CN105879600B - Energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device - Google Patents
Energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device Download PDFInfo
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- CN105879600B CN105879600B CN201510861067.9A CN201510861067A CN105879600B CN 105879600 B CN105879600 B CN 105879600B CN 201510861067 A CN201510861067 A CN 201510861067A CN 105879600 B CN105879600 B CN 105879600B
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- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 title claims abstract description 210
- 230000009467 reduction Effects 0.000 title claims abstract description 37
- 230000004888 barrier function Effects 0.000 title claims abstract description 23
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 64
- 230000003647 oxidation Effects 0.000 claims abstract description 61
- 238000002485 combustion reaction Methods 0.000 claims abstract description 30
- 239000007789 gas Substances 0.000 claims description 56
- 238000006722 reduction reaction Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 24
- 238000012545 processing Methods 0.000 claims description 20
- 230000008569 process Effects 0.000 claims description 13
- 238000007751 thermal spraying Methods 0.000 claims description 5
- 239000003638 chemical reducing agent Substances 0.000 abstract 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000012360 testing method Methods 0.000 description 4
- 238000000137 annealing Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000010891 electric arc Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 3
- 238000010926 purge Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 241000196324 Embryophyta Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000003916 acid precipitation Methods 0.000 description 2
- 239000000809 air pollutant Substances 0.000 description 2
- 231100001243 air pollutant Toxicity 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000446 fuel Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000000505 pernicious effect Effects 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000127225 Enceliopsis nudicaulis Species 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 239000007832 Na2SO4 Substances 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 206010047571 Visual impairment Diseases 0.000 description 1
- GCNLQHANGFOQKY-UHFFFAOYSA-N [C+4].[O-2].[O-2].[Ti+4] Chemical compound [C+4].[O-2].[O-2].[Ti+4] GCNLQHANGFOQKY-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 229910000856 hastalloy Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000003345 natural gas Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000006213 oxygenation reaction Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 208000023504 respiratory system disease Diseases 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052815 sulfur oxide Inorganic materials 0.000 description 1
- -1 that is Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/02—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust
- F01N3/04—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for cooling, or for removing solid constituents of, exhaust using liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/46—Removing components of defined structure
- B01D53/54—Nitrogen compounds
- B01D53/56—Nitrogen oxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D47/00—Separating dispersed particles from gases, air or vapours by liquid as separating agent
- B01D47/06—Spray cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D47/00—Separating dispersed particles from gases, air or vapours by liquid as separating agent
- B01D47/12—Washers with plural different washing sections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/26—Drying gases or vapours
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/32—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by electrical effects other than those provided for in group B01D61/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/34—Chemical or biological purification of waste gases
- B01D53/74—General processes for purification of waste gases; Apparatus or devices specially adapted therefor
- B01D53/75—Multi-step processes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N13/00—Exhaust or silencing apparatus characterised by constructional features ; Exhaust or silencing apparatus, or parts thereof, having pertinent characteristics not provided for in, or of interest apart from, groups F01N1/00 - F01N5/00, F01N9/00, F01N11/00
- F01N13/009—Exhaust or silencing apparatus characterised by constructional features ; Exhaust or silencing apparatus, or parts thereof, having pertinent characteristics not provided for in, or of interest apart from, groups F01N1/00 - F01N5/00, F01N9/00, F01N11/00 having two or more separate purifying devices arranged in series
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N3/00—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust
- F01N3/08—Exhaust or silencing apparatus having means for purifying, rendering innocuous, or otherwise treating exhaust for rendering innocuous
- F01N3/0892—Electric or magnetic treatment, e.g. dissociation of noxious components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/24—Generating plasma
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2257/00—Components to be removed
- B01D2257/40—Nitrogen compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D2259/00—Type of treatment
- B01D2259/80—Employing electric, magnetic, electromagnetic or wave energy, or particle radiation
