且内部模制物的底表面可形成焊接区。而且,金属材料的涂层可形成在内部模制物的接触区的至少一部分和焊接区的至少一部分上,并且涂层可被形成以连接接触区和焊接区。在内部模制物耦合到模制部分时,内部模制物可从模制部分的顶表面凸出以具有预设高度。配置成将内部模制物固定到模制部分的导向部分(guide portion)可形成在内部模制物的底表面上。内部模制物可使用与模制部分的材料相同的材料来形成。 The contact part may include a plurality of inner molds provided in a pin shape, and the molded part may include a plurality of inner mold receiving parts through which the inner molds respectively pass. Admitted in part and thus admitted. A coating of metallic material may be plated on the entire surface of the inner molding, and the top surface of the inner molding may form a contact area and the bottom surface of the inner molding may form a soldering area. Also, a coating of a metallic material may be formed on at least a portion of the contact area and at least a portion of the welding area of the inner molding, and the coating may be formed to connect the contact area and the welding area. When the inner molding is coupled to the molding part, the inner molding may protrude from a top surface of the molding part to have a preset height. A guide portion configured to fix the inner molding to the molding portion may be formed on a bottom surface of the inner molding. The inner molding may be formed using the same material as that of the molded part.

多个凸出部(protrusion)可形成在模制部分的顶表面上,并且接触区可通过将金属材料的涂层形成在凸出部的至少一部分上来形成,并且焊接区可通过将金属材料的涂层形成在模制部分的底表面的至少一部分上来形成。接触区和焊接区可通过将金属材料的涂层形成在模制部分的顶表面和底表面的至少一部分上来形成。而且,涂层可被形成以连接接触区和焊接区。 A plurality of protrusions may be formed on the top surface of the molded part, and the contact area may be formed by forming a coating of a metallic material on at least a part of the protrusions, and the soldering area may be formed by applying a coating of a metallic material. A coating is formed on at least a portion of a bottom surface of the molded portion. The contact area and the welding area may be formed by forming a coating of a metallic material on at least a portion of the top and bottom surfaces of the molded part. Also, a coating may be formed to connect the contact area and the pad.

涂层可使用金(Au)、镍(Ni)和铜(Cu)的至少一个来形成。 The coating layer may be formed using at least one of gold (Au), nickel (Ni), and copper (Cu).

绝缘盖部分可被形成以覆盖模制部分的顶表面和侧面,并且多个孔可形成在绝缘盖部分上以暴露接触区。法兰可形成在绝缘盖部分的侧面上,并且法兰可响应于耦合在绝缘盖部分和对应实体之间而被压缩,并且可封闭与对应实体的间隔因而防止湿气流进模制部分中。而且,绝缘盖部分可设置成相对于与对应实体的耦合方向垂直,并且多个法兰可在绝缘盖部分上设置为平行。绝缘盖部分可使用包含橡胶的弹性材料来形成。 An insulating cover part may be formed to cover a top surface and a side of the molding part, and a plurality of holes may be formed on the insulating cover part to expose the contact area. A flange may be formed on a side of the insulating cover portion, and the flange may be compressed in response to coupling between the insulating cover portion and the corresponding entity, and may close a gap with the corresponding entity thereby preventing moisture from flowing into the molded portion. Also, the insulating cover part may be arranged perpendicularly with respect to a coupling direction with the corresponding entity, and a plurality of flanges may be arranged parallel on the insulating cover part. The insulating cover portion may be formed using an elastic material including rubber.

根据另一个方面,提供一种充电连接器组合件,其包含:模制部分;多个内部模制物,其配置成通过模制部分,并且每个内部模制物包含配置成从内部模制物的顶表面凸出在模制部分之上并且在内部模制物的顶表面上电连接到对应实体的接触区以及配置成在内部模制物的底表面上电连接到PCB的焊接区;以及绝缘盖部分,其配置成覆盖接触部分的顶表面和侧面、暴露接触区并且防止湿气流进接触部分中。 According to another aspect, there is provided a charging connector assembly comprising: a molded portion; a plurality of inner moldings configured to pass through the molded portion, each inner molding comprising a molded portion configured to be molded from within The top surface of the object protrudes above the molded part and is electrically connected to the contact area of the corresponding entity on the top surface of the inner molding and is configured to be electrically connected to the soldering area of the PCB on the bottom surface of the inner molding; and an insulating cover portion configured to cover the top surface and sides of the contact portion, expose the contact area, and prevent moisture from flowing into the contact portion.

