CN105679967B - Mask plate, the method for preparing organic light-emitting display device - Google Patents
Mask plate, the method for preparing organic light-emitting display device Download PDFInfo
- Publication number
- CN105679967B CN105679967B CN201410659247.4A CN201410659247A CN105679967B CN 105679967 B CN105679967 B CN 105679967B CN 201410659247 A CN201410659247 A CN 201410659247A CN 105679967 B CN105679967 B CN 105679967B
- Authority
- CN
- China
- Prior art keywords
- organic light
- display device
- emitting display
- region
- mask plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims abstract description 26
- 239000004020 conductor Substances 0.000 claims abstract description 23
- 230000007797 corrosion Effects 0.000 claims abstract description 22
- 238000005260 corrosion Methods 0.000 claims abstract description 22
- 230000008020 evaporation Effects 0.000 claims abstract description 10
- 238000001704 evaporation Methods 0.000 claims abstract description 10
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 13
- 239000012774 insulation material Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229920002313 fluoropolymer Polymers 0.000 claims description 6
- 229920000728 polyester Polymers 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- 229910052725 zinc Inorganic materials 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000003628 erosive effect Effects 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 abstract description 10
- 239000001301 oxygen Substances 0.000 abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000011241 protective layer Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 26
- 238000010586 diagram Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a kind of mask plate, the methods for preparing organic light-emitting display device; the mask plate during organic light-emitting display device is prepared by evaporation process can contact conductor region, IC and FPC bondings region conducting terminal on form protective layer; in organic light-emitting display device production process guard electrode lead areas, IC and FPC bondings region conducting terminal from water oxygen corrode; so as to effectively improve the water resistant oxygen corrosion ability of organic light-emitting display device, and then improve the product reliability and product yield of organic light-emitting display device.
Description
Technical field
The present invention relates to field of photoelectric technology, and in particular to a kind of to be shown for the organic light emission with water resistant oxygen corrosion to be deposited
The mask plate of showing device and a kind of method for preparing organic light-emitting display device.
Background technology
As the display device of a new generation, organic light-emitting display device (English full name organic lighting
Emitting display, abbreviation OLED) advantage that has conventional display device incomparable, such as self-luminous do not need to backlight
Source, ultra-thin display and Flexible Displays can be achieved, driving voltage is low, reaction speed is fast etc..But it is produced in organic light-emitting display device
In the process, the aerial various terminals of exposure and lead are easily influenced by factors such as water, oxygen, oxidation, corrosion etc. occur
Bad phenomenon, the influence to the organic light-emitting display device service life are very big.
Chinese patent literature CN101162314A discloses a kind of display device, prepares it with mask plate and the display device
Preparation method, wherein the mask plate, which is used in, forms the photoetching workshop section of the netted insulating layer in display area, while also need to pass through
Wet etching or dry etch process etch netted layer pattern and antisitic defect figure.The mask plate is exposure mask
Plate, structure are chromium plating on quartz glass or soda glass, and the position of non-chromium plating can penetrate ultraviolet light；Therefore the mask plate is only suitable
For etching technics, structure design limit its can only guard electrode lead, for integrated circuit (IC) and flexible circuit board
(FPC) conducting terminal cannot play a protective role.In addition, forming antisitic defect pattern by lithography and etching technique, gone back after etching
It needs to be purged remaining photoresist, step is various, and process costs are high.
Invention content
The technical problems to be solved by the invention are integrated circuit and flexible circuitry in existing organic light-emitting display device
The problem of plate conducting terminal is easily corroded by water oxygen shows so as to provide a kind of organic light emission for having water resistant oxygen corrosion for vapor deposition
The mask plate of showing device carries out vapor deposition using the mask plate and prepares organic light-emitting display device, can be integrated circuit and
Flexible circuit board conducting terminal forms protective layer, the guard electrode lead, integrated in the production process of organic light-emitting display device
Circuit and flexible circuit board conducting terminal corrode from water oxygen, so as to effectively improve the water resistant oxygen corrosion of organic light-emitting display device
Ability, and then improve the product reliability and product yield of organic light-emitting display device.