- B01D2259/818—Employing electrical discharges or the generation of a plasma
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2240/00—Combination or association of two or more different exhaust treating devices, or of at least one such device with an auxiliary device, not covered by indexing codes F01N2230/00 or F01N2250/00, one of the devices being
- F01N2240/28—Combination or association of two or more different exhaust treating devices, or of at least one such device with an auxiliary device, not covered by indexing codes F01N2230/00 or F01N2250/00, one of the devices being a plasma reactor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
- F01N2570/00—Exhaust treating apparatus eliminating, absorbing or adsorbing specific elements or compounds
- F01N2570/14—Nitrogen oxides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H2245/00—Applications of plasma devices
- H05H2245/10—Treatment of gases
- H05H2245/15—Ambient air; Ozonisers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A50/00—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE in human health protection, e.g. against extreme weather
- Y02A50/20—Air quality improvement or preservation, e.g. vehicle emission control or emission reduction by using catalytic converters
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E20/00—Combustion technologies with mitigation potential
- Y02E20/12—Heat utilisation in combustion or incineration of waste
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/10—Internal combustion engine [ICE] based vehicles
- Y02T10/12—Improving ICE efficiencies
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Combustion & Propulsion (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Environmental & Geological Engineering (AREA)
- Toxicology (AREA)
- Biomedical Technology (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Treating Waste Gases (AREA)
- Exhaust Gas After Treatment (AREA)
Abstract
The present invention provides the nitrogen oxides emission reduction device for utilizing dielectric barrier discharge plasma.Combustion section, wet processed portion and plasma oxidation portion are configured in shell by plasma oxynitride emission reduction device of the invention, thus, so that the nitrogen oxides form being discharged from the final outlet of plasma oxynitride emission reduction device is with NO2Ground discharge is limited, the nitrogen oxides of discharge is eventually processed in final exhaust end by the wet scrubber that reducing agent operates.
Description
Technical field
The present invention relates to exhaust-gas treatment fields, and being related to one kind in more detail can be effectively treated containing nitrogen oxides (NOx)
And energy-saving dielectric barrier discharge (Dielectric Barrier Discharge) plasma of the exhaust gas of other pollutants
Nitrogen oxides emission reduction device.
Background technique
With industrialized fast development, meet the industrial activity of human demand based on energy basic means.But
With the increase of using energy source, the generation of environmental pollution is not only resulted in, also, pollution level is increasingly severe.Occupy energy money
The fossil fuels such as the most petroleum in source, coal, natural gas in combustion, necessarily discharge Air Pollutants, therefore, are
Sustainable development from now on, the mankind have to realize the coordination of economic growth and environmental protection.
Because using energy bring atmosphere pollution, local pollution and the world are roughly divided into according to involving range and corresponding to range
Contact scar.Sulfur and nitrogen oxides etc. compare locality for acid rain, the damaging range of animals and plants, but, titanium dioxide
Carbon, NOx isothermal chamber gas become the international dispute object in relation to global warming phenomenon.
The immoderate economical operation for the purpose of developing, has led to atmosphere pollution around domestic metropolis and industrial area
Reached and jeopardize state, also, as economic development bring income improves, about preventing domestic atmosphere pollution, global concern
Execute the proposition of the methodology of the global warming of various regulations and because referred to as important using the Air Pollutants prospect of the energy
Project.
Currently, with the increase of the demand for semiconductor display screen, it is more and more extensive to use fluoride, here, for
Because the total amount regulation correspondence problem largely discharged of 2 polluters (NOx) that occurs after handle semiconductor process gases with
The technology of processing NOx at present mainly uses catalysis process, but the energy that overuses in operation, accordingly it is desirable to ensure to replace skill
Art, it is therefore desirable to be able to solve the replacement technology of existing issue.
[advanced technical literature]
[patent document]
(patent document 1) Korean Patent Publication 10-2011-0065985
Summary of the invention
Problems to be solved by the invention
The technical problem to be solved in the present invention be provide it is a kind of suitable in the shell of plasma oxynitride emission reduction device
Secondary configuration combustion section, wet processed portion and plasma oxidation portion, with NO in the form of by the nitrogen oxides of final outlet2Limit
Surely it is discharged, thus, it is possible to effectively handle the nitrogen oxides emission reduction type plasma oxidation device of nitrogen oxides.
