CN105896307B - A kind of the autoregistration sintering fixture and sintering method of semiconductor laser chip - Google Patents
A kind of the autoregistration sintering fixture and sintering method of semiconductor laser chip Download PDFInfo
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- CN105896307B CN105896307B CN201610285100.2A CN201610285100A CN105896307B CN 105896307 B CN105896307 B CN 105896307B CN 201610285100 A CN201610285100 A CN 201610285100A CN 105896307 B CN105896307 B CN 105896307B
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- briquetting
- chip
- heat sink
- fixture
- cantilever
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02355—Fixing laser chips on mounts
- H01S5/0237—Fixing laser chips on mounts by soldering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
- H01S5/02375—Positioning of the laser chips
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of autoregistration of semiconductor laser chip sintering fixture and sintering methods.The autoregistration sintering fixture includes pedestal, rail brackets and briquetting；The pedestal is equipped with and the heat sink locating groove being adapted to, there are symmetrical positioning road in the briquetting two sides, the rail brackets are erected on the pedestal, there is symmetrical cantilever on rail brackets, positioning guide rail is equipped in cantilever, so that the positioning road of briquetting is inserted in positioning guide rail and moved up and down in positioning guide rail, there is compression leg in the briquetting bottom end, and compression leg compresses the chip on heat sink when briquetting moves down.The present invention also provides a kind of methods for carrying out semiconductor laser chip sintering using the fixture.Clamp structure of the invention is simple, and low in cost, it can be achieved that being voluntarily aligned, it is convenient to operate and observe；The sintering that the chip and heat sink progress rapid batch of noise spectra of semiconductor lasers can be achieved, significantly improves the sintering yield of fixture.
Description
Technical field
Fixture is sintered the present invention relates to a kind of autoregistration for semiconductor laser chip and carries out core using the fixture
The method of piece sintering, belongs to semiconductor laser chip sintering technology field.
Background technique
Since semiconductor laser has, small in size, light-weight, electro-optical efficiency is high, the service life is long and reliability height etc. is excellent
Point has gradually replaced the use of gas and solid state laser in fields such as communication, medical treatment, display, industry production and security protections,
Application range is also gradually extending.The waste heat that chip generates when semiconductor laser works needs timely and effectively to be discharged, otherwise
It will cause that chip of laser temperature is excessively high, reduce device light emitting efficiency and induce the failure of laser.The skill being widely used at present
Art scheme is sintered to semiconductor laser chip on strong heat sink of heat-sinking capability, by it is heat sink to chip operation when generate
Heat is effectively evacuated.The heat sink solder sintering with chip chamber should meet that resistance is low, thermal conductivity is high, solid and reliable, antifatigue
Etc. characteristics, sintering quality be the key that influence semiconductor laser heat dissipation performance so that laser life and reliability because
Element.
There are two types of currently used sintering schemes, picks up chip one is use vacuum WAND and is placed on heat sink, then
Carry out heat-agglomerating.The sintering quality of the mode of used sucking pen pressurization is preferable, but each heating and cooling circulation can only pressure sintering
One chip of laser, completion to be sintered and it is cooling after replace again next group of chip and it is heat sink be sintered, therefore be sintered efficiency
It is low, and the device is complicated, need vacuum equipment to manufacture negative pressure, it is closed to be in addition difficult to will to be sintered environment, and solder is caused to be easy by oxygen
Change.Another kind is that chip is placed on heat sink and then carries out heat-agglomerating, is not applied to chip using alloying furnace or reflow ovens etc.
Plus-pressure.Due to the solder on heat sink in fusing with certain mobility so that chip and it is heat sink between be easy after sintering
There is sintering cavity, it is also possible to lead to chip relative to the offset of heat sink position, cause luminous position and the direction of chip of laser
It shifts, so that the qualification rate of laser and service life decline.
