CN105957664A - Chip resistor, circuit board and terminal equipment - Google Patents

Abstract

The application provides a chip resistor, circuit board and terminal equipment, wherein chip resistor includes: the resistor components are arranged in a stacked mode and comprise a substrate, a resistor body and electrodes, and N is a positive integer equal to or larger than 2; the electrodes are symmetrically arranged at two ends of the substrate, and the resistor body is arranged on one plane of the substrate and is connected with the electrodes in a non-perpendicular mode. Therefore, cross wiring among circuits can be realized, conditions are provided for board arrangement design of the circuit board, the board arrangement difficulty is reduced, the board arrangement time is saved, and the board arrangement efficiency is improved.

Description

Chip resistors, circuit boards and terminal equipment

technical field

The present application relates to the field of electronic technology, in particular to a chip resistor, a circuit board and terminal equipment.

Background technique

At present, in the PCB (Printed Circuit Board, referred to as PCB) layout process of electronic products, there are often situations where lines are crossed. Wiring to avoid crossing not only increases the layout cost, but also makes the layout cycle longer and inefficient.

Contents of the invention

This application aims to solve one of the technical problems in the related art at least to a certain extent.

For this reason, this application proposes a chip resistor, which realizes the cross wiring between lines, provides conditions for the layout design of the circuit board, reduces the difficulty of layout, saves time for layout, and improves the efficiency of layout. .

In order to achieve the above purpose, an embodiment of the present application proposes a chip resistor, including: N stacked resistance components; wherein, the resistance component is composed of a substrate, a resistor body and an electrode, and N is a positive integer equal to or greater than 2 ; The electrodes are arranged symmetrically at both ends of the substrate, and the resistors are arranged on a plane of the substrate and non-perpendicularly connected to the electrodes.

The chip resistor provided by the embodiment of the present application includes N stacked resistance components, wherein the resistance component is composed of a substrate, electrodes disposed at both ends of the substrate, and a resistor disposed on the substrate and connected non-perpendicularly to the electrodes. In this way, the cross-wiring between lines can be realized, which provides conditions for the layout design of the circuit board, reduces the difficulty of layout, saves time for layout, and improves the efficiency of layout.

In one embodiment of the present invention, the included angle between the resistor body and the electrode in the N stacked resistor assemblies is the same, and the included angle refers to the acute angle formed by the resistor body and the electrode.

In one embodiment of the present invention, the included angles between the resistors and the electrodes in the N stacked resistor assemblies are different, and the included angle refers to the acute angle formed between the resistors and the electrodes.

In one embodiment of the present invention, the resistors in the N stacked resistor assemblies have different resistance values.

In one embodiment of the present invention, the resistors in the N stacked resistor assemblies have the same resistance value.

In one embodiment of the present invention, a predetermined distance is set between adjacent electrodes on the same side of the chip resistor.

In one embodiment of the present invention, the resistor body is fixed on the substrate by sintering.

In order to achieve the above purpose, an embodiment of the present application proposes a circuit board, including the above-mentioned chip resistor.

The circuit board provided by the embodiment of the present application adopts a chip resistor including N stacked resistance components, wherein the resistance component consists of a substrate, electrodes arranged at both ends of the substrate, and a resistor body arranged on the substrate and connected non-perpendicularly to the electrodes composition. Therefore, when the circuit board is wired, cross wiring between lines can be carried out, which provides conditions for the layout design of the circuit board, reduces the difficulty of layout, saves time for layout, and improves the efficiency of layout.

To achieve the above purpose, an embodiment of the present application provides a terminal device, including the circuit board as described above.

To achieve the above purpose, the embodiment of the present application proposes another terminal device, which includes one or more of the following components: a circuit board, a housing, a processor, a memory, a power supply circuit, a multimedia component, an audio component, an input/output (I/O (2) interface, sensor assembly, and communication assembly; wherein, the circuit board is arranged inside the space enclosed by the housing, and the processor and the memory are arranged on the circuit board; the power supply circuit , used to supply power to each circuit or device of the mobile terminal; the memory is used to store executable program codes; the processor runs and executes the executable code by reading the executable program code stored in the memory The program corresponding to the program code;

The circuit board includes at least one chip resistor, wherein the chip resistor includes: N stacked resistor components; wherein the resistor component includes a substrate, a resistor body and an electrode, and N is a positive integer equal to or greater than 2 ; The electrodes are arranged symmetrically at both ends of the substrate, and the resistors are arranged on a plane of the substrate and non-perpendicularly connected to the electrodes.