金属材料的涂层可形成在内部模制物的整个表面上。金属材料的涂层可形成在内部模制物的接触区的至少一部分和焊接区的至少一部分上,并且涂层可被形成以连接接触区和焊接区。 A coating of metallic material may be formed on the entire surface of the inner molding. A coating of a metallic material may be formed on at least a portion of the contact area and at least a portion of the welding area of the inner molding, and the coating may be formed to connect the contact area and the welding area.

根据再一个方面,提供一种充电连接器组合件,其包含:模制部分,其包含形成在模制部分之上的接触区以及形成在内部模制物之下的焊接区,接触区配置成电连接到对应实体并且以整体形式从模制部分的顶表面凸出,并且焊接区配置成安装到PCB并且与其电连接;以及绝缘盖部分,其配置成覆盖接触部分的顶表面和侧面并且暴露接触区。 According to yet another aspect, there is provided a charging connector assembly comprising: a molded portion including a contact area formed over the molded portion and a soldering area formed under an inner moulding, the contact area being configured to Electrically connected to the corresponding entity and protruding from the top surface of the molded part in integral form, and the soldering pad is configured to be mounted to the PCB and electrically connected to it; and an insulating cover part, which is configured to cover the top surface and sides of the contact part and expose contact area.

金属材料的涂层可形成在包含在模制部分中的焊接区的至少一部分和接触区的至少一部分上,并且涂层可被形成以连接接触区和焊接区。 A coating of a metallic material may be formed on at least a portion of the land and at least a portion of the contact area included in the molding part, and the coating may be formed to connect the contact area and the land.

效果 Effect

根据示范性实施例,有可能增强充电连接器组合件的防水效率。 According to exemplary embodiments, it is possible to enhance the waterproof efficiency of the charging connector assembly.

而且,根据示范性实施例,有可能使用模制部分增强装配能力和产量以及防水能力。 Also, according to exemplary embodiments, it is possible to enhance assembly ability and yield and waterproof ability using molded parts.

附图说明 Description of drawings

从结合如下的附图所进行的示例实施例的下面描述,本公开的这些和/或其他方面、特征和优点将变得显而易见并且更容易领会: These and/or other aspects, features and advantages of the present disclosure will become apparent and more readily appreciated from the following description of example embodiments taken in conjunction with the following drawings:

图1是根据一个实施例的充电连接器组合件的透视图; 1 is a perspective view of a charging connector assembly according to one embodiment;

图2是图1的充电连接器组合件的底部透视图; 2 is a bottom perspective view of the charging connector assembly of FIG. 1;

图3是图1的充电连接器组合件的侧截面图; 3 is a side sectional view of the charging connector assembly of FIG. 1;

图4图示图1的充电连接器组合件的装配过程; Fig. 4 illustrates the assembly process of the charging connector assembly of Fig. 1;

图5是根据另一个实施例的充电连接器组合件的透视图; 5 is a perspective view of a charging connector assembly according to another embodiment;

图6是图5的充电连接器组合件的底部透视图; 6 is a bottom perspective view of the charging connector assembly of FIG. 5;

图7是图5的充电连接器组合件的侧截面图;以及 7 is a side cross-sectional view of the charging connector assembly of FIG. 5; and

图8图示图5的充电连接器组合件的装配过程。 FIG. 8 illustrates an assembly process of the charging connector assembly of FIG. 5 .

具体实施方式 detailed description

在下文中,将参考附图详细地描述一些示例实施例。关于分配给附图中组件的参考数字,应注意,相同的组件将通过相同的参考数字来指定,在任何可能的地方,即使它们在不同的附图中示出。而且,在示例实施例的描述中,众所周知的相关结构或功能的详细描述在认为这种描述将引起本公开的模糊解释时将被省略。 Hereinafter, some example embodiments will be described in detail with reference to the accompanying drawings. With regard to the reference numbers assigned to components in the drawings, it should be noted that like components will be designated by the same reference numbers wherever possible even if they are shown in different drawings. Also, in descriptions of example embodiments, detailed descriptions of well-known related structures or functions will be omitted when it is considered that such descriptions will cause obscure interpretation of the present disclosure.

另外,诸如第一、第二、A、B、(a)、(b)等的术语可在本文中用来描述组件。这些术语学的每一个不是用来限定对应组件的本质、顺序或次序,而是仅用来将对应组件与一个或多个其他组件区分。应注意,如果在说明书中描述一个组件“连接”、“耦合”或“结合”到另一个组件,则第三组件可“连接”、“耦合”或“结合”在第一和第二组件之间,虽然第一组件可直接连接、耦合或结合到第二组件。 Additionally, terms such as first, second, A, B, (a), (b), etc. may be used herein to describe components. Each of these nomenclatures is not used to define the nature, order or order of the corresponding component, but is only used to distinguish the corresponding component from one or more other components. It should be noted that if it is described in the specification that one component is "connected", "coupled" or "coupled" to another component, the third component may be "connected", "coupled" or "coupled" between the first and second components While a first component may be directly connected, coupled or bonded to a second component.

