CN105702670A - Lens type SMD packaging device - Google Patents

Abstract

The invention discloses a lens type SMD packaging device. The device comprises a bracket; at least two bonding pads are arranged at the inner bottom of the bracket; luminous chips are correspondingly arranged above the bonding pads; and baffle plates for isolating the bonding pads are arranged among the bonding pads. The bonding pads are mutually independent; the bonding pads are isolated by the baffle plates; the luminous angle and the optical curve of the light ray emitted by the luminous chip above each bonding pad are consistent and do not influence each other; a condition of optical crosstalk is avoided; the light ray overlap ratio is high; and the light color consistency is good. Packaging lenses are arranged above the luminous chips; the brightness of an LED device is improved greatly; the radians of the lenses can be adjusted according to different demands, thus adjusting the luminous angle and the luminous curve of the device; and therefore, the product satisfies market demands for high brightness, good light color consistency and energy saving.

Description

A lens type SMD packaging device

technical field

The invention belongs to the technical field of LED display, and in particular relates to a lens type SMD packaging device.

Background technique

Due to its advantages of high definition, stable quality, long life, and flexible display functions, LED display has become a high-tech display device that has been widely used in recent years. There will be considerable room for development in time. LED displays have high brightness, can be spliced and used, and have high efficiency and low consumption. They are widely used in large-area display, such as advertising, finance, exhibition, sports, transportation and other fields.

For outdoor occasions such as squares, large shopping malls, railways, and highways, outdoor LED displays are often used. Due to the complex outdoor environment, the display screens are required to be waterproof, dustproof, high temperature resistant, and lightning resistant. At present, in-line LED has good waterproof, anti-ultraviolet ability and good heat dissipation effect, and meets the requirements of outdoor LED display screens. However, it also has many defects, such as poor consistency, complicated manufacturing process, and low production efficiency. The installation process requires high requirements, and the in-line LED is bulky, which is not conducive to shortening the pixel pitch of the screen and limits the resolution of the display screen.

In order to solve the above technical problems, surface-mounted (SMD) LED devices have been gradually developed. Compared with traditional in-line LEDs, they have the advantages of small size, light weight, and fast signal processing speed, and SMD full-color devices have excellent color performance. There are many aspects such as reproduction, color consistency, viewing angle, overall picture effect and light and thin structure, which cannot be surpassed by direct plug-in lamps. Therefore, SMD full-color products are bound to become the mainstream development direction of display screens in the future. However, the light-emitting surface of the SMD-type LED display in the prior art is usually flat, and the light-emitting angle is single. Multiple chips are arranged at different positions on the internal pads, resulting in different light-emitting angles and light-emitting curves between the middle chip and the chips on both sides. At the same time, different placement positions inside the solder pad have different effects on the brightness of the finished product. At the same time, the existing SMD LED has a large luminous angle and low brightness. When the product is used in indoor and outdoor environments, the brightness is low, and it needs to be driven by a larger current to meet the requirements, so that the life is shortened, the optical curve coincidence degree is not high, and, when used in high-density LED screens, two adjacent LED devices will appear cross-light phenomenon, resulting in the current SMD full-color devices are less used in the field of outdoor display screens.

Contents of the invention

For this reason, the technical problem to be solved by the present invention is that in the prior art, the SMD type LED has a large light-emitting angle and low brightness, and needs to be driven by a large current, and in a high-density LED screen, once the phenomenon of cross-lighting occurs, the application is relatively limited, so A lens-type SMD packaging device with high brightness and low energy consumption is proposed.

In order to solve the problems of the technologies described above, the technical solution of the present invention is:

The present invention provides a lens-type SMD packaging device, which includes a bracket, at least two welding pads are arranged on the inner bottom of the bracket, a light-emitting chip is correspondingly arranged above the welding pads, and a pad isolating pad is arranged between the welding pads. Open the bezel.

Preferably, an encapsulation lens is arranged above the baffle, and the encapsulation lens is located directly above each light-emitting chip.

Preferably, the baffle is wide at the bottom and narrow at the top, and the top is flush with the top of the bracket.

Preferably, the number of the pads is at least three, and they are arranged in a straight line, and the baffles are arranged between the pads.

Preferably, the packaging lens is located above the baffle and between two adjacent baffles.

Preferably, the cross-sectional figure of the encapsulating lens is a semicircle or a semiellipse.

Preferably, the light emitting chip includes a red light chip, a blue light chip and a green light chip, which are respectively placed on independent pads, and the light emitting chip is connected to the pads by metal wires.

Preferably, the baffle is an opaque insulating baffle. Preferably, the bracket is filled with an encapsulating adhesive layer, the encapsulating adhesive layer is disposed above the light-emitting chip and the metal wire, and between the baffles, and the encapsulating lens is disposed on the upper surface of the encapsulating adhesive layer.

Preferably, the encapsulation glue layer is formed by mixing encapsulation glue and modified powder.

The above technical solution of the present invention has the following advantages compared with the prior art:

(1) The lens-type SMD packaging device of the present invention includes a bracket, and at least two pads are arranged at the inner bottom of the bracket, and a light-emitting chip is correspondingly arranged above the pads, and the pads are arranged between the pads. Pads are isolated by baffles. The pads are independent of each other, and the pads are separated by a partition, so that the luminous angle of the light emitted by the light-emitting chip above each pad is consistent with the optical curve and does not affect each other, and there will be no cross-lighting. High light overlap and good light color consistency.

