CN105098593A - Self-aligning sintering clamp of semiconductor laser tube core and tube core sintering method - Google Patents
Self-aligning sintering clamp of semiconductor laser tube core and tube core sintering method Download PDFInfo
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- CN105098593A CN105098593A CN201510438893.2A CN201510438893A CN105098593A CN 105098593 A CN105098593 A CN 105098593A CN 201510438893 A CN201510438893 A CN 201510438893A CN 105098593 A CN105098593 A CN 105098593A
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- tube core
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- compression leg
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- 238000005245 sintering Methods 0.000 title claims abstract description 52
- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 18
- 230000006835 compression Effects 0.000 claims abstract description 83
- 238000007906 compression Methods 0.000 claims abstract description 83
- 229910000679 solder Inorganic materials 0.000 claims abstract description 14
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 6
- 230000001681 protective effect Effects 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 7
- 230000003044 adaptive effect Effects 0.000 claims description 6
- 238000001179 sorption measurement Methods 0.000 claims description 4
- 230000006978 adaptation Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims description 2
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012800 visualization Methods 0.000 description 3
- 238000000149 argon plasma sintering Methods 0.000 description 2
- 230000001012 protector Effects 0.000 description 2
- 238000012797 qualification Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005275 alloying Methods 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Semiconductor Lasers (AREA)
Abstract
The invention relates to a self-aligning sintering clamp of a semiconductor laser tube core and a tube core sintering method. The self-aligning sintering clamp comprises a bracket, an alignment base, a compression column and a spring, wherein the bracket is provided with a bottom support seat and a cantilever; a positioning clamping groove matched with the alignment base is formed in the bottom support seat; a compression column guide hole is formed in the cantilever; the spring sleeves the upper part of the compression column; a heat sink carrying table is arranged on the alignment base; and the tube core on the heat sink can be rightly aligned at the lower end of the compression column when the alignment base is completely pushed into the positioning clamping groove, so that the compression column can be pressed on the tube core under the elasticity of the spring. The invention further provides a method for sintering the semiconductor laser tube core by the clamp. The clamp provided by the invention is simple in structure; self-aligning can be realized; the overall clamp can be conveniently arranged in a nitrogen protective casing; oxidation of solder is effectively prevented during high-temperature sintering; and fast and massive sintering of the tube core and the heat sink of the semiconductor laser is realized.
Description
Technical field
The present invention relates to a kind of autoregistration for semiconductor laser tube core sintering fixture and using method thereof, belong to semiconductor laser tube core sintering technology field.
Background technology
Semiconductor laser has that volume is little, lightweight, electro-optical efficiency is high, the life-span is long and high reliability, just progressively instead of traditional gas and the application market of solid state laser, progressively expand in the application in the fields such as industrial processes, communication, medical treatment, display and security protection.The used heat that during semiconductor laser work, tube core produces needs to discharge in time, otherwise device can be caused overheated, brings out the inefficacy of laser.Thus the technical scheme of extensive use is sintered to by semiconductor laser tube core on strong heat sink of heat-sinking capability, effectively evacuated by the heat sink heat production to tube core.Connection between heat sink and tube core need meet the characteristics such as high heat conductance, low resistance, solid and reliable, antifatigue, and sintering quality is the key factor affecting the heat dispersion of semiconductor laser and even the life and reliability of laser.
At present conventional agglomerating plant has two classes, and a class is alloying furnace or reflow ovens etc., tube core is placed on heat sink on then directly heat-agglomerating, pressure is not applied to tube core.Because the solder on heat sink has certain mobility when melting, tube core and heat sink between easily occurs sintering cavity, also may cause the skew of die site, luminous position and direction are deflected, the qualification rate of laser and life-span decline.Another kind of be adopt vacuum slot pick up tube core be positioned over heat sink on, then carry out the equipment of heat-agglomerating.Adopt suction nozzle to pressurize mode make each temperature cycles can only sinter a laser tube core, to be sintered complete and cool after change next group tube core again and heat sinkly to sinter, efficiency is lower, and equipment is complicated, be unfavorable for that solder is easily oxidized by airtight for sintering environment.