除非另有限定,本文中所使用的包含技术和科学术语的所有术语具有与由示例实施例属于的领域中的技术人员普遍理解的相同的含义。将进一步理解,术语,比如在常用字典中所限定的那些,应解释为具有与其在相关领域的上下文中的含义一致的含义并且将不以理想化或过度形式(overly formal)的意义来解释,除非本文中明确如此限定。 Unless otherwise defined, all terms including technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which example embodiments belong. It will be further understood that terms, such as those defined in commonly used dictionaries, shall be construed to have a meaning consistent with their meaning in the context of the relevant art and shall not be construed in an idealized or overly formal sense, Unless expressly so limited herein.

在下文中,根据示范性实施例的充电连接器组合件10将参考图1到图8来描述。 Hereinafter, a charging connector assembly 10 according to an exemplary embodiment will be described with reference to FIGS. 1 to 8 .

在下文中,在描述参考数字时,相似参考数字指的是相似组件,并且与其相关的重复解释在这里将被省略。在确定与已知相关领域有关的详细描述使示范性实施例呈现模糊时,该描述将被省略。此外,在下面的术语“上/下”、“左/右”和“前/后”基于图示充电连接器组合件10的方向或将充电连接器组合件10安装在印刷电路板(PCB)1上的状态来描述,然而,示范性实施例不限制于此。对应组件的本质、顺序或次序等不被这种术语限制。本文中所使用的术语“终端”可不仅包含移动通信终端而且包含不配备有通信功能的诸如个人计算机(PC)等的装置、诸如照相机、音乐播放器等的便携式装置以及诸如表等的可佩戴装置。 Hereinafter, when describing reference numerals, like reference numerals refer to like components, and repeated explanations related thereto will be omitted here. When it is determined that a detailed description related to known related art would obscure the exemplary embodiments, the description will be omitted. In addition, the terms "up/down", "left/right" and "front/rear" in the following are based on the orientation of the charging connector assembly 10 in illustration or mounting the charging connector assembly 10 on a printed circuit board (PCB). 1, however, exemplary embodiments are not limited thereto. The nature, order or sequence, etc. of the corresponding components are not limited by such terms. The term "terminal" used herein may include not only mobile communication terminals but also devices such as personal computers (PCs) that are not equipped with a communication function, portable devices such as cameras, music players, etc., and wearable devices such as watches. device.

在下文中,根据一个示范性实施例的充电连接器组合件10将参考图1到图4来描述。图1是根据一个实施例的充电连接器组合件10的透视图,图2是图1的充电连接器组合件10的底部透视图,图3是图1的充电连接器组合件10的侧截面图,以及图4图示图1的充电连接器组合件10的装配过程。 Hereinafter, a charging connector assembly 10 according to an exemplary embodiment will be described with reference to FIGS. 1 to 4 . 1 is a perspective view of a charging connector assembly 10 according to one embodiment, FIG. 2 is a bottom perspective view of the charging connector assembly 10 of FIG. 1 , and FIG. 3 is a side section of the charging connector assembly 10 of FIG. 1 1 and 4 illustrate the assembly process of the charging connector assembly 10 of FIG. 1 .

参考图1到图4,充电连接器组合件10可包含配置成形成充电连接器组合件10的外形的模制部分12、配置成电连接到对应实体(未示出)的接触部分11、配置成电耦合到PCB 1的焊接区112以及配置成覆盖模制部分12的绝缘盖部分13。 1 to 4, the charging connector assembly 10 may include a molding portion 12 configured to form an outer shape of the charging connector assembly 10, a contact portion 11 configured to be electrically connected to a corresponding entity (not shown), a configuration To be electrically coupled to the solder pad 112 of the PCB 1 and the insulating cover portion 13 configured to cover the molding portion 12 .

在这里,“对应实体”被提供给配置成耦合到充电连接器组合件10的装置。根据一个实施例的充电连接器组合件10可被提供给终端,并且对应实体可以是连接到外部电源等的电缆。然而,它仅是示例并且因此对应实体可以是物理连接和电连接到充电连接器组合件10的各种装置。 Here, a “corresponding entity” is provided to a device configured to be coupled to the charging connector assembly 10 . The charging connector assembly 10 according to one embodiment may be provided to a terminal, and the corresponding entity may be a cable connected to an external power source or the like. However, it is only an example and thus the corresponding entities may be various devices that are physically and electrically connected to the charging connector assembly 10 .