In order to solve the above technical problems, the present invention is achieved by the following technical solutions：
A kind of mask plate of the present invention, the mask plate include blocked area and open region, open region packet
Include at least one of IC open areas, FPC open areas and lead open area；
The IC open areas are arranged on the corresponding position in IC bondings region of organic light-emitting display device；
The FPC open areas are arranged on the corresponding position in FPC bondings region of organic light-emitting display device；
The lead open area is arranged on the corresponding position in contact conductor region of organic light-emitting display device.
The open region further includes display area open region, and the display area open region is shown with being arranged on organic light emission
The display area position of showing device corresponds to.
A kind of method for preparing organic light-emitting display device of the present invention, includes the following steps：
S1, display area on substrate form Organic Light Emitting Diode, and in IC bondings region and/or FPC bondings area
Domain is respectively formed IC bondings terminal and FPC bonding terminals；
S2, the mask plate is covered in substrate described in step S1 close to the upper of the Organic Light Emitting Diode side
Side is respectively formed in IC bondings region and FPC bondings region by evaporation process and covers its corrosion-resistant conductive material layer.
The step S2 is further included：It is formed by the mask plate and evaporation process in display area and covers corrosion-resistant lead
Material layer.
The step S2 is further included：
Covering insulation is respectively formed on display area and/or contact conductor region by the mask plate and evaporation process
The step of material layer.
The insulating materials is one kind or wherein several in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride
Mixture.
The insulation material layer is one or more layers in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride
Stacked combination.
The corrosion-resistant conductive material is aluminium, gold, copper, zinc, one kind in silver or wherein several alloys.
The corrosion-resistant conductive material layer is one or more layers the stacked combination in aluminium, gold, copper, zinc, silver.
The above technical solution of the present invention has the following advantages over the prior art：
Mask plate provided by the invention can be in electrode by evaporation process during organic light-emitting display device is prepared
Lead areas, IC and FPC bondings region conducting terminal on form protective layer, protected in organic light-emitting display device production process
The conducting terminal in contact conductor region, IC and FPC bondings region is protected from water oxygen corrosion, so as to effectively improve organic light emitting display
The water resistant oxygen corrosion ability of device, and then improve the product reliability and product yield of organic light-emitting display device.
Description of the drawings
In order to make the content of the present invention more clearly understood, below in conjunction with the accompanying drawings, the present invention is made further detailed
Thin explanation, wherein,
Fig. 1 is the structure diagram of organic light-emitting display device described in embodiment 1；
Fig. 2 is the structure diagram of organic light-emitting display device described in embodiment 2；
Fig. 3 is the structure diagram of mask plate described in embodiment 1；
Fig. 4 is the structure diagram of another mask plate in embodiment 1；
Fig. 5 is the structure diagram of mask plate described in embodiment 2；
Fig. 6 is the structure diagram of another mask plate in embodiment 2.
Reference numeral is expressed as in figure：
1-substrate, 2-package substrate, 3-display area, 4-IC bondings region, 5-FPC bondings region, 6-electrode
Lead areas, 7-insulation material layer, 8-display area open region, 9-blocked area, 10-IC open regions, 11-FPC openings
Area, 12-lead open area.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
The present invention can be embodied in many different forms, and should not be construed as limited to embodiment set forth herein.
On the contrary, provide these embodiments so that the disclosure will be thorough and complete, and the design of the present invention will be fully conveyed to
Those skilled in the art, the present invention will only be defined by the appended claims.In the accompanying drawings, for clarity, Ceng He areas can be exaggerated
The size and relative size in domain.It should be understood that when element such as layer, region or substrate are referred to as " being formed in " or " setting
" another element " on " when, which can be arranged directly on another element or there may also be intermediary elements.
On the contrary, when element is referred to as on " being formed directly into " or " being set up directly on " another element, there is no intermediary elements.
Embodiment 1
As shown in figure 3, the present embodiment provides a kind of mask plate, the mask plate includes blocked area 9 and open region, described
Open region include：
IC open areas 10, the IC bondings region 4 that the IC open areas 10 are arranged on organic light-emitting display device correspond to
Position；
FPC open areas 11, the FPC bondings region 5 that the FPC open areas 11 are arranged on organic light-emitting display device are right
The position answered；
Display area open region 8, the display area open region 8 are arranged on the display area 3 of organic light-emitting display device
Corresponding position.