Chinese patent literature CN101515702A proposes a kind of semiconductor laser tube core chip apparatus and its user
Method, sintering equipment include bottom support, front apron, heat sink, pressure spring column, spring, dial and pull, pressing, pillar, stick up compression bar, elastic support
With sliding foot；This method is removed first sticks up compression bar to empty place, using suction spindle by sinking to be heated at the front apron of device, remove
It pulls to dial after suction spindle and pull, be fixed on heat sink between pressure spring column and front apron, it under microscopic visualization will be to be sintered with suction spindle
Chip is drawn onto heat sink edge and puts alignment, and after suction spindle is removed, compression bar is stuck up in movement under microscopic visualization, will stick up the pressing of compression bar
Accurately fall in the top of chip；Sintering is completed under vacuum and nitrogen protection.The disadvantage of this method is that needing aobvious
Micro mirror bottom heat release is heavy, chip and falls pressing, and inconvenient and efficiency is lower；And whole device component is more, processing and
Precise part needed for assembling is more difficult, needs to manufacture negative pressure using vacuum equipment to draw heat sink and chip, the system of equipment
It makes at high cost, is not suitable for batch sinter.
Chinese patent literature CN105098593A propose a kind of semiconductor laser tube core autoregistration sintering fixture and
Sintering method, sintering fixture include bracket, contraposition pedestal, compression leg and spring；Bracket has bottom support and cantilever, have on the support of bottom with
The locating groove of pedestal adaptation is aligned, has compression leg guide hole on cantilever, spring pocket is on compression leg top；The contraposition pedestal has heat sink load
Platform is set, the compression leg lower end described in positive alignment when aligning pedestal and pushing against in locating groove completely of the tube core on heat sink is enable, so that
Compression leg can be pressed on tube core under spring force.The disadvantage of this method is that the processing of C-shaped support is more difficult；And
Heat sink and chip is put on contraposition pedestal and after being pushed into the locating groove of bracket, can not be observed due to blocking for frame upper
Whether the chip on heat sink is displaced in placement process；In addition in the Thermal Cycling of sintering, used spring
Plastic deformation can occur, down force pressure is caused to become smaller, it is bad to may cause chip generation sintering.
Summary of the invention
The present invention existing semiconductor laser chip sintering technology there are aiming at the problem that, propose a kind of there is autoregistration
The structure of function is simple, operation and the semiconductor laser chip of inspection, high production efficiency is facilitated to be sintered fixture.
The present invention also provides a kind of methods for carrying out semiconductor laser chip sintering using the fixture.
Technical scheme is as follows:
A kind of semiconductor laser chip autoregistration sintering fixture, including pedestal, rail brackets and briquetting；On the pedestal
Equipped with the heat sink locating groove being adapted to, there are symmetrical positioning road in the briquetting two sides, have symmetrical cantilever on rail brackets, hang
It is equipped with positioning guide rail in arm, so that the positioning road of briquetting is inserted in positioning guide rail and is moved up and down in positioning guide rail.
Preferred according to the present invention, the positioning road of briquetting is flange or groove, and the positioning guide rail on the cantilever is groove
Or flange, positioning guide rail are adapted with positioning road.Guarantee that briquetting can move up and down not under the cooperation of positioning road and positioning guide rail
Offset, it is final to realize autoregistration and precise positioning is in the chip to be sintered on heat sink on pedestal.
It is preferred according to the present invention, the compression leg with it is heat sink on chip size and position be adapted.
According to the present invention, the locating groove on the pedestal has is adapted to heat sink, is to instigate the heat for being loaded with chip to be sintered
It is heavy to move and be fitted on the locating groove inner wall in locating groove, and make in heat sink complete pushing and pressing bottom locating groove
When it is heat sink on chip can be sitting at below the compression leg of the briquetting lower end so that the gravity-pressing of briquetting is on chip.
According to the present invention, the distance between described symmetrical cantilever is adapted with the size of briquetting.The height of the briquetting
Greater than the height of cantilever；After being inserted in briquetting in cantilever, the upper end of briquetting can expose cantilever one and cut, and be easy to use.And guarantee
Briquetting two sides contact well with cantilever inner wall when being pressed on chip to be sintered, and locating flange is limited in positioning guide rail.
, according to the invention it is preferred to, there is compression leg in the briquetting bottom end, and compression leg can compress on heat sink when briquetting moves down
Chip.The size of briquetting bottom end compression leg and position are adapted to the size of chip to be sintered and position, so that briquetting is being led
The chip on heat sink can be compressed when moving down in the positioning guide rail of rail bracket by the compression leg.The compression leg is cube shaped
Or it is cylindrical.
Preferred according to the present invention, the symmetrical cantilever is two parallel vertical arm, and cantilever is vertical with susceptor surface.
Preferred according to the present invention, the rail brackets are perpendicular to the susceptor surface.