Chinese patent literature CN201238153Y proposes a kind of semiconductor laser sintering equipment and using method, heat sink and tube core are placed in the holddown groove of base by this device, after installing upper body, press pin is put into the location hole of upper body, be depressed on tube core and sinter.The weak point of the method is to need under the microscope by the heat sink relevant position being accurately placed on base holddown groove, to ensure just to press pin when using; And utilize the gravity of press pin to push down tube core, in mobile sintering equipment to sintering furnace and in high-temperature sintering process, press pin may because of vibration and solder fusing and be shifted, tube core is offset, reduces the qualification rate of sintering and the reliability of laser.
Chinese patent literature CN101515702A proposes a kind of semiconductor laser tube core sintering device and using method thereof, and sintering equipment comprises end bearing, front apron, heat sink, stage clip post, spring, dial and pull, pressing, pillar, stick up depression bar, elastic support and sliding foot; First the method is removed and is stuck up depression bar to empty place, suction spindle is used to burn the heat sink front apron place being put in device by waiting, pull after removing suction spindle to dial and pull, be fixed between stage clip post and front apron by heat sink, with suction spindle, tube core to be sintered is drawn onto heat sink edge under microscopic visualization and puts aligning, after suction spindle is removed, depression bar is stuck up in movement under microscopic visualization, the pressing sticking up depression bar is accurately dropped on the top of tube core; Sintering is completed under vacuum and nitrogen protection.The weak point of the method is to need to put under the microscope heat sink, tube core and falls pressing, uses inconvenience and efficiency is lower; And whole device feature is more, the precise part needed for processing and assembling is comparatively difficult, and manufacturing cost is high, is not suitable for batch sinter.
Chinese patent literature CN104409964A proposes a kind of semiconductor laser sintering fixture and sintering method thereof, comprise base, supporting bracket and briquetting, supporting bracket is fixed on base, base is provided with fixed leg, briquetting is placed on base by fixed leg location, bottom briquetting, side is provided with boss, and opposite side fixed arrangement has vertical spring needle.The heat sink of prefabricated complete solder is placed on base, by fixed leg to heat sink location; Then by be encapsulated in time heat sink on laser along heat sink curved edge be placed on heat sink on; Briquetting is placed on heat sink on, spring needle and laser one_to_one corresponding, rotate hold-down bolt, make it compress briquetting, sinter.This fixture need under microscopic visualization by be encapsulated in time heat sink on laser location and be placed into heat sink on, autoregistration cannot be realized owing to lacking corresponding positioner, operation inconvenience; Spring needle on briquetting favours bottom surface when exerting a force, and may cause the sliding transfer of laser tube core, the laser after sintering is offset when touching laser, reduces sintering yield and optical quality.
Summary of the invention
The present invention is directed to existing semiconductor laser tube core sintering technology Problems existing, propose a kind of semiconductor laser tube core that structure is simple, easy and simple to handle, production efficiency is high sintering fixture with automatic aligning function.
The present invention also provides a kind of method utilizing this fixture to carry out semiconductor laser tube core sintering.
Technical scheme of the present invention is as follows:
A kind of semiconductor laser tube core autoregistration sintering fixture, comprises support, contraposition base, compression leg and spring; Described support has end bearing and cantilever, end bearing has the locating groove with contraposition base adaptation, contraposition base can be moved in locating groove and be fitted on described locating groove inwall; Described cantilever there is compression leg guide hole, compression leg upper end can be moved up and down wherein; Have flange in the middle part of described compression leg, this flange can block the spring being enclosed within compression leg top; Described contraposition base has heat sink mounting table, enable heat sink on tube core compression leg lower end described in positive alignment when pushing against completely at contraposition base in the locating groove on end bearing, can be pressed on tube core under spring force to make compression leg.
Preferred according to the present invention, described cantilever is parallel to end bearing, is connected with linking arm between cantilever and end bearing.Preferably linking arm is connected with cantilever is vertical with end bearing further.
Preferred according to the present invention, the locating groove on bearing of the described end is the rectangle of a side opening or square draw-in groove; Distortion on this basis also can adopt, such as, also can be circular arc with opening side opposite edge, and corresponding with this limit on corresponding contraposition base is also circular arc, and both should be suitable.
Preferred according to the present invention, described contraposition base is that rectangle or square are stepped, step is just slotted to heat sink die site, to protect laser tube core front facet.
Preferred further according to the present invention, described contraposition base has the first plane and the second plane, and the first plane is higher than the second plane, and the second plane is set to heat sink mounting table and heat sink size is suitable, and the first plane is concordant with heat sink upper surface.