模制部分12形成充电连接器组合件10的外形并且使用注模法来形成。 The molded portion 12 forms the outer shape of the charging connector assembly 10 and is formed using injection molding.

接触部分11可包含配置成通过模制部分12并且具有预定插脚或圆柱形状的多个内部模制物110。例如,接触部分11可包含五个内部模制物110。然而,它仅是示例并且因此内部模制物110的数量可不同地修改。 The contact portion 11 may include a plurality of inner moldings 110 configured to pass through the molded portion 12 and having a predetermined pin or cylindrical shape. For example, the contact portion 11 may contain five inner moldings 110 . However, it is only an example and thus the number of inner moldings 110 may be variously modified.

配置成电连接到对应实体的接触区111形成在内部模制物110的顶表面上,并且配置成安装到PCB 1并且与其电连接的焊接区112形成在内部模制物110的底表面上。内部模制物110由非导电材料通过注模法形成。预定金属材料的涂层形成在内部模制物110的表面上,由此形成接触区111和焊接区112。在这里,内部模制物110可使用与模制部分12的材料相同或不同的材料来形成。 Contact pads 111 configured to be electrically connected to corresponding entities are formed on the top surface of the inner molding 110 , and pads 112 configured to be mounted to and electrically connected to the PCB 1 are formed on the bottom surface of the inner molding 110 . The inner molding 110 is formed of a non-conductive material by injection molding. A coating of a predetermined metal material is formed on the surface of the inner molding 110 , thereby forming a contact area 111 and a welding area 112 . Here, the inner molding 110 may be formed using the same or different material as that of the molding part 12 .

在这里,涂层可包含可电连接到终端和PCB 1的导电金属材料。例如,涂层可使用金(Au)、镍(Ni)和铜(Cu)中的一个或其至少一个的合金来形成。备选地,涂层可大体包含Ni材料以及有选择性地包含Au或Cu材料。然而,它仅是示例并且因此任何导电材料可被用于涂层。 Here, the coating may comprise a conductive metallic material electrically connectable to the terminals and the PCB 1 . For example, the coating layer may be formed using one of gold (Au), nickel (Ni), and copper (Cu), or an alloy of at least one thereof. Alternatively, the coating may consist essentially of Ni material and optionally Au or Cu material. However, it is only an example and thus any conductive material may be used for the coating.

涂层可形成在内部模制物110的整个表面上或可仅形成在用作接触区111和焊接区112的部分上。在涂层仅形成在内部模制物110的部分区上时,形成涂层以连接接触区111和焊接区112。 The coating may be formed on the entire surface of the inner molding 110 or may be formed only on portions serving as the contact area 111 and the welding area 112 . When the coating layer is formed only on a partial area of the inner molding 110 , the coating layer is formed to connect the contact area 111 and the welding area 112 .

而且,在内部模制物110被插入到模制部分12的孔例如用于接纳内部模制物110的接纳部分121中并且因此耦合到模制部分12时,接触区111以预定高度从内部模制物110凸出在模制部分12之上。内部模制物110可耦合到模制部分12,使得形成在内部模制物110的底表面上的焊接区112以与模制部分12的底表面相同的高度来安置或进一步从内部模制物110向下凸出在模制部分12之下。 Also, when the inner molding 110 is inserted into a hole of the molded part 12 such as the receiving part 121 for receiving the inner molded 110 and thus coupled to the molded part 12, the contact area 111 is raised from the inner mold at a predetermined height. Artifact 110 protrudes above molded part 12 . The inner molding 110 may be coupled to the molded part 12 such that the land 112 formed on the bottom surface of the inner molded 110 is placed at the same height as the bottom surface of the molded part 12 or further removed from the inner molded part 110 . 110 protrudes downwards under the molded portion 12 .

凸起(projection)112a可以以预定高度从焊接区112向下凸出。参考图2和图3,凸起112a可插入到PCB 1并且因此耦合到PCB 1,因此增强PCB 1和充电连接器组合件10之间的耦合力以及耦合可靠性。 A projection 112 a may protrude downward from the land 112 at a predetermined height. Referring to FIGS. 2 and 3 , the protrusion 112 a may be inserted into the PCB 1 and thus coupled to the PCB 1 , thus enhancing coupling force and coupling reliability between the PCB 1 and the charging connector assembly 10 .