The technical solution solved the problems, such as
To solve the above-mentioned problems, the present invention provides a kind of energy-saving dielectric barrier discharge plasma nitrogen for handling exhaust gas
Oxide emission reduction device, comprising: combustion section carries out burning processing for the exhaust gas；Wet processed portion connects from the combustion section
The gas of burning processing is received, wet processed is carried out；Plasma oxidation portion, investment is for handling through the wet processed portion
The plasma gas for the nitrogen oxides for including in gas.
The energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device may also include shell, also, described
Combustion section, the wet processed portion and the plasma oxidation portion are configured in the shell.
The energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device may also include main discharge, be used for
The nitrogen oxides handled by the plasma gas is discharged to the shell exterior, also, it is described etc. from
Daughter oxidation section can connect installation with the interface channel for being connected to the main discharge in the shell.
The O that the plasma gas can generate for the plasma discharge by the plasma oxidation portion3Gas
Body.
The nitrogen oxides can be with the O that generates from the plasma oxidation portion3Oxidation reaction is generated, NO is transformed to2。
The NO of the discharge2It can be processed by reduction reaction in the wet processed technique of subsequent treatment process.
The plasma oxidation portion, it may include: internal electrode is rod shape；Dielectric, around the internal electricity
Pole；And external electrode, outside the dielectric with loop shape be inserted into install, also, to the internal electrode with it is described
External electrode can be applied for generating the AC power source of plasma.
The external electrode surface can be coated by thermal spraying.
Identical height can be formed with outside the external electrode outside the dielectric.
The plasma oxidation portion can use dielectric barrier discharge (Dielectric Barrier Discharge,
DBD) plasma and generate plasma.
The effect of invention
According to the present invention, plasma oxynitride emission reduction device will pass through combustion section and the gas in wet processed portion for processing
The nitrogen oxides for including in body and the plasma oxidation portion for putting into plasma gas is configured at together in shell, thus, energy
Enough final outlets in plasma oxide emission reduction device make nitrogen oxides form with NO2Limit discharge.Also, it is not necessarily to
Other equipment is added, and discharges the dielectric barrier discharge plasma in the plasma oxidation portion formed by coil form electrode, it is right
Nitrogen oxides is handled, thus, it is possible to save the energy supplied to equipment.
Such plasma oxidation portion, including internal electrode, around the dielectric of internal electrode and outside dielectric with
The external electrode of loop shape insertion installation, external electrode surface are coated by thermal spraying, dielectric outside and external electrode
The height of outside is identically formed, thus, it is possible to prevent dust adhesion between electrode, and is able to solve in dielectric and electrode
Between gap there is the problem of generating heat or electric arc occurs.
Technical effect of the invention is not limited to above-mentioned content, and those skilled in the art passes through following the description
It should be understood that unmentioned other technical effects.
Detailed description of the invention
Fig. 1 is the attached drawing for the gas purge system that schematic diagram is applicable in plasma oxidation portion of the invention.
Fig. 2 is the attached drawing for indicating to be applicable in the plasma oxynitride emission reduction device in plasma oxidation portion of the invention.
Fig. 3 is the cross-sectional view for illustrating plasma oxidation portion of the invention.
Fig. 4 is the sectional view for illustrating plasma oxidation portion of the invention.
Fig. 5 is the expanded view for illustrating plasma oxidation portion of the invention.
Description of symbols
300: plasma oxynitride emission reduction device
301: shell 310: combustion section
320: wet processed portion 330: plasma oxidation portion
331: internal electrode 332: dielectric
333: external electrode 334: outside dielectric
335: 336 outside external electrode: reaction gas intake
337: plasma gas outlet 340: AC power source supply department
Specific embodiment
The present invention can make various changes, and carry out various embodiments, in the accompanying drawings illustrations specific embodiments, and detailed
It is described in detail in explanation.But, it should be understood that this is not intended to limit the invention to particular implementation form, but wraps
Include all transformation, equipollent and the sub belonged in thought and technical scope of the invention.As in explaining the present invention, sentence
Disconnected when can obscure the gist of the invention for the detailed description in relation to well-known technique, then description is omitted.
Hereinafter, be explained in detail with reference to the accompanying drawings according to an embodiment of the invention, also, when being described with reference to, it is identical or
Corresponding constituent element assigns identical reference numeral, and omits to its repeated explanation.