Preferred further according to the present invention, described contraposition base has the first plane, the second plane and the 3rd plane, and the first plane is higher than the second plane, and the second plane is that heat sink mounting table and heat sink size are suitable, second plane higher than the 3rd plane, the 3rd planar dimension and locating groove suitable.For less heat sink of size.
Preferred according to the present invention, the flange in the middle part of described compression leg is annular boss.It is compression leg bottom below flange.
Preferred according to the present invention, the diameter of described compression leg bottom is less than the diameter on compression leg top; Preferred further, diameter and the heat sink die-size of compression leg bottom are suitable, make compression leg lower end push down tube core.
According to the present invention, described support, contraposition base, compression leg and spring all adopt metal material to make, and preferably, adopt oxygen-free copper to make.
When fixture of the present invention uses, be placed with in the heat sink heat sink mounting table be placed on contraposition base of tube core, compression leg top puts adaptive spring, lower spring end to be butted on flange and to be blocked, then compression leg top is placed in the guide hole of support cantilever, compression leg moved up and down by guide hole and push down heat sink on tube core.Spring is sandwiched on the compression leg between described compression leg intermediate flange and support cantilever.Locating groove on end bearing and contraposition base and heat sink size fit, be placed with heat sink contraposition base and just can push in fluting, on heat sink when arriving to draw-in groove bottom, the position of tube core is right against compression leg bottom, thus realizes autoregistration.
Utilize above-mentioned fixture to carry out the method for semiconductor laser tube core sintering, comprise the steps:
(1) will be placed in the heat sink mounting table of contraposition base with the heat sink of solder, by adsorption machine, semiconductor laser tube core is placed on heat sink solder under the microscope;
(2) compression leg is put adaptive spring, compression leg upper end to be inserted in the compression leg guide hole on support cantilever and on carry;
(3) placing had contraposition base that is heat sink and tube core to be inserted in the locating groove of bracket bottom bearing, and pushing and pressing on earth;
(4) compression leg is transferred, rectify living laser tube core and compressing under making compression leg, complete holder;
(5) repeat above-mentioned steps (1) ~ (4), the heat sink and tube core of other several identical holder is set; Then by fixture marshalling that is heat sink for clamping and tube core, seal after the fixture be well placed is stated in the protective cover cap residence being connected with nitrogen, be put on heating station and sinter.
Described sintering process is conventionally carried out.
Beneficial effect of the present invention:
Clamp structure of the present invention is simple, with low cost, reliably easy and simple to handle, can realize aiming at voluntarily.Utilize spring to put on the elastic force of compression leg, certain pressure applied to tube core and sinters, can effectively reduce tube core and heat sink between sintering cavity, in the life-span of improving laser device, ensure the quality of product; Contraposition base can ensure to realize autoregistration after insertion support fluting, just to tube core when compression leg presses down, does not need to carry out observing and adjusting, can keep heat sink and tube core is stablized motionless after compression leg puts down under the effect of spring force, the yield that lifting sinters.
The compression leg of fixture of the present invention can move up and down, thus can meet the sintering needs of the heat sink and different-thickness tube core of differing heights.By changing contraposition base, adjusting size and the position on heat sink mounting table top on contraposition base, can sinter the heat sink of different size.As less heat sink in sintered, can make contraposition base heat sink mounting table upper dimension and heat sink consistent size, remainder self-assembling formation boss keeps adaptive with the locating groove of end bearing.
This invention simplifies the accurate location of tube core sintering; The elastic force that compression leg is applied to tube core effectively reduces series resistance and the thermal resistance of laser tube core, solves because tube core during heat sink upper solder fusing is shifted the low problem of the luminous efficiency that causes; Features simple and practical process, cost of manufacture is low, and production efficiency is high.
Fixture of the present invention can be placed in nitrogen protection case easily, effectively prevents solder to be oxidized when high temperature sintering.Utilization many groups fixture can use heater to carry out the sintering of rapid batch after fixing and often organizing heat sink and tube core, thus remarkable improving production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of semiconductor laser tube core autoregistration of the present invention sintering fixture.
Fig. 2 is the structural representation of fixture medium-height trestle of the present invention.
Fig. 3 is the structural representation of contraposition base in embodiment 1 fixture.
Fig. 4 is the structural representation of compression leg in fixture of the present invention.
Fig. 5 is the heat sink schematic diagram in fixture of the present invention, contraposition base being placed with tube core.
Fig. 6 is the structural representation of contraposition base in embodiment 3 fixture.