在这里,导向部分113可形成在内部模制物110的中间或底表面上以将内部模制物110固定到模制部分12。例如,朝径向外部方向凸出的多个导向部分113可形成在内部模制物110的底表面上,并且导向部分113可固定地插入的导向槽122可形成在模制部分12上。此外,配置成固定到模制部分12的耦合部分114可以以这样的方式来形成,使得内部模制物110的外周的一部分在内部模制物110的纵向方向的中间向外凸出。然而,内部模制物110的形状不限于附图,并且可以以各种形状来提供内部模制物110。而且,导向部分113和耦合部分114可从内部模制物110省略。 Here, a guide part 113 may be formed on a middle or bottom surface of the inner molding 110 to fix the inner molding 110 to the molding part 12 . For example, a plurality of guide parts 113 protruding toward the radially outer direction may be formed on the bottom surface of the inner molding 110 , and guide grooves 122 into which the guide parts 113 may be fixedly inserted may be formed on the molding part 12 . In addition, the coupling portion 114 configured to be fixed to the molding portion 12 may be formed in such a manner that a part of the outer circumference of the inner molding 110 protrudes outward in the middle of the inner molding 110 in the longitudinal direction. However, the shape of the inner molding 110 is not limited to the drawings, and the inner molding 110 may be provided in various shapes. Also, the guide part 113 and the coupling part 114 may be omitted from the inner molding 110 .

绝缘盖部分13可使用绝缘材料来形成,并且为了在耦合到对应实体时防水可使用诸如橡胶的弹性材料来形成。形成绝缘盖部分13以覆盖模制部分12的顶表面和侧面。多个孔131形成在绝缘盖部分13的顶表面中以向外暴露接触区111。在这里,由于提供绝缘盖部分13,所以可在接触区111周围直接应用密封。因此,有可能有效地防止湿气流进接触部分11中。 The insulating cover part 13 may be formed using an insulating material, and may be formed using an elastic material such as rubber for waterproofing when coupled to a corresponding entity. The insulating cover portion 13 is formed to cover the top surface and side surfaces of the molding portion 12 . A plurality of holes 131 are formed in the top surface of the insulating cover part 13 to expose the contact region 111 to the outside. Here, due to the provision of the insulating cover part 13 , a seal can be applied directly around the contact area 111 . Therefore, it is possible to effectively prevent the inflow of moisture into the contact portion 11 .

而且,至少一个法兰132形成在绝缘盖部分13的侧面上以增强防水能力。法兰132响应于与对应实体或盒(case)2耦合而被压缩并且弹性地变形以封闭与对应实体或盒2的间隔。例如,多个法兰132可在绝缘盖部分13的侧面上形成为平行,并且法兰132可形成为相对于与对应实体的耦合方向垂直。然而,它仅是示例并且绝缘盖部分13和法兰132的形状可不同地修改。 Also, at least one flange 132 is formed on the side of the insulating cover part 13 to enhance waterproof capability. The flange 132 is compressed in response to coupling with the corresponding entity or case 2 and elastically deforms to close the compartment with the corresponding entity or case 2 . For example, a plurality of flanges 132 may be formed in parallel on the side of the insulating cover part 13, and the flanges 132 may be formed perpendicular to a coupling direction with a corresponding entity. However, it is only an example and the shapes of the insulating cover portion 13 and the flange 132 may be variously modified.

在下文中,将描述根据一个实施例的充电连接器组合件10的装配过程。参考图4,准备模制部分12和多个内部模制物110。涂层使用预定金属材料形成在每个内部模制物110的表面上。有涂层的内部模制物110插入到模制部分12中并且因此耦合到模制部分12。每个内部模制物110的从模制部分12凸出的部分用作接触区111,并且模制部分12的底表面用作焊接区112。通过从上面将绝缘盖部分13耦合到与内部模制物110耦合的模制部分12,完成充电连接器组合件10的装配。 Hereinafter, an assembly process of the charging connector assembly 10 according to one embodiment will be described. Referring to FIG. 4 , a molded part 12 and a plurality of inner moldings 110 are prepared. A coating layer is formed on the surface of each inner molding 110 using a predetermined metal material. The coated inner molding 110 is inserted into the molded part 12 and thus coupled to the molded part 12 . A portion of each inner molding 110 protruding from the molded portion 12 serves as a contact area 111 , and a bottom surface of the molded portion 12 serves as a land 112 . Assembly of the charging connector assembly 10 is completed by coupling the insulating cover portion 13 to the molding portion 12 coupled with the inner molding 110 from above.

根据实施例,由于充电连接器组合件10使用注模法通过将模制部分12和将是多个插脚的内部模制物110耦合来制造,有可能简化充电连接器组合件10的结构和形状,促进其制造和装配,并且增强其防水能力。 According to the embodiment, since the charging connector assembly 10 is manufactured using injection molding by coupling the molded part 12 and the inner molding 110 which will be a plurality of pins, it is possible to simplify the structure and shape of the charging connector assembly 10 , to facilitate its manufacture and assembly, and enhance its waterproof ability.