In general, nitrogen oxides occurs because of the mobile occurring source of the fixed occurring source and automobile etc. such as thermal power plant,
The nitrogen oxides occurred in semiconductor technology be before discharging various pernicious gases to atmosphere safely in the process of processing
The washer combustion process of process, what high temperature nitrogen and oxygen when burning generated due to generating reaction.
NO is discharged to atmosphere, passes through the O in atmosphere3、O2, moisture etc. and be oxidized to NO2、NO3、N2O4Deng wherein most
For NO2, it is fused into suspended particulates state in air, and become acid rain or photochemical fog is formed by sunray.Its
Harm is very extensive, mainly causes respiratory disease to human body, stimulation eyes cause dysopia, or corrosion metal material, to plant
Object growth also produces bigger effect.
The SiH used in semiconductor processing as processing4、NF3The technique of equal pernicious gases, using annealing device, this
The type of class annealing device has fuel type, electric heater formula, plasma type.Such mode during processing, passes through O2、H2O
Deng and N2Reaction, a large amount of nitrogen oxides (NO, NO occurs2) etc..In particular, in the case where fuel type and plasma type, because
The high characteristic of operation temperature, the occurrence rate of NO is higher in nitrogen oxides.
As another occurring source, NH in gas used in semiconductor technology3And NF3, in decomposition or chemical reaction process
In, from NH3And NF3The nitrogen factor (N+) of decomposition and the O in atmosphere2Or H2O reaction, and it is (most of largely to generate nitrogen oxides
NO)。
Fig. 1 is the attached drawing for the gas purge system that schematic diagram is applicable in plasma oxidation portion of the invention；Fig. 2 is to indicate
It is applicable in the attached drawing of the plasma oxynitride emission reduction device in plasma oxidation portion of the invention.
Referring to FIG. 1 and FIG. 2, it for handling the gas purge system of the exhaust gas containing nitrogen oxides, including processes as follows
Journey: the exhaust gas used in main process task equipment 100 is passed through into vacuum pump 200 to the plasma for being applicable in plasma oxidation portion 330
Body nitrogen oxides emission reduction device 300 introduces, and the exhaust gas of introducing is handled by plasma oxynitride emission reduction device 300
Afterwards, it by subsequent technique, that is, wet scrubber 400, is discharged by fan 500 to atmosphere.
Here, it is applicable in the plasma oxynitride emission reduction device 300 in plasma oxidation portion 330 according to the present invention,
It can be in order to handle exhaust gas and usually used annealing device i.e. point of use (POU, Point Of Use) washer.Previous
It may include combustion section 310 and wet processed portion 320 in POU washer, but plasma oxynitride emission reduction according to the present invention
Device 300 can configure plasma oxidation portion 330 in shell 301 other than combustion section 310 and wet processed portion 320,
For launching the plasma gas for being used for handling the nitrogen oxides for including in the gas by wet processed portion 320.
As shown in Fig. 2, the combustion section 310 of plasma oxynitride emission reduction device 300 according to the present invention connects on top
It is connected to and flows into pipe 311, exhaust gas used in semiconductors manufacture etc. is flowed by the inflow pipe 311 into shell 301.Opposite shell
The exhaust gas flowed into 301 carries out burning processing by combustion section 310, and the exhaust gas by burning processing passes through under combustion section 310
The discharge pipe 312 that portion's sectional area is formed with becoming narrow gradually is discharged to wet processed portion 320.
Combustion section 310 using make the exhaust gas of harmful components by handling exhaust gas between flame by the way of, also, in order to mention
High burning efficiency, O2And CH4Burning gases inlet 313 by being configured at 301 top of combustion section is injected.
But during processing, because of O2、H2O etc. and N2Reaction and generate a large amount of nitrogen oxides (NO, NO2) etc., especially
It, in combustion, operation temperature high characteristic when because of burning, the ratio of NO increases in nitrogen oxides.
In the exhaust gas of the processing of combustion section 310, in order to handle dissolution and the high temperature of the depositions of 2 by-products, water-soluble gas
Burning gases cooling, pass through wet processed portion 320.
Wet processed portion 320 is in order to receive the gas of burning processing from combustion section 310 and carry out wet processed, it may include the
1 nozzle 321, the 2nd nozzle 322, wet type sink 323, flow adjusting device 324, pump 325, water supply comb 326.
