CN107331499A - The encapsulating method and embedding circuit structure of circuit structure - Google Patents
The encapsulating method and embedding circuit structure of circuit structure Download PDFInfo
- Publication number
- CN107331499A CN107331499A CN201710522344.2A CN201710522344A CN107331499A CN 107331499 A CN107331499 A CN 107331499A CN 201710522344 A CN201710522344 A CN 201710522344A CN 107331499 A CN107331499 A CN 107331499A
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- China
- Prior art keywords
- embedding
- circuit structure
- inductance
- inductor
- inductance component
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
The present invention relates to a kind of encapsulating method of circuit structure and embedding circuit structure.Encapsulating method includes：The embedding inductance component using pouring adhesive into inductor, in inductance mould；After being stripped to inductance component, the inductance component after embedding is assembled into the circuit structure for treating embedding；And use circuit casting glue embedding circuit structure.Embedding circuit structure includes multiple components, at least one inductance component in multiple components, inductance component is coated or covered by pouring adhesive into inductor by embedding, and the inductance component and other components for being coated with pouring adhesive into inductor are coated or covered by circuit casting glue by embedding together.Inductance component is coated with pouring adhesive into inductor before embedding is carried out together with other components by an embedding；The pouring adhesive into inductor of cladding can protect the magnetic core of inductance component not by the stress impact of circuit casting glue in the overall embedding of circuit structure, so as to prevent inductance sensibility reciprocal from dropping, it is ensured that EMC performances.
Description
Technical field
The present invention relates to the encapsulating method and embedding circuit in circuit and circuit embedding field, more particularly to a kind of circuit structure
Structure.
Background technology
The common mode inductance included in many circuit structures in inductance component, such as power supply (is also common mode choke Common
Mode Choke), it is usually used in suppressing suppression common mode electromagnetic interference signal in power supply so that power supply meets the electromagnetic interference standard of correlation.
The magnetic circuit form of common mode inductance also has (such as T of closed magnetic circuit by (two parts are constituted, such as PK types, UU types, EE types) of opening magnetic
Ring, SQ types, ET types etc.), the magnetic conductivity of its material is usually 5000 to 15000.
Exemplified by opening magnetic common mode inductance, there is certain advantage in cost, in volume and in terms of reliability because of it
And extensive utilization has been obtained, the particularly application in terms of small-power, small size power supply.But it is by two to open magnetic common mode inductance
Magnetic core is divided to constitute a closed magnetic circuit, and environment is very sensitive to external world for its high magnetic permeability material magnetic core, although magnetic core junction
By mirror surface treatment, it is also difficult to ensure inductance component when by external impacts, sensibility reciprocal does not fall, and this ultimately results in electromagnetic interference
Surplus is not enough, when serious, causes electromagnetic interference exceeded.
The reason for sensibility reciprocal falls, is mostly due to magnetic core by casting glue (such as power supply embedding AB glue) stress impact, magnetic
Core position is changed, and this change naked eyes are difficult to observe by, but can be counter to push away Effective permeability to confirm by detecting sensibility reciprocal.
For example, the sensibility reciprocal of a UU16 common mode inductance is 13mH, number of turns 45Ts, sensibility reciprocal is reduced to 1mH under external force.Normal condition
Under, the contact of magnetic core minute surface is good, and the 0.001mm gaps of magnetic core minute surface can be ignored；It is counter to push away if sensibility reciprocal is reduced to 1mH
Breath depth is about 0.0652mm, and gap variable quantity is 0.0652-0.001=0.0642mm, and 0.0642mm is very trickle
Change, but can directly result in sensibility reciprocal and reduce more than 10 times, therefore, opens magnetic common mode inductance sensibility reciprocal and falls problem and do not allow in embedding power supply
Ignore.
In addition, because casting glue need to meet simultaneously waterproof, radiating, EMC, resist stress the problems such as, in conventional dosing technology stream
, it is necessary to vacuumize to ensure that each component in circuit structure is all covered or coated by casting glue in journey, but vacuumizing ring
In border, magnetic core junction a part of casting glue because vacuum pressure has been squeezed into, colloid increases in the hot stage coefficient of expansion, one
Determine under hardness, stress impact is generated to magnetic core, ultimately result in the drop of inductance sensibility reciprocal, EMC degradations.