参考图5到图8,在充电连接器组合件20中,可与模制部分22整体地形成接触部分21。在下文中,根据另一个示范性实施例的充电连接器组合件20将参考图5到图8来描述。相似参考数字将指的是上面在那一个示范性实施例中所描述的相似组件,并且在这里将省略重复的解释。图5是根据另一个示范性实施例的充电连接器组合件20的透视图,图6是图5的充电连接器组合件20的底部透视图,图7是图5的充电连接器组合件20的侧截面图,以及图8图示图5的充电连接器组合件20的装配过程。 Referring to FIGS. 5 to 8 , in the charging connector assembly 20 , the contact portion 21 may be integrally formed with the molding portion 22 . Hereinafter, a charging connector assembly 20 according to another exemplary embodiment will be described with reference to FIGS. 5 to 8 . Like reference numerals will refer to like components described above in that one exemplary embodiment, and repeated explanations will be omitted here. 5 is a perspective view of a charging connector assembly 20 according to another exemplary embodiment, FIG. 6 is a bottom perspective view of the charging connector assembly 20 of FIG. 5 , and FIG. 7 is a bottom perspective view of the charging connector assembly 20 of FIG. 5 . 8 illustrates the assembly process of the charging connector assembly 20 of FIG. 5 .

参考图5到图8,在充电连接器组合件20中,省略了图1到图4的内部模制物110,并且整体地形成接触部分21和模制部分22。充电连接器组合件20包含配置成形成充电连接器组合件20的外形的模制部分22以及配置成覆盖模制部分22的绝缘盖部分23。配置成电连接到对应实体(未示出)的接触区211形成在模制部分22的顶表面上,并且配置成电连接到PCB 1的焊接区212形成在模制部分22的底表面上。在下文中,接触区211和焊接区212被称为接触部分21。 Referring to FIGS. 5 to 8 , in the charging connector assembly 20 , the inner molding 110 of FIGS. 1 to 4 is omitted, and the contact portion 21 and the molding portion 22 are integrally formed. The charging connector assembly 20 includes a molding portion 22 configured to form an outer shape of the charging connector assembly 20 and an insulating cover portion 23 configured to cover the molding portion 22 . Contact areas 211 configured to be electrically connected to corresponding entities (not shown) are formed on the top surface of the molded part 22 , and lands 212 configured to be electrically connected to the PCB 1 are formed on the bottom surface of the molded part 22 . Hereinafter, the contact region 211 and the pad region 212 are referred to as a contact portion 21 .

模制部分22形成充电连接器组合件20的外形。形成多个凸出部210以预定高度从模制部分22的顶表面凸出。接触区211通过将金属材料的涂层形成在凸出部210的至少一部分上来形成。形成涂层以连接接触区211和焊接区212。例如,接触区211可具有条带形状以连接到形成在模制部分22的底表面上的焊接区212。然而,它仅是示例并且涂层可形成在凸出部210的整个表面上。 The molded portion 22 forms the outer shape of the charging connector assembly 20 . A plurality of protrusions 210 are formed to protrude from the top surface of the molding part 22 at a predetermined height. The contact region 211 is formed by forming a coating of a metallic material on at least a portion of the protrusion 210 . A coating is formed to connect the contact area 211 and the pad area 212 . For example, the contact area 211 may have a strip shape to be connected to the land 212 formed on the bottom surface of the molding part 22 . However, it is only an example and a coating may be formed on the entire surface of the protrusion 210 .

焊接区212通过将金属材料的涂层形成在模制部分22的底表面的至少一部分上来形成。例如,焊接区212也可具有条带形状以连接到接触区211。凸起212a可以以预定高度从焊接区212向下凸出。参考图6和图7,凸起212a可插入到PCB 1中并且因此耦合到PCB 1,因此增强PCB 1和充电连接器组合件20之间的耦合力和耦合可靠性。 The land 212 is formed by forming a coating of a metallic material on at least a portion of the bottom surface of the molding part 22 . For example, the land 212 may also have a strip shape to connect to the contact area 211 . The protrusion 212a may protrude downward from the pad 212 at a predetermined height. Referring to FIGS. 6 and 7 , the protrusion 212 a may be inserted into the PCB 1 and thus coupled to the PCB 1 , thus enhancing coupling force and coupling reliability between the PCB 1 and the charging connector assembly 20 .