In wet processed portion 320, spraying by nozzle 321,322 generates in combustion section 310 to adsorb and be dissolved in
Water-soluble exhaust gas and silica (SiO2) powder etc., it is stored using wet type sink 323 from combustion section 310 and nozzle 321,322
The treated substance of discharge and discharge.Preferably, the 1st nozzle 321 and the 2nd nozzle 322 are configured at 323 top of wet type sink.
1st nozzle 321 and the 2nd nozzle 322 can be connect with water supply comb 326, be supplied to receive from wet type sink 323
Water, also, pump 325 can be installed, between wet type sink 323 and water supply comb 326 to be configured in shell 301
Lower part wet type sink 323 water be supplied to top nozzle 321,322.Also, between wet type sink 323 and pump 325,
It is configurable to the flow adjusting device 324 for the water that adjustment nozzle 321,322 sprays.
As above-mentioned, in wet processed portion 320, wet type sink 323, flow adjusting device 324, pump 325 and water supply comb
326, which pull together, cooperates, to play the function of water recursive device, so that the water of fixed temperature is continuously circulated in wet processed portion 320.
The rear end in wet processed portion 320 may also include main discharge 327, and the exhaust gas for that will handle is to outside shell 301
Discharge, so as to the device discharge for aftertreatment technology.
Main discharge 327 extends from 301 interior of shell and is formed, and is formed in shell 301 in main discharge 327
The main discharge 327 in portion can be connected by the interface channel 328 connecting with main discharge 327 with plasma oxidation portion 330
It connects.That is, plasma oxidation portion 330 according to the present invention, in the shell 301 of plasma oxynitride emission reduction device 300,
It is configured together with combustion section 310 and wet processed portion 320, and forms the washer equipment of an entirety.
Also, it may also include in the lower part in plasma oxidation portion 330 to plasma oxidation portion 330 and apply AC power source
AC power source supply department 340.
As described above, plasma oxidation portion 330 is configured at last in plasma oxynitride emission reduction device 300
End is main discharge 327, and can be made eventually by main discharge 327 to nitrogen oxides (NO) shape being discharged outside shell 301
State is with NO2Limit discharge.
That is, the O generated in plasma oxidation portion 330 by plasma discharge3When with burning in combustion
The nitrogen oxides (NO) of generation occurs oxidation reaction and is transformed to NO2, the NO of variation2By main discharge to arranging outside shell 301
Out, to the NO being discharged outside shell 3012It, can be effectively by subsequent treatment process, that is, wet processed technique reduction reaction
Handle nitrogen oxides.
Fig. 3 is the cross-sectional view for illustrating plasma oxidation portion of the invention；Fig. 4 be for illustrate it is of the invention it is equal from
The sectional view of daughter oxidation section；Fig. 5 is the expanded view for illustrating plasma oxidation portion of the invention.
Referring to Fig. 3 to Fig. 5, plasma oxidation portion 330 of the invention may include internal electrode 331, dielectric 332, outer
Portion's electrode 333.
Internal electrode 331 can have the rod shape of internal sky, also, be formed by electric conductor substance, so that electric current passes through.For
The discharge gas of plasma discharge can be introduced by the reaction gas intake 336 of 331 lower part of internal electrode, pass through plasma
The plasma gas that body discharges and generates can be discharged by the plasma gas outlet (337) on 331 top of internal electrode.
Preferably, the discharge gas for being plasma discharge can be O2, can be by the plasma gas that plasma discharge generates
O3。
Dielectric 332 around 331 one end of internal electrode both set a distances to the other end both set a distances, and have and inside
The identical rod shape of electrode 331.Dielectric 332 is configured between internal electrode 331 and external electrode 333, is passed through for preventing
The electric arc etc. for being applied to the high voltage of electrode and generating between the electrodes.
External electrode 333 can form the coil form electrode structure formed with loop shape, and be inserted into and be installed on dielectric 332
Outside.It can will be set to same intervals between coil and be inserted into, the section of coil, which is formed such that, is inserted in coil
It can prevent from being formed in origination interval between the groove and coil of dielectric 332 when dielectric 332, also, in order to enable electricity is situated between
335 height configures in the same manner outside matter outside 334 and external electrode, and can have square shape.But to the shape of coil section
State can make various changes according to user.
