CN105739245A - Anti-collision device and method for immersion unit of immersion lithography machine - Google Patents
Anti-collision device and method for immersion unit of immersion lithography machine Download PDFInfo
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- CN105739245A CN105739245A CN201410758603.8A CN201410758603A CN105739245A CN 105739245 A CN105739245 A CN 105739245A CN 201410758603 A CN201410758603 A CN 201410758603A CN 105739245 A CN105739245 A CN 105739245A
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- submergence unit
- sensor
- wafer stage
- silicon wafer
- immersion
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- 238000007654 immersion Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 10
- 238000000671 immersion lithography Methods 0.000 title abstract description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 53
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 53
- 239000010703 silicon Substances 0.000 claims abstract description 53
- 230000003287 optical effect Effects 0.000 claims abstract description 16
- 238000005259 measurement Methods 0.000 claims abstract description 8
- 238000001514 detection method Methods 0.000 claims description 12
- 230000002265 prevention Effects 0.000 claims description 11
- 230000001133 acceleration Effects 0.000 claims description 8
- 239000000523 sample Substances 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 27
- 239000007788 liquid Substances 0.000 description 18
- 239000012530 fluid Substances 0.000 description 16
- 239000007789 gas Substances 0.000 description 14
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 238000001459 lithography Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 1
- 230000000386 athletic effect Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052756 noble gas Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses an anti-collision device for an immersion unit of an immersion lithography machine. The anti-collision device is used for preventing the immersion unit from colliding with a silicon wafer stage. The anti-collision device is characterized by comprising sensors, a measurement device, a controller and drivers, wherein relative positions of the sensors and the immersion unit are kept fixed; the sensors send out an electromagnetic beam along the optical axis of the immersion lithography machine to measure the distance or the speeds or the accelerated speeds of the immersion unit and the silicon wafer stage; the measurement device is used for converting an electric signal measured by the sensors into a digital signal; the controller is used for receiving the digital signal, judging whether a collision risk exists in the relative positions or speeds of the immersion unit and the silicon wafer stage or not and sending out a corresponding control command; and the drivers are used for driving the immersion unit according to the control command sent out by the controller.
Description
Technical field
The present invention relates to a kind of integrated circuit equipment manufacturing field, particularly relate to a kind of immersion lithographic machine submergence unit collision prevention device and method.
Background technology
Litho machine is one of Core equipment manufacturing super large-scale integration, and modern lithographic machine is based on optical lithography, and it utilizes optical system the figure on mask plate is accurately projected and is exposed on the silicon chip of coated photoresist.It includes a LASER Light Source, optical system, one piece of projection mask being made up of graphics chip, one to Barebone and a silicon chip scribbling photosensitive photoresist.
Liquid immersion lithography (ImmersionLithography) equipment is by the end filling the liquid of certain high index of refraction between a piece of projection objective and silicon chip, relative to the dry lithography machine that intermediate medium is gas, improve the numerical aperture (NA) of projection objective, thus improve resolution and the depth of focus of lithographic equipment.In the Next Generation Lithographies machine having pointed out, existing equipment is changed minimum by liquid immersion lithography, and present dry lithography facility are had good inheritance.Substrate or substrate and base station can be immersed in immersion bath.The example of a this layout disclosed in United States Patent (USP) NO.4509852, is incorporated herein by reference this full patent texts at this.Immersion liquid can be provided by liquid-supplying system between the regional area of substrate and last element and substrate of optical projection system, and generally this substrate has the surface region bigger than last element of optical projection system.The example of a this layout disclosed in international application No.99/49504, is hereby incorporated by reference the document at this.Provide the liquid in substrate by least one entrance, it is preferable that provide relative to the moving direction of last element of optical projection system along substrate, and remove liquid by least one outlet being connected with low pressure source.Various orientations and the quantity of the entrance and exit positioned around last component ambient are all possible.Additionally, liquid-supplying system can have potted component, it extends along at least some of of border in the space between last element and base station of optical projection system.This potted component is generally static relative to optical projection system in the xy plane, but can have some relative movements in Z-direction (optical axis direction of optical projection system).Formed between potted component and substrate surface and seal.Preferably, this sealing is non-contact seals, and such as hermetic seal, it can be further used as a gas bearing.