In figure: 1, end bearing, 2, cantilever, 3, linking arm, 4, contraposition base, 5 compression legs, 6 springs; 7, locating groove, 8, compression leg guide hole, 9, heat sink mounting table, 10, tube core protector, 11, compression leg flange, 12, compression leg upper end, 13, compression leg top, 14, compression leg bottom, 15, tube core, 16, heat sink.17, the first plane, the 18, second plane, the 19, the 3rd plane.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the present invention will be further described.But be not limited thereto.
Embodiment 1:
The autoregistration sintering fixture of semiconductor laser tube core, as shown in Figure 1, comprises support, contraposition base 4, compression leg and spring 6.Described support, as shown in Figure 2, comprise end bearing 1, cantilever 2 and linking arm 3, end bearing 1 has the locating groove 7 with contraposition base 4 adaptation, locating groove 7 is rectangular grooves of openings at one side, contraposition base 4 can be moved in locating groove 7 and side and draw-in groove inwall are fitted; Contraposition base 4 is that rectangle or square are stepped, as shown in Figure 3, there is the first plane 17 and the second plane (ladder lower plane), first plane 17 is higher than the second plane, second plane is heat sink mounting table 9, heat sink mounting table 9 is suitable with heat sink 16 sizes, enables the positive alignment compression leg bottom when contraposition base 4 pushes against in the locating groove 7 on bearing 1 on earth completely of the tube core 15 on heat sink 16, can be pressed on tube core 15 to make compression leg 5 under spring 6 elastic force.Step just has tube core protector 10 to heat sink die site, to protect laser tube core front facet.First plane 17 is concordant with heat sink upper surface.
Described cantilever 2 there is compression leg guide hole 8, compression leg upper end 12 can be moved up and down wherein; As shown in Figure 4, have flange 11 in the middle part of compression leg, this flange 11 is annular boss, can block the spring 6 being enclosed within compression leg top 13; Described compression leg bottom 14 diameter is less than compression leg top 13 diameter.Insert support fluting 7 completely and after pushing and pressing on earth, compression leg 5 bottom is right against the tube core 15 on heat sink 16 at contraposition base 4, make compression leg compress tube core and heat sink by the elastic force effect of spring, realize autoregistration and fixing.As shown in Figure 5, be placed in heat sink 16 after in heat sink mounting table 9, semiconductor laser tube core 15 be placed on on heat sink 16 of solder by adsorption machine under the microscope.
During use, compression leg top puts adaptive spring, lower spring end is butted on annular boss and is blocked, compression leg top is placed in the compression leg guide hole of support cantilever, on the compression leg of spring clip between described annular boss and support cantilever, then will be placed with in the heat sink heat sink mounting table be placed on contraposition base of tube core, contraposition base to be pushed in locating groove and push away and be put into the end; Compression leg moved down by guide hole under spring force effect and push down heat sink on tube core.Locating groove on end bearing 17 and contraposition base 4 and heat sink 16 size fit, when arriving to draw-in groove 7 bottom, the position of tube core 15 is right against the bottom of compression leg 5 on heat sink 16, thus realizes autoregistration and fixing.
Polishing is carried out at the position that the bottom of compression leg contacts the heat sink mounting table on laser tube core and contraposition base, and the size of compression leg bottom can be determined according to the size of tube core to be sintered, and the size of heat sink mounting table and position can according to heat sink size adjustment to be sintered.During sintering compression leg act on laser tube core and heat sink pressure can by increasing the elastic force adjustment of spring.
Embodiment 2:
Utilize the autoregistration of embodiment 1 sintering fixture to carry out the method for semiconductor laser tube core sintering, step is as follows:
(1) will be placed in the heat sink mounting table of contraposition base with the heat sink of solder, by adsorption machine, semiconductor laser tube core is placed on heat sink solder under the microscope;
(2) compression leg is put adaptive spring, compression leg upper end to be inserted in the compression leg guide hole on support cantilever and on carry;
(3) the contraposition base laying heat sink and tube core is inserted in the locating groove of bracket bottom bearing, and pushing and pressing on earth;
(4) compression leg is transferred, make it just to living laser tube core and compressing, complete the setting of fixture;
(5) repeat above-mentioned steps (1) ~ (4), the heat sink and tube core of other several identical holder is set; Then by fixture marshalling that is heat sink for clamping and tube core, seal after the fixture be well placed is stated in the protective cover cap residence being connected with nitrogen, be put on heating station and sinter.