In the terminal device provided by the embodiment of the present application, the chip resistor included in the circuit board is composed of N stacked resistor components, wherein the resistor component consists of a substrate, electrodes arranged at both ends of the substrate, and electrodes arranged on the substrate and non-perpendicular to the electrodes connected resistors. Therefore, when the circuit board is wired, cross wiring between lines can be realized, which provides conditions for the layout design of the circuit board, reduces the difficulty of layout, saves time for layout, improves the efficiency of layout, and reduces the cost of terminal equipment. design difficulty and cost.

Description of drawings

The above and/or additional aspects and advantages of the present invention will become apparent and easy to understand from the following description of the embodiments in conjunction with the accompanying drawings, wherein:

Fig. 1 is the structural representation of the chip resistor of an embodiment of the present application;

Fig. 2 is a schematic structural view of a resistance component in a chip resistor of an embodiment of the present application;

Fig. 3 is a schematic diagram of the chip resistor structure of another embodiment of the present application;

Figure 4 is a schematic diagram of two intersecting lines in the PCB board;

FIG. 5 is a schematic diagram of a circuit board structure according to an embodiment of the present application;

FIG. 6 is a schematic structural diagram of a terminal device according to an embodiment of the present application;

FIG. 7 is a schematic structural diagram of a terminal device according to another embodiment of the present application.

Explanation of reference signs:

SMD resistor-100; Resistor component-110; Substrate-111;

Resistor body-112; Electrode-113; Resistor assembly-110a;

Resistor assembly-110b; Resistor body 112a; Resistor body-112b;

Electrode-113a; Electrode-113b; Circuit board 5;

Terminal device 6; Housing 70; Processor 71;

memory 72; power circuit 73; multimedia component 74;

audio component 75; input/output (I/O) interface 76;

sensor assembly 77; communication assembly 78.

detailed description

Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are intended to explain the present application, and should not be construed as limiting the present application.

The structure of the chip resistor, the circuit board and the terminal device according to the embodiments of the present application will be described below with reference to the accompanying drawings.

FIG. 1 is a schematic structural diagram of a chip resistor according to an embodiment of the present application, and FIG. 2 is a schematic structural diagram of resistor components in a chip resistor according to an embodiment of the present application.

As shown in FIG. 1 and FIG. 2 , the chip resistor 100 includes: N stacked resistance components 110 .

Wherein, as shown in Figures 1 and 2, the resistance assembly 110 is composed of a substrate 111, a resistor body 112 and an electrode 113, N is a positive integer equal to or greater than 2; the electrodes 113 are symmetrically arranged on both sides of the substrate 111 end, the resistor body 112 is disposed on a plane of the substrate 111 and non-perpendicularly connected to the electrode 113 .

Wherein, the resistor 112 can be fixed on the substrate 111 by sintering.

Specifically, as shown in Figures 1 and 2, in this embodiment, the resistor body 112 in the resistor assembly 110 is non-vertically connected to the electrode 113, so that when N resistor assemblies 110 are stacked to form a chip resistor 100, through A single chip resistor 100 can realize the reliable connection of intersecting lines in the circuit board, thereby providing convenience for the layout process of the designer and reducing the layout time.

Further, the N resistor components 110 in the chip resistor 100 may be the same or different, that is, the included angle between the resistor body 112 and the electrode 113 in the N stacked resistor components 110 in the chip resistor 100 may be the same They can also be different; and, the resistance values of the resistors 112 in the N stacked resistor assemblies 100 can be the same or different.

For example, if N=2, and the included angle between the resistor body and the electrode of the two resistors in the chip resistor is 45°, the structure of the chip resistor can be shown in FIG. 3 .