Many inductance manufacturers are fixed using single component epoxy point in magnetic core side column binding site at present, but because of magnetic
The difference and higher technological requirement of the position irregular, for dispensing glue of cored structure, fixed effect is not obvious.And in high-temperature region,
Epoxy resin can equally soften, and fixed effect can accordingly weaken.Understood based on above-mentioned data analysis, small magnetic core movement
(0.06mm) may also cause the serious drop (reduction more than 10 times) of sensibility reciprocal, therefore currently employed epoxy resin improves fixed effect
Fruit is not largely effective.
The content of the invention
The technical problem to be solved in the present invention is, filling is vulnerable to for the magnetic core junction of inductance component in the prior art
The extruding of sealing and cause the defect that sensibility reciprocal falls after embedding there is provided a kind of encapsulating method of circuit structure and embedding circuit knot
Structure.
The technical solution adopted for the present invention to solve the technical problems is：There is provided a kind of encapsulating method of circuit structure,
Circuit structure includes inductance component, and the encapsulating method includes：
The inductance component described in embedding using pouring adhesive into inductor, in inductance mould；
After being stripped to the inductance component, the inductance component after embedding is assembled into the circuit structure for treating embedding
In；And
Using circuit structure described in circuit casting glue embedding.
Preferably, the hardness of the pouring adhesive into inductor is less than the hardness of the circuit casting glue.
Preferably, the hardness of the pouring adhesive into inductor is 10-25, and the hardness of the circuit casting glue is at least 50.
Preferably, in the use pouring adhesive into inductor, in inductance mould in embedding inductance component, an inductance mould
One inductance component of embedding in tool.
Preferably, in the use pouring adhesive into inductor, in inductance mould in embedding inductance component, under non-vacuum condition
Inductance component described in embedding；
In circuit structure described in the use circuit casting glue embedding, circuit structure described in embedding under vacuum.
Preferably, the plastics that the inductance mould is not higher than 60 DEG C using heat resisting temperature are made.
Preferably, in the demoulding to the inductance component, using the baking temperature higher than the heat resisting temperature to filling
The inductance mould that sealing has the inductance component is toasted, to be stripped to the inductance component.
Preferably, the baking temperature is at least 110 DEG C.
Present invention also offers a kind of embedding circuit structure, including multiple components, in the multiple component at least
One inductance component, the inductance component coats pouring adhesive into inductor by embedding, coats the inductance component of pouring adhesive into inductor
Pass through embedding coating circuit casting glue together with other components.
Preferably, the hardness of the pouring adhesive into inductor is less than the hardness of the circuit casting glue.
Implement the invention has the advantages that：Above-mentioned encapsulating method and thus encapsulating method obtain embedding circuit
In structure, inductance component is coated with inductance embedding before embedding is carried out together with other components by an embedding
Glue；The pouring adhesive into inductor of cladding can protect the magnetic core of inductance component not by circuit casting glue in the overall embedding of circuit structure
Stress impact, so as to prevent inductance sensibility reciprocal from dropping, it is ensured that EMC performances.In addition, the inductance component for being coated with pouring adhesive into inductor is electric
Sense casting glue is fixed, it is no longer necessary to is fixed using epoxy resin in magnetic core side column binding site, is eliminated the fixing step,
Technological process is simplified, the technique uncertainty that the fixation procedure is brought is it also avoid, improves the reliability of circuit structure.
Brief description of the drawings
Below in conjunction with drawings and Examples, the invention will be further described, in accompanying drawing：
Fig. 1 is a kind of flow chart of the encapsulating method of circuit structure of one embodiment of the invention；
Fig. 2 is the structural representation of the inductance die assembly of one embodiment of the invention；
Fig. 3 is to carry out multiple inductance in the circuit structure after embedding to circuit structure using existing conventional encapsulating method
The suite line of inductance-temperature 10 of device；
Fig. 4 carries out multiple electricity in the circuit structure after embedding using the encapsulating method of the present invention to identical circuit structure
The suite line of inductance-temperature 10 of inductor component；
Fig. 5 is the conducted emission test result of identical circuit structure in Fig. 3；
Fig. 6 is the conducted emission test result of identical circuit structure in Fig. 4.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, it is right below in conjunction with drawings and Examples
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Fig. 1 shows a kind of flow chart of the encapsulating method of circuit structure according to one embodiment of the invention, the circuit knot
Structure includes at least one inductance component in multiple components, multiple components.The encapsulating method includes：Step S100, use
Pouring adhesive into inductor, the embedding inductance component in inductance mould；Step S200, to inductance component be stripped after, by the inductance after embedding
Device is assembled into the circuit structure for treating embedding；And step S300, using circuit casting glue embedding circuit structure.