Preferred according to the present invention, the locating groove on the pedestal is rectangle open at one end or square card slot,
It is adapted to the heat sink phase size for being loaded with chip to be sintered.
Preferred according to the present invention, locating groove bottom end face is heat sink, and upper chip position is provided with protection groove；To protect
Protect the front cavity surface of chip of laser.The locating groove bottom end is one end opposite with locating groove open end.
Preferred according to the present invention, the briquetting main part is positive cube shape or cuboid；Briquetting size and guide rail
Size between bracket cantilever is adapted, and briquetting is enable freely up and down to move between rail brackets cantilever.
Preferred according to the present invention, the positioning road of the briquetting two sides is rectangular flange, correspondingly, on the cantilever
Positioning guide rail is rectangular groove, its size of the two and position are adapted, so that locating flange can be moved freely up and down in a groove
It is dynamic.
According to the present invention, the pedestal, rail brackets and briquetting are all made of metal material and are made, it is preferred that the pedestal,
Rail brackets and briquetting are made of oxygen-free copper.
, according to the invention it is preferred to, the bottom polishing treatment of the compression leg.
According to the present invention, the height of the rail brackets is put into the locating groove of bottom support with observing under the microscope
Heat sink and chip.
Fixture of the invention is in use, by being placed in the heat sink complete pushing and pressing to the locating groove on pedestal of chip, then
Briquetting is placed between cantilever, the positioning road (flange or groove) of briquetting two sides is limited in the positioning guide rail of rail brackets cantilever
In, briquetting is moved up and down by guide rail and the compression leg of briquetting lower end is made to compress the chip on heat sink.Locating groove on pedestal
With heat sink size fit, it is heat sink it is lucky can be pushed into open slot, when arriving to locating groove bottom end, the position of heat sink upper chip is being just
Position-limiting action for compression leg bottom end, while between briquetting side and cantilever inner face, locating flange or groove and positioning guide rail is protected
It has demonstrate,proved briquetting and lateral movement does not occur after pushing, to realize that autoregistration and position are stablized.Compression leg acts on laser core
Piece and heat sink pressure can be adjusted by changing the overall dimensions of briquetting main body.
According to the present invention, a kind of method of semiconductor laser chip sintering, including using above-mentioned autoregistration sintering clip
Tool, includes the following steps:
(1) semiconductor laser chip is placed on heat sink solder with adsorption machine under the microscope；
(2) placing is had in the heat sink locating groove for being inserted into pedestal of chip, and pushed against on earth；
(3) confirm that the chip position in operation on heat sink is not displaced with microscope is viewed from above；
(4) the positioning road of briquetting two sides is placed in the positioning guide rail of rail brackets cantilever, make briquetting be inserted into cantilever it
Between and move down, so that the compression leg lower end face of briquetting low side is lived chip of laser and compression on heat sink, complete fixture clamping；
(5) repeat the above steps (1)~(4), other several identical fixtures are arranged and clamp heat sink and chip；Then will
Heat sink and chip fixture marshalling is clamped, is sealed after the fixture being well placed is stated in the protective cover cap residence for being connected with nitrogen,
It is put on warm table and is sintered.
The sintering process is carried out according to the prior art.
Beneficial effects of the present invention:
Present clip structure is simple, low in cost, operates and checks and is convenient and reliable, it can be achieved that being voluntarily aligned.Utilize pressure
The gravity of block applies certain pressure to chip and is sintered, can effectively reduce chip and it is heat sink between sintering cavity, mention
In the service life for rising laser, guarantee the quality of product；Locating groove can guarantee it is heat sink realize autoregistration after such insertion, briquetting pushes
When compression leg face chip, be not required to adjustment briquetting position, compression leg be able to maintain under gravity after putting down chip compacting in heat
On heavy.
The rail brackets top of present clip is not blocked, after heat sink and chip is promoted locating groove, Neng Goufang
Just heat sink and chip relative position is checked from top using microscope, so that heat sink and chip be avoided to be placed in positioning card
Occur accidentally displacement during slot and cause the product of sintering unqualified, further improves the qualification rate of fixture sintering.Pass through
Briquetting body side and the positioning road (flange or groove) on the positioning guide rail and briquetting inside cantilever and on rail brackets
Adaptation and position-limiting action, it is ensured that briquetting rear stabilization for keeping lateral position between the cantilever for being placed in rail brackets is only capable of
It moves up and down and enables the compression leg face chip of briquetting lower end.The sintering Yield lmproved of fixture of the invention is to 90% or more.