As shown in Figure 1, the present embodiment also provides a kind of organic light-emitting display device and preparation method thereof, the organic light emission
The preparation method of display device, includes the following steps：
S1, display area 3 on substrate 1 form Organic Light Emitting Diode, and in IC bondings region 4 and FPC bondings area
Domain 5 is respectively formed IC bondings terminal and FPC bonding terminals.
S2, the mask plate is covered in substrate 1 described in step S1 close to the upper of the Organic Light Emitting Diode side
Side is respectively formed in display area 3, IC bondings region 4 and FPC bondings region 5 by evaporation process and covers the corrosion-resistant of its and lead
Material layer (not shown)；Again in the encapsulation for having the setting covering display area 3 on corrosion-resistant conductive material layer
Substrate 2.
The corrosion-resistant conductive material layer material is selected from, but not limited to, aluminium, gold, copper, zinc, one kind of silver or wherein several
Alloy.
The corrosion-resistant conductive material layer can also be selected from, but not limited to, one or more layers heap of aluminium, gold, copper, zinc, silver
Stacked group is closed.
Corrosion-resistant conductive material layer described in the present embodiment is preferably layer gold.
As the convertible embodiment of the present invention, as shown in figure 4, the open area of the mask plate can also only include IC
Open area 10 and FPC open areas 11, can also achieve the object of the present invention, belong to the scope of protection of the present invention.
Embodiment 2
The present embodiment provides a kind of mask plate, as shown in figure 5, the mask plate includes blocked area 9 and open region, it is described
Open region include：
Display area open region 8, the display area open region 8 and the display area for being arranged on organic light-emitting display device
3 positions correspond to.
Lead open area 12, the lead open area 12 and the contact conductor area for being arranged on organic light-emitting display device
6 position of domain is corresponding.
The present embodiment also provides a kind of organic light-emitting display device and preparation method thereof, as shown in Fig. 2, the organic light emission
The preparation method of display device includes the following steps：
S1, display area 3 on substrate 1 form Organic Light Emitting Diode, and in IC bondings region 4, FPC bondings region
5 and contact conductor region 6 be respectively formed IC bondings terminal, FPC bondings terminal and contact conductor.
S2, the mask plate is covered in substrate 1 described in step S1 close to the Organic Light Emitting Diode side
Top is respectively formed on display area 3 and contact conductor region 6 by evaporation process and covers its (covering of insulation material layer 7
Insulation material layer on the display area 3 is not shown in figure)；Setting covering is described aobvious on the insulation material layer 7 again
Show the package substrate 2 in region 3.
The insulating materials is selected from, but not limited to, one kind in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride
Or wherein several mixture.
The insulation material layer 7 is selected from, but not limited to, one in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride
The stacked combination of layer or multilayer.Insulation material layer 7 described in the present embodiment be preferably stack gradually setting acrylate layer and
Layer of lithium fluoride.
As the convertible embodiment of the present invention, the mask plate can be with as shown in fig. 6, the open region of the mask plate
Domain only includes lead open area 12, can also achieve the object of the present invention, belong to the scope of protection of the present invention.
Obviously, the above embodiments are merely examples for clarifying the description, and is not intended to limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And the obvious variation thus extended out or
Among changing still in the protection domain of the invention.
Claims (9)
1. a kind of mask plate, the mask plate includes blocked area (9) and open region, which is characterized in that the open region packet
Include at least one of IC open areas (10), FPC open areas (11) and lead open area (12)
The IC open areas (10) are arranged on the corresponding position in IC bondings region (4) of organic light-emitting display device, for
IC bondings region (4), which is formed, covers its corrosion-resistant conductive material layer；
The FPC open areas (11) are arranged on the corresponding position in FPC bondings region (5) of organic light-emitting display device, are used for
FPC bondings region (5), which is formed, covers its corrosion-resistant conductive material layer；
The lead open area (12) is arranged on the corresponding position in contact conductor region (6) of organic light-emitting display device.
2. mask plate according to claim 1, which is characterized in that the open region further includes display area open region
(8), the display area open region (8) is corresponding with display area (3) position for being arranged on organic light-emitting display device.
