CN105848426A - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
- Publication number
- CN105848426A CN105848426A CN201610191627.9A CN201610191627A CN105848426A CN 105848426 A CN105848426 A CN 105848426A CN 201610191627 A CN201610191627 A CN 201610191627A CN 105848426 A CN105848426 A CN 105848426A
- Authority
- CN
- China
- Prior art keywords
- plug connector
- printed substrate
- solder
- hole
- metal forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 72
- 239000002184 metal Substances 0.000 claims abstract description 71
- 229910052751 metal Inorganic materials 0.000 claims abstract description 71
- 238000000034 method Methods 0.000 claims abstract description 51
- 238000000151 deposition Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 97
- 230000008021 deposition Effects 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 239000006071 cream Substances 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 15
- 230000004907 flux Effects 0.000 abstract 4
- 239000011888 foil Substances 0.000 abstract 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 32
- 230000004927 fusion Effects 0.000 description 9
- 239000011889 copper foil Substances 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10257—Hollow pieces of metal, e.g. used in connection between component and PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Embodiments of the present invention disclose a printed circuit board and a manufacturing method thereof, and belong to the technical field of printed circuit boards. The manufacturing method comprises the steps of depositing at least one metal foil ring, wherein the metal foil ring is positioned on the first surface or the second surface of a printed circuit board to surround a corresponding through hole of a plug connector and is in contact with the hole edge of the through hole of the plug connector; forming the soldering flux on the surface of the metal foil ring; installing at least one plug connector on the first surface of the printed circuit board and penetrating the pin of the plug connector through the corresponding through hole of the plug connector; fusing the soldering flux to solder the plug connector of the printed circuit board. According to the embodiment of the present invention, the fusing of the soldering flux is conducted to bond the soldering flux onto the printed circuit board, so that the soldering of the plug connector on the printed circuit board is realized. Compared with the prior art, the soldering temperature is controllable and the soldering of the plug connector can be realized without the wave-soldering process. The short-circuit condition of the plug connector caused by the tinning phenomenon of the plug connector can be avoided. Moreover, the advantages of simple soldering process is, low manufacturing cost and high yield are realized.
Description
Technical field
The present embodiments relate to printed substrate technical field, particularly relate to a kind of printed substrate and system thereof
Make method.
Background technology
Two kinds of components and parts generally it are pasted with on existing printed substrate (PCB), a kind of for being pasted onto PCB
The Surface Mount part on surface, the another kind of plug connector needing guiding through pcb board for pin.In welding process, the most first
Use backflow welding method to melt the tin cream of Surface Mount part weld Surface Mount part, then use ware-soldering welding plug connector.
During ware-soldering welding plug connector, the junction to be welded of printed substrate directly contacts with high-temperature liquid state stannum,
May make grafting components and parts that the phenomenon of tin sticky occurs, cause short circuit between plug connector.
In realizing process of the present invention, inventor finds that in prior art, at least there are the following problems: existing PCB
Plate needs twice welding to have manufactured, and welding process is loaded down with trivial details, and manufacturing cost is higher, and pcb board
Problem components and parts short circuit easily occur, affects the performance of pcb board, causes the problem that yields is low.
Summary of the invention
The embodiment of the present invention provides a kind of printed substrate and manufacture method thereof, to solve PCB in prior art
The problem that plate welding process is loaded down with trivial details, manufacturing cost is high and yields is low.
First aspect, embodiments provides the manufacture method of a kind of printed substrate, this manufacture method
Including:
Depositing at least one metal forming ring, wherein, described metal forming ring is positioned at the first of described printed substrate
Surface or second surface and around corresponding plug connector through hole and contact setting with the hole rib of this plug connector through hole；
The surface of described metal forming ring is formed solder；
The first surface of described printed substrate is installed at least one plug connector drawing described plug connector
Foot is through corresponding plug connector through hole；
Melted described solder is to weld the plug connector of described printed substrate.
Further, described metal forming ring is Copper Foil ring.
