CN105904099B - A kind of manufacture method of SIP modules, the cutting method and system of elargol groove - Google Patents
A kind of manufacture method of SIP modules, the cutting method and system of elargol groove Download PDFInfo
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- CN105904099B CN105904099B CN201610301017.XA CN201610301017A CN105904099B CN 105904099 B CN105904099 B CN 105904099B CN 201610301017 A CN201610301017 A CN 201610301017A CN 105904099 B CN105904099 B CN 105904099B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 238000007596 consolidation process Methods 0.000 claims abstract description 93
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- 238000007711 solidification Methods 0.000 claims description 18
- 230000008023 solidification Effects 0.000 claims description 18
- 239000000945 filler Substances 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000003292 glue Substances 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 241000208340 Araliaceae Species 0.000 claims description 4
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 claims description 4
- 235000003140 Panax quinquefolius Nutrition 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 235000008434 ginseng Nutrition 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 4
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- 238000003860 storage Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 230000006870 function Effects 0.000 description 9
- 229910052705 radium Inorganic materials 0.000 description 5
- HCWPIIXVSYCSAN-UHFFFAOYSA-N radium atom Chemical compound [Ra] HCWPIIXVSYCSAN-UHFFFAOYSA-N 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 238000013499 data model Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000002271 resection Methods 0.000 description 2
- HLQDGCWIOSOMDP-UHFFFAOYSA-N 2,3,4,5-tetrachlorobiphenyl Chemical compound ClC1=C(Cl)C(Cl)=CC(C=2C=CC=CC=2)=C1Cl HLQDGCWIOSOMDP-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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Abstract
The invention discloses a kind of manufacture method of SIP modules, the cutting method and system of elargol groove, it is related to semiconductor applications, including：Step S10 obtains the groove cutting data in the consolidation zone of SIP modules；Groove cutting data includes：Groove cutting path and groove cutting position；Step S20 is cut according to groove cutting data using radium-shine in consolidation zone, forms the groove of elargol to be filled, there is reserved cured portion between groove and the exposed region of SIP modules；Step S30 obtains reserved cured portion to the range data of exposed region after the elargol for inserting groove solidifies；Step S40 presets radium-shine control parameter according to range data is corresponding, and using the reserved cured portion of radium-shine excision, consolidation zone and exposed region are got through.After elargol solidifies, automatic obtain presets radium-shine control parameter by reserved cured portion excision accordingly, reduces the probability of product rejection.
Description
Technical field
The present invention relates to semiconductor applications, more particularly to a kind of manufacture method of SIP modules, the cutting method of elargol groove
And system.
Background technology
With the development and progress of radium-shine cutting technique, because its precision is high, speed is fast, heat affected area is small, it is difficult to make product
Deform, cost performance is high, use cost is low, steady performance makes radium-shine cutting technique be widely used in semicon industry.
In semicon industry, system in package (SIP, System In a Package) is mainly by a variety of function cores
Piece is integrated in an encapsulation, reaches the purpose that function is integrated.Different chip arrangement, from different interior bonds technologies
Collocation, makes SIP encapsulation form produce diversified combination.
Module, refers to the chip and active member, passive device needed for the upper surface welding module in PCB, module is made
PCBA, filler is carried out to PCBA upper surface, glue is covered the chip and active member, passive device of PCBA upper surfaces, and
After make adhesive curing that module is made.
Consolidation zone and exposed region are there may be on one module, the demand based on product is, it is necessary to by the two regions
Get through, connected between region using elargol.Prior art is directly the modeling on the line position of zone boundary with radium-shine cutting technique
Closure material cuts off to form groove, then inserts elargol in this groove.
But it is due to that elargol is liquid before uncured, its characteristic flowed, which may pollute other, can not be infected with elargol
Region, so as to cause product rejection.
The content of the invention
It is an object of the invention to provide a kind of manufacture method of SIP modules, the cutting method and system of elargol groove, full
Sufficient product demand, while get through consolidation zone and exposed region, it is to avoid not solidified elargol is stained with the effective district of SIP modules,
Improve product yield.
The technical scheme that the present invention is provided is as follows：
A kind of cutting method of the elargol groove of SIP modules, including：Step S10 obtains the consolidation zone of the SIP modules
In groove cutting data；The groove cutting data includes：Groove cutting path and groove cutting position；Step S20 according to
The groove cutting data, is cut using radium-shine in the consolidation zone, forms the groove of elargol to be filled, the groove
There is reserved cured portion between the exposed region of the SIP modules；Step S30 is when the elargol solidification for inserting the groove
Afterwards, the reserved cured portion is obtained to the range data of the exposed region；Step S40 is according to range data correspondence
Default radium-shine control parameter, using the reserved cured portion of radium-shine excision, by the consolidation zone and the exposed area
Domain is got through.
It is further preferred that the step S30 is specifically included：The reserved cured portion of step S31 collections is described in
The picture of exposed region；Step S32 is handled the picture, and calculating obtains the reserved cured portion to described exposed
The range data in region.
It is further preferred that the step S40 is specifically included：Step S41 inquire about residing for the range data it is default away from
From data area；Step S42 obtains described according to the corresponding default radium-shine control parameter of the pre-determined distance data area
The corresponding default radium-shine control parameter of range data；Step S43 presets radium-shine control parameter according to the described of acquisition, uses
The reserved cured portion of radium-shine excision, the consolidation zone and the exposed region are got through.
It is further preferred that also including before the step S10：Step S00 configures the pre-determined distance data area, institute
State the corresponding default radium-shine control parameter of pre-determined distance data area.
It is further preferred that the range data includes：The reserved cured portion is close to the end of the exposed region
Point and the exposed region are close to the distance between reserved end points of the cured portion.
The present invention also provides a kind of manufacture method of SIP modules, including：Step S100 is described in PCB upper surface welding
Chip, active member, passive device needed for SIP modules, the lower surface of the PCB have reserved solder joint, and the SIP is made
The PCBA of module；Wherein, the upper surface of the PCBA includes：Region to be solidified and exposed region；Step S200 is to the PCBA
Upper surface in region to be solidified carry out filler, glue is covered the chip in region to be solidified, active in the upper surface of the PCBA
Element, passive device, then make adhesive curing that consolidation zone is made, and the consolidation zone and the exposed region constitute described
SIP modules；Step S400 obtains the groove cutting data in the consolidation zone of the SIP modules；The groove cutting data bag
Include：Groove cutting path and groove cutting position；Step S500 is according to the groove cutting data, using radium-shine in the solidification
Region is cut, and forms the groove of elargol to be filled, is existed between the groove and the exposed region of the SIP modules reserved
Cured portion；Step S600 obtains the reserved cured portion to described naked after the elargol for inserting the groove solidifies
Reveal the range data in region；Step S700 presets radium-shine control parameter according to the range data is corresponding, using radium-shine excision
The reserved cured portion, the consolidation zone and the exposed region are got through；Step S800 to the SIP modules four
Week and upper surface carry out metal sputtering formation EMI electro-magnetic screen layers.