A kind of 3. method for preparing organic light-emitting display device, which is characterized in that include the following steps：
S1, the display area (3) on substrate (1) form Organic Light Emitting Diode, and in IC bondings region (4) and FPC bondings
Region (5) is respectively formed IC bondings terminal and FPC bonding terminals；
S2, the mask plate described in claims 1 or 2 is covered in substrate (1) described in step S1 close to the organic light emission
The top of diode side is respectively formed in IC bondings region (4) and/or FPC bondings region (5) by evaporation process and covers it
Corrosion-resistant conductive material layer.
4. the method according to claim 3 for preparing organic light-emitting display device, which is characterized in that the step S2 is also
Including：
Covering corrosion-resistant conductive material layer is formed in display area (3) by the mask plate and evaporation process.
5. the method according to claim 3 for preparing organic light-emitting display device, which is characterized in that the step S2 is also
Including：
It is exhausted that covering is respectively formed on display area (3) and/or contact conductor region (6) by the mask plate and evaporation process
The step of edge material layer.
6. the method according to claim 5 for preparing organic light-emitting display device, which is characterized in that the insulating materials is
One kind or wherein several mixtures in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
7. the method according to claim 5 for preparing organic light-emitting display device, which is characterized in that the insulation material layer
For one or more layers the stacked combination in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
8. according to any methods for preparing organic light-emitting display device of claim 3-7, which is characterized in that the corrosion resistant
Erosion conductive material is aluminium, gold, copper, zinc, one kind in silver or wherein several alloys.
9. according to any methods for preparing organic light-emitting display device of claim 3-7, which is characterized in that the corrosion resistant
Erosion conductive material layer is one or more layers the stacked combination in aluminium, gold, copper, zinc, silver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410659247.4A CN105679967B (en) | 2014-11-18 | 2014-11-18 | Mask plate, the method for preparing organic light-emitting display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410659247.4A CN105679967B (en) | 2014-11-18 | 2014-11-18 | Mask plate, the method for preparing organic light-emitting display device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105679967A CN105679967A (en) | 2016-06-15 |
| CN105679967B true CN105679967B (en) | 2018-06-26 |
Family
ID=56944686
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410659247.4A Active CN105679967B (en) | 2014-11-18 | 2014-11-18 | Mask plate, the method for preparing organic light-emitting display device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105679967B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106201145B (en) * | 2016-07-21 | 2018-10-30 | 京东方科技集团股份有限公司 | A kind of touch screen, its production method and display device |
| CN107689430A (en) * | 2017-09-06 | 2018-02-13 | 武汉华星光电半导体显示技术有限公司 | Manufacturing method of flexible OLED panel and flexible OLED panel |
| CN108004521A (en) * | 2017-11-27 | 2018-05-08 | 武汉华星光电半导体显示技术有限公司 | Mask plate and film encapsulation method |
| CN108375595B (en) * | 2018-02-27 | 2020-09-01 | 北京工商大学 | Test method for surface stress distribution of metal workpieces along the depth direction |
| CN109786582B (en) * | 2019-03-08 | 2024-04-19 | 京东方科技集团股份有限公司 | Mask plate, display back plate, display panel and display device |
| CN110212091B (en) * | 2019-06-13 | 2023-09-15 | 京东方科技集团股份有限公司 | Evaporation mask plate, OLED display substrate, manufacturing method of OLED display substrate and display device |
| CN110571350A (en) * | 2019-08-14 | 2019-12-13 | 武汉华星光电半导体显示技术有限公司 | Display panel mother board, preparation method thereof and display panel |
| CN111399708A (en) * | 2020-04-07 | 2020-07-10 | 惠州易晖光电材料股份有限公司 | Electrode wiring structure of touch functional sheet and preparation method thereof |
| CN114574803A (en) * | 2022-02-28 | 2022-06-03 | 云谷（固安）科技有限公司 | Mask, display panel manufacturing method and display panel |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2577383Y (en) * | 2002-11-12 | 2003-10-01 | 高峻 | Multicolour solid panel display screen |
