CN105679967A - Mask plate and method for preparing organic light-emitting display device - Google Patents
Mask plate and method for preparing organic light-emitting display device Download PDFInfo
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- CN105679967A CN105679967A CN201410659247.4A CN201410659247A CN105679967A CN 105679967 A CN105679967 A CN 105679967A CN 201410659247 A CN201410659247 A CN 201410659247A CN 105679967 A CN105679967 A CN 105679967A
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Abstract
The invention relates to a mask plate and a method for preparing an organic light-emitting display device. The mask plate can form protective layers on conductive terminals in electrode lead regions, an IC bonding region and an FPC bonding region through an evaporation process in an organic light-emitting display device preparation process, and prevents the conductive terminals in the electrode lead regions, the IC bonding region and the FPC bonding region from being corroded by water and oxygen in the production process of the organic light-emitting display device, so that the water and oxygen corrosion resistance of the organic light-emitting display device is effectively improved; and the product reliability and the product yield of the organic light-emitting display device are improved.
Description
Technical field
The present invention relates to field of photoelectric technology, it is specifically related to a kind of for steaming the mask plate that plating has the organic light-emitting display device of water resistant oxygen corrosion, and a kind of method preparing organic light-emitting display device.
Background technology
As the display device of a new generation, organic light-emitting display device (English full name organiclightingemittingdisplay, it is called for short OLED) advantage that has conventional display device incomparable, such as luminous, do not need backlight, ultra-thin display can be realized and Flexible Displays, driving voltage is low, speed of response is fast. But in organic light-emitting display device production process, expose aerial various terminal and lead-in wire is easily subject to the impact of the factor such as water, oxygen, the bad phenomenon such as oxidation, corrosion occur, the impact in organic light-emitting display device life-span is very big.
Chinese patent literature CN101162314A discloses a kind of display device, prepares it by the preparation method of mask plate and this display device, wherein said mask plate is used in the photoetching workshop section forming the netted insulation layer in display area, also needs to be etched netted insulation layer figure and anti-damage figure by wet etching or dry etch process simultaneously. This mask plate is exposure mask plate, and structure is chromium plating in silica glass or soda glass, and the position of non-chromium plating can pass through UV-light; Therefore this mask plate is only applicable to etching technics, and its structure design limits it can only protect contact conductor, and (FPC) conducting terminal for unicircuit (IC) and flexible circuit board can not play a protective role. In addition, forming anti-pattern of lesions by photoetching and etching technics, also need to be removed by residue photoresist material after etching, step is various, technique cost height.
Summary of the invention
Technical problem to be solved by this invention is the problem that the unicircuit in existing organic light-emitting display device and flexible circuit board conducting terminal are easily subject to water oxygen corrosion, thus provide a kind of for steaming the mask plate that plating has the organic light-emitting display device of water resistant oxygen corrosion, utilize described mask plate to carry out steaming and it is coated with standby organic light-emitting display device, can be that unicircuit and flexible circuit board conducting terminal form protective layer, the production process of organic light-emitting display device protects contact conductor, unicircuit and flexible circuit board conducting terminal are from water oxygen corrosion, thus effectively improve the water resistant oxygen corrosion ability of organic light-emitting display device, and then improve product reliability and the product yield of organic light-emitting display device.
For solving the problems of the technologies described above, the present invention is achieved by the following technical solutions:
A kind of mask plate of the present invention, described mask plate comprises and blocks district and open region, and described open region comprises at least one in IC open area, FPC open area and lead-in wire open area;
The IC nation that described IC open area is arranged on organic light-emitting display device determines position corresponding to region;
The FPC nation that described FPC open area is arranged on organic light-emitting display device determines position corresponding to region;
Described lead-in wire open area is arranged on position corresponding to the contact conductor region of organic light-emitting display device.
Described open region also comprises open region, display area, and open region, described display area is corresponding with the position, display area being arranged on organic light-emitting display device.
A kind of method preparing organic light-emitting display device of the present invention, comprises the steps:
S1, display area on substrate are formed with OLED, and determine region and/or FPC nation determines region and forms fixed end Zi HeFPC nation of IC nation fixed end respectively in IC nation;
S2, described mask plate is covered the top of substrate described in step S1 near described Organic Light Emitting Diode side, determine region and FPC nation determines region and forms the corrosion-resistant conductive material layer covering it respectively by evaporation process in IC nation.