Further, at least one metal forming ring of described deposition includes: the gold that deposition at least two is oppositely arranged
Belong to paper tinsel ring, the metal forming ring that said two is oppositely arranged lay respectively at described printed substrate first surface and
Second surface and around corresponding plug connector through hole and contact setting with the hole rib of this through hole.
Further, the surface of described metal forming ring forms solder to include:
The surface of at least one metal forming ring being positioned at described first surface is formed solder；And/or,
The surface of at least one metal forming ring being positioned at described second surface is formed solder.
Further, described solder is tin cream.
Further, solder reflow techniques is used to melt described solder to weld the grafting of described printed substrate
Part.
Further, before melted described solder, also include:
The first surface of described printed substrate mounts at least one Surface Mount part drawing described Surface Mount part
Hem facing is placed in the Surface Mount part pad being printed with solder.
Further, solder reflow techniques is used to melt described solder to weld the plug connector of described printed substrate
With Surface Mount part.
Second aspect, the embodiment of the present invention additionally provides a kind of printed substrate, this printed substrate is arranged
Having plug connector, this printed substrate uses manufacture method manufacture as described in relation to the first aspect.
The printed substrate of embodiment of the present invention offer and manufacture method thereof, first deposit at least one metal forming ring,
Wherein, the plug connector of first surface or second surface and cincture correspondence that metal forming ring is positioned at printed substrate leads to
The hole rib contact of this plug connector through hole of Kong Bingyu is arranged, and forms solder, in printing on the surface of metal forming ring
At least one plug connector is installed and by the pin of plug connector through corresponding plug connector on the first surface of wiring board
Through hole, remelted solder is to weld the plug connector of printed substrate.The embodiment of the present invention uses fusion welding
Method make solder and printed substrate bond, weld, with existing skill realizing the plug connector of printed substrate
Art is compared, and welding temperature is controlled, it is not necessary to weld plug connector by ware-soldering, it is to avoid grafting components and parts occur
Tin sticky so that the situation of short circuit between components and parts, this technical scheme has that welding process is simple, low cost of manufacture,
And the advantage that yields is high.
Accompanying drawing explanation
For the technical scheme being illustrated more clearly that in the embodiment of the present invention, institute in embodiment being described below
Need the accompanying drawing used to do one to introduce simply, it should be apparent that, the accompanying drawing in describing below is the present invention
Some embodiments, for those of ordinary skill in the art, on the premise of not paying creative work,
Other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the manufacture method of the printed substrate that the embodiment of the present invention provides；
Fig. 2 A～Fig. 2 D is the manufacture schematic diagram of the printed substrate that the embodiment of the present invention provides；
Wherein, Fig. 2 B is that printed substrate shown in Fig. 2 A is along the sectional view of A-A'.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearer, hereinafter with reference to the embodiment of the present invention
In accompanying drawing, technical scheme is clearly and completely described, it is clear that described by embodiment
Embodiment be a part of embodiment of the present invention rather than whole embodiments.Based on the enforcement in the present invention
Example, the every other enforcement that those of ordinary skill in the art are obtained under not making creative work premise
Example, broadly falls into the scope of protection of the invention.
As it is shown in figure 1, the flow chart of manufacture method of the printed substrate provided for the embodiment of the present invention one,
The technical scheme of the present embodiment is applicable to weld the situation of the plug connector of printed substrate.
The manufacture method of printed substrate that the present embodiment provides, specifically includes following steps:
S110, depositing at least one metal forming ring, wherein, metal forming ring is positioned at the first table of printed substrate
Face or second surface and around corresponding plug connector through hole and contact setting with the hole rib of this plug connector through hole.
First surface and the second surface of printed substrate is oppositely arranged in the present embodiment, and plug connector through hole passes through
Wear first surface and the second surface of printed substrate.At least one the plug-in unit part that can be selected in printed substrate leads to
The position deposition metal forming ring in hole, this metal forming ring is the electric conductor of printed substrate and as printed wire
The local circuit pattern of plate, in the circuit that plug connector accesses printed substrate.