At present frequently with scheme be local immersion method, be limited in the regional area above silicon chip and between the lower surface of last a piece of projection objective by liquid, and remain stable for the flowing of continuous print liquid.In stepping-scan-type lithographic equipment, silicon chip carries out scanning motion at a high speed in exposure process, and the liquid in exposure area is taken away flow field by this athletic meeting, thus causing leakage, the liquid of leakage can form water mark on a photoresist, affects exposure quality.Therefore, in immersion lithography, necessary emphasis solves the sealing problem of gap flow field.
In current existing solution, patent US6954256B2 discloses the use of hermetic seal, and Dry-gas Sealing Technology is to surround on the periphery filling flow field, forms annular air curtain by applying gases at high pressure, is limited to filling liquid in certain border circular areas.
Existing hermetic adopts air curtain to be applied to around fill fluid, but for ensureing that silicon wafer stage does not occur immersion liquid to leak under high speed horizontal movement, require submergence unit and object lens, the distance of silicon wafer stage or silicon chip is very near, wherein require that the distance between submergence unit and silicon wafer stage or silicon chip is for less than 200um, and silicon wafer stage is provided with miscellaneous part, cause that silicon wafer stage surface exists the fluctuating pattern of 0-160um, and silicon wafer stage is moving component, its catenary motion stroke is ± 0.5mm, there are submergence unit and object lens, silicon wafer stage or silicon chip collide and affect lithography performance, damage the risk of lithographic equipment.
In European patent application EP03257072.3, disclose a kind of double; two or two platform immersion lithography apparatus, at this, document is hereby incorporated by reference.This device has two platforms supporting substrate.Carry out with a platform in primary importance, measure, do not use immersion liquid, and the second position providing immersion liquid wherein uses a platform to be exposed.Utilizing as discussed above in the enforcement of known lithographic apparatus of submergence, provide immersion liquid, liquid-supplying system opposed substrate or base station motion by gas bearing, gas bearing can provide air-flow in the gap between liquid-supplying system and substrate or base station.Effectively, liquid-supplying system may remain on this gas blanket flowed in gap.By utilizing this gas bearing, owing to gas bearing generally can provide minimum spacing between liquid-supplying system and substrate or base station, certain safety therefore can be obtained.Additionally, in order to avoid substrate surface with around the difference in height between the surface of the base station around portion of substrate, it is possible to implement a selection mechanism is to select the thickness of substrate.When the thickness that substrate has excessive or too small time will not be allowed to enter lithographic equipment because when liquid-supplying system through substrate to substrate time, this will make liquid-supplying system strike substrate and base station.At substrate surface with when reaching the clearance height between substrate and base station and liquid-supplying system around the difference in height between the base station surface of substrate or be bigger, it is possible to this collision occurs.
Generation in order to avoid this collision, the damage disclosing a kind of lithographic equipment at patent CN1892435B controls system, this system includes computer, and it for calculating the size quantity in the gap between fluid feed system and the base station keeping substrate from the position quantity of base station and the position quantity of fluid feed system.When size quantity exceedes predetermined level of security, described damage control system can produce alarm signal.But this position quantity of detection base station and the position quantity of fluid feed system control the distance between liquid-supplying system and base station, and time response is longer, the travelling speed of computer is required higher.
Summary of the invention
In order to overcome the defect existed in prior art, the present invention provides a kind of and detects the apparatus and method of the relative position of base station and fluid feed system in modern lithographic device, by the relative position of direct detection base station Yu fluid feed system, prevent base station fluid feed system from colliding.