It is further preferred that the EMI electro-magnetic screen layers SIP modules are got through after the consolidation zone and described
Exposed region connect, and to getting through after the consolidation zone and the exposed region carry out EMI electromagnetic shieldings.
It is further preferred that the step S600 is specifically included：Step S610 gathers the reserved cured portion to institute
State the picture of exposed region；Step S620 is handled the picture, and calculating obtains the reserved cured portion described in
The range data of exposed region.
It is further preferred that the step S700 is specifically included：Step S710 inquires about default residing for the range data
Range data scope；Step S720 is obtained according to the corresponding default radium-shine control parameter of the pre-determined distance data area
The range data is corresponding described to preset radium-shine control parameter；Step S730 joins according to the default radium-shine control of acquisition
Number, using the reserved cured portion of radium-shine excision, the consolidation zone and the exposed region are got through.
It is further preferred that also including between the step S200 and the step S400：Step S300 configurations are described pre-
If the corresponding radium-shine control parameter of range data scope, the pre-determined distance data area.
It is further preferred that the range data includes：The reserved cured portion is close to the end of the exposed region
Point and the exposed region are close to the distance between reserved end points of the cured portion.
The present invention also provides a kind of diced system of the elargol groove of SIP modules, including：Control module；Acquisition module, with
The control module electrical connection, under the control of the control module, the groove obtained in the consolidation zone of the SIP modules is cut
Cut data；And, after the elargol for inserting the groove solidifies, under the control of the control module, it is described that acquisition is reserved
Range data of the cured portion to the exposed region of the SIP modules；Wherein, the groove cutting data includes：Groove is cut
Path and groove cutting position；Memory module, is electrically connected with the control module, under the control of the control module, storage
Preset radium-shine control parameter；Radium-shine module, is electrically connected with the control module, under the control of the control module, according to institute
State groove cutting data, cut using radium-shine in the consolidation zone, form the groove of elargol to be filled, the groove with
There is reserved cured portion between the exposed region of the SIP modules；And, under the control of the control module,
, will according to the corresponding cured portion preset radium-shine control parameter, reserved using radium-shine excision of the range data
The consolidation zone and the exposed region are got through.
It is further preferred that the acquisition module is specifically included：Submodule is gathered, the reserved cured portion of collection is arrived
The picture of the exposed region；Submodule is handled, the picture is handled, calculating obtains the reserved cured portion and arrived
The range data of the exposed region.
It is further preferred that the memory module, is further used for storing pre-determined distance data area；The radium-shine module
Including：Data query submodule, inquires about the pre-determined distance data area residing for the range data；Parameter acquiring submodule
Block, according to the corresponding default radium-shine control parameter of the pre-determined distance data area, obtains the range data corresponding
It is described to preset radium-shine control parameter；Radium-shine excision submodule, described according to acquisition presets radium-shine control parameter, is cut using radium-shine
Except the reserved cured portion, the consolidation zone and the exposed region are got through；And, number is cut according to the groove
According to being cut using radium-shine in the consolidation zone, form the groove of elargol to be filled, the groove and the SIP modules
Exposed region between there is reserved cured portion.
It is further preferred that also including：Configuration module, is electrically connected with the control module, in the control of the control module
Under system, the corresponding default radium-shine control parameter of the pre-determined distance data area, the pre-determined distance data area is configured.
It is further preferred that the range data includes：The reserved cured portion is close to the end of the exposed region
Point and the exposed region are close to the distance between reserved end points of the cured portion.
Compared with prior art, the beneficial effects of the present invention are：
1st, in order to avoid not solidified elargol flow to the region that SIP modules do not need elargol, the problem of scrapping is produced, because
This, when using the radium-shine consolidation zone got through on SIP modules and exposed region, close to exposed area in the region for needing to get through
The one end in domain leaves some cured portions, and the region for getting through needs first turns into the groove and reserved solidified portion of elargol to be filled out
Point, insert after elargol, reserved cured portion is flow to for equivalent to one dykes and dams of not solidified elargol which prevent elargol
Exposed region, the possibility for causing product rejection；Reserved cured portion is beaten after the elargol for inserting groove solidifies, then with radium-shine
Fall, get through consolidation zone and exposed region.Destroy for the second time after reserved cured portion, it is formed with previous elargol groove
Same groove；According to the range data of the reserved cured portion of acquisition to exposed region, corresponding default radium is automatically selected
Penetrate control parameter, it is ensured that the second radium-shine position that cuts out is only the elongated end of the groove of cutting for the first time, can't
Askew, other regions of influence SIP modules are cut, product quality has been ensured.
2nd, when PCBA carries out filler solidification, because of reasons such as mould losses, the consolidation zone of SIP modules can have certain modeling
Envelope skew.Cut for the first time when the groove of elargol is filled out, be that the region for needing to cut is positioned by recognizing Mark points,
Even if each SIP modules are identical for the Mark points position of first time cutting, the problem of due to there is plastic packaging skew, each SIP
The length of the reserved cured portion of module is also different, accordingly, it would be desirable to be carried out according to actual conditions to reserved cured portion
Positioning, it is ensured that reserved cured portion can be correctly cut off during second of cutting without influenceing other places.And based on progress radium
The purpose of cutting is penetrated exactly in order to get through consolidation zone and exposed region, therefore exposed region is just set for reference position,
Reserved cured portion is gathered to the picture of exposed region by CCD, so that obtaining reserved cured portion arrives exposed region
Range data, is that the corresponding radium-shine control parameter of following selections provides the foundation.
3rd, reserved cured portion length is different, and it needs the region cut also just different, it is therefore desirable to corresponding
Radium-shine control parameter under carry out second and cut off reserved cured portion, according to the reserved cured portion of acquisition to exposed area
The position data in domain, automatically selects corresponding radium-shine control parameter, confirms the starting point and working length of operation；Avoid cutting manually
The mistake caused is changed, reduces the probability of product rejection.