Concrete, this metal forming ring 201 is positioned at the first table of printed substrate 202 the most as shown in Figure 2 A
Face 203, and this metal forming ring 201 is around corresponding plug connector through hole 204, and this metal forming ring 201
Also contact with the hole rib 205 of plug connector through hole 204, from there through the metal forming ring 201 of first surface 203
Plug connector (not shown) can be accessed in the circuit of printed substrate 202, as shown in Figure 2 B for shown in Fig. 2 A
Along the sectional view of A-A', wherein second surface 206 is oppositely arranged with first surface 203.
It should be noted that the most optional metal forming ring 201 and plug connector through hole 204
Hole rib 205 interval is arranged.It will be recognized to those skilled in the art that function based on metal forming ring, gold
Belonging to the interval between paper tinsel ring and the hole rib of plug connector through hole should be less, in order to can be by plug connector after melt solder
Turn on metal forming ring so that plug connector accesses in the circuit of printed substrate, the most not
Spacing distance between metal forming ring and plug connector through hole hole rib is limited.
It should be noted that the pin of known plug connector needs to insert in plug connector through hole, plug connector through hole passes through
Wear first surface and the second surface of printed substrate, the most also can be selected in second surface deposition metal forming ring,
And by the metal forming ring of second surface plug connector accessed in the circuit of printed substrate.Implement at other
In example, at least one metal forming ring optional is positioned at the second surface of printed substrate and leads to around corresponding plug connector
The hole rib contact of this plug connector through hole of Kong Bingyu is arranged；Or, the most optional at least two metal forming ring position respectively
Lead in the first surface of printed substrate and second surface and around corresponding plug connector through hole and with this plug connector
The hole rib contact in hole is arranged, no longer concrete example at this.
Exemplary, preferably metal forming ring is Copper Foil ring.Copper Foil is a kind of cloudy matter electrolysis material, generally makees
For the electric conductor as printed substrate, it is easy to be bonded in insulating barrier and can accept to print protective layer.At this
The advantage selecting Copper Foil is, Copper Foil has low surface oxygen species and can be attached from various different base materials
, such as metal, insulant etc.；In addition Copper Foil also has wider temperature range, as put by Copper Foil
In substrate surface metal substrate combining, then Copper Foil has excellent conduction and can provide the effect of electromagnetic shielding
Really.
S120, on the surface of metal forming ring formed solder.
Solder is for dosing the metal alloy compositions in weld seam, overlay cladding and brazed seam, and its shape includes weldering
Silk, welding rod, solder and soldering paste etc..In the present embodiment on the surface of metal forming ring formed solder so that after
Continuous melting bonds with printed substrate and welds plug connector, is therefore preferably able to be attached to metal forming ring surface
Solder, preferred solder is tin cream in the present embodiment, but the most not to can adhere to metal
Solder on paper tinsel ring surface specifically limits.Tin cream is electronic devices and components welding weldering on a printed-wiring board
Connect material, be the cream being mixed to form by solder powder, scaling powder and other surfactant, thixotropic agent etc.
Shape mixture, but the composition of tin cream is not specifically limited.
The present embodiment is formed on the surface of metal forming ring 201 solder 207 the most as shown in Figure 2 C, in order to
It is welded in the circuit of printed substrate 202 by solder 207 in plug connector, it should be noted that formed
Solder 207 can local complexity or all cover metal forming ring 201.
S130, at least one plug connector is installed on the first surface of printed substrate and by the pin of plug connector
Through corresponding plug connector through hole.
In the present embodiment, the preferably first surface of printed substrate is the front surface of printed substrate, Surface Mount
Multiple components and parts such as part, plug connector are all mounted on the front surface of printed substrate.Preferably such as figure in the present embodiment
Shown in 2D, plug connector 208 is arranged on the first surface 203 of printed substrate 202 and by plug connector 208
Pin is through corresponding plug connector through hole 204, and the pin of plug connector 208 extends to printed substrate 202
Second surface 206.
S140, fusion welding are to weld the plug connector of printed substrate.
In the present embodiment, plug connector pin inserts plug connector through hole, and the periphery of plug connector through hole is wound with gold
Belong to paper tinsel ring, the surface of metal forming ring is formed with solder, then after fusion welding, solder glues with printed substrate
Knot, it is achieved the plug connector of welding printed substrate.