The embedding circuit structure obtained using above-mentioned encapsulating method embedding is included in multiple components, multiple components at least
There is an inductance component, wherein, inductance component is coated or covered by pouring adhesive into inductor by embedding, is coated with pouring adhesive into inductor
Inductance component and other components are coated or covered by circuit casting glue by embedding together.Foregoing circuit structure can be electricity
Inductance in source, foregoing circuit can be common mode inductance.For example, circuit structure is the power supply of LED device, the electricity in concrete application
Common mode inductance at least is led including 2 high in source, the height for specially opening magnetic structure leads common mode inductance, because inductance component passes through electricity in advance
Sense casting glue embedding cladding is protected, and thus inhibitory action can be played to the common mode disturbances in electromagnetic interference, so as to meet phase
The electromagnetic interference standard of pass.
Above-mentioned encapsulating method and thus encapsulating method obtain embedding circuit structure in, inductance component with other yuan of device
Part is carried out before embedding together, is coated with pouring adhesive into inductor by an embedding；The pouring adhesive into inductor of cladding can be in circuit
The magnetic core of inductance component is protected in the overall embedding of structure not by the stress impact of circuit casting glue, so as to prevent under inductance sensibility reciprocal
Fall, it is ensured that EMC performances.In addition, the inductance component for being coated with pouring adhesive into inductor is fixed by pouring adhesive into inductor, it is no longer necessary to use ring
Oxygen tree fat is fixed in magnetic core side column binding site, eliminates the fixing step, simplifies technological process, it also avoid this and consolidates
Determine the technique uncertainty that process is brought, improve the reliability of circuit structure.
Specifically, in the step s 100, the pouring adhesive into inductor of use is different from circuit casting glue, general opposing circuit embedding
Glue is softer casting glue.The hardness of pouring adhesive into inductor is usually 10-25, for example, can be the limited public affairs of the magnificent apocalypse science and technology in Shenzhen
Department produces, brand is magnificent apocalypse, model CS-9812G-T20 embedding AB glue, and it is 20 that wherein T20, which represents shore hardness,.Firmly
The relatively small pouring adhesive into inductor of degree is expanded because hardness is softer after high temperature, and colloid can absorb a part of pressure, and magnetic core is produced
Stress impact it is relatively small, the sensibility reciprocal of inductance component will not be caused to fall in embedding.And be 50 or more according to hardness
The direct embedding inductance of casting glue, even if not vacuumizing, by checking, the sensibility reciprocal of inductance component still has different degrees of fall
Fall.
Referring to Fig. 2, it illustrates the structural representation of inductance die assembly 1, inductance die assembly 1 includes multiple inductance moulds
Tool 11, each inductance mould 11 is suitable to accommodate an inductance component, can determine inductance mould for the inductance component of different model
11 size and pattern, and based on this die sinking, thus may be implemented in one inductance component of embedding in an inductance mould 11.Inductance
The plastics that mould 11 can be not higher than 60 DEG C using heat resisting temperature are made, and such as heat resisting temperature is about 60 DEG C of PVC material.
In potting process, inductance mould is placed on tool fixed first, be accurately positioned, and prevent glue from sticking in inductance
In PIN；Then configuration pouring adhesive into inductor, using automation glue pouring machine, controls encapsulating speed and flow, fills 1/3 mold height,
So that inductance mold bottom has the colloid of abundant surplus；Then inductance component is sequentially placed into the inductance mould for having filled glue, after
It is continuous to use automatic dispensing machine encapsulating, until colloid did not just have line bag；Encapsulating terminates rear normal temperature cure, so as to complete inductance component
Embedding.Can also carry out embedding to integrated circuit structure because follow-up, thus this time for single inductor part embedding to waterproof, dissipate
Heat, EMC, resist stress requirement it is relatively low, without vacuumizing, the embedding in non-vacuum environment.In potting process not
Magnetic core binding site impregnation can be prevented by vacuumizing, as long as and impact is not stressed inside magnetic core, magnetic core position does not just occur
Change, sensibility reciprocal would not also drop.
