CN105988293B - Method and system for detecting negative film error - Google Patents

Abstract

A method for detecting film errors comprises: a providing step, a configuring step, and a detecting step. The providing step provides a light-transmitting substrate disposed on an exposure device and having at least four positioning symbols, and a film having at least four alignment symbols corresponding to the positioning symbols. The configuring step arranges the film on the light-transmitting substrate. The detecting step measures the offset between the positioning symbol and the alignment symbol to obtain the error value of the film. The present invention also provides a system for executing the above method.

Description

Method and system for detecting film errors

technical field

The invention relates to a method and system for detecting film errors, in particular to a method and system for detecting film errors in real time for an exposure device.

Background technique

The current circuit pattern formation method on the printed circuit board is mainly to form a pre-designed circuit pattern on a light-permeable film, and then develop the circuit on the film on a glass fiber substrate by exposure and development technology. pattern, and then carry out subsequent processing to make the printed circuit board. Wherein, before performing the exposure and developing step, the alignment target of the film must be used to accurately align with the alignment hole of the glass fiber substrate, so that the circuit pattern on the film can be accurately formed on the predetermined position of the substrate.

Generally speaking, the circuit pattern on the negative film is firstly designed in the negative film room, and then brought to the process site and installed on the exposure machine for alignment with the glass fiber substrate and subsequent exposure and development process. However, when the negative film and the glass fiber substrate cannot be aligned successfully, it is impossible to judge the error of the negative film or the glass fiber substrate in real time, which causes alignment problems. At present, the negative film is usually disassembled and sent back to the negative film room for size confirmation. After confirming that the size of the negative film is deformed, the negative film will be replaced. The deformation will further affect the result of judgment.

Contents of the invention

The object of the present invention is to provide a method for detecting film errors in real time.

The method for detecting film errors of the present invention includes: a providing step, a configuring step, and a detecting step.

The step of providing provides a light-transmitting substrate mounted on an exposure device, and a negative film, the light-transmitting substrate has at least four positioning symbols opposite to each other and with a preset distance, the negative film has a line forming a predetermined line pattern area, and at least four alignment marks formed in the same process as the predetermined circuit pattern and located outside the line area, the transparent substrate and the film each have a pair of positions, and the positions of the alignment marks are the same as The positioning symbols correspond.

The disposing step uses the alignment points of the light-transmitting substrate and the negative to position the negative on the light-transmitting substrate, and make the positioning symbols correspond to the alignment symbols.

The detection step is to measure the offset between the positioning symbol and the alignment symbol to obtain the error value of the film.

In the method for detecting an error of a film of the present invention, the alignment points of the light-transmitting substrate and the film are selected from at least one of corresponding positioning symbols and alignment symbols.

In the method for detecting the error of the film of the present invention, the film is generally rectangular, and the film also has an invalid area surrounding the line area, and the four alignment symbols of the film are formed corresponding to the four diagonal positions of the invalid area .

In the method for detecting film errors of the present invention, the providing step further provides four detection elements, and the detection step is to calculate the center point of each positioning symbol and each corresponding alignment symbol through the detection elements The offset to get the error value of the film.

In the method for detecting film errors of the present invention, the providing step further defines two first positioning lines spaced apart from each other and extending along a first direction on the transparent substrate, and two spaced apart from each other and extending along a first direction perpendicular to the first positioning line. The second positioning line extending in the second direction of the direction, and defining two first alignment lines extending along the first direction and two second alignment lines extending along the second direction to the film, wherein, The intersection points of the first positioning line and the second positioning line are respectively the center points of the four positioning symbols, and the intersection points of the first alignment line and the second alignment line are the four alignment symbols respectively. The central point of the symbol, the configuration step is to align one of the alignment lines with one of the corresponding positioning lines, and position the film on the light-transmitting substrate, and the detection step measures the The offset between the positioning line and the alignment line is used to obtain the error value of the film.

In the method for detecting film errors of the present invention, the providing step further defines two third positioning lines that are angled to the light-transmitting substrate and respectively pass through the center points of two positioning symbols located at opposite corners, and define the third positioning line for the film. Two third alignment lines that are angled and respectively pass through the center points of the two diagonal alignment symbols.

In the method for detecting film errors of the present invention, the positioning symbols are formed on the light-transmitting substrate by milling or printing.

Another object of the present invention is to provide a system for detecting film errors, the system comprising an exposure device and at least four detection elements.

The exposure device includes an alignment platform, and a light-transmitting substrate located on the alignment platform, the film is arranged on the light-transmitting substrate and is located between the alignment platform and the light-transmitting substrate, and the light-transmitting substrate has At least four positioning symbols corresponding to the positions of the alignment symbols.

The detection unit is located on the light-transmitting substrate, measures and calculates the offset between each positioning symbol and the corresponding center point of each alignment symbol, and obtains an error value of the film.

In the system for detecting film errors of the present invention, the projection of the positions of the positioning symbols on the transparent substrate to the film is located outside the line area, and the positions of the positioning marks are opposite to each other and have a preset distance.

In the system for detecting film errors of the present invention, the detection unit has a plurality of electrical coupling elements corresponding to the positioning symbols.

The beneficial effect of the present invention is that: the positioning symbol is formed on the light-transmitting substrate of the exposure device, and the alignment symbol corresponding to the positioning symbol is formed outside the circuit area of the negative, and the negative is positioned on the transparent substrate. On the optical substrate, the offset between the positioning symbol and the alignment symbol is measured, so that the error value of the film can be detected in real time.

Description of drawings

Fig. 1 is a three-dimensional exploded view illustrating the system for detecting film errors of the present invention;

Fig. 2 is a flow chart, illustrates the flow chart of the method for detecting film error of the present invention;

Fig. 3 is a plan view omitting four detection elements, illustrating a first embodiment of the method for detecting film errors of the present invention;

Fig. 4 is a three-dimensional exploded view illustrating a second embodiment of the method for detecting film errors of the present invention;

Fig. 5 is a top view omitting the detection element, to assist in explaining the second embodiment of Fig. 4;

FIG. 6 is a top view omitting the detecting element, illustrating a third embodiment of the method for detecting film errors of the present invention.

Detailed ways

The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

Referring to FIG. 1 , an embodiment of the system for detecting film errors of the present invention is suitable for detecting the error value of a film 31 to be exposed. Wherein, the negative film 31 includes a line area 311 having a predetermined line pattern 300 , an invalid area 312 surrounding the line area 311 , and at least four alignment symbols 313 outside the line area 311 .

An embodiment of the system includes an exposure device 2 and a detection unit 20 .

The exposure device 2 is an automatic exposure machine currently used in the industry to manufacture semiconductor integrated circuits. The exposure device 2 shown in FIG. 1 is a schematic diagram of the automatic exposure machine to illustrate the main components related to the present invention. The exposure device 2 includes an alignment platform 200 and a transparent substrate 22 on the alignment platform 200 .

Specifically, the alignment platform 200 is used to carry an exposure substrate 21 , and the exposure substrate 21 has an exposure region 211 for forming a circuit pattern, and a non-exposure region 212 surrounding the exposure region 211 . The exposed substrate 21 of this embodiment is a conventional printed circuit board (PCB) used to form integrated circuits thereon.

The light-transmitting substrate 22 is disposed on the exposure substrate 21 at intervals, and is made of a material that can pass through the exposure light. The light-transmitting substrate 22 in this example is a glass substrate made of glass material as an example for illustration. . It is worth mentioning that the transparent substrate 22 of this example has at least four positioning symbols 221 facing each other with a preset distance.

Preferably, the light-transmitting substrate 22 of this example is described as having four positioning symbols 221 as an example. The positioning symbols 221 are respectively formed at four diagonal positions of the transparent substrate 22 . More preferably, the positioning symbols 221 are located at four diagonal positions and form a rectangle. Therefore, the preset spacing of the positioning symbols 221 in this example changes correspondingly according to the length and width of the rectangle. And the projection of the positioning symbols 221 on the four diagonal positions of the transparent substrate 22 to the exposure substrate 21 is located on the four diagonal corners of the non-exposed area 212 of the exposure substrate 21 .

The detection unit 20 is located on the light-transmitting substrate 22, and is used to measure and calculate the offset between each positioning symbol 221 and the corresponding center point of each alignment symbol 313, so as to obtain the position of the film 31. difference. It should be noted that the detection unit 20 may only have one or two detection elements 231 depending on the operation and design requirements, and measure each of the corresponding positioning symbols 221 and Corresponding to the offset of the center point of each alignment symbol 313, or there may be a plurality of detection elements 231 respectively corresponding to the alignment symbols 313, without moving the detection elements 231 during the measurement process Element 231. In this embodiment, the detection unit 20 has four detection elements 231 arranged corresponding to the positioning symbols 221, and is a charge-coupled device (CCD) capable of converting image signals into digital signals. ) as an example for illustration.

Referring to FIG. 2 , the present invention uses the above-mentioned system for detecting film errors to implement a method for detecting the errors of the film 31 in real time.

Generally speaking, when a predetermined integrated circuit pattern is to be formed on the exposure substrate 21, the predetermined circuit pattern 300 will be formed in the circuit area 311 on the negative film 31 first, and then the negative film 31 with the predetermined circuit pattern 300 is arranged on the negative film 31. between the light-transmitting substrate 22 and the exposure substrate 21 , and then align the negative film 31 with the exposure substrate 21 to facilitate the subsequent exposure and development process, so that the predetermined circuit pattern 300 is developed and formed on the exposure substrate 21 In the exposure area 211.

However, the present invention mainly utilizes the assistance of the positioning symbol 221 of the light-transmitting substrate 22 and the alignment symbol 313 of the negative film 31 before performing the above-mentioned alignment of the negative film 31 and the exposure substrate 21, and transmits Through the detection of the detection element 231 , the size expansion and contraction of the negative film 31 during the formation of the predetermined circuit pattern 300 or the installation process can be detected in real time. When it is detected that the expansion and shrinkage of the negative film 31 exceeds the allowable error value of the process, it can be replaced directly. This method can avoid the situation when the negative film 31 and the exposure substrate 21 cannot be aligned in the existing process. , the complex steps of disassembling the film 31 and measuring the size of the film 31 again. The aforementioned techniques for forming integrated circuits are not the focus of the present invention and are well known to those skilled in the art, so details are not repeated here.

More specifically, referring to FIG. 1 and FIG. 3 , a first embodiment of the method for detecting film errors of the present invention includes: a providing step 41 , a configuring step 42 , and a detecting step 43 .

In the providing step 41 , firstly, the transparent substrate 22 installed in the exposure device 2 and having four positioning symbols 221 located at four diagonal positions is firstly provided. Next, provide the film 31 which is substantially rectangular and has a predetermined circuit pattern 300 and four alignment symbols 313 . It should be noted that the method of forming the positioning symbol 221 can be milling or printing, and is not particularly limited, as long as it can be formed on the light-transmitting substrate 22 and used for subsequent positioning. The milling process is formed on the surface of the light-transmitting substrate 22 as an example for illustration. The four alignment marks 313 of the negative 31 are formed together with the predetermined circuit pattern 300 in the same manufacturing process, that is to say, when the predetermined circuit pattern 300 is formed in the circuit area 311 of the negative film 31, they will be formed together in the same manufacturing process. The invalid area 312 outside the line area 311 forms the alignment symbol 313 , and the alignment symbol 313 is located at four diagonal positions of the invalid area 312 corresponding to the positioning symbol 221 .

In addition, it should be noted that the shapes of the positioning symbols 221 and the alignment symbols 313 are not particularly limited, and the number is not limited to four, and the positioning symbols 221 and the alignment symbols can be increased according to actual needs. 313, as long as the alignment symbol 313 is located in the invalid area 312 of the film 31, and the alignment symbol 313 corresponds to the position of the positioning symbol 221. The positioning symbol 221 and the alignment symbol 313 in this example are illustrated by taking a square and a cross as geometric figures respectively.

The disposing step 42 is to place the negative film 31 in the exposure device 2 on the surface of the transparent substrate 22 opposite to the detecting element 231 . Specifically, before disposing the negative film 31 on the surface of the light-transmitting substrate 22, a pair of positions will be respectively defined on the light-transmissive substrate 22 corresponding to the position of the negative film 31, and through the negative film The alignment point of 31 is aligned with the alignment point of the light-transmitting substrate 22 , so that the positioning symbols 221 correspond to the alignment symbols 313 .

In detail, in the first embodiment of the detection method of the present invention, the alignment point between the transparent substrate 22 and the negative film 31 is selected from at least one of the corresponding alignment symbols 221 and alignment symbols 313, preferably Specifically, in this example, the center point 222 of the corresponding positioning symbol 221 and the center point 314 of the alignment symbol 313 are used as respective alignment points. It should be noted that the position of the defined alignment point can also be additionally marked, for example, at the center of the light-transmitting substrate 22 and the negative film 31 or other positions, and the number of alignment points is not particularly limited. When defining a The above alignment points can be more accurately aligned to facilitate the subsequent detection step 43 .

The detecting step 43 is to measure the offset between the positioning symbol 221 and the alignment symbol 313 through the detecting element 231 to obtain an error value of the film 31 .

Specifically, after the positioning step 42 is completed and the negative film 31 is disposed on the light-transmitting substrate 22, the detection element 231 detects the center points 222 of the other three positioning symbols 221 at the non-alignment points. The error value of the negative film 31 can be known by the overlap with the center points 314 of the other three alignment symbols 313 .

It should be noted here that in the exposure and development technology, high-energy ultraviolet light is usually used as the exposure light, so the light-transmitting substrate 22 in the exposure device 2 through which the exposure light can pass is prone to thermal expansion and cooling due to high energy. Shrinkage, resulting in size variation day by day. Therefore, the light-transmitting substrate 22 used in this example is made of glass material with a low coefficient of thermal expansion, so when the exposure light passes through the light-transmitting substrate 22, the light-transmitting substrate 22 still has low expansion and contraction. characteristics without affecting the deformation and displacement of the positioning symbol 221 .

Accordingly, because the light-transmitting substrate 22 is not easy to expand and contract, the relative positions of the positioning symbols 221 can be regarded as fixed. That is to say, the center point 222 of the positioning symbol 221 is respectively detected by the detection element 231 to obtain the reference position of the positioning symbol 221, and then the detection element 231 is used to detect the The center point 314 of the bit symbol 313 is further compared with the position of the center point 222 of the positioning symbol 221 to obtain the error value of the film 31 .

As can be seen from the above description, the detection method of the present invention can pass through the alignment between the positioning symbols 221 on the light-transmitting substrate 22 and the negative film 31 before the exposure substrate 21 and the negative film 31 are aligned. Symbol 313 to detect the expansion and contraction of the film 31 in real time.

Referring to Fig. 4 and Fig. 5, the second embodiment of the method for detecting the error of the negative film 31 of the present invention is substantially the same as the first embodiment, the difference is that this embodiment further defines two spaced spaces between the light-transmitting substrate 22. And a first positioning line 201 extending along a first direction X, and two second positioning lines 202 extending along a second direction Y perpendicular to the first direction X, and defining two lines along the second positioning line 202 for the bottom sheet 31 A first bit line 301 extending in a direction X, and two second bit lines 302 extending in a second direction. Wherein, the intersection points of the first positioning line 201 and the second positioning line 202 are the center points 222 of the four positioning symbols 221 respectively, and the intersections of the first alignment line 301 and the second alignment line 302 The intersection points are the center points 314 of the four alignment symbols 313 . Therefore, in this example, the configuration step 42 is to use one of the first positioning line 201 and the second positioning line 202 as the corresponding first alignment line 301 or the second alignment line Line 302 is used for alignment. Then use the detection element 231 to detect the offset between the first positioning line 201 and the second positioning line 202 and the first pair of bit lines 301 and the second pair of bit lines 302 respectively , to calculate the error value of the film 31. By measuring in this way, the deformation of each side length of the negative sheet 31 can be known more accurately.

Referring to Fig. 6, the third embodiment of the method for detecting the error of the film 31 of the present invention is substantially the same as the second embodiment, the difference is that this embodiment further defines two angles for the light-transmitting substrate 22 and passes through them respectively. The third positioning line 203 of the center point 222 of the two non-adjacent positioning symbols 221, and define two angles to the film 31 and pass through the third alignment of the center point 314 of the two non-adjacent alignment symbols 313 respectively line 303. That is to say, the third positioning line 203 is two diagonal lines in the rectangle formed by the first positioning line 201 and the second positioning line 202; two diagonal lines in the rectangle formed by the first pair of bit lines 301 and the second pair of bit lines 302 . With the assistance of the third alignment line 203 and the third alignment line 303 , the overall expansion and contraction direction of the negative film 31 can be clearly known, and then the error value of the negative film 31 can be calculated more quickly and accurately.

In summary, the method and system for detecting film errors of the present invention, through forming the positioning marks 221 on the light-transmitting substrate 22 of the exposure device 2, and forming the corresponding positioning marks 221 in the invalid area 312 of the negative film 31 The alignment symbol 313, and the film 31 is arranged on the light-transmitting substrate 22 to measure the offset between the alignment symbol 221 and the alignment symbol 313, and the positioning symbol 221 can pass through Further define the first positioning line 201, the second positioning line 202, the third positioning line 203, the first positioning line 301, the second positioning line 203 and the alignment symbol 313. The second pair of bit lines 302 and the third pair of bit lines 303 can detect the expansion and contraction value of the film 31 more accurately and quickly in real time, so the purpose of the present invention can indeed be achieved.

Claims (10)

1. a kind of method of detection egative film error, it is characterised in that：Including one provides step, a configuration step and a detection step Suddenly, which is to provide the transparent substrates and an egative film that one is installed in an exposure device, which has at least four A position is relative to each other and has the sprocket bit of default spacing, which has the line areas of one one-tenth scheduled circuit pattern, and At least four form with the scheduled circuit pattern in same processing procedure, and outside the line areas to bit sign, the transparent substrates And the egative film respectively has a loci, and the position to bit sign is corresponding with the sprocket bit；The configuration step It is to be aligned using the loci of the transparent substrates and the egative film, which is positioned on the transparent substrates, and enable the positioning Symbol with it is described respectively corresponding to bit sign；The detecting step is to measure the sprocket bit and the offset to bit sign Amount, obtains the error amount of the egative film.

2. the method for detection egative film error according to claim 1, it is characterised in that：Pair of the transparent substrates and the egative film Site is selected from the corresponding sprocket bit of wherein at least one and to bit sign.

3. the method for detection egative film error according to claim 1, it is characterised in that：The egative film is generally rectangular, and the bottom The dead space that piece also surrounds the line areas with one, four of the egative film to bit sign are correspondingly formed in four of the dead space Diagonal position.

4. the method for detection egative film error according to claim 1, it is characterised in that：The offer step also provides four and detects Element is surveyed, which is to calculate each sprocket bit and corresponding each contraposition through the detecing element The offset of the central point of symbol obtains the error amount of the egative film.

5. the method for detection egative film error according to claim 1, it is characterised in that：The offer step is also further right The transparent substrates define two and are spaced and the first position line extended along a first direction and two are spaced and along one The second position line that the second direction of the vertical first direction extends, and two are defined to the egative film and is extended along the first direction A pair of bit lines and two articles of second pair of bit lines extended along the second direction, wherein first position line is fixed with described second The intersection point of bit line is respectively the central point of four sprocket bits, the intersection point point of described a pair of bit lines and second pair of bit line Not Wei four central points to bit sign, the configuration step be wherein one by described to bit line with it is corresponding described fixed Wherein one of bit line is aligned, which is positioned on the transparent substrates, the detecting step measure the position line with The offset to bit line obtains the error amount of the egative film.

6. the method for detection egative film error according to claim 5, it is characterised in that：The offer step is also further right The transparent substrates define the third position line of two central points that are angled and being located at diagonal sprocket bit by two respectively, And two thirds that are angled and being located at the diagonal central point to bit sign by two respectively are defined to bit line to the egative film.

7. the method for detection egative film error according to claim 6, it is characterised in that：The sprocket bit is added with milling cutter Work or mode of printing are formed in the transparent substrates.

8. a kind of system of detection egative film error, the egative film have one one-tenth scheduled circuit pattern line areas and at least four In including to bit sign, the system outside the line areas：One exposure device and a detecting unit, it is characterised in that：The exposure Electro-optical device includes that a pair of of bit platform and one are located at this to the transparent substrates on bit platform, which is set on the transparent substrates And positioned at this between bit platform and the transparent substrates, which has at least four and the position phase to bit sign Corresponding sprocket bit；The detecting unit is located on the transparent substrates, measure and calculate each sprocket bit with it is corresponding This each offset to the central point of bit sign, obtain the error amount of the egative film.

9. the system of detection egative film error according to claim 8, it is characterised in that：The sprocket bit of the transparent substrates Position is to be located at outside the line areas, and the position of the sprocket bit is opposite to each other and between default to the projection of the egative film Away from.

10. the system of detection egative film error according to claim 8, it is characterised in that：It is multiple right that the detecting unit has Answer the charge coupled device of the sprocket bit.