CN105788469A - Monochromatic LED composite panel display module and manufacturing method thereof - Google Patents
Monochromatic LED composite panel display module and manufacturing method thereof Download PDFInfo
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- CN105788469A CN105788469A CN201410816681.9A CN201410816681A CN105788469A CN 105788469 A CN105788469 A CN 105788469A CN 201410816681 A CN201410816681 A CN 201410816681A CN 105788469 A CN105788469 A CN 105788469A
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Abstract
The invention relates to a monochromatic LED composite panel display module and a manufacturing method thereof. The method comprises the following steps: manufacturing an eutectic electrode on a monochromatic LED epitaxial substrate, wherein the monochromatic LED epitaxial substrate comprises an epitaxial substrate main body and monochromatic LEDs which achieve epitaxial growth on the epitaxial substrate main body, the various monochromatic LEDs are separated by virtue of wafer cutting grooves, and SiO2 is filled in each of the wafer cutting grooves; manufacturing a metallic electronic line; communicating the metallic electronic line with the eutectic electrode; grinding and thinning the base of the monochromatic LED epitaxial substrate; making the base side of the thinned monochromatic LED epitaxial substrate attached to a transparent panel, and conducting edge cutting in accordance with required dimensions; manufacturing a control circuit on the metallic electronic line; and installing integrated circuit discrete components, wherein the integrated circuit discrete components are used for providing control signals by which each of the monochromatic LEDs is controlled to work through the control circuit.
Description
Technical field
The present invention relates to semiconductor applications, particularly relate to a kind of monochromatic LED composite panel display module and manufacture method thereof.
Background technology
Semiconductor display production development is to today, and the supporting or resource of intersection industry has greatly been enriched and perfect.
But has there is bottleneck in high density field in traditional LED Display Technique.Because being limited by the traditional structure of LED light source, the material structure involved by module of integrated processing after being simultaneously limited by, the driving capacity of such as traditional constant-current source encapsulation and structure, the thermally labile sex chromosome mosaicism of the integrated finished product that the loose material of traditional FR4PCB plate is brought and flatness strength problem, and for install be spliced into giant-screen required for injection moulding face shield and mould shell etc., all seriously limit the breakthrough in high density field of the LED Display Technique and application.
Summary of the invention
In view of this, the invention provides a kind of monochromatic LED composite panel display module and manufacture method thereof, described method technique is simple, be suitable to large-scale production and application, the monochromatic LED composite panel display module prepared, display effect and concordance are good, it is possible to meet the needs that LED Display Technique is applied in high density field.
First aspect, the invention provides the manufacture method of a kind of monochromatic LED composite panel display module, including:
Compound monochromatic LED epitaxial substrate prepares eutectic electrode；Described compound monochromatic LED epitaxial substrate includes epitaxial substrate and builds the monochromatic LED of crystals growth in epitaxial substrate；Isolated by wafer cutting groove between the plurality of monochromatic LED, in described wafer cutting groove, be filled with SiO2；
Preparation metallization electronic circuit；Described metallization electronic circuit is connected with described eutectic electrode；
The substrate of described compound monochromatic LED epitaxial substrate is ground thinning；
By the substrate side of the compound monochromatic LED epitaxial substrate after thinning and transparent panel laminating, and carry out edge cuts according to required size；
Described metallization electronic circuit makes control circuit；
Integrated circuit discrete device is installed；Described integrated circuit discrete device is used for providing control signal, is controlled the work of each described monochromatic LED by described control circuit.
Preferably, described monochromatic LED includes: substrate, N-type epitaxy layer and P type epitaxial layer；
One electrode of described eutectic electrode is connected with described substrate, and another electrode is connected with described p-shaped epitaxial layer.
Preferably, described preparation metallization electronic circuit specifically includes:
Deposit the first conductive metal layer；
Described first conductive metal layer is patterned etching, forms the first electronic circuit layer；
Deposit the first insulating barrier；
Described first insulating barrier is performed etching；
Deposit the second conductive metal layer；
Described second conductive metal layer is patterned etching, forms the second electronic circuit layer；
Deposit the second insulating barrier；
Patterned area etches described second insulating barrier and the first insulating barrier, in described patterned area, exposes described first conductive metal layer and the second conductive metal layer respectively；
Deposit metal forms signal terminal and ball-like pins grid array BGA pad；
Graphical deposit the 3rd insulating barrier；
Described signal terminal and described BGA pad deposit AuSn, forms Eutectic Layer.
Preferably, described integrated circuit discrete device specifically includes:
Application-specific integrated circuit ASIC or on-site programmable gate array FPGA.