4th, configure default range data scope and preset the basis that radium-shine control parameter is follow-up normal operation accordingly
Ensure.
5th, reserved cured portion is not in order to influence properties of product, and this body length is just shorter, typically in hundreds of um or so,
And according to the demand of product, the length of exposed region is also very small, typically in 100um or so, based on this, for apart from number
According to it is expressly intended that when further ensuring the reserved cured portion of excision, can be carried out to the starting point and working length of operation
It is accurately positioned, it is ensured that excision effect.
6th, the manufacturing process of SIP modules is welding chip, active member, passive device on PCB hollow plates, so as to be made
PCBA；Based on product demand, PCBA a part of region can not be solidified, therefore be needed admittedly in cure stage is to PCBA
The region of change carries out filler solidification, so that the SIP modules needed；And further according to product demand by consolidation zone and naked
Dew region is got through, and elargol is inserted in the part that consolidation zone is got through；Although the consolidation zone of SIP modules is insulator,
But insert elargol region and exposed region all containing circuit and on-insulated, in order to ensure SIP modules in subsequent applications not by
Other products are had influence on, it is necessary to SIP modules progress metal sputtering, form EMI electro-magnetic screen layers.
7th, the circuit in region and exposed region of the EMI electro-magnetic screen layers to inserting elargol is shielded, at the same also
Exposed region and the region connection for inserting elargol, so as to ensure being successfully connected for consolidation zone and exposed region.
Manufacture method, the cutting method and system of elargol groove of the SIP modules of the present invention, are getting through consolidating for SIP modules
When changing region and exposed region, a little cured portion is first reserved, the elargol that do not solidify inserted is carried out using this cured portion
Stop, elargol is not flowed to other regions；After elargol solidifies, according between reserved cured portion and exposed region away from
From the automatic default radium-shine control parameter accordingly that obtains is cut off, and thoroughly gets through consolidation zone and exposed region, automatic to obtain
Radium-shine control parameter is preset accordingly and ensure that product quality, it is to avoid the artificial mistake caused during the radium-shine control parameter of manual switching
Generation, reduces the probability of product rejection by mistake.
Brief description of the drawings
Below by clearly understandable mode, preferred embodiment is described with reference to the drawings, to a kind of manufacturer of SIP modules
Above-mentioned characteristic, technical characteristic, advantage and its implementation of method, the cutting method of elargol groove and system give furtherly
It is bright.
Fig. 1 is the flow chart of cutting method one embodiment of the elargol groove of SIP modules of the present invention；
Fig. 2 is the flow chart of another embodiment of the cutting method of elargol groove of SIP modules of the present invention；
Fig. 3 is the flow chart of manufacture method one embodiment of SIP modules of the present invention；
Fig. 4 is the flow chart of another embodiment of the manufacture method of SIP modules of the present invention；
Fig. 5 is the structural representation of diced system one embodiment of the elargol groove of SIP modules of the present invention；
Fig. 6 is the structural representation of another embodiment of the diced system of elargol groove of SIP modules of the present invention；
Fig. 7 is the three-dimensional structure diagram of the elargol groove of SIP modules of the present invention；
Fig. 8 is the sectional view of C-C in Fig. 7；
Fig. 9 is the sectional view of the B-B after the elargol solidification that the groove in Fig. 7 is inserted.
Drawing reference numeral explanation：
10. control module, 20. memory modules, 30. acquisition modules, 31. collection submodules, 32. processing submodules, 40. radium
Penetrate module, 41. data query submodules, 42. parameter acquiring submodules, 43. radium-shine excision submodules, 50. configuration modules,
61.PCB, 62. plastic packaging materials, 63. grooves, 64. reserved cured portions, 65. exposed regions, 66. elargol, 67. reserved solidifications
Part is close to the end points of exposed region, end points of 68. exposed regions close to reserved cured portion.
Embodiment
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, control is illustrated below
The embodiment of the present invention.It should be evident that drawings in the following description are only some embodiments of the present invention, for
For those of ordinary skill in the art, on the premise of not paying creative work, other can also be obtained according to these accompanying drawings
Accompanying drawing, and obtain other embodiments.
To make only to schematically show part related to the present invention in simplified form, each figure, they are not represented
Its as product practical structures.In addition, so that simplified form is readily appreciated, there is identical structure or function in some figures
Part, only symbolically depicts one of those, or has only marked one of those.Herein, " one " is not only represented
" only this ", can also represent the situation of " more than one ".
In one embodiment of the invention, as shown in figure 1, a kind of cutting method of the elargol groove of SIP modules, bag
Include：Step S10 obtains the groove cutting data in the consolidation zone of SIP modules；Groove cutting data includes：Groove cutting path
With groove cutting position；Step S20 is cut according to groove cutting data using radium-shine in consolidation zone, is formed to be filled
There is reserved cured portion between the exposed region of the groove of elargol, groove and SIP modules；Step S30, which works as, inserts groove
After elargol solidification, reserved cured portion is obtained to the range data of exposed region；Step S40 is corresponding pre- according to range data
If radium-shine control parameter, using the reserved cured portion of radium-shine excision, consolidation zone and exposed region are got through.
It is that first time is cut using Mark points specifically, as shown in Figure 7, Figure 8, groove cutting data is obtained in step S10
The starting point of the groove of the elargol to be filled out cut and operating area are positioned, so that radium-shine light beam falls in designated area, to SIP
The consolidation zone of module is cut, and forms the groove 63 of elargol to be filled out；Because the position of Mark points is set and in order to get through solidification
The real start bit of region and exposed region, which is equipped with, a little to be offset, it is ensured that is used radium-shine excision consolidation zone in first time, is formed
Wait after the groove for filling out elargol, there can be reserved cured portion 64 between this groove and exposed region.Need to fill out in this groove
Enter elargol and carry out sticking for micro-element, and not solidified elargol is liquid, its characteristic flowed may be stained with SIP modules
Other regions for not needing elargol to stick, so as to cause product rejection；And a little reserved cured portion here is equivalent to one
Individual dykes and dams, block the elargol of flowing to not needing its region to flow, for example：Exposed region, reduces product and produces and scrap
Chance.