The briquetting of present clip can move up and down, so as to meet the heat sink burning with different-thickness chip of different height
Knot needs.Size and position by adjusting locating groove on guiderail base heat sink can be sintered to various sizes of.
This invention simplifies the accurate positionins of chip sintering；The gravity that briquetting is applied to chip effectively reduces laser core
The series resistance and thermal resistance of piece solve the problems, such as that luminous efficiency is low caused by chip displacement when because of heat sink upper solder fusing, work
Skill is simple and practical, and is sintered front and just checks；Device only includes two components, and structure is simple, low manufacture cost, production efficiency
It is high.
What fixture of the invention can be convenient is placed in nitrogen protection housing, and solder is effectively prevent to occur when sintering at high temperature
Oxidation.It is fixed after every group heat sink and chip using multiple groups fixture, the sintering that heating device carries out rapid batch can be used, from
And it is obviously improved production efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of semiconductor laser chip autoregistration sintering fixture of the present invention.
Fig. 2 is the structural schematic diagram of briquetting in present clip.
Fig. 3 is the structural schematic diagram of rail brackets in present clip.
In figure: 1, chip of laser, 2, heat sink, 3, briquetting main body, 4, the positioning road (flange) on briquetting, 5, compression leg, 6,
Pedestal, 7, locating groove, 8, protection groove, 9, cantilever, 10, rail brackets, 11, positioning guide rail (groove).
Specific embodiment
Below with reference to embodiment and attached drawing, the present invention will be further described.But not limited to this.
Embodiment 1:
The autoregistration of semiconductor laser chip is sintered fixture, as shown in Figure 1, including pedestal 6, rail brackets 10 and briquetting
3.The rail brackets are erected on the pedestal, are had symmetrical cantilever 9 on rail brackets, are equipped with positioning guide rail 11 in cantilever 9,
The positioning guide rail is square groove.As shown in Figure 3.There are the locating groove 7 being adapted to heat sink 2, locating groove 7 on the pedestal 6
It is the rectangular groove of openings at one side, enables heat sink 2 to move in locating groove 7 and side is bonded with card slot inner wall.
The structure of the briquetting 3 as shown in Fig. 2, include briquetting main body 3, briquetting positioning road 4 and compression leg 5, briquetting main body 3
Gap between size and the cantilever 9 of rail brackets is adapted；There is briquetting positioning road (flange) 4 of positioning in briquetting two sides, should
It is square boss that briquetting, which positions road 4, can cover in the positioning guide rail 11 on rail brackets cantilever 9 and move up and down；The briquetting
Compression leg 5 is arranged at lower part, and when in the locating groove 7 on heat sink 2 completely pushing and pressing road pedestal 6,5 bottom end of compression leg is right against on heat sink 2
Chip 1 makes compression leg compress chip and heat sink, realization autoregistration and fixation by gravity.
The heat sink chip position of face is provided with protection groove 8 in the locating groove 7, to protect the ante-chamber of chip of laser
Face.
Size between the cantilever 9 accommodates briquetting main body 3 just and enables between briquetting side and symmetrical cantilever 9
Inner wall fitting, guarantee briquetting can be moved up and down in rail brackets；As shown in Figure 1, by positioning guide rail and locating flange with
And the position-limiting action between cantilever inner wall and briquetting main body, guarantee that briquetting is placed downwards in being placed into rail brackets and freely
When, it is not displaced in transverse direction, while setting by locating groove, briquetting lower end compression leg and heat sink relative position
It counts, on the chip 1 that compression leg is pressed in just on heat sink 2 when guarantee briquetting is placed downwards, realizes position stabilization and autoregistration.
In use, semiconductor laser chip 1 is placed on heat sink 2 with solder with adsorption machine under the microscope.