Preferably, described method also includes,
Aluminum matter or ceramic heat-dissipating support is mounted in described discrete device side.
Preferably, described method also includes:
Described display module is carried out electrical testing.
Preferably, described method also includes:
Described display module is carried out optic test.
Second aspect, embodiments provides monochromatic LED composite panel display module prepared by a kind of method applied described in above-mentioned first aspect.
The manufacture method of monochromatic LED composite panel provided by the invention display module, technique is simple, is suitable to large-scale production and application, the monochromatic LED composite panel display module prepared, display effect and concordance are good, it is possible to meet the needs that LED Display Technique is applied in high density field.
Accompanying drawing explanation
The manufacture method flow chart of the monochromatic LED composite panel display module that Fig. 1 provides for the embodiment of the present invention；
One of preparation process schematic diagram of monochromatic LED composite panel display module that Fig. 2 provides for the embodiment of the present invention；
The two of the preparation process schematic diagram of the monochromatic LED composite panel display module that Fig. 3 provides for the embodiment of the present invention；
The three of the preparation process schematic diagram of the monochromatic LED composite panel display module that Fig. 4 provides for the embodiment of the present invention；
The four of the preparation process schematic diagram of the monochromatic LED composite panel display module that Fig. 5 provides for the embodiment of the present invention；
The five of the preparation process schematic diagram of the monochromatic LED composite panel display module that Fig. 6 provides for the embodiment of the present invention；
The six of the preparation process schematic diagram of the monochromatic LED composite panel display module that Fig. 7 provides for the embodiment of the present invention；
The seven of the preparation process schematic diagram of the monochromatic LED composite panel display module that Fig. 8 provides for the embodiment of the present invention；
The eight of the preparation process schematic diagram of the monochromatic LED composite panel display module that Fig. 9 provides for the embodiment of the present invention；
The nine of the preparation process schematic diagram of the monochromatic LED composite panel display module that Figure 10 provides for the embodiment of the present invention；
The ten of the preparation process schematic diagram of the monochromatic LED composite panel display module that Figure 11 provides for the embodiment of the present invention；
The 11 of the preparation process schematic diagram of the monochromatic LED composite panel display module that Figure 12 provides for the embodiment of the present invention；
The 12 of the preparation process schematic diagram of the monochromatic LED composite panel display module that Figure 13 provides for the embodiment of the present invention；
The 13 of the preparation process schematic diagram of the monochromatic LED composite panel display module that Figure 14 provides for the embodiment of the present invention；
The schematic diagram of the monochromatic LED composite panel display module that Figure 15 provides for the embodiment of the present invention.
Below by drawings and Examples, technical scheme is described in further detail.
Detailed description of the invention
The monochromatic LED composite panel display module of the present invention and manufacture method thereof, be mainly used in LED display, Ultra fine pitch LED display, VHD LED display, the just luminous TV of LED, the just luminous monitor of LED, LED video wall, the display floater manufacture in the fields such as LED indicates, LED special lighting.
The manufacture method flow chart of the monochromatic LED composite panel display module that Fig. 1 provides for the embodiment of the present invention.Fig. 2-Figure 14 is the preparation process schematic diagram of the monochromatic LED composite panel display module of the embodiment of the present invention, the manufacture method of the present invention is illustrated with Fig. 1 and in conjunction with Fig. 2-Figure 14 below.
The manufacture method of the monochromatic LED composite panel display module that the embodiment of the present invention provides comprises the steps:
Step 110, prepares eutectic electrode in compound monochromatic LED epitaxial substrate；
Concrete, as in figure 2 it is shown, the described compound monochromatic LED epitaxial substrate that the present embodiment adopts includes epitaxial substrate (being labeled as substrate in figure) and builds the monochromatic LED of crystals growth in epitaxial substrate；Isolated by wafer cutting groove between the plurality of monochromatic LED, in described wafer cutting groove, be filled with SiO2；
Monochromatic LED can be any one in the most frequently used red LED, green LED or blue led, it is also possible to be other monochromatic LEDs.LED can prepare in a manufacturing process, and each LED wafer includes anelectrode and negative electrode (in figure PAD), receives LED drive signal by electrode.
Step 120, preparation metallization electronic circuit；
Concrete, described metallization electronic circuit is connected with described eutectic electrode.
The process of preparation metallization electronic circuit, specifically can in conjunction with Fig. 3-Figure 13, and in conjunction with described in following steps:
Step 120-1, deposits the first conductive metal layer；
Concrete, as shown in Figure 3.First conductive metal layer can be the illuvium of AL or other metals.
The deposition process adopted is preferably physical vapor deposition (PhysicalVaporDeposition, PVD).