Embodiment 3:
As described in Example 1, difference be the structure of contraposition base as shown in Figure 6, described contraposition base has the first plane 17, second plane 18 and the 3rd plane 19, first plane 17 is higher than the second plane 18, second plane 18 is that heat sink mounting table and heat sink size are suitable, second plane 18 higher than the 3rd plane the 19, three plane 19 size and locating groove 7 suitable.For less heat sink of size.
The above, be only preferred embodiment, and not for limiting the scope of the invention, all equivalences done according to the present patent application the scope of the claims change or modify, and are all the present invention and contain.
Claims (10)
1. a semiconductor laser tube core autoregistration sintering fixture, is characterized in that comprising support, contraposition base, compression leg and spring; Described support has end bearing and cantilever, end bearing has the locating groove with contraposition base adaptation, contraposition base can be moved in locating groove and be fitted on locating groove inwall; Described cantilever there is compression leg guide hole, compression leg upper end can be moved up and down wherein; Have flange in the middle part of described compression leg, this flange can block the spring being enclosed within compression leg top; Described contraposition base has heat sink mounting table, enable heat sink on tube core compression leg lower end described in positive alignment when pushing against completely at contraposition base in the locating groove on end bearing, can be pressed on tube core under spring force to make compression leg.
2. semiconductor laser tube core autoregistration sintering fixture as claimed in claim 1, it is characterized in that described cantilever is parallel to end bearing, cantilever is connected by linking arm with end bearing.
3. semiconductor laser tube core autoregistration sintering fixture as claimed in claim 1, is characterized in that the locating groove on bearing of the described end is the rectangle of a side opening or square draw-in groove.
4. semiconductor laser tube core autoregistration sintering fixture as claimed in claim 1, is characterized in that described contraposition base is that rectangle or square are stepped, step is just slotted to heat sink die site, to protect laser tube core front facet.
5. semiconductor laser tube core autoregistration sintering fixture as claimed in claim 1, it is characterized in that described contraposition base has the first plane and the second plane, first plane is higher than the second plane, second plane is set to heat sink mounting table and heat sink size is suitable, and the first plane is concordant with heat sink upper surface.
6. semiconductor laser tube core autoregistration sintering fixture as claimed in claim 1, it is characterized in that described contraposition base has the first plane, the second plane and the 3rd plane, first plane is higher than the second plane, second plane is that heat sink mounting table and heat sink size are suitable, second plane higher than the 3rd plane, the 3rd planar dimension and locating groove suitable.
7. semiconductor laser tube core autoregistration sintering fixture as claimed in claim 1, is characterized in that the flange in the middle part of described compression leg is annular boss.
8. semiconductor laser tube core autoregistration sintering fixture as claimed in claim 1, the compression leg diameter that it is characterized in that below described compression leg intermediate flange is less than the compression leg diameter above flange.
9. semiconductor laser tube core autoregistration sintering fixture as claimed in claim 1, is characterized in that described support, contraposition base, compression leg and spring all adopt metal material to make; Preferred employing oxygen-free copper is made.
10. utilize autoregistration sintering fixture described in any one of claim 1-9 to carry out the method for semiconductor laser tube core sintering, comprise the steps:
(1) will be placed in the heat sink mounting table of contraposition base with the heat sink of solder, by adsorption machine, semiconductor laser tube core is placed on heat sink solder under the microscope;
(2) compression leg is put adaptive spring, compression leg upper end to be inserted in the compression leg guide hole on support cantilever and on carry;
(3) placing had contraposition base that is heat sink and tube core to be inserted in the locating groove of bracket bottom bearing, and pushing and pressing on earth;
(4) compression leg is transferred, rectify living laser tube core and compressing under making compression leg, complete holder;