| CN1617034A (en) * | 2003-11-12 | 2005-05-18 | 三星电子株式会社 | LCD Monitor |
| CN1682569A (en) * | 2002-09-20 | 2005-10-12 | 株式会社半导体能源研究所 | Manufacturing system and method for manufacturing light-emitting element |
| CN1945665A (en) * | 2005-10-06 | 2007-04-11 | Lg电子株式会社 | Plasma display apparatus |
| CN101162314A (en) * | 2007-08-16 | 2008-04-16 | 昆山维信诺显示技术有限公司 | Display device and method for manufacturing mask plate and display device |
| CN101314841A (en) * | 2007-06-01 | 2008-12-03 | 株式会社半导体能源研究所 | Manufacturing device and method for manufacturing light-emitting device |
| CN201859895U (en) * | 2010-09-16 | 2011-06-08 | 昆山维信诺显示技术有限公司 | Organic electroluminescent device, mask plate, luminescent module and application thereof |
| CN102709492A (en) * | 2012-06-13 | 2012-10-03 | 信利半导体有限公司 | Flexible organic electroluminescence display (OELD) and manufacture method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090041316A (en) * | 2007-10-23 | 2009-04-28 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Film formation method and manufacturing method of light emitting device |
-
2014
- 2014-11-18 CN CN201410659247.4A patent/CN105679967B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1682569A (en) * | 2002-09-20 | 2005-10-12 | 株式会社半导体能源研究所 | Manufacturing system and method for manufacturing light-emitting element |
| CN2577383Y (en) * | 2002-11-12 | 2003-10-01 | 高峻 | Multicolour solid panel display screen |
| CN1617034A (en) * | 2003-11-12 | 2005-05-18 | 三星电子株式会社 | LCD Monitor |
| CN1945665A (en) * | 2005-10-06 | 2007-04-11 | Lg电子株式会社 | Plasma display apparatus |
| CN101314841A (en) * | 2007-06-01 | 2008-12-03 | 株式会社半导体能源研究所 | Manufacturing device and method for manufacturing light-emitting device |
| CN101162314A (en) * | 2007-08-16 | 2008-04-16 | 昆山维信诺显示技术有限公司 | Display device and method for manufacturing mask plate and display device |
| CN201859895U (en) * | 2010-09-16 | 2011-06-08 | 昆山维信诺显示技术有限公司 | Organic electroluminescent device, mask plate, luminescent module and application thereof |
| CN102709492A (en) * | 2012-06-13 | 2012-10-03 | 信利半导体有限公司 | Flexible organic electroluminescence display (OELD) and manufacture method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105679967A (en) | 2016-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105679967B (en) | Mask plate, the method for preparing organic light-emitting display device | |
| JP6602832B2 (en) | Method for manufacturing light emitting device | |
| CN109950296B (en) | Flexible display panel and manufacturing method thereof | |
| CN105742324B (en) | Organic light-emitting display device and its manufacturing method | |
| TWI671930B (en) | Organic light-emitting device | |
| WO2020164554A1 (en) | Oled device and manufacturing method therefor | |
| CN102308671B (en) | Method for manufacturing light-emitting element, light-emitting element, method for manufacturing light-emitting device, and light-emitting device | |
| CN111613634B (en) | display panel | |
| US11086155B2 (en) | Flexible device and method of manufacturing the same, and display apparatus | |
| CN102610760B (en) | light emitting device | |
| CN107302061A (en) | Oled display substrate and preparation method thereof, display device | |
| US20040169467A1 (en) | Luminescent display device and method of manufacturing same | |
| KR20160066463A (en) | Organic light emitting display device and method of manufacturing the same | |
| JP2005183209A (en) | Organic electroluminescent display device and method of manufacturing the same | |
| CN110289285A (en) | Substrate for display and preparation method thereof, display panel | |
| CN101840998A (en) | OLED (Organic Light Emitting Diode) lighting substrate, OLED lighting device and manufacturing methods thereof | |
| US10971572B2 (en) | Flexible OLED panel for lighting device and method of manufacturing same | |
| CN111584763A (en) | Display panel and preparation method thereof | |
| CN212517243U (en) | Display panel | |
| CN112366223A (en) | OLED panel manufacturing method and OLED panel | |
| CN111312753A (en) | Method for improving aperture opening ratio of back plate, manufacturing method, back plate and display panel | |
| KR20160005959A (en) | Organic light emitting display apparatus and manufacturing the same | |
| JP2006286220A (en) | Organic electroluminescence device | |
| JP7493080B2 (en) | Light-emitting device | |
| JP2011091063A (en) | Transparent electrode material which is improved for improvement of performance of oled device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |