CN105957800B - A kind of process of surface treatment of substrate - Google Patents
A kind of process of surface treatment of substrate Download PDFInfo
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- CN105957800B CN105957800B CN201610301332.2A CN201610301332A CN105957800B CN 105957800 B CN105957800 B CN 105957800B CN 201610301332 A CN201610301332 A CN 201610301332A CN 105957800 B CN105957800 B CN 105957800B
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- 239000000758 substrate Substances 0.000 title claims abstract description 70
- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004381 surface treatment Methods 0.000 title claims abstract description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011521 glass Substances 0.000 claims abstract description 17
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims abstract description 13
- 239000008367 deionised water Substances 0.000 claims abstract description 12
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 12
- 238000009210 therapy by ultrasound Methods 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003960 organic solvent Substances 0.000 claims abstract description 9
- 239000003599 detergent Substances 0.000 claims abstract description 7
- 238000002360 preparation method Methods 0.000 claims abstract description 7
- 238000002791 soaking Methods 0.000 claims abstract description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims description 30
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 20
- 230000001737 promoting effect Effects 0.000 claims description 17
- 241001474374 Blennius Species 0.000 claims description 10
- 239000004354 Hydroxyethyl cellulose Substances 0.000 claims description 10
- 229920000663 Hydroxyethyl cellulose Polymers 0.000 claims description 10
- 235000019447 hydroxyethyl cellulose Nutrition 0.000 claims description 10
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 10
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- 238000004321 preservation Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 238000003756 stirring Methods 0.000 claims description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 4
- 229910001873 dinitrogen Inorganic materials 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 1
- 239000007822 coupling agent Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910000077 silane Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000000463 material Substances 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract description 2
- 238000007654 immersion Methods 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004506 ultrasonic cleaning Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002525 ultrasonication Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0075—Cleaning of glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/31—Pre-treatment
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Organic Chemistry (AREA)
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Abstract
本发明涉及一种基板的表面处理工艺，将基板浸入玻璃洗涤剂内，洗净后用去离子水清洗；浸入附着力促进液中，超声处理然后取出加入丙酮超声处理取出后使用去离子水冲洗，然后使用氮气将基板吹干；浸泡在有机溶剂内，避光保存。本发明使用清洗、超声、冲洗、干燥、浸泡处理工艺处理的基板材料，能够利用有机溶剂与基板表面的缓慢反应最大限度的去除表面油污残留，并改善基板表面浸润性，能够增强基板后续镀膜的附着力及均匀性，该方法操作简单，无需其他处理设备，可在室温下空气中制备，与大面积商业化生产制备工艺相兼容。The invention relates to a surface treatment process of a substrate. The substrate is immersed in a glass detergent and cleaned with deionized water; immersed in an adhesion promotion liquid, ultrasonically treated and then taken out by adding acetone for ultrasonic treatment, and then rinsed with deionized water , and then use nitrogen to dry the substrate; soak it in an organic solvent and store it away from light. The present invention uses the substrate material treated by cleaning, ultrasonic, rinsing, drying, and soaking processes, and can utilize the slow reaction between the organic solvent and the substrate surface to remove surface oil residue to the greatest extent, improve the wettability of the substrate surface, and enhance the subsequent coating of the substrate. Adhesion and uniformity, the method is simple to operate, does not require other processing equipment, can be prepared in air at room temperature, and is compatible with large-scale commercial production preparation processes.
Description
技术领域technical field
本发明涉及表面处理领域，具体涉及一种改善基板表面浸润性、增强基板镀膜附着力及均匀性的基板的表面处理工艺。The invention relates to the field of surface treatment, in particular to a substrate surface treatment process for improving substrate surface wettability and enhancing substrate coating adhesion and uniformity.
背景技术Background technique
近年来，基板材料在电子产品，半导体器件等领域广泛使用。In recent years, substrate materials have been widely used in electronic products, semiconductor devices and other fields.
通常为了制造太阳能电池、半导体器件和平板显示器件，需要在基板的表面形成预定的薄膜层、薄膜电路图案或光学团。隐刺，需要进行半导体制造工艺，例如，在基板上沉积预定材料的薄膜的薄膜沉积工艺，使用光敏材料对薄膜进行选择性的曝光的光学工艺，以及通过选择性的出去该薄膜的曝光部分形成图案的蚀刻工艺。Generally, in order to manufacture solar cells, semiconductor devices and flat panel display devices, it is necessary to form a predetermined thin film layer, thin film circuit pattern or optical group on the surface of the substrate. Hidden thorns that require semiconductor manufacturing processes such as film deposition processes for depositing a thin film of a predetermined material on a substrate, optical processes for selectively exposing a thin film using a photosensitive material, and forming by selectively removing the exposed portion of the film Patterned etching process.
基板材料在使用前需要采用超声清洗方式去除表面油污。超声清洗具有以下问题：短时间超声清洗无法去除基板所有油污，对基板表面浸润性改善不明显，超声后基板若不立刻使用则会造成基板的二次污染，因此，基板的清洗效果受到影响和限制。Substrate materials need to be ultrasonically cleaned to remove surface oil before use. Ultrasonic cleaning has the following problems: short-term ultrasonic cleaning cannot remove all oil stains on the substrate, and the wettability of the substrate surface is not significantly improved. If the substrate is not used immediately after ultrasonication, it will cause secondary pollution of the substrate. Therefore, the cleaning effect of the substrate is affected and limit.
发明内容Contents of the invention
本发明的目的是为了解决现有基板超声清洗后对基板表面浸润性改善不明显、附着力差的缺陷而提供一种改善基板表面浸润性、增强基板镀膜附着力及均匀性的基板的表面处理工艺。The purpose of the present invention is to provide a substrate surface treatment that improves the wettability of the substrate surface, enhances the adhesion and uniformity of the substrate coating, and solves the defects that the wettability of the substrate surface is not significantly improved and the adhesion is poor after ultrasonic cleaning of the existing substrate. craft.
为了实现上述目的，本发明采用以下技术方案：In order to achieve the above object, the present invention adopts the following technical solutions:
一种基板的表面处理工艺，包括以下步骤：A surface treatment process for a substrate, comprising the steps of:
a)清洗：将基板浸入玻璃洗涤剂内，洗净后用去离子水清洗；a) Cleaning: immerse the substrate in glass detergent, wash it with deionized water after cleaning;
b)超声处理：将步骤a)得到的基板浸入附着力促进液中，超声处理45-60min；然后取出加入丙酮超声处理15-30min，取出后使用去离子水冲洗，然后使用氮气将基板吹干；b) Ultrasonic treatment: immerse the substrate obtained in step a) in the adhesion promoting solution, and ultrasonically treat it for 45-60 minutes; then take it out and add acetone for ultrasonic treatment for 15-30 minutes, rinse it with deionized water after taking it out, and then dry the substrate with nitrogen gas ;
c)浸泡保存：将步骤b)得到的基板浸泡在有机溶剂内，避光保存。在本技术方案中，首先通过玻璃洗涤剂清洗基板表面的油渍污垢等物质，然后用附着力促进液提升基板表面的附着力与浸润性，以便后续提高后续镀膜时的基板镀膜附着力及均匀性，长时间浸泡有助于基板表面与有机溶剂缓慢发生反应，彻底清除基板表面油污残留并改善基板表面浸润性。c) Preservation by immersion: immerse the substrate obtained in step b) in an organic solvent, and store it away from light. In this technical solution, the oily dirt and other substances on the surface of the substrate are first cleaned with a glass detergent, and then the adhesion and wettability of the substrate surface are improved with an adhesion promoting liquid, so as to subsequently improve the adhesion and uniformity of the substrate coating during the subsequent coating , Prolonged immersion helps the substrate surface to react slowly with organic solvents, completely removes oil residue on the substrate surface and improves the wettability of the substrate surface.
作为优选，步骤b)中附着力促进液由以下重量份的原料组成：羟乙基纤维素10-15份、正硅酸甲酯20-35份、海藻泥5-10份、乙酸乙酯80-100份、硅烷偶联剂15-25份与氢氟酸1-5份。As a preference, the adhesion promoting liquid in step b) consists of the following raw materials in parts by weight: 10-15 parts of hydroxyethyl cellulose, 20-35 parts of methyl orthosilicate, 5-10 parts of seaweed mud, 80 parts of ethyl acetate -100 parts, 15-25 parts of silane coupling agent and 1-5 parts of hydrofluoric acid.
作为优选，附着力促进液的制备方法为：将羟乙基纤维素、正硅酸甲酯、硅烷偶联剂与海藻泥加入到乙酸乙酯中，搅拌溶解完后加入氢氟酸，超声60KHz处理35-50min后得到。As a preference, the preparation method of the adhesion promoting liquid is as follows: adding hydroxyethyl cellulose, methyl orthosilicate, silane coupling agent and seaweed mud to ethyl acetate, adding hydrofluoric acid after stirring and dissolving, and supersonicating at 60KHz Obtained after 35-50 minutes of treatment.
作为优选，步骤b)中附着力促进液的温度为65-80℃。Preferably, the temperature of the adhesion promoting solution in step b) is 65-80°C.
作为优选，步骤b)中超声频率85-100KHz。Preferably, the ultrasonic frequency in step b) is 85-100KHz.
作为优选，步骤c)中有机溶剂为乙醇、异丙醇、丙酮、甲醇、乙二醇乙醚或丙二醇甲醚中的一种。Preferably, the organic solvent in step c) is one of ethanol, isopropanol, acetone, methanol, ethylene glycol ether or propylene glycol methyl ether.
作为优选，所述基板为PET，玻璃，石英，硅片，ITO导电玻璃，FTO导电玻璃，ZnO导电玻璃中的一种。Preferably, the substrate is one of PET, glass, quartz, silicon wafer, ITO conductive glass, FTO conductive glass, and ZnO conductive glass.
本发明的有益效果：本发明使用清洗、超声、冲洗、干燥、浸泡处理工艺处理的基板材料，能够利用有机溶剂与基板表面的缓慢反应最大限度的去除表面油污残留，并改善基板表面浸润性，能够增强基板后续镀膜的附着力及均匀性，该方法操作简单，无需其他处理设备，可在室温下空气中制备，与大面积商业化生产制备工艺相兼容。Beneficial effects of the present invention: the substrate material treated by cleaning, ultrasonic, rinsing, drying, and soaking processes in the present invention can utilize the slow reaction between the organic solvent and the surface of the substrate to remove surface oil residue to the greatest extent, and improve the wettability of the substrate surface, The method can enhance the adhesion and uniformity of subsequent coating films on the substrate. The method is simple to operate, does not require other processing equipment, can be prepared in air at room temperature, and is compatible with large-area commercial production preparation processes.
具体实施方式Detailed ways
下面将对本发明实施例中的技术方案进行清楚、完整的描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
实施例1Example 1
一种基板的表面处理工艺，包括以下步骤：A surface treatment process for a substrate, comprising the steps of:
a)清洗：将基板(基板选择ITO导电玻璃)浸入玻璃洗涤剂内，洗净后用去离子水清洗；a) Cleaning: immerse the substrate (ITO conductive glass as the substrate) into the glass detergent, wash it with deionized water after cleaning;
b)超声处理：将步骤a)得到的基板浸入温度为65℃的附着力促进液中，超声频率85KHz处理45min；然后取出加入丙酮超声频率85KHz处理15min，取出后使用去离子水冲洗，然后使用氮气将基板吹干；其中附着力促进液由以下重量份的原料组成：羟乙基纤维素10份、正硅酸甲酯20份、海藻泥5份、乙酸乙酯80份、硅烷偶联剂15份与氢氟酸1份；附着力促进液的制备方法为：将羟乙基纤维素、正硅酸甲酯、硅烷偶联剂与海藻泥加入到乙酸乙酯中，搅拌溶解完后加入氢氟酸，超声60KHz处理35min后得到；；b) Ultrasonic treatment: immerse the substrate obtained in step a) in an adhesion promoting solution with a temperature of 65°C, and treat it at an ultrasonic frequency of 85KHz for 45 minutes; then take it out and add acetone and treat it at an ultrasonic frequency of 85KHz for 15 minutes, rinse it with deionized water after taking it out, and then use Dry the substrate with nitrogen; wherein the adhesion promoting liquid is composed of the following raw materials in parts by weight: 10 parts of hydroxyethyl cellulose, 20 parts of methyl orthosilicate, 5 parts of seaweed mud, 80 parts of ethyl acetate, silane coupling agent 15 parts and 1 part of hydrofluoric acid; the preparation method of the adhesion promoting liquid is: add hydroxyethyl cellulose, methyl orthosilicate, silane coupling agent and seaweed mud to ethyl acetate, stir and dissolve, then add Hydrofluoric acid, obtained after ultrasonic treatment at 60KHz for 35 minutes;
c)浸泡保存：将步骤b)得到的基板浸泡在乙醇内，将密封瓶盖旋紧，并放于避光阴凉处。放置24小时以上，待用。c) Soaking and preservation: Soak the substrate obtained in step b) in ethanol, tighten the sealed bottle cap, and put it in a cool place away from light. Put it aside for more than 24 hours.
实施例2Example 2
一种基板的表面处理工艺，包括以下步骤：A surface treatment process for a substrate, comprising the steps of:
a)清洗：将基板(基板选择ZnO导电玻璃)浸入玻璃洗涤剂内，洗净后用去离子水清洗；a) Cleaning: immerse the substrate (ZnO conductive glass is selected as the substrate) in the glass detergent, and clean it with deionized water after cleaning;
b)超声处理：将步骤a)得到的基板浸入温度为70℃的附着力促进液中，超声频率90KHz处理50min；然后取出加入丙酮超声频率90KHz处理20min，取出后使用去离子水冲洗，然后使用氮气将基板吹干；其中附着力促进液由以下重量份的原料组成：羟乙基纤维素12份、正硅酸甲酯25份、海藻泥5份、乙酸乙酯95份、硅烷偶联剂20份与氢氟酸3份；附着力促进液的制备方法为：将羟乙基纤维素、正硅酸甲酯、硅烷偶联剂与海藻泥加入到乙酸乙酯中，搅拌溶解完后加入氢氟酸，超声60KHz处理40min后得到；；b) Ultrasonic treatment: immerse the substrate obtained in step a) in an adhesion promoting solution with a temperature of 70°C, and treat it at an ultrasonic frequency of 90KHz for 50min; then take it out and add acetone and treat it at an ultrasonic frequency of 90KHz for 20min, rinse it with deionized water after taking it out, and then use Dry the substrate with nitrogen gas; wherein the adhesion promoting liquid is composed of the following raw materials in parts by weight: 12 parts of hydroxyethyl cellulose, 25 parts of methyl orthosilicate, 5 parts of seaweed mud, 95 parts of ethyl acetate, silane coupling agent 20 parts and 3 parts of hydrofluoric acid; the preparation method of the adhesion promoting liquid is: add hydroxyethyl cellulose, methyl orthosilicate, silane coupling agent and seaweed mud to ethyl acetate, stir and dissolve, then add Hydrofluoric acid, obtained after ultrasonic treatment at 60KHz for 40 minutes;
c)浸泡保存：将步骤b)得到的基板浸泡在丙二醇甲醚内，将密封瓶盖旋紧，并放于避光阴凉处。放置24小时以上，待用。c) Preservation by immersion: Soak the substrate obtained in step b) in propylene glycol methyl ether, tighten the cap of the sealed bottle, and place it in a cool place away from light. Put it aside for more than 24 hours.
实施例3Example 3
一种基板的表面处理工艺，包括以下步骤：A surface treatment process for a substrate, comprising the steps of:
a)清洗：将基板(基板选择FTO导电玻璃)浸入玻璃洗涤剂内，洗净后用去离子水清洗；a) Cleaning: immerse the substrate (select FTO conductive glass as the substrate) into the glass detergent, wash it with deionized water after cleaning;
b)超声处理：将步骤a)得到的基板浸入温度为80℃的附着力促进液中，超声频率100KHz处理60min；然后取出加入丙酮超声频率100KHz处理30min，取出后使用去离子水冲洗，然后使用氮气将基板吹干；其中附着力促进液由以下重量份的原料组成：羟乙基纤维素15份、正硅酸甲酯35份、海藻泥10份、乙酸乙酯100份、硅烷偶联剂25份与氢氟酸5份；附着力促进液的制备方法为：将羟乙基纤维素、正硅酸甲酯、硅烷偶联剂与海藻泥加入到乙酸乙酯中，搅拌溶解完后加入氢氟酸，超声60KHz处理50min后得到；；b) Ultrasonic treatment: immerse the substrate obtained in step a) in an adhesion promoting solution with a temperature of 80°C, and treat it at an ultrasonic frequency of 100KHz for 60 minutes; then take it out and add acetone and treat it at an ultrasonic frequency of 100KHz for 30 minutes, rinse it with deionized water after taking it out, and then use it Dry the substrate with nitrogen; wherein the adhesion promoting liquid is composed of the following raw materials in parts by weight: 15 parts of hydroxyethyl cellulose, 35 parts of methyl orthosilicate, 10 parts of seaweed mud, 100 parts of ethyl acetate, silane coupling agent 25 parts and 5 parts of hydrofluoric acid; the preparation method of the adhesion promoting liquid is: add hydroxyethyl cellulose, methyl orthosilicate, silane coupling agent and seaweed mud to ethyl acetate, stir and dissolve, then add Hydrofluoric acid, obtained after ultrasonic treatment at 60KHz for 50 minutes;
c)浸泡保存：将步骤b)得到的基板浸泡在有机溶剂内，将密封瓶盖旋紧，并放于避光阴凉处。放置24小时以上，待用。c) Preservation by immersion: Soak the substrate obtained in step b) in an organic solvent, tighten the cap of the sealed bottle, and store it in a cool place away from light. Put it aside for more than 24 hours.
以上所述的实施例只是本发明的一种较佳的方案，并非对本发明作任何形式上的限制，在不超出权利要求所记载的技术方案的前提下还有其它的变体及改型。The embodiment described above is only a preferred solution of the present invention, and does not limit the present invention in any form. There are other variations and modifications on the premise of not exceeding the technical solution described in the claims.
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| CN105038397A (en) * | 2015-07-08 | 2015-11-11 | 合肥旭阳铝颜料有限公司 | Ultrasonic cleaning resistant mirror ink for mobile phone lens |
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| CN105038397A (en) * | 2015-07-08 | 2015-11-11 | 合肥旭阳铝颜料有限公司 | Ultrasonic cleaning resistant mirror ink for mobile phone lens |
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