In the locating groove 7 for heat sink 2 supports 6 for being inserted into rail brackets that placing is had chip 1, and push against on earth.Determine on support 6
Position card slot 7 with heat sink 2 size fit, when heat sink 2 pushing and pressing are to 7 bottom end of locating groove heat sink 2 on the position of chip 1 be right against
The compression leg 5 of briquetting lower end.It can confirm that position of the chip 1 on heat sink 2 does not occur in operation from the top through micro- sem observation
Displacement.Briquetting main body 3 is nested between the cantilever 9 of rail brackets, and so that the briquetting of briquetting two sides is positioned road 4 and is nested into cantilever
In 9 positioning guide rail 11, make briquetting free releasing, 5 face of compression leg of briquetting lower end is lived chip of laser 1 and compressed, thus real
Fixture clamping is completed in existing autoregistration and fixation.
The bottom of compression leg 5 is polished, which contacts the heat sink upper surface of the placement on chip of laser and pedestal, pressure
The size of column bottom end can be adjusted according to the size of chip to be sintered, and the size of locating groove and position can be according to heat to be sintered
Heavy size adjustment.Compression leg acts on chip of laser when sintering and heat sink pressure can be by the entire length of change briquetting
Adjustment.
Embodiment 2:
The method for carrying out semiconductor laser chip sintering using the autoregistration sintering fixture of embodiment 1, steps are as follows:
(1) semiconductor laser chip 1 is placed on the solder on heat sink 2 with adsorption machine under the microscope；
(2) heat sink 2 that placing is had chip 1 are inserted into the locating groove 7 of pedestal, and are pushed against on earth；
(3) it is not displaced with the position in operation of chip of laser 1 in microscope confirmation heat sink 2 viewed from above；
(4) the briquetting positioning road 4 of briquetting two sides is placed in the positioning guide rail 11 of rail brackets upper cantilever, is inserted into briquetting
To between cantilever and transferring, 5 lower end face of compression leg is made to live chip of laser 1 and compress, completes fixture clamping；
(5) repeat the above steps (1)~(4), other several identical fixtures are arranged and clamp heat sink and chip；Then will
Heat sink and chip fixture marshalling is clamped, is sealed after the fixture being well placed is stated in the protective cover cap residence for being connected with nitrogen,
It is put on warm table and is sintered.
Sintering test:
Semiconductor laser chip sintering is carried out using the fixture of embodiment 1 as described in Example 2, is sintered quantity 128
Only, wherein qualified product number is 116, is sintered yield 90.6%.
Comparative experiments:
Semiconductor laser tube core sintering is carried out by the method for embodiment 2 by the fixture of CN105098593A embodiment 1,
Sintering quantity 120, wherein qualified product number is 97, is sintered yield 80.8%.
When due to carrying out semiconductor laser chip sintering using fixture of the invention, there is the heat sink of chip to insert placing
After entering into the locating groove of pedestal and pushing against on earth, can by microscope, whether chip is shifted from above fixture, such as
The adjustment that can be taken off for having chip to shift is reloaded into, to further improve the yield of sintered laser device.Of the invention
The sintering yield of fixture can be promoted to 90% or more by 80% or so of CN105098593A.
Claims (7)
1. a kind of semiconductor laser chip autoregistration is sintered fixture, including pedestal, rail brackets and briquetting；It is set on the pedestal
Have has symmetrical positioning road, has symmetrical cantilever, cantilever on rail brackets with the heat sink locating groove being adapted to, the briquetting two sides
It is interior to be equipped with positioning guide rail, so that the positioning road of briquetting is inserted in positioning guide rail and is moved up and down in positioning guide rail；The briquetting
There is compression leg in bottom end, and compression leg compresses the chip on heat sink when briquetting moves down；The size of compression leg and position and chip to be sintered
Size and position adaptation；
The positioning road of the briquetting is flange or groove, and the positioning guide rail on the cantilever is groove or flange, positioning guide rail with
Positioning road is adapted；
The symmetrical cantilever is two parallel vertical arm, and cantilever is vertical with susceptor surface；
Locating groove bottom end face is heat sink, and upper chip position is provided with protection groove.
2. semiconductor laser chip autoregistration as described in claim 1 is sintered fixture, which is characterized in that on the pedestal
Locating groove is rectangle open at one end or square card slot, is adapted to the heat sink phase size for being loaded with chip to be sintered.
3. semiconductor laser chip autoregistration as described in claim 1 is sintered fixture, which is characterized in that the briquetting main body
Partially be positive cube shape or cuboid；Size between briquetting size and rail brackets cantilever is adapted.