FIG. 3 is a schematic structural diagram of a chip resistor according to another embodiment of the present application. FIG. 4 is a schematic diagram of two intersecting lines in the PCB board.

As shown in Figure 3, the chip resistor 100 is composed of two resistor components 110a and 110b, wherein in the first resistor component 110a, the resistor body 112a forms an angle of 45° with the electrode 113a, and in the second resistor component 110b, the resistor body 112b Forming an included angle of 45° with the electrode 113b, the chip resistor can realize signal transmission as shown in FIG. 4 . That is, the signal from point A is transmitted to point D, and the signal input from point B is transmitted to point C.

In specific use, according to the angle between AC and BD, select a chip resistor that matches the angle between the resistor body and the electrode and the angle between the lines, and choose resistors with different resistance values according to the needs of line transmission. Chip resistors.

Further, when there are at least two electrodes 113 on the same side of the chip resistor 100 , there is a preset distance between adjacent electrodes 113 disposed on the same side of the chip resistor 110 .

Specifically, for the chip resistor shown in FIG. 3 , the electrodes 113a and 113b are respectively connected to different resistors and lines. In order to realize the isolation between electrical signals, a preset distance needs to be set between the electrodes 113a and 113b.

Wherein, the preset distance needs to be determined according to the size of the cross-sectional area of the substrate, the size of the current to be transmitted by each electrode, and the insulation level between the lines.

The chip resistor provided by the embodiment of the present application includes N stacked resistance components, wherein the resistance component is composed of a substrate, a resistor body and electrodes, and N is a positive integer equal to or greater than 2; the electrodes are symmetrically arranged at At both ends of the substrate, the resistors are arranged on a plane of the substrate and non-perpendicularly connected to the electrodes. In this way, the cross-wiring between lines can be realized, which provides conditions for the layout design of the circuit board, reduces the difficulty of layout, saves time for layout, and improves the efficiency of layout.

FIG. 5 is a schematic structural diagram of a circuit board according to an embodiment of the present application. As shown in FIG. 5 , the circuit board 5 includes N crossover wiring transmission lines and the chip resistor 100 as described in any one of the above embodiments, wherein N is a positive integer equal to or greater than 2.

Wherein, the specific structure of the chip resistor 100 and the way of coordinating and connecting with the N lines can be referred to the detailed description of the above-mentioned embodiments, and will not be repeated here.

The circuit board provided in the embodiment of the present application adopts a chip resistor including N stacked resistance components, wherein the resistance component is composed of a substrate, a resistor body and an electrode, and N is a positive integer equal to or greater than 2; the electrodes are symmetrical The resistors are arranged at both ends of the substrate, and the resistors are arranged on a plane of the substrate and non-perpendicularly connected to the electrodes. As a result, the circuit board can be cross-wired between lines when wiring, which provides conditions for the layout design of the circuit board, reduces the difficulty of layout, saves time for layout, and improves the efficiency of layout.

Fig. 6 is a schematic structural diagram of a terminal device according to an embodiment of the present application. As shown in FIG. 6, the terminal device 6 includes the circuit board 5 as described above.

It should be noted that the above detailed description of the circuit board 5 is also applicable to the terminal device in this embodiment, and will not be repeated here.

In the terminal device provided in this embodiment, the chip resistors included in the circuit board are composed of N stacked resistance components, wherein the resistance components are composed of a substrate, electrodes arranged at both ends of the substrate, and electrodes arranged on the substrate and connected non-perpendicularly to the electrodes composition of resistors. Therefore, when the circuit board is wired, cross wiring between lines can be realized, which provides conditions for the layout design of the circuit board, reduces the difficulty of layout, saves time for layout, improves the efficiency of layout, and reduces the cost of terminal equipment. design difficulty and cost.

FIG. 7 is a schematic structural diagram of a terminal device according to another embodiment of the present application.