为了防水,绝缘盖部分23可使用绝缘材料以及诸如橡胶的弹性材料来形成。形成绝缘盖部分23以覆盖模制部分22的顶部和侧面。多个孔231形成在绝缘盖部分23的顶表面上以向外暴露接触区211。在这里,绝缘盖部分23可直接在接触区211周围进行密封,并且有可能有效地防止湿气通过接触区211流进接触部分21中。而且,至少一个法兰232形成在绝缘盖部分23的侧面上以增强防水能力。 For waterproofing, the insulating cover portion 23 may be formed using an insulating material and an elastic material such as rubber. An insulating cover portion 23 is formed to cover the top and sides of the molding portion 22 . A plurality of holes 231 are formed on the top surface of the insulating cover part 23 to expose the contact region 211 outward. Here, the insulating cover part 23 can seal directly around the contact area 211 and it is possible to effectively prevent moisture from flowing into the contact part 21 through the contact area 211 . Also, at least one flange 232 is formed on a side of the insulating cover part 23 to enhance waterproof capability.

在下文中,将描述根据另一个示范性实施例的充电连接器组合件20的装配过程。参考图8,准备模制部分22。通过使用金属材料将涂层形成在模制部分22顶表面上的凸出部210的至少一部分以及模制部分22底表面的至少一部分上来形成接触区211和焊接区212。通过将绝缘盖部分23耦合到模制部分22,完成充电连接器组合件20的装配。 Hereinafter, an assembly process of the charging connector assembly 20 according to another exemplary embodiment will be described. Referring to Fig. 8, the molded part 22 is prepared. The contact area 211 and the welding area 212 are formed by forming a coating on at least a part of the protrusion 210 on the top surface of the molding part 22 and at least a part of the bottom surface of the molding part 22 using a metal material. Assembly of the charging connector assembly 20 is completed by coupling the insulating cover portion 23 to the molded portion 22 .

根据示范性实施例,由于充电连接器组合件20的模制部分22使用注模法来形成并且整体地形成模制部分22和接触部分21,有可能简化充电连接器组合件20的形状和结构,促进其制造和装配,并且增强其防水能力。 According to the exemplary embodiment, since the molding portion 22 of the charging connector assembly 20 is formed using injection molding and the molding portion 22 and the contact portion 21 are integrally formed, it is possible to simplify the shape and structure of the charging connector assembly 20 , to facilitate its manufacture and assembly, and enhance its waterproof ability.

根据示范性实施例,由于接触部分11、21使用注模法来制造,所以有可能增强防水能力,实现简单结构和形状,并且增强装配能力和产量。而且,有可能单独制造并且然后装配接触部分11和模制部分12,或有可能整体地形成接触部分21和模制部分22。因此,有可能制造能够增强防水能力以及增强装配能力和产量的充电连接器组合件10、20。而且,由于绝缘盖部分13、23可直接在接触区111、211周围进行密封,因此有可能有效地防止湿气流进接触部分11、21中。 According to an exemplary embodiment, since the contact parts 11, 21 are manufactured using injection molding, it is possible to enhance waterproof capability, realize a simple structure and shape, and enhance assembly ability and yield. Also, it is possible to separately manufacture and then assemble the contact portion 11 and the molding portion 12 , or it is possible to integrally form the contact portion 21 and the molding portion 22 . Therefore, it is possible to manufacture the charging connector assembly 10, 20 capable of enhancing the waterproof capability as well as enhancing the assembly ability and yield. Furthermore, since the insulating cover portion 13 , 23 can be sealed directly around the contact area 111 , 211 , it is possible to effectively prevent moisture from flowing into the contact portion 11 , 21 .

上面已描述多个示范性实施例。然而,应理解,可对这些示例实施例作出各种修改。例如,可实现适合的结果,如果所描述的技术以不同顺序执行的话和/或如果所描述系统、构造、装置或电路中的组件以不同方式组合和/或由其等同物或其他组件替代或补充的话。因此,其他实施方式处于随附权利要求书的范围内。 A number of exemplary embodiments have been described above. However, it should be understood that various modifications may be made to these example embodiments. For example, suitable results may be achieved if the described techniques are performed in a different order and/or if components in the described system, configuration, device, or circuit are combined in a different manner and/or are replaced by equivalents or other components thereof or Supplementary words. Accordingly, other implementations are within the scope of the following claims.