In step S200, inductance component can be stripped from inductance mould using the various methods being arbitrarily adapted to.If for example,
Inductance mould is not higher than 60 DEG C of plastics using heat resisting temperature and is made, if heat resisting temperature is about 60 DEG C of PVC material, then can use
The inductance mould for having inductance component to embedding higher than the baking temperature of above-mentioned heat resisting temperature is toasted, with de- to inductance component
Mould.The stripping means make use of the relatively low characteristic of plastics heatproof, specifically, can put the inductance component being potted in inductance mould
It is placed in hot environment, the baking high temperature can be at least 110 DEG C, the environment temperature is higher than the heat resisting temperature of plastics, so that
Plastics rapid deformation is obtained to collapse, and pouring adhesive into inductor heatproof is relatively strong without deforming, and is thus contributed to using this characteristic
Inductance component and inductance mould natural separation.Using the release method caused product during manual removal plastics can be avoided to hinder
Evil；And multiple products can be once peeled off, greatly save artificial, raising efficiency；In addition, inductance mould will be not take up PCB after the demoulding
Space, can farthest reduce encapsulating volume, save product space；In addition, can promote the pouring adhesive into inductor of embedding inductance with
The circuit casting glue of the whole circuit structure of embedding is fully merged in both junctions, the middle isolation without plastic mould, is entered
One step improves radiating effect.Inductance component after the demoulding is coated by pouring adhesive into inductor, and is assembled into together with other components
Circuit structure.
In step S300, the circuit casting glue of use is different from pouring adhesive into inductor, and general relative pouring adhesive into inductor is harder
Casting glue.The hardness of pouring adhesive into inductor is usually 10-25, and the hardness of circuit casting glue is at least 50, for example, can be using deep
Apocalypse Science and Technology Ltd. of China of ditch between fields city produces, brand is used as electricity for magnificent apocalypse, model CS-9812G-T54 embedding AB glue
Road casting glue, wherein T54 represent that shore hardness is 54.
Can be using the existing method being arbitrarily adapted to come the whole circuit structure of embedding；In addition, when circuit structure is in itself with outer
During shell (such as power supply), without using further mold, embedding can be directly carried out in its shell, if circuit structure non-housing,
Embedding can be carried out using the existing mould suitable for integrated circuit structure.Whole circuit structure is carried out under conditions of vacuumizing
Embedding, this treats that the circuit structure of embedding is coated with the inductance component of pouring adhesive into inductor, because inductance component is being vacuumized
By being coated with pouring adhesive into inductor before embedding, carry out together with other components vacuumizing filling in circuit structure
Envelope, under the protective effect of pouring adhesive into inductor, can avoid magnetic core junction because vacuum pressure has been squeezed into a part of casting glue, from
And avoid the stress impact that colloid is produced in hot stage to magnetic core.
Circuit structure after the completion of embedding includes at least one inductance component in multiple components, multiple components, its
In, inductance component is coated or covered by pouring adhesive into inductor by embedding, is coated with the inductance component and other yuan of pouring adhesive into inductor
Device is coated or covered by circuit casting glue by embedding together.In an embodiment, the hardness of pouring adhesive into inductor is small
In the hardness of circuit casting glue, and the hardness of pouring adhesive into inductor is 10-25, and the hardness of circuit casting glue is at least 50.
Comparative analysis
Fig. 3, which is shown, uses existing conventional encapsulating method to circuit structure (herein for the power supply applied to LED device)
Inductance-temperature curve of 10 groups of inductance components in the circuit structure after embedding is carried out, ordinate sensibility reciprocal unit is mH, the embedding
Magnetic core junction point epoxy resin in method in inductance component is fixed；Fig. 4 shows the encapsulating method using the present invention
Pair with Fig. 3 identical circuit structure carry out embedding after circuit structure in 10 groups of inductance components inductance-temperature curve, indulge
Coordinate sensibility reciprocal unit is mH, and every curve in figure represents inductance-temperature curve of an inductance component.From figure 3, it can be seen that
Although before 55 DEG C, sensibility reciprocal increases with the rise of temperature, and at 60 DEG C or so, sensibility reciprocal drastically drops, and reason is epoxy
Self performance is deteriorated resin at high temperature, and magnetic flux is 15000 height that to lead material relatively sensitive, is impacted by internal stress
Lower sensibility reciprocal significantly falls.From fig. 4, it can be seen that in the range of identical warm area, sensibility reciprocal increases with the rise of temperature, without bright
Aobvious sensibility reciprocal falls phenomenon.From the contrast of above-mentioned inductance-temperature curve, it is apparent that using the encapsulating method of the present invention
And the embedding circuit structure obtained by the encapsulating method can be prevented effectively from inductance component sensibility reciprocal caused by embedding and fall phenomenon.