As shown in Figure 7, this terminal equipment comprises following one or more components: circuit board 5, housing 70, processor 71, memory 72, power supply circuit 73, multimedia component 74, audio frequency component 75, input/output (I /O) interface 76, sensor assembly 77, and communication assembly 78; wherein, the circuit board 5 is arranged inside the space enclosed by the housing 70, and the processor 71 and the memory 72 are arranged in the On the circuit board 5; the power supply circuit 73 is used to supply power to each circuit or device of the mobile terminal; the memory 72 is used to store executable program codes; stored executable program code to run a program corresponding to said executable program code;

Wherein, the circuit board 5 includes at least one chip resistor, wherein the chip resistor includes: N stacked resistor components; wherein, the resistor component includes a substrate, a resistor body and an electrode, and N is equal to or greater than 2 is a positive integer; the electrodes are arranged symmetrically at both ends of the substrate, and the resistor is arranged on a plane of the substrate and connected non-perpendicularly to the electrodes.

It can be understood that any component on the circuit board 5 can be composed of the above-mentioned chip resistors, and the specific structure of the chip resistors can refer to the detailed description of the above-mentioned embodiments, and will not be repeated here.

In the terminal device provided by the embodiment of the present application, the chip resistor included in the circuit board is composed of N stacked resistor components, wherein the resistor component consists of a substrate, electrodes arranged at both ends of the substrate, and electrodes arranged on the substrate and non-perpendicular to the electrodes connected resistors. Therefore, when the circuit board is wired, cross wiring between lines can be realized, which provides conditions for the layout design of the circuit board, reduces the difficulty of layout, saves time for layout, improves the efficiency of layout, and reduces the cost of terminal equipment. design difficulty and cost.

In the description of the present invention, the orientation or positional relationship indicated by the terms "angle", "distance", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying The referenced positions or elements must have a specific orientation, be configured in a specific orientation, and in a specific orientation, and thus should not be construed as limiting the invention.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present application.

In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.

Claims (10)

1. a Chip-R, it is characterised in that including: the resistor assembly that N number of stacking is arranged；Wherein, described resistor group Part is made up of substrate, resistive element and electrode, and N is the positive integer equal to or more than 2；

Described electrode is symmetricly set on the two ends of described substrate, and described resistive element is arranged in a plane of described substrate, and Non-perpendicular with described electrode it is connected.

Chip-R the most according to claim 1, it is characterised in that in the resistor assembly that described N number of stacking is arranged Resistive element is identical with the angle value that electrode forms, and described angle refers to the acute angle of resistive element and electrode composition.

Chip-R the most according to claim 1, it is characterised in that in the resistor assembly that described N number of stacking is arranged Resistive element is different from the angle value that electrode forms, and described angle refers to the acute angle of resistive element and electrode composition.

4. according to the arbitrary described Chip-R of claim 1-3, it is characterised in that the resistor group that described N number of stacking is arranged The resistance of the resistive element in part is different.

5. according to the arbitrary described Chip-R of claim 1-3, it is characterised in that the resistor group that described N number of stacking is arranged The resistance of the resistive element in part is identical.

6. according to the arbitrary described Chip-R of claim 1-3, it is characterised in that be arranged on the adjacent of Chip-R homonymy Default distance it is spaced between electrode.

Chip-R the most according to claim 6, it is characterised in that described resistive element is by being sintered to fix at described base On plate.

8. a circuit board, it is characterised in that include the Chip-R as described in claim 1-7 is arbitrary.

9. a terminal unit, it is characterised in that include circuit board as claimed in claim 8.

10. a terminal unit, it is characterised in that include following one or more assembly: circuit board, housing, processor, Memorizer, power circuit, multimedia groupware, audio-frequency assembly, the interface of input/output (I/O), sensor cluster, with And communications component；Wherein, described circuit board is placed in the interior volume that described housing surrounds, described processor and described storage Device is arranged on described circuit board；Described power circuit, powers for each circuit or the device for described mobile terminal；Institute State memorizer for storing executable program code；Described processor is by reading the executable program of storage in described memorizer Code runs the program corresponding with described executable program code；

At least including a Chip-R on described circuit board, wherein, Chip-R includes: the resistor group that N number of stacking is arranged Part；Wherein, described resistor assembly includes substrate, resistive element and electrode, and N is the positive integer equal to or more than 2；Described electricity Pole is symmetricly set on the two ends of described substrate, and described resistive element is arranged in a plane of described substrate, and with described electrode Non-perpendicular connection.