Claims (20)

1. a charge connector molectron, including:
Molding part;
Contact portion, including the contact area being arranged on described molding part and be configured to be electrically connected to correspondent entity;
Weld zone, is arranged under described molding part and is configured to attach to printed circuit board (PCB) (PCB) and be connected electrically;And
Insulating cover segments, is configured to cover the top surface of described molding part, expose described contact portion and prevent dampness from flowing in described contact portion.
2. charge connector molectron as claimed in claim 1, wherein said contact portion includes the multiple inner molded things provided with pin shape, and
Described molding part includes multiple inner molded thing receiving portion, and therefore described inner molded thing by the plurality of inner molded thing receiving portion and is accepted respectively.
3. charge connector molectron as claimed in claim 2, wherein the coating of metal material is plated on the whole surface of described inner molded thing, and the top surface of described inner molded thing forms the basal surface of described contact area and described inner molded thing and forms described weld zone.
4. charge connector molectron as claimed in claim 2, wherein the coating of metal material be formed at described inner molded thing described contact area at least some of and described weld zone at least some of on, and
Described coating is formed to connect described contact area and described weld zone.
5. charge connector molectron as claimed in claim 2, wherein when described inner molded thing is coupled to described molding part, described inner molded thing protrudes from the described top surface of described molding part to have preset height.
6. charge connector molectron as claimed in claim 2, is wherein configured to be formed on the basal surface of described inner molded thing the targeting part that described inner molded thing is fixed to described molding part.
7. charge connector molectron as claimed in claim 2, wherein said inner molded thing uses the material identical with the material of described molding part to be formed.
8. charge connector molectron as claimed in claim 1, plurality of protuberance is formed on the top surface of described molding part, and described contact area by the coating of metal material is formed at described protuberance at least some of on formed, and
Described weld zone by the described coating of described metal material is formed at the basal surface of described molding part at least some of on formed.
9. charge connector molectron as claimed in claim 8, wherein said contact area and described weld zone are formed by the described coating of described metal material being formed on the described top surface of described molding part and at least some of of described basal surface.
10. charge connector molectron as claimed in claim 8, wherein said coating is formed to connect described contact area and described weld zone.
11. charge connector molectrons as claimed in claim 1, wherein said coating uses at least one in gold (Au), nickel (Ni) and copper (Cu) to be formed.
12. charge connector molectrons as claimed in claim 1, wherein said Insulating cover segments is formed to cover top surface and the side of described molding part, and multiple hole is formed on described Insulating cover segments to expose described contact area.
13. charge connector molectrons as claimed in claim 12, wherein flange is formed on the described side of described Insulating cover segments, and
Described flange is compressed between described Insulating cover segments and described correspondent entity in response to being coupling in, and close and the interval of described correspondent entity thus prevent dampness from flowing in described molding part.
14. charge connector molectrons as claimed in claim 13, wherein said Insulating cover segments be disposed relative to described correspondent entity to couple direction vertical, and multiple flange is provided parallel in described insulation covering part.
15. charge connector molectrons as claimed in claim 12, wherein said Insulating cover segments uses the elastomeric material comprising rubber to be formed.
16. 1 kinds of charge connector molectrons, including:
Molding part;
Multiple inner molded things, it is configured through described molding part, and each inner molded thing includes being configured to protrude from the top surface of described inner molded thing and be electrically connected to the contact area of correspondent entity on described molding part on the described top surface of described inner molded thing and be configured to be electrically connected to the weld zone of printed circuit board (PCB) (PCB) on the basal surface of described inner molded thing;And
Insulating cover segments, is configured to cover the top surface of contact portion and side and expose described contact area.
17. charge connector molectrons as claimed in claim 16, wherein the coating of metal material is formed on the whole surface of described inner molded thing.
18. charge connector molectrons as claimed in claim 16, wherein the coating of metal material be formed at described inner molded thing described contact area at least some of and described weld zone at least some of on, and described coating is formed to connect described contact area and described weld zone.
19. 1 kinds of charge connector molectrons, including:
Molding part, including the contact area being formed on described molding part and be formed at the weld zone under inner molded thing, described contact area is configured to be electrically connected to correspondent entity and protrude from the top surface of described molding part with integral form, and described weld zone is configured to attach to printed circuit board (PCB) (PCB) and is connected electrically;And
Insulating cover segments, is configured to cover the top surface of contact portion and side, the described contact area of exposure and prevents dampness from flowing in described contact portion.
20. charge connector molectrons as claimed in claim 19, wherein the coating of metal material be formed at the described contact area being included in described molding part at least some of and described weld zone at least some of on, and
Described coating is formed to connect described contact area and described weld zone.
CN201610148643.XA 2015-03-16 2016-03-16 Charging conenctor combination member Pending CN105990735A (en)

Applications Claiming Priority (2)

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KR1020150035806A KR20160111100A (en) 2015-03-16 2015-03-16 Signal pad
KR10-2015-0035806 2015-03-16

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Application publication date: 20161005