Step 120-2, is patterned etching to described first conductive metal layer, forms the first electronic circuit layer；
Concrete, as shown in Figure 4.After etching, the first electronic circuit layer of formation is connected with P type epitaxial region.
Step 120-3, deposits the first insulating barrier；
Concrete, as it is shown in figure 5, the first insulating barrier can adopt PVD mode to deposit, its medium can be SiO2Deng dielectric.First insulating barrier is for isolating the second conductive metal layer of the first conductive metal layer and follow-up making.
Step 120-4, performs etching described first insulating barrier；
Concrete, as shown in Figure 6.The first insulating barrier after etching, covers on the first conductive metal layer, exposes the electrode zone connecting substrate simultaneously.
Step 120-5, deposits the second conductive metal layer；
Concrete, as shown in Figure 7.Second conductive metal layer can be the illuvium of AL or other metals.
The deposition process adopted is preferably PVD.
Step 120-6, is patterned etching to described second conductive metal layer, forms the second electronic circuit layer；
Concrete, as shown in Figure 8, after etching, the second electronic circuit layer of formation is connected with substrate.
Step 120-7, deposits the second insulating barrier；
Concrete, as it is shown in figure 9, the second insulating barrier can also adopt PVD mode to deposit, its medium can be SiO2Deng dielectric.Second insulating barrier is for isolating the second conductive metal layer and the signal terminal etc. of follow-up making.
Step 120-8, patterned area etches described second insulating barrier and the first insulating barrier, in described patterned area, exposes described first conductive metal layer and the second conductive metal layer respectively；
Concrete, as shown in Figure 10.
Step 120-9, deposit metal forms signal terminal and ball-like pins grid array (BallGridArray, BGA) pad；
Concrete, as shown in figure 11.Deposit metal, in the patterned area that upper step prepares, forms signal terminal and BGA pad, and forms the control circuit of relevant connection in-between.
Step 120-10, graphical deposit the 3rd insulating barrier；
Concrete, as shown in figure 12, the 3rd insulating barrier can also adopt PVD mode to deposit, and its medium can be SiO2Deng dielectric.
Step 120-11, deposits AuSn on described signal terminal and described BGA pad, forms Eutectic Layer.
Concrete, as shown in figure 13, signal terminal and BGA pad deposit Eutectic Layer AuSn, it is possible to better realize and realize between follow-up control circuit and integrated circuit discrete device electrically connecting and signal transmission.
Each conductive metal layer above-mentioned is for driving the transmission of signal, and insulating barrier is for the isolation between different conductive metal layers.
Step 130, is ground thinning to the substrate of described compound monochromatic LED epitaxial substrate；
Concrete, substrate grinds thinning thickness, shows that monochromatic LED is specially the LED of which kind of color and determines, and to the LED not shared the same light, thickness thinning differs.Such as if red LED, then to require to be thinned to substrate very thin for thickness thinning, and if green or blue led, and the substrate thickness after thinning can relatively thickness be a bit.
Step 140, by the substrate side of the compound monochromatic LED epitaxial substrate after thinning and transparent panel laminating, and carries out edge cuts according to required size；
Concrete, transparent panel can be glass material or organic material etc..It is preferably shaped to consistent with the disk shape of compound monochromatic LED epitaxial substrate.Namely as shown in figure 14.By after the substrate side of the compound monochromatic LED epitaxial substrate after thinning and transparent panel laminating, carry out edge cuts according to required size.Generally it is cut into as broad as long square, or length-width ratio by a certain percentage is cut into rectangle.
Step 150, makes control circuit on described metallization electronic circuit；
Concrete, this control circuit is used for being connected with follow-up need integrated circuit discrete device to be mounted or other peripheral components, transmission of control signals.
Such as, being specifically as follows data cascade terminal, external circuit can pass through data cascade terminal and drive signal to the transmission of each monochromatic LED wafer.
Step 160, installs integrated circuit discrete device；
Concrete, integrated circuit discrete device is used for providing control signal, controls the work of LED wafer.Integrated circuit discrete device can be specially special IC (ASIC) or field programmable gate array (FPGA) etc. and control device.
Preferably, described method also includes,
Aluminum matter or ceramic heat-dissipating support is mounted, for compound monochromatic LED epitaxial substrate and integrated circuit discrete device are dispelled the heat in described discrete device side.The concrete structure of radiator structure, it is possible to design according to actual needs.
To monochromatic LED composite panel, step 170, shows that module carries out electrical testing；
Concrete, after obtaining monochromatic LED composite panel display module, this display module is cleaned, dry, then carries out electrical testing, to ensure its electric property, and the electric property after assembling with ASIC or FPGA.