(2) In the lens-type SMD packaging device of the present invention, a packaging lens is arranged above the baffle, and the packaging lens is located directly above each light-emitting chip. The lens can greatly improve the brightness of the LED device, and according to different needs, the radian of the lens can be adjusted to adjust the luminous angle and luminous curve of the device, so that the product can meet the market demand of high brightness, good light color consistency, and energy saving, and solve the problem of The problems in the prior art that the SMD type LED device has a large light-emitting angle, low brightness, high current drive and high energy consumption are solved.

Description of drawings

In order to make the content of the present invention more easily understood, the present invention will be described in further detail below according to specific embodiments of the present invention in conjunction with the accompanying drawings, wherein

Fig. 1 is the sectional view of lens type SMD package device described in the embodiment of the present invention;

2 is a schematic diagram of the internal structure of the lens-type SMD package device described in the embodiment of the present invention;

Fig. 3 is a top view of the lens-type SMD package device described in the embodiment of the present invention.

The reference signs in the figure are represented as: 1-bracket; 2-welding pad; 3-light-emitting chip; 4-baffle; 5-packaging lens; 6-metal wire; 7-packaging adhesive layer;

detailed description

Example

This embodiment provides a lens-type SMD packaging device, as shown in Figure 1-3, which includes a bracket 1, at least two pads 2 are provided on the inner bottom of the bracket 1, and each of the pads 2 is correspondingly arranged above There is a light-emitting chip 3, and a baffle 4 is arranged between the pads 2 to isolate the pads 2. The baffle 4 is an opaque insulating baffle, which can be a bracket plastic such as PA6T, PA9T, and PCT. Material or EMC epoxy molding compound and other materials, the bottom of the baffle 4 is wide, the top is narrow, and the top is flush with the top of the bracket 1, and the baffle 4 isolates the light-emitting chips 3, so that each light-emitting source The luminous angle and optical curve are consistent and do not affect each other, and the light color consistency is good. The shape of the baffle 4 with a narrow top and a wide bottom will not block the light, and is conducive to light divergence.

In this embodiment, there are at least three welding pads 2, the welding pads 2 are arranged in a straight line, the baffle plate 4 is arranged between the welding pads 2, and the light-emitting chip 3 includes a red light chip and a blue light chip. and the green light chip, the three kinds of chips are respectively placed on three independent pads 2, the positive and negative electrode pads are set separately, and the light-emitting chip 3 and the pads are connected by metal wires 6.

An encapsulation lens 5 is arranged above the baffle plate 4, and the cross-sectional figure of the encapsulation lens 5 is semicircular or semi-elliptical. Above the board 4, and in the gap between two adjacent baffles 4, the encapsulation lens 5 improves the brightness of the light emitted by the light-emitting chip 3, and the light-emitting angle and light-emitting curve of the LED device can be adjusted by encapsulating the lens 5 to adjust the arc.

The bracket 1 is also filled with an encapsulating adhesive layer 7, the encapsulating adhesive layer 7 is arranged above the light-emitting chip and the metal wire 6, and between the baffles 4, and the encapsulating lens 5 is arranged on the encapsulating adhesive layer 7 on the upper surface, the encapsulation adhesive layer 7 is formed by mixing encapsulation glue and modified powder, and the modified powder is light diffusion powder or matt powder, etc., which can absorb stress and absorb ultraviolet rays. Solder pins 8 are provided at the bottom of the bracket 1 for connecting the SMD packaged device to other components.

Apparently, the above-mentioned embodiments are only examples for clear description, rather than limiting the implementation. For those of ordinary skill in the art, on the basis of the above description, other changes or changes in different forms can also be made. It is not necessary and impossible to exhaustively list all the implementation manners here. And the obvious changes or changes derived therefrom are still within the scope of protection of the present invention.

Claims (10)

1. A lens-type SMD packaging device, comprising a bracket, at least two pads are arranged at the inner bottom of the bracket, and a light-emitting chip is correspondingly arranged above the pads, and it is characterized in that, between the pads, there are Pads are isolated by baffles. 2 . The lens-type SMD package device according to claim 1 , wherein a package lens is arranged above the baffle, and the package lens is located directly above each light-emitting chip. 3 . 3. The lens-type SMD package device according to claim 1 or 2, wherein the baffle is wide at the bottom and narrow at the top, and the top is flush with the top of the bracket. 4 . The lens-type SMD package device according to claim 3 , wherein the number of the pads is at least three and arranged in a straight line, and the baffles are arranged between the pads. 5 . The lens-type SMD package device according to claim 4 , wherein the package lens is located above the baffle and between two adjacent baffles. 6 . The lens-type SMD packaged device according to claim 5 , wherein the cross-sectional figure of the packaged lens is a semicircle or a semiellipse. 7. The lens type SMD packaging device according to claim 6, wherein the light emitting chip comprises a red light chip, a blue light chip and a green light chip, which are respectively placed on independent pads, and the light emitting chip and the light emitting chip The pads are connected by metal wires. 8. The lens-type SMD packaging device according to claim 7, wherein the baffle is an opaque insulating baffle. 9. The lens-type SMD packaging device according to claim 8, wherein a packaging adhesive layer is filled in the bracket, and the packaging adhesive layer is arranged above the light-emitting chip and the wire and between the baffles, The encapsulation lens is arranged on the upper surface of the encapsulation adhesive layer. 10. The lens-type SMD packaging device according to claim 9, wherein the packaging adhesive layer is formed by mixing packaging glue and modified powder.