In order to realize foregoing invention purpose, disclosure one immersion lithographic machine submergence unit collision prevention device, for preventing submergence unit and silicon wafer stage from colliding, it is characterized in that, including: sensor, described sensor and described submergence unit keep relative position to fix, and described sensor launches an electromagnetic beam to measure the distance of described submergence unit and silicon wafer stage or speed or acceleration along the optical axis of described immersion lithographic machine；Measurement apparatus, converts the signal of telecommunication that described sensor measurement obtains to digital signal；Controller, is used for receiving described digital signal, it is judged that whether relative position or the speed of described submergence unit and silicon wafer stage exist risk of collision, and send corresponding control command；Driver, drives described submergence unit according to the control command that described controller sends.
Further, this sensor is positioned on four summits of the bottom surface of this submergence unit or the line in summit and the center of circle.
Further, this sensor is laser displacement sensor, or microwave detector, ultrasonic detector, capacitance probe.
Further, the quantity of this sensor is at least three.
Further, the least significant end of this sensor flushes with this submergence unit lowermost end.
Present invention simultaneously discloses a kind of immersion lithographic machine submergence unit collision-proof method, it is characterized in that, including: utilizing a sensor and this submergence unit to keep relative position to fix, this sensor launches an electromagnetic beam to measure the distance of this submergence unit and silicon wafer stage or speed or acceleration along the optical axis of this immersion lithographic machine；This submergence unit of driver drives is controlled for the detection data according to this sensor.
Compared with prior art, the present invention has abandoned and has introduced the 3rd reference coordinate in prior art to calculate the technological means of base station and the relative position of fluid feed system, by the relative position of direct detection base station Yu fluid feed system, prevent base station fluid feed system from colliding.Calculate the relative position response speed of base station and fluid feed system faster compared to the 3rd reference coordinate of existing introducing, the block of existing patent can be broken simultaneously.
Accompanying drawing explanation
Can be described in detail by invention below about the advantages and spirit of the present invention and institute's accompanying drawings is further understood.
Fig. 1 is the structural representation of litho machine common in prior art；
Fig. 2 is air seal submergence cell schematics；
Fig. 3 is the structural representation of submergence unit collision prevention device involved in the present invention；
Fig. 4 is the detection method schematic diagram of base station and the relative position of fluid feed system；
Fig. 5 is sensor mounting location top view；
Fig. 6 is sensor mounting location front view.
Detailed description of the invention
Specific embodiments of the invention are described in detail below in conjunction with accompanying drawing.
It is an object of the invention to provide and a kind of detect the apparatus and method of the relative position of base station and fluid feed system in modern lithographic device, by the relative position of direct detection base station Yu fluid feed system, prevent base station fluid feed system from colliding.
Fig. 1 is the structural representation of litho machine, and it discloses an existing litho machine structure.In this litho machine, main frame supports illuminator 20, projection objective 10 and a silicon wafer stage 40, and silicon wafer stage 40 is placed with a silicon chip 50 scribbling light sensitive photoresist.Figure on mask 30 passes through illuminator 20 and projection objective 10, in the way of Imagewise exposure, transfers on the silicon chip 50 scribbling light sensitive photoresist, thus completing exposure.
Fig. 2 is the structural representation of air seal submergence unit, pipe 13 is carried by inlet/outlet, the liquid 11 with of a relatively high refractive index will be full of between projection objective PL and silicon wafer stage W, such as water. by being positioned under the last parts of projection arrangement PL or potted component 12 around forms storing apparatus, by forming air seal 16 between the surface of the bottom of potted component 12 and substrate W, liquid seal is maintained in device in submergence.This gas can be air or forming gas, but it is preferred that N2 or other noble gas.Gas passes under pressure through entrance 15 and provides the gap between potted component 12 and substrate, and by the first outlet 14 extraction.The geometry in the excess pressure at gas access 15 place, the first outlet vacuum level at 14 places and gap is set, thus providing the air-flow of inside two-forty to limit liquid.
Fig. 3 is submergence unit collision prevention device of the present invention, including sensor 305, is used for directly measuring the relative position of submergence unit 302 and silicon wafer stage 310 or speed or acceleration.In Fig. 3, immersion lithography apparatus includes object lens 301, immersion 303, be positioned at the silicon chip 304 on silicon wafer stage 310, sensor 305 is installed with on submergence unit 302, and sensor 305 is popped one's head in and issued radio magnetic along optical axis direction or laser comes the distance of direct detection silicon wafer stage or silicon chip and submergence unit or speed or acceleration.
Submergence unit collision prevention device farther includes a measurement apparatus 306, controller 308, driver 309 and executor M, and measurement apparatus 306 is for converting, by measuring the signal of telecommunication obtained, the digital signal that controller can accept to.Controller 308, for whether the relative position or speed judging submergence unit and silicon wafer stage exists risk of collision, and sends corresponding control command.Driver 309 and executor M, for performing the control command that controller sends, drive submergence unit 302 away from silicon wafer stage 310, it is prevented that the generation of collision.
Fig. 4 is the detection method schematic diagram of base station 310 and the relative position of fluid feed system, and the method essentially describes the detection mode of submergence unit 302 and the relative position of base station 310.It is tetragon that the submergence of this embodiment maintains face, device bottom.The motion of base station is easiest to cause the place of collision to be on the four edges of submergence unit, therefore to prevent base station and submergence unit from colliding, we have only to control the four edges of submergence unit and do not collide with base station in locus, sensor is arranged on the line in four summits or summit and the center of circle, by calculating the distance indirectly obtaining four summits with substrate.Detect four summits of submergence unit by sensor and calculate the border of submergence unit and the relative tertiary location signal of base station to the vertical dimension S1 of base station, S2, S3, S4.The relative tertiary location signal obtained is transferred to execution system and makes adjustment, thus avoiding the collision of submergence unit and base station.
The present embodiment adopts laser displacement sensor, and sensor probe issues radio magnetic along optical axis direction or laser comes direct detection silicon wafer stage or silicon chip and the relative position of submergence unit, speed, acceleration.Namely sensor end face goes out the probe employing right angle setting of light, and sensors sides goes out the probe employing level of light and installs.Sensor is not limited to laser displacement sensor, it is also possible to be microwave detector, ultrasonic detector, and capacitance probe etc. is capable of short distance detection and instrument that measurand is the silicon chip scribbling photoresist.The quantity of sensor is at least 3, and the number of vertices that its concrete number exists risk of collision according to submergence unit determines.
Fig. 5 is sensor mounting location top view, and this figure is the top view of lithographic equipment submergence unit, mainly comprises submergence unit 21, silicon wafer stage 40, object lens 10, silicon chip 50 and sensor 25 as shown in the figure.Silicon wafer stage 40 supporting silicon chip 50, distance silicon chip distance above is submergence unit 21, and submergence unit is centered around object lens and is formed around with closing structure.Sensor 25 is arranged on the outside of submergence unitary gas sealing area, and it is on the line at four summits and center, the proportionate relationship from submergence unit center according to sensor and submergence unit summit, calculate the distance obtaining four summits with substrate, i.e. the relative tertiary location of submergence unit and silicon wafer stage or silicon chip.When any one sensor detect the relative tertiary location of submergence unit and silicon wafer stage or silicon chip less than setting value or relative velocity, acceleration more than setting value time, controller sends control command to executor, this control command makes submergence unit be lifted up with maximal rate, namely moves to the direction away from silicon wafer stage.Control command can also is that cut-out submergence unit executor or silicon wafer stage executor's power supply, makes the stop motion at once of submergence unit or silicon wafer stage.
Fig. 6 is sensor mounting location front view, and this figure designates the particular location that sensor 25 is arranged on submergence unit on the basis of Fig. 2 air seal submergence cell schematics, and sensor lowermost end flushes with submergence unit lowermost end.When both lowermost ends are uneven at ordinary times, its difference in height will compensate in software as offset.
The preferred embodiment of the simply present invention described in this specification, above example is only in order to illustrate technical scheme but not limitation of the present invention.All those skilled in the art, all should be within the scope of the present invention under this invention's idea by the available technical scheme of logical analysis, reasoning, or a limited experiment.