Described step S2 also comprises: is formed in display area by described mask plate and evaporation process and covers corrosion-resistant conductive material layer.
Described step S2 also comprises:
On display area and/or contact conductor region, the step of covering insulating material layer is formed respectively by described mask plate and evaporation process.
Described insulating material is a kind of or wherein several mixture in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
Described insulation material layer is one or more layers the stacked combination in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
Described corrosion-resistant conductive material is a kind of or wherein several alloy in aluminium, gold, copper, zinc, silver.
Described corrosion-resistant conductive material layer is one or more layers the stacked combination in aluminium, gold, copper, zinc, silver.
The technique scheme of the present invention has the following advantages compared to existing technology:
Mask plate provided by the invention prepare in organic light-emitting display device process by evaporation process can in contact conductor region, IC and FPC nation determine the conducting terminal in region is formed protective layer; organic light-emitting display device production process is protected conducting terminal that region is determined in contact conductor region, IC and FPC nation from water oxygen corrosion; thus effectively improve the water resistant oxygen corrosion ability of organic light-emitting display device, and then improve product reliability and the product yield of organic light-emitting display device.
Accompanying drawing explanation
In order to make the content of the present invention be more likely to be clearly understood, below in conjunction with accompanying drawing, the present invention is further detailed explanation, wherein,
Fig. 1 is the structural representation of organic light-emitting display device described in embodiment 1;
Fig. 2 is the structural representation of organic light-emitting display device described in embodiment 2;
Fig. 3 is the structural representation of mask plate described in embodiment 1;
Fig. 4 is the structural representation of another kind of described mask plate in embodiment 1;
Fig. 5 is the structural representation of mask plate described in embodiment 2;
Fig. 6 is the structural representation of another kind of described mask plate in embodiment 2.
In figure, Reference numeral represents and is:
1 substrate, 2 base plate for packaging, 3 display areas, 4 IC nations determine region, 5 FPC nations determine region, district, 10 IC open regions, 11 FPC open regions, 12 lead-in wire open areas are blocked in 6 contact conductor regions, 7 insulation material layers, 8 open regions, display area, 9.
Embodiment
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
The present invention can implement in many different forms, and should not be understood to be limited to embodiment set forth herein. On the contrary, it is provided that these embodiments so that the disclosure will be thorough and complete, and fully passes on the design of the present invention to those skilled in the art, and the present invention will only be limited by claim. In the accompanying drawings, for clarity, the size in layer and region and relative dimension can be exaggerated. Should be understood that, when element such as layer, region or substrate be referred to as " being formed in " or " being arranged on " another element " on " time, this element can be set directly on another element described, or can also there is intermediary element. On the contrary, when element is referred to as on " being formed directly into " or " being set directly at " another element, there is not intermediary element.
Embodiment 1
As shown in Figure 3, the present embodiment provides a kind of mask plate, and described mask plate comprises and blocks district 9 and open region, and described open region comprises:
IC open area 10, the IC nation that described IC open area 10 is arranged on organic light-emitting display device determines the position of region 4 correspondence;
FPC open area 11, the FPC nation that described FPC open area 11 is arranged on organic light-emitting display device determines the position of region 5 correspondence;
Open region, display area 8, open region, described display area 8 is arranged on the position of display area 3 correspondence of organic light-emitting display device.
As shown in Figure 1, the present embodiment also provides a kind of organic light-emitting display device and its preparation method, and the preparation method of described organic light-emitting display device, comprises the steps:
S1, display area 3 on substrate 1 are formed with OLED, and determine region 4 and FPC nation determines region 5 and forms fixed end Zi HeFPC nation of IC nation fixed end respectively in IC nation.
S2, described mask plate is covered the top of substrate 1 described in step S1 near described Organic Light Emitting Diode side, by evaporation process in display area 3, IC nation determines region 4 and FPC nation determines region 5 and forms the corrosion-resistant conductive material layer (not shown) covering it respectively; The base plate for packaging 2 arranging on corrosion-resistant conductive material layer and covering described display area 3 is had again described.
Described corrosion-resistant conductive material layer material is selected from but is not limited to aluminium, gold, copper, zinc, silver-colored a kind of or wherein several alloy.
Described corrosion-resistant conductive material layer can also be selected from but be not limited to aluminium, gold, copper, zinc, one or more layers silver-colored stacked combination.
The layer of corrosion-resistant conductive material described in the present embodiment is preferably layer gold.
As the convertible embodiment of the present invention, as shown in Figure 4, the open area of described mask plate can also only comprise IC open area 10 and FPC open area 11, can also realize the object of the present invention, belong to protection scope of the present invention.
Embodiment 2
The present embodiment provides a kind of mask plate, and as shown in Figure 5, described mask plate comprises and blocks district 9 and open region, and described open region comprises:
Open region, display area 8, open region, described display area 8 is corresponding with the position, display area 3 being arranged on organic light-emitting display device.
Lead-in wire open area 12, described lead-in wire open area 12 is corresponding with the position, contact conductor region 6 being arranged on organic light-emitting display device.
The present embodiment also provides a kind of organic light-emitting display device and its preparation method, and as shown in Figure 2, the preparation method of described organic light-emitting display device comprises the steps:
S1, display area 3 on substrate 1 are formed with OLED, and determine region 4 in IC nation, FPC nation determines region 5 and contact conductor region 6 forms IC nation fixed end, FPC nation fixed end and contact conductor respectively.
S2, described mask plate is covered the top of substrate 1 described in step S1 near described Organic Light Emitting Diode side, on display area 3 and contact conductor region 6, formed the insulation material layer 7 (covering the insulation material layer on described display area 3 not shown) covering it by evaporation process respectively; The base plate for packaging 2 covering described display area 3 is set on described insulation material layer 7 again.
Described insulating material is selected from but a kind of or wherein several mixture of being not limited in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
Described insulation material layer 7 is selected from but one or more layers the stacked combination that is not limited in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride. Insulation material layer 7 described in the present embodiment is preferably acrylate layer and the fluoride lithium layer of stacking setting successively.
As the convertible embodiment of the present invention, described mask plate can also as shown in Figure 6, and the open area of described mask plate only comprises lead-in wire open area 12, can also realize the object of the present invention, belong to protection scope of the present invention.
Obviously, above-described embodiment is only for example is clearly described, and not to the restriction of the mode of enforcement. For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description. Here without the need to also cannot all enforcement modes be given exhaustive. And the apparent change thus extended out or variation are still among the protection domain of the invention.
Claims (9)
1. a mask plate, described mask plate comprises and blocks district (9) and open region, it is characterized in that, described open region comprises at least one in IC open area (10), FPC open area (11) and lead-in wire open area (12);
The IC nation that described IC open area (10) is arranged on organic light-emitting display device determines position corresponding to region (4);
The FPC nation that described FPC open area (11) is arranged on organic light-emitting display device determines position corresponding to region (5);
Described lead-in wire open area (12) is arranged on the position of contact conductor region (6) correspondence of organic light-emitting display device.
2. mask plate according to claim 1, it is characterized in that, described open region also comprises open region, display area (8), and open region, described display area (8) is corresponding with display area (3) position being arranged on organic light-emitting display device.
3. prepare the method for organic light-emitting display device for one kind, it is characterised in that, comprise the steps:
S1, display area (3) on substrate (1) are formed with OLED, and determine region (4) and FPC nation determines region (5) and forms fixed end Zi HeFPC nation of IC nation fixed end respectively in IC nation;
S2, the mask plate described in claim 1 or 2 is covered substrate described in step S1 (1) near the top of described Organic Light Emitting Diode side, determine region (4) and/or FPC nation determines region (5) and forms its corrosion-resistant conductive material layer of covering respectively by evaporation process in IC nation.
4. the method preparing organic light-emitting display device according to claim 3, it is characterised in that, described step S2 also comprises:
Covering corrosion-resistant conductive material layer is formed in display area (3) by described mask plate and evaporation process.