Preferably employ the solder reflow techniques fusion welding plug connector with welding printed substrate in the present embodiment,
Optional employing solder reflow device realizes reflow soldering method.Specifically, the heater circuit of solder reflow device is by sky
Gas or nitrogen are heated to sufficiently high temperature after-blow to having posted the printed substrate of plug connector, and plug connector leads to
Solder on hole bonds with printed substrate after melting, and then is welded on a printed-wiring board by plug connector.But
The method of fusion welding includes but not limited to solder reflow techniques, the most not to fusion welding
Method specifically limits.
The manufacture method of the printed substrate that the embodiment of the present invention provides, first deposits at least one metal forming ring,
Wherein, the plug connector of first surface or second surface and cincture correspondence that metal forming ring is positioned at printed substrate leads to
The hole rib contact of this plug connector through hole of Kong Bingyu is arranged, and forms solder, in printing on the surface of metal forming ring
At least one plug connector is installed and by the pin of plug connector through corresponding plug connector on the first surface of wiring board
Through hole, remelted solder is to weld the plug connector of printed substrate.The present embodiment uses the side of fusion welding
Method makes solder bond with printed substrate, to realize the plug connector welding of printed substrate, with prior art phase
Ratio, welding temperature is controlled, it is not necessary to weld plug connector by ware-soldering, it is to avoid grafting components and parts tin sticky occur
So that the situation of short circuit between components and parts, this technical scheme has that welding process is simple, low cost of manufacture, with
And the advantage that yields is high.
Exemplary, on the basis of technique scheme, at least one metal forming ring of optional deposition includes:
The metal forming ring that deposition at least two is oppositely arranged, the metal forming ring that two are oppositely arranged lays respectively at track
The first surface of road plate and second surface and set around corresponding plug connector through hole contacting with the hole rib of this through hole
Put.
First surface and the second surface of printed substrate are oppositely arranged, and plug connector through hole runs through printed substrate
First surface and second surface, the first surface generally arranging printed substrate is front surface, also for grafting
The end face of part through hole, the second surface of printed substrate is anti-surface, is also the bottom surface of plug connector through hole.?
In the present embodiment, at least one plug connector through hole, preferably in end face and the bottom surface difference of plug connector through hole
Deposit metal forming ring, and the metal forming ring of through hole end face contacts with the top-portion apertures rib of plug connector through hole, with
And the metal forming ring of through hole bottom surface contacts with the base apertures rib of plug connector through hole.Thus can effectively ensure to insert
Fitting has access in the circuit of printed substrate.
Exemplary, on the basis of technique scheme, formation solder can be selected on the surface of metal forming ring
Including: on the surface of at least one metal forming ring being positioned at first surface, form solder；And/or, in place
Solder is formed on the surface of at least one metal forming ring of second surface.
If as it has been described above, deposition has at least one metal forming ring, the most in place on printed substrate only first surface
Solder is formed on the metal forming ring of first surface；If deposition has at least one on printed substrate only second surface
Individual metal forming ring, then form solder on the metal forming ring be positioned at second surface；If the first of printed substrate
On surface and second surface, all deposition has at least one metal forming ring, then preferably at printed wire during formation solder
Solder is formed, the most again on the anti-surface of printed substrate on the metal forming ring of the i.e. first surface of the front surface of plate
I.e. form solder on the metal forming ring of second surface.
Exemplary, on the basis of technique scheme, before optional fusion welding, also include: in print
Mount at least one Surface Mount part on the first surface of brush wiring board and the pin of Surface Mount part is placed with is being printed with weldering
In the Surface Mount part pad of material.
Generally including Surface Mount part and plug connector on known printed substrate, at this, preferred first surface is track
The front surface of road plate, then be mounted on the first surface of printed substrate by Surface Mount part.The first of printed substrate
On surface, the most corresponding Surface Mount part is provided with the Surface Mount part pad being printed with solder, and this pad is formed at printed wire
The relevant position of plate circuit patterns, then the pin of Surface Mount part is placed with on Surface Mount part pad.On Surface Mount part pad
Optional and on metal forming ring the solder forming process of solder identical and preferred solder fusing point is identical, then melt
During the solder of printed substrate, the solder on the solder of Surface Mount part pad and metal forming ring can melt simultaneously, has
Welding temperature is controlled and the simple advantage of welding process.
Exemplary, on the basis of technique scheme, optional employing solder reflow techniques fusion welding is with weldering
Connect plug connector and the Surface Mount part of printed substrate.
As it has been described above, Surface Mount part is mounted on the first surface of printed substrate and its pin is placed with and welds at Surface Mount part
On dish, and on the first surface of printed substrate, also it is pasted with plug connector, and the pin of plug connector is through inserting
Fitting through hole.Utilize solder reflow device that plug connector and the Surface Mount part of printed substrate are welded at this, tool
Body ground, air or nitrogen are heated to sufficiently high temperature after-blow to having pasted by the heater circuit of solder reflow device
Good plug connector and the printed substrate of Surface Mount part, then after the melt solder on plug connector through hole with printed substrate
Bond with by after plug connector welding melt solder on a printed-wiring board and on Surface Mount part pad with printing
Wiring board bonding is to weld Surface Mount part on a printed-wiring board.
Preferably employing the advantage that solder reflow techniques carries out welding to be at this, welding temperature is easily controllable and welding
During be also avoided that printed substrate and components and parts oxidation, manufacturing cost be also easier to control；Secondly, print
Generally include Surface Mount part and plug connector on brush wiring board, then printed substrate can pass through a reflow solder technique
The plug connector on printed substrate and the welding of Surface Mount part can be completed simultaneously.
In the technology of technique scheme, the embodiment of the present invention also provides for a kind of printed substrate, this printing
Being provided with plug connector on wiring board, this printed substrate uses the printed wire as described in above-mentioned any embodiment
Board fabrication method manufactures.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.Those skilled in the art
It will be appreciated that the invention is not restricted to specific embodiment described here, can enter for a person skilled in the art
Row various obvious changes, readjust and substitute without departing from protection scope of the present invention.Therefore, though
So by above example, the present invention is described in further detail, but the present invention be not limited only to
Upper embodiment, without departing from the inventive concept, it is also possible to include other Equivalent embodiments more,
And the scope of the present invention is determined by scope of the appended claims.
Claims (9)
1. the manufacture method of a printed substrate, it is characterised in that including:
Depositing at least one metal forming ring, wherein, described metal forming ring is positioned at the first of described printed substrate
Surface or second surface and around corresponding plug connector through hole and contact setting with the hole rib of this plug connector through hole；
The surface of described metal forming ring is formed solder；
The first surface of described printed substrate is installed at least one plug connector drawing described plug connector
Foot is through corresponding plug connector through hole；
Melted described solder is to weld the plug connector of described printed substrate.
Manufacture method the most according to claim 1, it is characterised in that described metal forming ring is Copper Foil
Ring.
Manufacture method the most according to claim 1, it is characterised in that at least one gold of described deposition
Belong to paper tinsel ring to include:
The metal forming ring that deposition at least two is oppositely arranged, the metal forming ring that said two is oppositely arranged position respectively
In the first surface of described printed substrate and second surface and around corresponding plug connector through hole and with this through hole
The contact of hole rib arrange.
Manufacture method the most according to claim 1, it is characterised in that at the table of described metal forming ring
Form solder on face to include:
The surface of at least one metal forming ring being positioned at described first surface is formed solder；And/or,
The surface of at least one metal forming ring being positioned at described second surface is formed solder.
Manufacture method the most according to claim 1, it is characterised in that described solder is tin cream.
Manufacture method the most according to claim 1, it is characterised in that use solder reflow techniques to melt
Described solder is to weld the plug connector of described printed substrate.
Manufacture method the most according to claim 1, it is characterised in that before melted described solder,
Also include:
The first surface of described printed substrate mounts at least one Surface Mount part drawing described Surface Mount part
Hem facing is placed in the Surface Mount part pad being printed with solder.
Manufacture method the most according to claim 7, it is characterised in that use solder reflow techniques to melt
Described solder is to weld plug connector and the Surface Mount part of described printed substrate.
9. a printed substrate, it is characterised in that be provided with plug connector on this printed substrate, this print
Brush wiring board uses the manufacture method manufacture as described in any one of claim 1-8.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610191627.9A CN105848426A (en) | 2016-03-30 | 2016-03-30 | Printed circuit board and manufacturing method thereof |
| PCT/CN2016/097021 WO2017166656A1 (en) | 2016-03-30 | 2016-08-26 | Printed circuit board and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610191627.9A CN105848426A (en) | 2016-03-30 | 2016-03-30 | Printed circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN105848426A true CN105848426A (en) | 2016-08-10 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610191627.9A Pending CN105848426A (en) | 2016-03-30 | 2016-03-30 | Printed circuit board and manufacturing method thereof |
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| CN (1) | CN105848426A (en) |
| WO (1) | WO2017166656A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107148146A (en) * | 2017-05-05 | 2017-09-08 | 青岛海信宽带多媒体技术有限公司 | A kind of manufacture method of optical module and optical module |
| WO2017166656A1 (en) * | 2016-03-30 | 2017-10-05 | 乐视控股（北京）有限公司 | Printed circuit board and manufacturing method therefor |
| CN109890134A (en) * | 2019-02-11 | 2019-06-14 | 武汉电信器件有限公司 | A kind of flexible circuit board |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315152A (en) * | 2019-11-27 | 2020-06-19 | 浪潮商用机器有限公司 | Welding method of PIH (plasma enhanced H) element |
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| JP2000040873A (en) * | 1998-07-22 | 2000-02-08 | Fujitsu Ten Ltd | Soldering method |
| CN1738525A (en) * | 2004-08-19 | 2006-02-22 | 英业达股份有限公司 | surface mount structure |
| CN203181471U (en) * | 2013-03-26 | 2013-09-04 | 天津市科易电子科技有限公司 | A single-sided PCB board plug-in structure |
| CN205005361U (en) * | 2015-07-21 | 2016-01-27 | 深圳市辰驹电子科技有限公司 | Formula of cuting straightly electronic components and converts vertical chip component adapter into |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4848219B2 (en) * | 2006-07-27 | 2011-12-28 | 日本メクトロン株式会社 | Printed wiring board and manufacturing method thereof |
| JP4344753B2 (en) * | 2007-02-22 | 2009-10-14 | シークス株式会社 | Electronic component mounting method on circuit board |
| CN201491380U (en) * | 2009-09-01 | 2010-05-26 | 深圳和而泰智能控制股份有限公司 | Post-welding pad |
| CN105848426A (en) * | 2016-03-30 | 2016-08-10 | 乐视控股（北京）有限公司 | Printed circuit board and manufacturing method thereof |
-
2016
- 2016-03-30 CN CN201610191627.9A patent/CN105848426A/en active Pending
- 2016-08-26 WO PCT/CN2016/097021 patent/WO2017166656A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000040873A (en) * | 1998-07-22 | 2000-02-08 | Fujitsu Ten Ltd | Soldering method |
| CN1738525A (en) * | 2004-08-19 | 2006-02-22 | 英业达股份有限公司 | surface mount structure |
| CN203181471U (en) * | 2013-03-26 | 2013-09-04 | 天津市科易电子科技有限公司 | A single-sided PCB board plug-in structure |
| CN205005361U (en) * | 2015-07-21 | 2016-01-27 | 深圳市辰驹电子科技有限公司 | Formula of cuting straightly electronic components and converts vertical chip component adapter into |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017166656A1 (en) * | 2016-03-30 | 2017-10-05 | 乐视控股（北京）有限公司 | Printed circuit board and manufacturing method therefor |
| CN107148146A (en) * | 2017-05-05 | 2017-09-08 | 青岛海信宽带多媒体技术有限公司 | A kind of manufacture method of optical module and optical module |
| CN109890134A (en) * | 2019-02-11 | 2019-06-14 | 武汉电信器件有限公司 | A kind of flexible circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017166656A1 (en) | 2017-10-05 |
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