Claims (6)
1. an immersion lithographic machine submergence unit collision prevention device, is used for preventing submergence unit and silicon wafer stage from colliding, it is characterised in that including:
Sensor, described sensor and described submergence unit keep relative position to fix, and described sensor launches an electromagnetic beam to measure the distance of described submergence unit and silicon wafer stage or speed or acceleration along the optical axis of described immersion lithographic machine；
Measurement apparatus, converts the signal of telecommunication that described sensor measurement obtains to digital signal；
Controller, is used for receiving described digital signal, it is judged that whether relative position or the speed of described submergence unit and silicon wafer stage exist risk of collision, and send corresponding control command；
Driver, drives described submergence unit according to the control command that described controller sends.
2. immersion lithographic machine submergence unit collision prevention device as claimed in claim 1, it is characterised in that described sensor is positioned on four summits of the bottom surface of described submergence unit or the line in summit and the center of circle.
3. immersion lithographic machine submergence unit collision prevention device as claimed in claim 1, it is characterised in that described sensor is laser displacement sensor, or microwave detector, ultrasonic detector, capacitance probe.
4. immersion lithographic machine submergence unit collision prevention device as claimed in claim 1, it is characterised in that the quantity of described sensor is at least three.
5. immersion lithographic machine submergence unit collision prevention device as claimed in claim 1, it is characterised in that the least significant end of described sensor flushes with described submergence unit lowermost end.
6. an immersion lithographic machine submergence unit collision-proof method, it is characterized in that, including: utilizing a sensor and described submergence unit to keep relative position to fix, described sensor launches an electromagnetic beam to measure the distance of described submergence unit and silicon wafer stage or speed or acceleration along the optical axis of described immersion lithographic machine；Submergence unit described in driver drives is controlled for the detection data according to described sensor.
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| CN201410758603.8A CN105739245B (en) | 2014-12-12 | 2014-12-12 | A kind of immersion lithographic machine submergence unit collision prevention device and method |
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| CN201410758603.8A CN105739245B (en) | 2014-12-12 | 2014-12-12 | A kind of immersion lithographic machine submergence unit collision prevention device and method |
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| CN105739245A true CN105739245A (en) | 2016-07-06 |
| CN105739245B CN105739245B (en) | 2018-12-14 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114690576A (en) * | 2020-12-31 | 2022-07-01 | 上海微电子装备（集团）股份有限公司 | Immersion lithography device with crash test function and crash test method |
| WO2024026952A1 (en) * | 2022-08-03 | 2024-02-08 | 北京华卓精科科技股份有限公司 | Motion table acceleration safety protection method, and apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1501173A (en) * | 2002-11-12 | 2004-06-02 | Asml荷兰有限公司 | Photolithography apparatus and device manufacturing method |
| CN1550905A (en) * | 2003-05-13 | 2004-12-01 | Asml荷兰有限公司 | Photolithography apparatus and device manufacturing method |
| CN1892435A (en) * | 2005-06-29 | 2007-01-10 | Asml荷兰有限公司 | Immersion Damage Control for Lithographic Apparatus |
| US7583357B2 (en) * | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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2014
- 2014-12-12 CN CN201410758603.8A patent/CN105739245B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1501173A (en) * | 2002-11-12 | 2004-06-02 | Asml荷兰有限公司 | Photolithography apparatus and device manufacturing method |
| CN1550905A (en) * | 2003-05-13 | 2004-12-01 | Asml荷兰有限公司 | Photolithography apparatus and device manufacturing method |
| US7583357B2 (en) * | 2004-11-12 | 2009-09-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| CN1892435A (en) * | 2005-06-29 | 2007-01-10 | Asml荷兰有限公司 | Immersion Damage Control for Lithographic Apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114690576A (en) * | 2020-12-31 | 2022-07-01 | 上海微电子装备（集团）股份有限公司 | Immersion lithography device with crash test function and crash test method |
| WO2024026952A1 (en) * | 2022-08-03 | 2024-02-08 | 北京华卓精科科技股份有限公司 | Motion table acceleration safety protection method, and apparatus |
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| CN105739245B (en) | 2018-12-14 |
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