5. the method preparing organic light-emitting display device according to claim 3, it is characterised in that, described step S2 also comprises:
On display area (3) and/or contact conductor region (6), the step of covering insulating material layer is formed respectively by described mask plate and evaporation process.
6. the method preparing organic light-emitting display device according to claim 5, it is characterised in that,
Described insulating material is a kind of or wherein several mixture in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
7. the method preparing organic light-emitting display device according to claim 5, it is characterised in that,
Described insulation material layer is one or more layers the stacked combination in acrylic resin, polyester, fluorocarbon polymer or lithium fluoride.
8. according to the arbitrary described method preparing organic light-emitting display device of claim 3-7, it is characterised in that, described corrosion-resistant conductive material is a kind of or wherein several alloy in aluminium, gold, copper, zinc, silver.
9. according to the arbitrary described method preparing organic light-emitting display device of claim 3-7, it is characterised in that, described corrosion-resistant conductive material layer is one or more layers the stacked combination in aluminium, gold, copper, zinc, silver.
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Cited By (9)
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CN106201145A (en) * | 2016-07-21 | 2016-12-07 | 京东方科技集团股份有限公司 | A kind of touch screen, its manufacture method and display device |
CN108004521A (en) * | 2017-11-27 | 2018-05-08 | 武汉华星光电半导体显示技术有限公司 | Mask plate and film encapsulation method |
WO2019047354A1 (en) * | 2017-09-06 | 2019-03-14 | 武汉华星光电半导体显示技术有限公司 | Manufacturing method of flexible oled panel, and flexible oled panel |
CN110212091A (en) * | 2019-06-13 | 2019-09-06 | 京东方科技集团股份有限公司 | Mask plate, oled display substrate and preparation method thereof, display device is deposited |
CN111399708A (en) * | 2020-04-07 | 2020-07-10 | 惠州易晖光电材料股份有限公司 | Electrode wiring structure of touch functional sheet and preparation method thereof |
CN108375595B (en) * | 2018-02-27 | 2020-09-01 | 北京工商大学 | Test method for surface stress distribution of metal workpieces along the depth direction |
WO2020181980A1 (en) * | 2019-03-08 | 2020-09-17 | 京东方科技集团股份有限公司 | Mask, display panel, and display device |
WO2021027061A1 (en) * | 2019-08-14 | 2021-02-18 | 武汉华星光电半导体显示技术有限公司 | Mother board of display panel and preparation method therefor, and display panel |
CN114574803A (en) * | 2022-02-28 | 2022-06-03 | 云谷(固安)科技有限公司 | Mask, display panel manufacturing method and display panel |
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CN106201145A (en) * | 2016-07-21 | 2016-12-07 | 京东方科技集团股份有限公司 | A kind of touch screen, its manufacture method and display device |
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WO2019047354A1 (en) * | 2017-09-06 | 2019-03-14 | 武汉华星光电半导体显示技术有限公司 | Manufacturing method of flexible oled panel, and flexible oled panel |
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CN108375595B (en) * | 2018-02-27 | 2020-09-01 | 北京工商大学 | Test method for surface stress distribution of metal workpieces along the depth direction |
WO2020181980A1 (en) * | 2019-03-08 | 2020-09-17 | 京东方科技集团股份有限公司 | Mask, display panel, and display device |
CN110212091A (en) * | 2019-06-13 | 2019-09-06 | 京东方科技集团股份有限公司 | Mask plate, oled display substrate and preparation method thereof, display device is deposited |
CN110212091B (en) * | 2019-06-13 | 2023-09-15 | 京东方科技集团股份有限公司 | Evaporation mask plate, OLED display substrate, manufacturing method of OLED display substrate and display device |
WO2021027061A1 (en) * | 2019-08-14 | 2021-02-18 | 武汉华星光电半导体显示技术有限公司 | Mother board of display panel and preparation method therefor, and display panel |
CN111399708A (en) * | 2020-04-07 | 2020-07-10 | 惠州易晖光电材料股份有限公司 | Electrode wiring structure of touch functional sheet and preparation method thereof |
CN114574803A (en) * | 2022-02-28 | 2022-06-03 | 云谷(固安)科技有限公司 | Mask, display panel manufacturing method and display panel |
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