In addition, the consolidation zone in SIP modules is when solidification, because a series of factor such as mould may result in
There is certain plastic packaging skew in the consolidation zone on SIP modules；Even if the position of Mark points is constant always, different SIP modules exist
After slotting for the first time, the length of reserved cured portion also can be different；In order to get through exposed region and consolidation zone, this is reserved
Cured portion must be removed after the elargol solidification inserted, and the difference of its length means starting point and the operation of operation
Length is different, to be controlled radium-shine light beam to fall in correct position according to actual conditions, just can guarantee that reserved cured portion quilt
Accurately cut off.Staff can control radium-shine light beam that reserved cured portion is cut off according to actual conditions, but manually
Operation often with the generation of certain mistake, increases the possibility of product rejection.
Therefore, the present invention can be automatically selected according to actual conditions presets radium-shine control parameter accordingly, it is ensured that just definite
While except reserved cured portion, the generation of mistake is also avoided, reduces the probability of product rejection.Because of the position of exposed region
It is constant to put in SIP modules, and the purpose cut for the second time is exactly in order to pre- between elargol groove and exposed region
The cured portion excision stayed, therefore exposed region just becomes datum mark, by reserved cured portion to exposed region away from
From acquisition needs the starting point and working length of operation, cuts reserved solidified portion under the control of corresponding relevant parameter
Remove.
It should be noted that as shown in Fig. 7, Fig. 8, Fig. 9, the groove 63 of elargol to be filled out either is cut out for the first time, still
The reserved cured portion 64 of excision, these Regional resections are all plastic packaging materials 62 on SIP modules, can't be under plastic packaging material 62
PCB 61 cut；In addition, it is necessary to be properly positioned during second of reserved cured portion 64 of excision, it is ensured that excision is reserved
Cured portion 64 after the groove that is formed cut with first time after groove 63 align, formed after the reserved cured portion 64 of excision
Groove be only the groove 63 after cutting for the first time elongated end, themselves is one groove, has simply divided cutting twice.
Preferably, step S30 is specifically included：Picture of the reserved cured portion of step S31 collections to exposed region；Step
S32 is handled picture, and calculating obtains reserved cured portion to the range data of exposed region.
Specifically, the reserved cured portion of collection, then using picture Processing Technique, calculates it to the picture of exposed region
The distance between two, be the premise that radium-shine control parameter is preset in following selection accordingly.
Preferably, step S40 is specifically included：Pre-determined distance data area residing for step S41 inquiry range data；Step
S42 presets radium-shine control parameter according to pre-determined distance data area is corresponding, obtains the corresponding default radium-shine control of range data
Parameter；Step S43 is according to the default radium-shine control parameter of acquisition, the cured portion reserved using radium-shine excision, by consolidation zone
Got through with exposed region.
Specifically, some range data scopes and corresponding radium-shine control parameter are pre-set in system, when reserved
Cured portion and exposed region distance be in some range data scope when, radium-shine light beam is in this range data scope pair
Under the control for the default radium-shine control parameter answered, reserved cured portion can exactly be cut off, it is ensured that by curing area
While domain and exposed region are smoothly got through, also it is further ensured that it will not cut to other regions, causes product rejection；Also may be used
To be interpreted as, it is ensured that under radium-shine cutting again, the groove for together getting through consolidation zone and exposed region is only formed.
Preferably, also include before step S10：Step S00 configuration pre-determined distances data area, pre-determined distance data area
It is corresponding to preset radium-shine control parameter.
Specifically, configuration pre-determined distance data area and its corresponding default radium-shine control parameter are to ensure correct excision
The basis of reserved cured portion；Presetting radium-shine control parameter includes：Focusing parameter, beam energy parameter etc., beam energy ginseng
Number includes：Frequency, power, speed etc..In addition, the positional information of exposed region can also be configured before cutting, it is ensured that
After the positional information for recognizing reserved cured portion, the range data obtained between the two can be calculated.
Preferably, as shown in figure 9, range data includes：Reserved cured portion close to exposed region end points 67 and
Exposed region is close to the distance between reserved end points 68 of cured portion.
Specifically, the a-quadrant in Fig. 9 is exposed region 65, after the elargol 66 for inserting groove solidifies, it is necessary to which excision is pre-
The cured portion 64 stayed, in order to be further ensured that the accuracy of radium-shine operation, to reserved cured portion 64 and exposed region
The distance between 65 have done further restriction.Why it is the conduct of end points 67 for using reserved cured portion close to exposed region
Basis is calculated, is because such design can rapidly confirm the starting point of operation；Because exposed region 65 and first time cut
The original position cut is also fixed, it is meant that reserved cured portion is also constant close to the position of groove end points, also may be used
To be interpreted as, reserved cured portion is between groove end points and the end points 68 of the close reserved cured portion of exposed region
Distance be also constant；And leaned on according to the reserved cured portion of acquisition close to the end points 67 and exposed region of exposed region
The distance between end points 68 of cured portion closely reserved, it is possible to obtain actual working length, i.e. reserved cured portion
Length so that select it is corresponding preset radium-shine control parameter, radium-shine light beam is fallen on a corresponding position, solidification that will be reserved
Part is cut off exactly.Each data, parameter are accurately defined, and reduce the probability of scrapping of product, and reduce unnecessary product
Loss, saves resource.
In another embodiment of the present invention, as shown in Fig. 2 a kind of cutting method of the elargol groove of SIP modules, bag
Include：The corresponding default radium-shine control parameter of step S00 configuration pre-determined distances data area, pre-determined distance data area；Step S10
Obtain the groove cutting data in the consolidation zone of SIP modules；Groove cutting data includes：Groove cutting path and groove cutting
Position；Step S20 is cut according to groove cutting data using radium-shine in consolidation zone, forms the groove of elargol to be filled,
There is reserved cured portion between the exposed region of groove and SIP modules；Step S30 when insert groove elargol solidify after,
Reserved cured portion is obtained to the range data of exposed region；Range data includes：Reserved cured portion is close to exposed area
The end points and exposed region in domain are close to the distance between reserved end points of cured portion；Step S30 is specifically included：Step
Picture of the reserved cured portion of S31 collections to exposed region；Step S32 is handled picture, and calculating obtains reserved consolidate
Change the range data that exposed region is arrived in part；Step S40 presets radium-shine control parameter according to range data is corresponding, using radium-shine
The reserved cured portion of excision, consolidation zone and exposed region are got through；Step S40 is specifically included：Step S41 is inquired about apart from number
According to residing pre-determined distance data area；Step S42 presets radium-shine control parameter according to pre-determined distance data area is corresponding, obtains
Take range data is corresponding to preset radium-shine control parameter；Step S43 is cut according to the default radium-shine control parameter of acquisition using radium-shine
Except reserved cured portion, consolidation zone and exposed region are got through.