Fig. 5 shows the conducted emission test result of identical circuit structure in Fig. 3, and Fig. 6 shows identical electricity in Fig. 4
The conducted emission test result of line structure, both are to start within 1 hour test after energization starts, and now power supply is by 1 hour
Start after temperature rise to a stable value, realize heat engine test, it is ensured that measured data are more accurate.Referring to figure
5, the result for ensphering part shows, using existing encapsulating method obtain circuit structure 180KHz Frequency points or so peak value
It is -1.88dB, average value is 4.36dB, undesirable product；And referring to Fig. 6, obtained using the encapsulating method of the present invention
Circuit structure in the peak value of 180KHz Frequency points or so be -8.46dB, average value is -5.18dB, meets standard requirement.
It should be understood that above example only expresses the preferred embodiment of the present invention, it describes more specific and detailed
Carefully, but can not therefore and be interpreted as the limitation to the scope of the claims of the present invention；It should be pointed out that for the common skill of this area
For art personnel, without departing from the inventive concept of the premise, independent assortment can be carried out to above-mentioned technical characterstic, can also done
Go out several modifications and improvements, these belong to protection scope of the present invention；Therefore, it is all to be done with scope of the invention as claimed
Equivalents and modification, all should belong to the covering scope of the claims in the present invention.
Claims (10)
1. a kind of encapsulating method of circuit structure, circuit structure includes inductance component, it is characterised in that the encapsulating method bag
Include：
The inductance component described in embedding using pouring adhesive into inductor, in inductance mould；
After being stripped to the inductance component, the inductance component after embedding is assembled into the circuit structure for treating embedding；
And
Using circuit structure described in circuit casting glue embedding.
2. the encapsulating method of circuit structure according to claim 1, it is characterised in that the hardness of the pouring adhesive into inductor is small
In the hardness of the circuit casting glue.
3. the encapsulating method of circuit structure according to claim 2, it is characterised in that the hardness of the pouring adhesive into inductor is
10-25, the hardness of the circuit casting glue is at least 50.
4. the encapsulating method of circuit structure according to claim 1, it is characterised in that the use pouring adhesive into inductor,
In inductance mould in embedding inductance component, one inductance component of embedding in an inductance mould.
5. the encapsulating method of circuit structure according to claim 1, it is characterised in that
It is electric described in embedding under non-vacuum condition in the use pouring adhesive into inductor, in inductance mould in embedding inductance component
Inductor component；
In circuit structure described in the use circuit casting glue embedding, circuit structure described in embedding under vacuum.
6. the encapsulating method of circuit structure according to claim 1, it is characterised in that the inductance mould uses heat-resisting temperature
The plastics that not higher than 60 DEG C of degree are made.
7. the encapsulating method of circuit structure according to claim 6, it is characterised in that described de- to the inductance component
In mould, the inductance mould for having the inductance component to embedding using the baking temperature higher than the heat resisting temperature dries
It is roasting, to be stripped to the inductance component.
8. the encapsulating method of circuit structure according to claim 7, it is characterised in that the baking temperature is at least 110
℃。
9. a kind of embedding circuit structure, it is characterised in that including multiple components, at least one electricity in the multiple component
Inductor component, the inductance component by embedding coat pouring adhesive into inductor, coat pouring adhesive into inductor the inductance component and other
Component passes through embedding coating circuit casting glue together.
10. embedding circuit structure according to claim 9, it is characterised in that the hardness of the pouring adhesive into inductor is less than institute
State the hardness of circuit casting glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710522344.2A CN107331499A (en) | 2017-06-30 | 2017-06-30 | The encapsulating method and embedding circuit structure of circuit structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710522344.2A CN107331499A (en) | 2017-06-30 | 2017-06-30 | The encapsulating method and embedding circuit structure of circuit structure |
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| Publication Number | Publication Date |
|---|---|
| CN107331499A true CN107331499A (en) | 2017-11-07 |
Family
ID=60198574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710522344.2A Pending CN107331499A (en) | 2017-06-30 | 2017-06-30 | The encapsulating method and embedding circuit structure of circuit structure |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110311595A (en) * | 2019-07-03 | 2019-10-08 | 合肥巨一动力系统有限公司 | A kind of integrated encapsulation structure of Double Motor Control device |
| CN111622747A (en) * | 2020-05-14 | 2020-09-04 | 中国科学院地质与地球物理研究所 | Receiving transducer array full digitalization device of acoustic logging while drilling instrument |
| CN114360872A (en) * | 2022-01-04 | 2022-04-15 | 合肥云路聚能电气有限公司 | Inductance product with naked glue filled in encapsulation |
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Application publication date: 20171107 |