Internally electrode 331 and external electrode 333 are by being installed on the AC power source of the lower part in plasma oxidation portion 330
Supply department 340 applies AC power source.For example, internally voltage can be applied by electrode 331, external electrode 333 is grounded, or replacement
The polarity of internal electrode 331 and external electrode 333, also, height can all be applied to two electrodes according to AC power source supply department 340
Voltage.That is, can apply high voltage (±) in internal electrode 331 and external electrode 333 to certain side, the other side is grounded, or
In internal electrode 331 and external electrode 333 when certain side application+electrode ,-electrode can be applied to the other side.
Also, internal electrode 331 and external electrode 333 are to wrap metalliferous conductive material, can be stronger by corrosion resistance
Aluminium (Al), stainless steel (STS), titanium (Ti), nickel (Ni), chromium (Cr), copper (Cu), tungsten (W), a certain material in platinum (Pt) or
Its alloy and formed.Preferably, it can be applicable in processability and the preferable nickel of corrosion resistance Kazakhstan as main component
(Hastelloy) alloy.
Ceramics, that is, MgO, Al of the higher oxide series of the applicable dielectric constant of dielectric 3322O3、TiO2、SiO2In
A certain material.
The electrode surface of the external electrode 333 formed with loop shape can be coated by thermal spraying, to outside dielectric 332
Portion's insertion installation.Also, the external electrode outside 335 for being inserted in dielectric 332 is identical highly as 334 formation outside dielectric
Configuration.
As above-mentioned, 333 surface of external electrode is coated by thermal spraying, and makes external electrode outside 335 and dielectric
Outside 334 formed it is identical highly configure, so as to prevent between dust adhesion electrode, further, it is possible to solve in dielectric
The problem of fever of gap generation between 332 and electrode or electric arc.
Plasma oxidation portion 330 can be embodied according to user with all size, preferred internal electricity according to the present invention
The size of pole 331 is 1.5m from one end to the height of the other end, and the height of one end to the other end of dielectric 332 is 1.2m.And
And one end since coil of the external electrode 333 of loop shape to coil end the other end height be 0.95m.Line
The thickness of circle and dielectric 332, as shown in figure 4, respectively 2mm and 7mm.
Using such coil form electrode structure dielectric barrier discharge (Dielectric Barrier Discharge,
DBD) plasma device is applying high-frequency, high voltage and the electric field (Electric field) occurred between electrodes,
It is additionally formed the induction field by Faraday's law of induction (Faraday's Law of Induction), and makes electric field
Intensity maximum significantly reduces power consumption as a result, and generates the plasma of good characteristic.
Such as above-mentioned, plasma oxidation portion 330 according to the present invention, using dielectric barrier discharge plasma occur etc. from
Daughter is occurred by such plasma, by O2It is transformed to O3, O is discharged to main discharge 327 by interface channel 3283.As above
The O being discharged to main discharge 327 with stating3The polluter existing for 327 inside of main discharge is carried out at oxidation and ionization
Reason.For example, by NO and CO oxidation processes at NO2And CO2, THC is oxidized and ionizes, and HF or dust are by coarsening.
To by the plasma occurred from plasma oxidation portion 330 according to the present invention, in plasma nitrogen
The nitrogen oxides occurred in 300 combustion process of oxide emission reduction device and the O occurred by plasma discharge3It is aoxidized
Reaction treatment, as a result, be capable of the nitrogen oxides form of the final outlet of plasma oxynitride emission reduction device 300 with
NO2Limit discharge.
Nitrogen oxides by above-mentioned plasma oxidation portion 330 is oxidized processing, and the reaction mechanism is as follows.
NO+O3=> NO2-+O2
It is oxidized processing by plasma oxidation portion 330, by main discharge 327 with NO2The nitrogen oxides of discharge, such as
Shown in Fig. 1, it is eventually processed in the wet processed technique of subsequent treatment process, that is, wet scrubber 400 by reduction reaction.