Specifically, being got through exposed region and consolidation zone using the method for secondary cut, secondary cut refers to, for the first time
The groove of elargol to be filled out together is first cut out, a little consolidation zone is reserved close to one end of exposed region in this groove, makes to insert
The elargol of groove causes product rejection because being unlikely to flow to exposed region when changing；After elargol solidifies, then carry out second and cut
Cut, reserved cured portion is cut off.Such operating type, one ensures that elargol will not be attached to unnecessary region, two
According to the actual conditions of reserved cured portion, corresponding default radium-shine control parameter is automatically selected, raising smoothly gets through naked
Reveal the probability of region and consolidation zone, reduce when product is in excision reserved cured portion caused by the radium-shine control parameter of mistake
The problem of causing to scrap.
In another embodiment of the present invention, as shown in figure 3, a kind of manufacture method of SIP modules, including：Step
Chip, active member, passive device needed for upper surface welding SIP modules of the S100 in PCB, PCB lower surface, which has, to be reserved
Solder joint, the PCBA of SIP modules is made；Wherein, PCBA upper surface includes：Region to be solidified and exposed region；Step S200
Filler is carried out to region to be solidified in PCBA upper surface, glue is covered the chip in region to be solidified, master in PCBA upper surface
Dynamic element, passive device, then make adhesive curing that consolidation zone is made, consolidation zone and exposed region constitute SIP modules；Step
S400 obtains the groove cutting data in the consolidation zone of SIP modules；Groove cutting data includes：Groove cutting path and groove
Cutting position；Step S500 is cut according to groove cutting data using radium-shine in consolidation zone, forms elargol to be filled
There is reserved cured portion between the exposed region of groove, groove and SIP modules；Step S600 consolidates when the elargol for inserting groove
After change, reserved cured portion is obtained to the range data of exposed region；Step S700 is according to the corresponding default radium of range data
Control parameter is penetrated, using the reserved cured portion of radium-shine excision, consolidation zone and exposed region are got through；Step S800 is to SIP
The surrounding of module and upper surface carry out metal sputtering formation EMI electro-magnetic screen layers.
Specifically, having been welded on PCB hollow plates after corresponding chip and element, obtained product is PCBA；It is ensuing
Step is exactly to carry out filler solidification to PCBA, and due to the demand of product, a part of region on PCBA may not be filled out
Adhesive curing, therefore, is needed to cover this region in filler solidifies this processing procedure, and filler solidification is carried out to other regions,
After so operating, will there are consolidation zone and exposed region on the SIP modules eventually formed；Then need on SIP modules
Consolidation zone and exposed region get through, elargol is inserted in the groove cut out and sticks tiny element, because elargol does not coagulate
Gu when be liquid, in order to ensure that it will not flow to unnecessary region, for example：Exposed region, using the method for secondary cut
Got through：1) groove of elargol to be filled out is cut out for the first time, and groove has reserved cured portion with exposed region, and this is reserved
Cured portion plays barrier effect to the elargol for inserting the flowing in groove, limits the flowing space of elargol, it is ensured that elargol only can be
Flowed in groove, stick the element in this groove, other regions will not be flow to；2) after elargol solidifies, then reserved consolidated
Change Partial Resection, exposed region and consolidation zone are got through.
Preferably, consolidation zone and exposed region connection after EMI electro-magnetic screen layers get through SIP modules, and to getting through
Consolidation zone and exposed region afterwards carries out EMI electromagnetic shieldings.
Specifically, the region that the exposed region and elargol on SIP modules stick all has circuit, and they are not insulation
, there may be electromagnetic interference in follow-up use, accordingly, it would be desirable to sputtering EMI electro-magnetic screen layer is carried out to SIP modules, this
EMI electro-magnetic screen layers are electromagnetically shielded to exposed region and elargol region, and also the two regions are connected together, real
The connection of exposed region and consolidation zone is showed.In addition, EMI electromagnetic shieldings are not only to exposed region and elargol region, and
It is that EMI electromagnetic shieldings have been carried out to the upper surface of SIP modules and surrounding, reducing SIP modules will not go out in follow-up use
The situation of existing electromagnetic interference.
Preferably, step S600 is specifically included：Picture of the reserved cured portion of step S610 collections to exposed region；Step
Rapid S620 is handled picture, and calculating obtains reserved cured portion to the range data of exposed region.
Preferably, step S700 is specifically included：Pre-determined distance data area residing for step S710 inquiry range data；Step
Rapid S720 presets radium-shine control parameter according to pre-determined distance data area is corresponding, obtains the corresponding default radium-shine control of range data
Parameter processed；Step S730 is according to the default radium-shine control parameter of acquisition, the cured portion reserved using radium-shine excision, by curing area
Domain and exposed region are got through.
Preferably, also include between step S200 and step S400：Step S300 configures pre-determined distance data area, preset
The corresponding radium-shine control parameter of range data scope.
Preferably, range data includes：Reserved cured portion is close close to the end points and exposed region of exposed region
The distance between reserved end points of cured portion.
Specifically, during due to carrying out filler solidification to PCBA, the problem of may having plastic packaging skew, even if reserved consolidates
The position for changing part close to groove end points is identical, and the length of its reserved cured portion is also different, it is necessary to be adopted according to actual conditions
With corresponding radium-shine control parameter, correctly reserved cured portion could be cut off, other can not be removed without injuring
Region, therefore, obtain reserved cured portion to after the distance between exposed region, automatically select preset accordingly it is radium-shine
Control parameter, it is ensured that reserved cured portion can correctly be cut off, makes it be alignd with the groove that first time cuts out, second
After the reserved cured portion of secondary excision, only have one of groove on SIP modules and connected with exposed region.