4. semiconductor laser chip autoregistration as described in claim 1 is sintered fixture, which is characterized in that the briquetting two sides
Positioning road be rectangular flange, correspondingly, the positioning guide rail on the cantilever is rectangular groove.
5. semiconductor laser chip autoregistration as described in claim 1 is sintered fixture, which is characterized in that the bottom of the compression leg
Portion's polishing treatment.
6. semiconductor laser chip autoregistration as described in claim 1 is sintered fixture, it is characterised in that the pedestal, guide rail
Bracket and briquetting are all made of metal material and are made.
7. a kind of method of semiconductor laser chip sintering, including with any one of the claim 1-6 autoregistration sintering clip
Tool is sintered, and is included the following steps:
(1) semiconductor laser chip is placed on heat sink solder with adsorption machine under the microscope；
(2) placing is had in the heat sink locating groove for being inserted into pedestal of chip, and pushed against on earth；
(3) confirm that the chip position in operation on heat sink is not displaced with microscope is viewed from above；
(4) the positioning road of briquetting two sides is placed in the positioning guide rail of rail brackets cantilever, is inserted into briquetting between cantilever simultaneously
It moves down, the compression leg lower end face of briquetting bottom end is made to live chip of laser and compression on heat sink, complete fixture clamping；
(5) repeat the above steps (1)~(4), other several identical fixtures are arranged and clamp heat sink and chip；It then will clamping
Heat sink and chip fixture marshalling seals after the protective cover cap for being connected with nitrogen is lived the fixture being well placed, is put in heating
It is sintered on platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610285100.2A CN105896307B (en) | 2016-04-29 | 2016-04-29 | A kind of the autoregistration sintering fixture and sintering method of semiconductor laser chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610285100.2A CN105896307B (en) | 2016-04-29 | 2016-04-29 | A kind of the autoregistration sintering fixture and sintering method of semiconductor laser chip |
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| CN105896307A CN105896307A (en) | 2016-08-24 |
| CN105896307B true CN105896307B (en) | 2019-03-22 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109326951B (en) * | 2017-07-31 | 2020-05-12 | 山东华光光电子股份有限公司 | Multiple semiconductor laser tube core sintering clamp and sintering method thereof |
| CN110289547A (en) * | 2018-03-19 | 2019-09-27 | 山东华光光电子股份有限公司 | A kind of gravity clamping semiconductor laser chip sintering fixture |
| CN111478177B (en) * | 2019-01-23 | 2021-02-05 | 潍坊华光光电子有限公司 | Rapid bonding device and bonding method for semiconductor laser electrode wire |
| CN111999631A (en) * | 2019-05-27 | 2020-11-27 | 潍坊华光光电子有限公司 | Aging clamp for semiconductor laser chip |
| CN111446617B (en) * | 2020-05-15 | 2024-05-14 | 度亘天元激光科技(丹阳)有限公司 | High efficiency multistation laser apparatus for producing |
| CN111843877B (en) * | 2020-07-23 | 2024-04-09 | 度亘天元激光科技(丹阳)有限公司 | Clamp for fast axis light spot collimating mirror of semiconductor laser chip |
| CN114247952A (en) * | 2020-09-22 | 2022-03-29 | 中国科学院大连化学物理研究所 | A laser crystal welding fixture and welding method |
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|---|---|---|---|---|
| CN201315408Y (en) * | 2008-12-02 | 2009-09-23 | 中国电子科技集团公司第十三研究所 | Rack mounting clamp for laser |
| US8340144B1 (en) * | 2011-08-29 | 2012-12-25 | Intellectual Light, Inc. | Compression mount for semiconductor devices, and method |
| CN105098593A (en) * | 2015-07-23 | 2015-11-25 | 山东华光光电子有限公司 | Self-aligning sintering clamp of semiconductor laser tube core and tube core sintering method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201315408Y (en) * | 2008-12-02 | 2009-09-23 | 中国电子科技集团公司第十三研究所 | Rack mounting clamp for laser |
| US8340144B1 (en) * | 2011-08-29 | 2012-12-25 | Intellectual Light, Inc. | Compression mount for semiconductor devices, and method |
| CN105098593A (en) * | 2015-07-23 | 2015-11-25 | 山东华光光电子有限公司 | Self-aligning sintering clamp of semiconductor laser tube core and tube core sintering method |
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| CN105896307A (en) | 2016-08-24 |
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