To described monochromatic LED composite panel, step 180, shows that module carries out optic test, in order to detect its optical property.
The manufacture method of the monochromatic LED composite panel display module that the embodiment of the present invention provides, technique is simple, is suitable to large-scale production and application, and the display module prepared, display effect and concordance are good, it is possible to meet the needs that LED Display Technique is applied in high density field.
Accordingly, the embodiment of the present invention additionally provides a kind of monochromatic LED composite panel utilized prepared by said method display module.As shown in figure 15, described display module includes: monochromatic LED composite panel display module 1510, aluminum matter or ceramic heat-dissipating support 1520 and discrete device 1530.
Display module at the present embodiment can splice by fabric width ratio in any desired, thus meeting different display needs.
The monochromatic LED composite panel display module of the present invention, manufacturing process is simple, and cost is low, it is possible to carry out full-color display, has good display effect.
Above-described detailed description of the invention; the purpose of the present invention, technical scheme and beneficial effect have been further described; it is it should be understood that; the foregoing is only the specific embodiment of the present invention; the protection domain being not intended to limit the present invention; all within the spirit and principles in the present invention, any amendment of making, equivalent replacement, improvement etc., should be included within protection scope of the present invention.
Claims (8)
1. the manufacture method of a monochromatic LED composite panel display module, it is characterised in that described method includes:
Compound monochromatic LED epitaxial substrate prepares eutectic electrode；Described compound monochromatic LED epitaxial substrate includes epitaxial substrate and builds the monochromatic LED of crystals growth in epitaxial substrate；Isolated by wafer cutting groove between the plurality of monochromatic LED, in described wafer cutting groove, be filled with SiO2；
Preparation metallization electronic circuit；Described metallization electronic circuit is connected with described eutectic electrode；
The substrate of described compound monochromatic LED epitaxial substrate is ground thinning；
By the substrate side of the compound monochromatic LED epitaxial substrate after thinning and transparent panel laminating, and carry out edge cuts according to required size；
Described metallization electronic circuit makes control circuit；
Integrated circuit discrete device is installed；Described integrated circuit discrete device is used for providing control signal, is controlled the work of each described monochromatic LED by described control circuit.
2. method according to claim 1, it is characterised in that described monochromatic LED includes: substrate, N-type epitaxy layer and P type epitaxial layer；
One electrode of described eutectic electrode is connected with described substrate, and another electrode is connected with described p-shaped epitaxial layer.
3. method according to claim 1, it is characterised in that described preparation metallization electronic circuit specifically includes:
Deposit the first conductive metal layer；
Described first conductive metal layer is patterned etching, forms the first electronic circuit layer；
Deposit the first insulating barrier；
Described first insulating barrier is performed etching；
Deposit the second conductive metal layer；
Described second conductive metal layer is patterned etching, forms the second electronic circuit layer；
Deposit the second insulating barrier；
Patterned area etches described second insulating barrier and the first insulating barrier, in described patterned area, exposes described first conductive metal layer and the second conductive metal layer respectively；
Deposit metal forms signal terminal and ball-like pins grid array BGA pad；
Graphical deposit the 3rd insulating barrier；
Described signal terminal and described BGA pad deposit AuSn, forms Eutectic Layer.
4. method according to claim 1, it is characterised in that described integrated circuit discrete device specifically includes:
Application-specific integrated circuit ASIC or on-site programmable gate array FPGA.
5. method according to claim 1, it is characterised in that described method also includes,
Aluminum matter or ceramic heat-dissipating support is mounted in described discrete device side.
6. method according to claim 1, it is characterised in that described method also includes:
Described display module is carried out electrical testing.
7. method according to claim 1, it is characterised in that described method also includes:
Described display module is carried out optic test.
8. apply monochromatic LED composite panel display module prepared by the arbitrary described method of the claims 1-7 for one kind.
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Cited By (2)
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| CN109427864A (en) * | 2017-08-28 | 2019-03-05 | 三星显示有限公司 | The method of the resistance of display device and measurement display device |
| CN112259006A (en) * | 2020-10-29 | 2021-01-22 | 厦门天马微电子有限公司 | A display panel and display device |
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| CN203799604U (en) * | 2014-04-15 | 2014-08-27 | 周鸣波 | LED display unit module with enhanced heat dissipation performance |
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| CN109427864A (en) * | 2017-08-28 | 2019-03-05 | 三星显示有限公司 | The method of the resistance of display device and measurement display device |
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| CN112259006A (en) * | 2020-10-29 | 2021-01-22 | 厦门天马微电子有限公司 | A display panel and display device |
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