In another embodiment of the present invention, as shown in figure 4, a kind of manufacture method of SIP modules, including：Step
Chip, active member, passive device needed for upper surface welding SIP modules of the S100 in PCB, PCB lower surface, which has, to be reserved
Solder joint, the PCBA of SIP modules is made；Wherein, PCBA upper surface includes：Region to be solidified and exposed region；
Step S200 carries out filler to region to be solidified in PCBA upper surface, covers glue and treats solid in PCBA upper surface
Change chip, active member, the passive device in region, then make adhesive curing that consolidation zone, consolidation zone and exposed region group is made
Into SIP modules；
Step S300 configuration pre-determined distances data area, the corresponding radium-shine control parameter of pre-determined distance data area；
Step S400 obtains the groove cutting data in the consolidation zone of SIP modules；Groove cutting data includes：Groove is cut
Cut path and groove cutting position；
Step S500 is cut according to groove cutting data using radium-shine in consolidation zone, forms elargol to be filled
There is reserved cured portion between the exposed region of groove, groove and SIP modules；
Step S600 obtains reserved cured portion to the distance number of exposed region after the elargol for inserting groove solidifies
According to；Step S600 is specifically included：Picture of the reserved cured portion of step S610 collections to exposed region；Step S620 is to picture
Handled, calculating obtains reserved cured portion to the range data of exposed region；Range data includes：Reserved solidified portion
Divide end points and exposed region close to exposed region close to the distance between reserved end points of cured portion；
Step S700 presets radium-shine control parameter according to range data is corresponding, using the reserved solidified portion of radium-shine excision
Point, consolidation zone and exposed region are got through；Step S700 is specifically included：Residing for step S710 inquiry range data it is default away from
From data area；Step S720 presets radium-shine control parameter according to pre-determined distance data area is corresponding, obtains range data pair
The default radium-shine control parameter answered；Step S730 consolidates according to the default radium-shine control parameter of acquisition using radium-shine excision is reserved
Change part, consolidation zone and exposed region are got through；
Step S800 carries out metal sputtering formation EMI electro-magnetic screen layers to the surrounding of SIP modules and upper surface；EMI electromagnetism
Screen layer SIP modules are got through after consolidation zone and exposed region connection, and to getting through after consolidation zone and exposed region
Carry out EMI electromagnetic shieldings.
Specifically, SIP modules are after exposed region and consolidation zone has been got through, upper surface that can be to SIP and surrounding sputter
EMI electro-magnetic screen layers, it is ensured that while connection between exposed region and consolidation zone, also make exposed region and elargol region
In circuit avoid electromagnetic interference problem in follow-up use.
In another embodiment of the present invention, as shown in figure 5, a kind of diced system of the elargol groove of SIP modules, bag
Include：Control module 10；Acquisition module 30, is electrically connected with control module 10, under the control of control module 10, obtains SIP modules
Consolidation zone in groove cutting data；And, after the elargol for inserting groove solidifies, under the control of control module 10,
Reserved cured portion is obtained to the range data of the exposed region of SIP modules；Wherein, groove cutting data includes：Groove is cut
Cut path and groove cutting position；Memory module 20, is electrically connected with control module 10, under the control of control module 10, storage
Preset radium-shine control parameter；Radium-shine module 40, is electrically connected with control module 10, under the control of control module 10, according to groove
Cutting data, is cut using radium-shine in consolidation zone, forms the groove of elargol to be filled, and groove is exposed with SIP modules
There is reserved cured portion between region；And, under the control of control module 10, according to the corresponding default radium of range data
Control parameter is penetrated, using the reserved cured portion of radium-shine excision, consolidation zone and exposed region are got through.
Specifically, the function of control module is realized by industrial computer in the diced system of the elargol groove of SIP modules,
The processor that can be described as its inside with other hardware in industrial computer is controlled；The function of memory module is then by depositing
Reservoir is realized；Radium-shine module, that is, laser apparatus, include laser head, galvanometer, focus lamp etc., and these devices ensure that phase
The radium-shine light beam that should be able to be measured can fall in accurate position, so as to realize accurate cutting；The function of acquisition module is by CCD camera
Realize.
The operation original position for filling out elargol groove is treated according to Mark points by CCD camera and operating area is positioned,
So as to obtain corresponding groove cutting data, groove cutting data includes：Groove cutting path and groove cutting position, in addition to
The radium-shine control parameter of groove, the radium-shine control parameter of this groove includes energy parameter and focusing parameter, and sending laser head mutually should be able to
The radium-shine light beam of amount, falls to being cut in correct position, forms elargol to be filled out in the control of the devices such as galvanometer, condensing lens
Groove.As shown in figure 9, it is necessary to according to the actual conditions of reserved cured portion 64, automatically using corresponding after elargol 66 solidifies
Default radium-shine control parameter reserved cured portion 64 is cut off without damaging other regions exactly, reduction product rejection
Probability.
Preferably, acquisition module 30 is specifically included：Submodule 31 is gathered, the reserved cured portion of collection arrives exposed region
Picture；Submodule 32 is handled, picture is handled, calculating obtains reserved cured portion to the range data of exposed region.
Specifically, as stated above, gathering the function of submodule can be realized by the taking lens of CCD camera, shoot pre-
Picture of the cured portion stayed to exposed region, it can be understood as needed in the photo of shooting while including reserved cured portion
And exposed region；And submodule is handled, and it can be realized by the picture processor being assemblied in CCD camera, can be according to GTG pair
It is that subsequently selected radium-shine control parameter default accordingly provides the foundation than the range data of principle calculating between the two.Consider
To cost, processing submodule can also be realized by the processor in industrial computer.
Preferably, memory module 20, are further used for storing pre-determined distance data area；Radium-shine module 40 includes：Data
Inquire about submodule 41, the pre-determined distance data area residing for inquiry range data；Parameter acquiring submodule 42, according to pre-determined distance
Data area is corresponding to preset radium-shine control parameter, obtains the corresponding default radium-shine control parameter of range data；Radium-shine excision
Module 43, according to the default radium-shine control parameter of acquisition, using the reserved cured portion of radium-shine excision, by consolidation zone and exposed
Region is got through；And, according to groove cutting data, cut using radium-shine in consolidation zone, form the ditch of elargol to be filled
There is reserved cured portion between the exposed region of groove, groove and SIP modules.
Specifically, the function of data query submodule, parameter acquiring submodule can in laser apparatus data processor
Realize, can also because of cost consideration, realized by industrial computer.Presetting radium-shine control parameter includes：Focusing parameter and energy
Measure parameter；Energy parameter includes：Speed, power, frequency etc.；Focusing parameter includes：The starting operation position of reserved cured portion
Put, working length, it is understood that be, the cutting position of the cutting path of reserved cured portion and reserved cured portion.
Corresponding pre-determined distance data area can be obtained according to the range data of acquisition, so that the range data obtained is corresponding
Radium-shine control parameter is preset, the radium-shine light beam of corresponding energy is made under the control of this parameter in the control of the devices such as galvanometer, focus lamp
System falls in specified location, and reserved cured portion is cut off.