Also, wet scrubber 400 is in addition to nitric oxides, also handles the absorption in the ionized THC of pretreatment process, preceding place
The remaining O of reason process3Reduction, HF etc..
The key reaction mechanism for carrying out reduction treatment by above-mentioned wet scrubber 400 is as follows.
NO2+(Na2S+ α)=N2+Na2SO4
As described above, pass through the reduction of oxidation process and wet scrubber 400 by means of plasma oxidation portion 330
Place is effectively performed in journey, the nitrogen oxides that can occur in the combustion process in plasma nitrogen oxides emission reduction device 300
Reason.
<experimental example 1>
In order to evaluate the nitrogen oxides treatment performance for the equipment for being equipped with plasma oxidation portion of the invention, nitrogen has been carried out
Oxide is converted into NO by the plasma discharge in this plasma oxidation portion2Transfer efficiency test.
The testing data that Tables 1 and 2 carries out the equipment for being equipped with plasma oxidation portion of the invention.
According to the condition of this experimental example 1, by the plasma O of oxidation stage (Stage)3Concentration is set as 40ppm, by base
Quasi- air quantity is set as 2CMM.Superficial linear velocity in a column 1m/s, when residence time 2sec condition, when plasma OFF and when plasma ON
Nitrogen oxides NO2Transfer efficiency is as shown in table 1, as shown in table 2 according to the oxygenation efficiency experimental result of time change.
[table 1]
| Plasma OFF (ppm) | Plasma ON (ppm) | Efficiency | ||
| NO | 45 | NO | 7 | 84% |
| NO2 | 22 | NO2 | 55 | |
| NOx | 67 | NOx | 62 | |
| O3 | 40 | O3 | 1.4 |
[table 2]
NO is effectively converted by applying the energy nitrogen oxides of plasma known to Tables 1 and 22.<experimental example 2>
In experimental example 2, in order to evaluate the nitrogen oxides treatment for the equipment for being equipped with plasma oxidation portion of the invention
Can, it has carried out after continuous starting 80 minutes, nitrogen oxides is converted by the plasma discharge in this plasma oxidation portion
For NO2Transfer efficiency test.
Table 3 to table 6 is that the test of the experimental example 2 carried out to the equipment for being equipped with plasma oxidation portion of the invention provides
Material.
According to the condition of this experimental example 2, identically as the condition of experimental example 1 by the plasma O of oxidation stage3Concentration is set
Be set to 40ppm, benchmark air quantity is set as 2CMM, also, superficial linear velocity in a column is set as 1m/s, change the residence time, with experimental example 1
Identical method is detected.
<table 3>
<table 4>
<table 5>
<table 6>
As shown in table 3 to table 6, the processing for having 95% or more can be confirmed from the measurement result of 0.5~2sec of residence time
Efficiency.
As described above, plasma oxynitride emission reduction device 300, by be used to burn handle exhaust gas combustion section 310, from
Combustion section 310 receives the gas of burning processing and carries out the wet processed portion 320 of wet processed and in order to handle by wet type
The nitrogen oxides for including in the gas in reason portion 320 and the plasma oxidation portion 330 for putting into plasma gas is configured at together
In shell 301, thus, it is possible to plasma oxynitride emission reduction device 300 final outlet make nitrogen oxides form with
NO2Limit discharge.Also, without adding other equipment, discharge Jie in the plasma oxidation portion 330 formed by coil form electrode
Matter barrier discharge plasma, handles nitrogen oxides, thus, it is possible to save the energy supplied to equipment.
Also, disclosed the embodiment of the present invention is intended merely to help to understand and prompt in the present description and drawings
Particular case, and not limit the scope of the invention.Those skilled in the art of the invention should understand that in addition to providing herein
Embodiment except, also implementable other variations based on the technical idea of the invention.