(5) repeat above-mentioned steps (1) ~ (4), the heat sink and tube core of other several identical holder is set; Then by fixture marshalling that is heat sink for clamping and tube core, seal after the fixture be well placed is stated in the protective cover cap residence being connected with nitrogen, be put on heating station and sinter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510438893.2A CN105098593A (en) | 2015-07-23 | 2015-07-23 | Self-aligning sintering clamp of semiconductor laser tube core and tube core sintering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510438893.2A CN105098593A (en) | 2015-07-23 | 2015-07-23 | Self-aligning sintering clamp of semiconductor laser tube core and tube core sintering method |
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| Publication Number | Publication Date |
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| CN105098593A true CN105098593A (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510438893.2A Pending CN105098593A (en) | 2015-07-23 | 2015-07-23 | Self-aligning sintering clamp of semiconductor laser tube core and tube core sintering method |
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| CN (1) | CN105098593A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428994A (en) * | 2015-12-21 | 2016-03-23 | 中国电子科技集团公司第十三研究所 | High-power laser strip-type chip sintering clamp |
| CN105896307A (en) * | 2016-04-29 | 2016-08-24 | 山东华光光电子股份有限公司 | Self-aligning sintering clamp and method for semiconductor laser chip |
| CN111092365A (en) * | 2018-10-23 | 2020-05-01 | 山东华光光电子股份有限公司 | Multi-tube-core sintering clamp and sintering method for semiconductor laser with uniform and adjustable pressure |
| CN112775517A (en) * | 2020-12-28 | 2021-05-11 | 苏州长光华芯光电技术股份有限公司 | Reflux device |
| CN114512891A (en) * | 2020-10-27 | 2022-05-17 | 山东华光光电子股份有限公司 | A sintering fixture and sintering method for improving the quality of low-power semiconductor laser COS alloy |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201238153Y (en) * | 2008-07-29 | 2009-05-13 | 山东华光光电子有限公司 | Semiconductor laser sintering equipment |
| US8340144B1 (en) * | 2011-08-29 | 2012-12-25 | Intellectual Light, Inc. | Compression mount for semiconductor devices, and method |
| CN103311797A (en) * | 2012-03-16 | 2013-09-18 | 山东华光光电子有限公司 | Fixture for sintering semiconductor device and sintering method for plurality of tube cores of semiconductor laser |
| CN104518423A (en) * | 2014-12-31 | 2015-04-15 | 山东华光光电子有限公司 | Sintering device of high-power semiconductor laser and sintering method thereof |
-
2015
- 2015-07-23 CN CN201510438893.2A patent/CN105098593A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201238153Y (en) * | 2008-07-29 | 2009-05-13 | 山东华光光电子有限公司 | Semiconductor laser sintering equipment |
| US8340144B1 (en) * | 2011-08-29 | 2012-12-25 | Intellectual Light, Inc. | Compression mount for semiconductor devices, and method |
| CN103311797A (en) * | 2012-03-16 | 2013-09-18 | 山东华光光电子有限公司 | Fixture for sintering semiconductor device and sintering method for plurality of tube cores of semiconductor laser |
| CN104518423A (en) * | 2014-12-31 | 2015-04-15 | 山东华光光电子有限公司 | Sintering device of high-power semiconductor laser and sintering method thereof |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428994A (en) * | 2015-12-21 | 2016-03-23 | 中国电子科技集团公司第十三研究所 | High-power laser strip-type chip sintering clamp |
| CN105428994B (en) * | 2015-12-21 | 2018-05-25 | 中国电子科技集团公司第十三研究所 | A kind of high power laser strip-like chip is sintered fixture |
| CN105896307A (en) * | 2016-04-29 | 2016-08-24 | 山东华光光电子股份有限公司 | Self-aligning sintering clamp and method for semiconductor laser chip |
| CN105896307B (en) * | 2016-04-29 | 2019-03-22 | 山东华光光电子股份有限公司 | A kind of the autoregistration sintering fixture and sintering method of semiconductor laser chip |
| CN111092365A (en) * | 2018-10-23 | 2020-05-01 | 山东华光光电子股份有限公司 | Multi-tube-core sintering clamp and sintering method for semiconductor laser with uniform and adjustable pressure |
| CN114512891A (en) * | 2020-10-27 | 2022-05-17 | 山东华光光电子股份有限公司 | A sintering fixture and sintering method for improving the quality of low-power semiconductor laser COS alloy |
| CN112775517A (en) * | 2020-12-28 | 2021-05-11 | 苏州长光华芯光电技术股份有限公司 | Reflux device |
| CN112775517B (en) * | 2020-12-28 | 2023-10-31 | 苏州长光华芯光电技术股份有限公司 | Reflux device |
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Address after: Tianchen Avenue high tech Zone of Ji'nan City, Shandong Province, No. 1835 250101 Applicant after: SHANDONG HUAGUANG OPTOELECTRONICS CO., LTD. Address before: 250101 Shandong city of Ji'nan province high tech Zone Tianchen (Licheng Street No. 1835) Applicant before: Shandong Huaguang Photoelectronic Co., Ltd. |
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Application publication date: 20151125 |