Preferably, in addition to：Configuration module 50, is electrically connected with control module 10, under the control of control module 10, configuration
Pre-determined distance data area, pre-determined distance data area are corresponding to preset radium-shine control parameter.
Specifically, the function of configuration module is realized by industrial computer, by default range data scope and its corresponding
Default radium-shine control parameter configuration in industrial computer, according to the reserved cured portion subsequently obtained to exposed region away from
Radium-shine control parameter is preset accordingly from data selection, radium-shine light beam is cut off reserved cured portion exactly, automatically
Selection is preset other regions of destruction SIP modules when radium-shine control parameter reduces excision reserved cured portion and made accordingly
Into the situation of product rejection.
Preferably, range data includes：Reserved cured portion is close close to the end points and exposed region of exposed region
The distance between reserved end points of cured portion.
Specifically, reserved cured portion and exposed region is all very small in itself, clear and definite range data is defined
It can ensure that radium-shine light beam is accurately controlled, improve the probability that radium-shine light beam successfully cuts off reserved cured portion, reduction production
The situation that product is scrapped.
In another embodiment of the present invention, as shown in fig. 6, a kind of diced system of the elargol groove of SIP modules, bag
Include：
Control module 10；
Configuration module 50, is electrically connected with control module 10, under the control of control module 10, configures pre-determined distance data model
Enclose, pre-determined distance data area it is corresponding preset radium-shine control parameter；
Acquisition module 30, is electrically connected with control module 10, under the control of control module 10, obtains the solidification of SIP modules
Groove cutting data in region；And, after the elargol for inserting groove solidifies, under the control of control module, obtain reserved
Cured portion to the exposed region of SIP modules range data；Range data includes：Reserved cured portion is close to exposed area
The end points and exposed region in domain are close to the distance between reserved end points of cured portion；Acquisition module 30 is specifically included：Adopt
Collect submodule 31, the picture of the reserved cured portion of collection to exposed region；Submodule 32 is handled, picture is handled, is counted
Calculation obtains reserved cured portion to the range data of exposed region；
Wherein, groove cutting data includes：Groove cutting path and groove cutting position；
Memory module 20, is electrically connected with control module 10, under the control of control module 10, the default radium-shine control ginseng of storage
Number, and, store pre-determined distance data area；
Radium-shine module 40, is electrically connected with control module 10, under the control of control module 10, according to groove cutting data,
Cut using radium-shine in consolidation zone, form the groove of elargol to be filled, deposited between groove and the exposed region of SIP modules
In reserved cured portion；And, under the control of control module, radium-shine control parameter is preset according to range data is corresponding,
Using the reserved cured portion of radium-shine excision, consolidation zone and exposed region are got through；Radium-shine module 40 includes：Data query
Module 41, the pre-determined distance data area residing for inquiry range data；Parameter acquiring submodule 42, according to pre-determined distance data model
Corresponding default radium-shine control parameter is enclosed, the corresponding default radium-shine control parameter of range data is obtained；Radium-shine excision submodule 43,
According to the default radium-shine control parameter of acquisition, using the reserved cured portion of radium-shine excision, consolidation zone and exposed region are beaten
It is logical；And, according to groove cutting data, cut using radium-shine in consolidation zone, form the groove of elargol to be filled, groove
There is reserved cured portion between the exposed region of SIP modules.
Specifically, due to the problem of plastic packaging is offset, making the length of the reserved cured portion of each SIP modules also differ
Sample, it is therefore desirable to selected to preset radium-shine control parameter accordingly according to actual conditions to ensure that reserved cured portion is accurate
The elargol groove cut out after excision, and the reserved cured portion of second of excision with first time aligns, after secondary cut only
A groove is formed to get through with exposed region.Default range data scope default radium-shine control parameter corresponding with its can be with journey
The form of formula is stored in industrial computer, after corresponding range data is obtained, is automatically selected accordingly according to actual conditions
Formula, reserved cured portion is cut off under the control of this formula.Automatically select corresponding formula, it is to avoid manually
The generation for the mistake that switching operation formula is caused, reduces the probability of product rejection.
It should be noted that above-described embodiment can independent assortment as needed.Described above is only the preferred of the present invention
Embodiment, it is noted that for those skilled in the art, is not departing from the premise of the principle of the invention
Under, some improvements and modifications can also be made, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (16)
1. a kind of cutting method of the elargol groove of SIP modules, it is characterised in that including：
Step S10 obtains the groove cutting data in the consolidation zone of the SIP modules；
The groove cutting data includes：Groove cutting path and groove cutting position；
Step S20 is cut according to the groove cutting data using radium-shine in the consolidation zone, forms elargol to be filled
Groove, there is reserved cured portion between the groove and the exposed region of the SIP modules；
Step S30 obtains the reserved cured portion to the exposed region after elargol for inserting the groove solidifies
Range data；
Step S40 presets radium-shine control parameter according to the range data is corresponding, using the reserved solidification of radium-shine excision
Part, the consolidation zone and the exposed region are got through.
2. a kind of cutting method of the elargol groove of SIP modules as claimed in claim 1, it is characterised in that the step S30
Specifically include：
Picture of the reserved cured portion of step S31 collections to the exposed region；
Step S32 is handled the picture, and calculating obtains the reserved cured portion to the distance of the exposed region
Data.
3. a kind of cutting method of the elargol groove of SIP modules as claimed in claim 1, it is characterised in that the step S40
Specifically include：
Step S41 inquires about the pre-determined distance data area residing for the range data；
Step S42 is obtained described apart from number according to the corresponding default radium-shine control parameter of the pre-determined distance data area
According to the corresponding default radium-shine control parameter；
Step S43 presets radium-shine control parameter according to the described of acquisition, using the reserved cured portion of radium-shine excision, by institute
State consolidation zone and the exposed region is got through.
4. a kind of cutting method of the elargol groove of SIP modules as claimed in claim 3, it is characterised in that the step S10
Also include before：
Step S00 configures the corresponding default radium-shine control of the pre-determined distance data area, the pre-determined distance data area
Parameter processed.
5. the cutting method of the elargol groove of a kind of SIP modules as described in claim 1-3 is any, it is characterised in that described
Range data includes：
The reserved cured portion is described solid close to what is reserved close to the end points and the exposed region of the exposed region
Change the distance between end points of part.