Claims (6)
1. a kind of energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device, the energy-saving medium as processing exhaust gas
Barrier discharge plasma nitrogen oxides emission reduction device characterized by comprising
Shell；
Combustion section carries out burning processing for the exhaust gas；
Wet processed portion receives the gas of burning processing from the combustion section, carries out wet processed；
Plasma oxidation portion, investment for handle the grade of the nitrogen oxides for including in gas by the wet processed portion from
Daughter gas,
Wherein the combustion section, the wet processed portion and the plasma oxidation portion are sequentially configured in the shell,
The wherein plasma oxidation portion, comprising:
Internal electrode is rod shape；
Dielectric surrounds the internal electrode；And
External electrode is inserted into loop shape outside the dielectric and is installed, and coil section has square shape,
Also, it is applied for generating the AC power source of plasma to the internal electrode and the external electrode,
Wherein the external electrode surface is coated by thermal spraying, and
Wherein identical height is formed with the external electrode outside outside the dielectric.
2. energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device according to claim 1, feature exist
In,
It further include main discharge, being used for will be by the nitrogen oxides that the plasma gas is handled to described outer
Discharge outside shell,
Also, the plasma oxidation portion connect peace with the interface channel for being connected to the main discharge in the shell
Dress.
3. energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device according to claim 1, feature exist
In,
The plasma gas is the O generated by the plasma discharge in the plasma oxidation portion3Gas.
4. energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device according to claim 3, feature exist
In,
The nitrogen oxides and the O generated from the plasma oxidation portion3Oxidation reaction is generated, NO is transformed to2。
5. energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device according to claim 4, feature exist
In,
The NO of the transformation2It is processed by reduction reaction in the wet processed technique of subsequent treatment process.
6. energy-saving dielectric barrier discharge plasma nitrogen oxides emission reduction device according to claim 1, feature exist
In,
The plasma oxidation portion generates plasma using dielectric barrier discharge plasma.
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| KR10-2015-0023940 | 2015-02-17 | ||
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| KR10-2015-0035697 | 2015-03-16 | ||
| KR1020150035697A KR101514195B1 (en) | 2015-02-17 | 2015-03-16 | Energy-Saving Type Dielectric Barrier Discharge Plasma NOx Reduction Equipment |
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| CN108026809B (en) * | 2015-09-10 | 2020-11-27 | 三星重工业株式会社 | Pollutant reduction device |
| CN105457470A (en) * | 2015-12-24 | 2016-04-06 | 华北电力大学 | Device and method for removing nitrogen oxide by combining magnetic field with single-medium barrier discharge |
| KR101809626B1 (en) * | 2017-03-02 | 2017-12-15 | (주)엔노피아 | System for Treat Complex Pollutant |
| KR101959165B1 (en) * | 2018-04-27 | 2019-03-15 | (주)엔노피아 | Plasma waste gas processing apparatus and system |
| KR102089599B1 (en) * | 2019-07-12 | 2020-03-16 | 성진엔지니어링(주) | Waste gas treatment device for semiconductor |
| KR102708095B1 (en) * | 2021-11-23 | 2024-09-19 | 한국핵융합에너지연구원 | High-purity no2 gas generator and high-concentration activated water and fertilizer water manufacturing device based on nitrate using plasma |
| KR102498090B1 (en) * | 2022-03-25 | 2023-02-10 | 주식회사 영원이엔지 | Apparatus of atmospheric pressure plasma for harmful gas decomposition of pipe |
| CN114688522B (en) * | 2022-04-15 | 2025-06-27 | 安徽理工大学 | Coal and ammonia combustion device with dielectric barrier discharge synergistically enhanced by central electrode structure |
| KR102768199B1 (en) * | 2022-10-31 | 2025-02-13 | 한국핵융합에너지연구원 | Nitrogen oxide dissolved water production system and nitrogen oxide dissolved water production process using the same |
| CN116220880A (en) * | 2023-03-10 | 2023-06-06 | 潍柴动力股份有限公司 | A kind of LNG engine tail gas treatment device and LNG engine |
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- 2015-11-25 US US14/951,983 patent/US20160237869A1/en not_active Abandoned
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| CN1359310A (en) * | 1999-05-07 | 2002-07-17 | 高级技术材料公司 | Effluent gas stream treatment system having utility for oxidation treatment of semiconductor manufacturing effluent gases |
| CN204073809U (en) * | 2014-09-28 | 2015-01-07 | 福州闽创环保科技有限公司 | Low-temperature plasma industrial |
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| KR101514195B1 (en) | 2015-04-23 |
| TWI615543B (en) | 2018-02-21 |
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