6. a kind of manufacture method of SIP modules, it is characterised in that including：
Chip, active member, passive device, the PCB needed for the upper surface welding SIP modules of the step S100 in PCB
Lower surface there is reserved solder joint, the PCBA of the SIP modules is made；
Wherein, the upper surface of the PCBA includes：Region to be solidified and exposed region；
Step S200 carries out filler to region to be solidified in the upper surface of the PCBA, glue is covered in the upper surface of the PCBA
Chip, active member, the passive device in region to be solidified, then make adhesive curing that consolidation zone, the consolidation zone and institute is made
State exposed region and constitute the SIP modules；
Step S400 obtains the groove cutting data in the consolidation zone of the SIP modules；
The groove cutting data includes：Groove cutting path and groove cutting position；
Step S500 is cut according to the groove cutting data using radium-shine in the consolidation zone, forms silver to be filled
There is reserved cured portion between the exposed region of the groove of glue, the groove and the SIP modules；
Step S600 obtains the reserved cured portion to the exposed region after elargol for inserting the groove solidifies
Range data；
Step S700 presets radium-shine control parameter according to the range data is corresponding, using the reserved solidification of radium-shine excision
Part, the consolidation zone and the exposed region are got through；
Step S800 carries out metal sputtering formation EMI electro-magnetic screen layers to the surrounding of the SIP modules and upper surface.
7. a kind of manufacture method of SIP modules as claimed in claim 6, it is characterised in that：
The EMI electro-magnetic screen layers SIP modules are got through after the consolidation zone and exposed region connection, it is and right
The consolidation zone and the exposed region after getting through carry out EMI electromagnetic shieldings.
8. a kind of manufacture method of SIP modules as claimed in claim 6, it is characterised in that the step S600 is specifically included：
Picture of the reserved cured portion of step S610 collections to the exposed region；
Step S620 is handled the picture, and calculating obtains the reserved cured portion to the distance of the exposed region
Data.
9. a kind of manufacture method of SIP modules as claimed in claim 6, it is characterised in that the step S700 is specifically included：
Step S710 inquires about the pre-determined distance data area residing for the range data；
Step S720 is obtained described apart from number according to the corresponding default radium-shine control parameter of the pre-determined distance data area
According to the corresponding default radium-shine control parameter；
Step S730 presets radium-shine control parameter according to the described of acquisition, will using the reserved cured portion of radium-shine excision
The consolidation zone and the exposed region are got through.
10. a kind of manufacture method of SIP modules as claimed in claim 9, it is characterised in that the step S200 and the step
Also include between rapid S400：
Step S300 configures the corresponding radium-shine control ginseng of the pre-determined distance data area, the pre-determined distance data area
Number.
11. a kind of manufacture method of SIP modules as described in claim 6-9 is any, it is characterised in that the range data bag
Include：
The reserved cured portion is described solid close to what is reserved close to the end points and the exposed region of the exposed region
Change the distance between end points of part.
12. a kind of diced system of the elargol groove of SIP modules, it is characterised in that including：
Control module；
Acquisition module, is electrically connected with the control module, under the control of the control module, obtains consolidating for the SIP modules
Change the groove cutting data in region；And, after the elargol for inserting the groove solidifies, in the control of the control module
Under, the reserved cured portion is obtained to the range data of the exposed region of the SIP modules；
Wherein, the groove cutting data includes：Groove cutting path and groove cutting position；
Memory module, is electrically connected with the control module, under the control of the control module, the default radium-shine control ginseng of storage
Number；
Radium-shine module, is electrically connected with the control module, under the control of the control module, and number is cut according to the groove
According to being cut using radium-shine in the consolidation zone, form the groove of elargol to be filled, the groove and the SIP modules
The exposed region between there is reserved cured portion；And, under the control of the control module, according to the distance
The corresponding cured portion preset radium-shine control parameter, reserved using radium-shine excision of data, by the consolidation zone
Got through with the exposed region.
13. a kind of diced system of the elargol groove of SIP modules as claimed in claim 12, it is characterised in that the acquisition
Module is specifically included：
Gather submodule, the picture of the reserved cured portion of collection to the exposed region；
Submodule is handled, the picture is handled, calculating obtains the reserved cured portion to the exposed region
Range data.
14. a kind of diced system of the elargol groove of SIP modules as claimed in claim 12, it is characterised in that：
The memory module, is further used for storing pre-determined distance data area；
The radium-shine module includes：
Data query submodule, inquires about the pre-determined distance data area residing for the range data；
Parameter acquiring submodule, according to the corresponding default radium-shine control parameter of the pre-determined distance data area, obtains institute
State the corresponding default radium-shine control parameter of range data；
Radium-shine excision submodule, described according to acquisition presets radium-shine control parameter, using the reserved solidification of radium-shine excision
Part, the consolidation zone and the exposed region are got through；And, according to the groove cutting data, using radium-shine in institute
State consolidation zone to be cut, form the groove of elargol to be filled, deposited between the groove and the exposed region of the SIP modules
In reserved cured portion.
15. a kind of diced system of the elargol groove of SIP modules as claimed in claim 14, it is characterised in that also include：
Configuration module, is electrically connected with the control module, under the control of the control module, configures the pre-determined distance data
The corresponding default radium-shine control parameter of scope, the pre-determined distance data area.
16. a kind of diced system of the elargol groove of SIP modules as described in claim 12-14 is any, it is characterised in that institute
Stating range data includes：
The reserved cured portion is described solid close to what is reserved close to the end points and the exposed region of the exposed region
Change the distance between end points of part.
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| CN107706174B (en) * | 2017-09-26 | 2024-05-10 | 环维电子(上海)有限公司 | Electronic module with low warpage and preparation method of electronic module |
| CN111438444B (en) * | 2018-12-28 | 2022-08-12 | 北京北科天绘科技有限公司 | Laser cutting method and system based on device array mass transfer |
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| JPH09298339A (en) * | 1996-04-30 | 1997-11-18 | Rohm Co Ltd | Manufacture of semiconductor laser |
| JP3842444B2 (en) * | 1998-07-24 | 2006-11-08 | 富士通株式会社 | Manufacturing method of semiconductor device |
| JP3933118B2 (en) * | 2003-10-02 | 2007-06-20 | ソニー株式会社 | Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
| US8778780B1 (en) * | 2005-10-13 | 2014-07-15 | SemiLEDs Optoelectronics Co., Ltd. | Method for defining semiconductor devices |
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