CN105676353B - A kind of light back board interface - Google Patents
A kind of light back board interface Download PDFInfo
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- CN105676353B CN105676353B CN201610226966.6A CN201610226966A CN105676353B CN 105676353 B CN105676353 B CN 105676353B CN 201610226966 A CN201610226966 A CN 201610226966A CN 105676353 B CN105676353 B CN 105676353B
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- Prior art keywords
- back board
- light back
- chip
- array
- waveguide
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- 239000000835 fiber Substances 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 14
- 238000003032 molecular docking Methods 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims abstract description 5
- 230000003287 optical effect Effects 0.000 claims description 23
- 238000005452 bending Methods 0.000 claims description 12
- 239000003292 glue Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000005498 polishing Methods 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000642 polymer Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000005342 ion exchange Methods 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 239000000377 silicon dioxide Substances 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 238000003491 array Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 230000008878 coupling Effects 0.000 abstract description 2
- 238000010168 coupling process Methods 0.000 abstract description 2
- 238000005859 coupling reaction Methods 0.000 abstract description 2
- 239000013307 optical fiber Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/125—Bends, branchings or intersections
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Optical Integrated Circuits (AREA)
Abstract
The present invention relates to a kind of light back board interface, which is 90 ° of curved waveguide array interfaces, and by 1 or the array of N number of multimode lightguide chip portfolio for including 90 ° of bent lightguides is constituted, wherein N >=2.Compared with prior art, the present invention is on the basis of keeping light back board to place vertically, the good coupling of PLC light back board and fiber array is realized using 90 ° of curved multimode lightguide arrays, and the spacing for being bent multimode lightguide array can be controlled accurately by the thickness of glass substrate, keep the butting error between fiber array and light back board smaller, realizes smaller docking loss.Interface production is simple, low to process specifications, and facilitates light back board and fiber array patch.
Description
Technical field
The present invention relates to optical communication fields, more particularly, to a kind of light back board interface.
Background technique
With increasingly popularizing for optical communication network and the 4G communication technology, when network transmission speed marches toward Gbps by Mbps
The transmission rate in generation, core network will even march toward the Tbps epoch.However the interchanger as network core and high-performance are simultaneously
Row computer, internal chip interconnect but still in " copper interconnection " epoch.Although in recent years, the processing of the chips such as microprocessor
Ability is greatly improved, but the hump speed of " copper interconnection " only has 100Gbps, for the Terahertz net that can be looked forward to,
" copper interconnection " certainly will become bottleneck therein, and what is thus come into being is exactly light back board interconnection technique.
Early in May, 2011, Hewlett-Packard Corporation just discloses a light back board concept product in InterOp exhibition, and core is
The transmission array of 12 road plastic light conduits composition, constitutes R-T unit by 4 road 850nm 6.25Gbps VCSEL, realizes each board
Between interconnection, this product is successfully applied on HP8212 interchanger.Since electricity interconnection at that time is fully able to meet user's
Most of demand, and the product is not yet mature, and light back board technology does not have significant breakthrough so far.
Nearly 2 years, especially domestic, with further universal and network rate the downward of fiber optic network, resident is to net
The demand growth of network bandwidth is obvious, and the growth of the market demand have stimulated the quickening of technological innovation.More and more scientific research machines at present
Structure and enterprise have carried out positive concern to light back board technology.
Currently used light back board system, there are two types of main embodiments: one is use optical fiber to be fixed on substrate,
Backboard interconnection is realized by the fibre system on substrate, substantially still falls within optical fiber interconnection, and the program implements complexity, and optical fiber is numerous
More, there are security risks, and optical-fiber type device size is larger, it is difficult to integrated；Another kind is returned using integrated-type plane light wave
Road (PLC) light back board, program compact, integrated level is high, can be by reasonably designing realization multiple functions, but the program
Connection with equipment needs to design reasonable interface.
The PLC light back board being designed or implemented at present, there are mainly two types of interfaces, and a kind of Interface integration is on light back board, light
The waveguide input of backboard output section directly docked with the fiber array of equipment, the program requires light back board to keep horizontal positioned,
This is unfavorable for the spatial arrangement inside optical communication equipment；If passing through the band fibre of extended fiber array and being bent band fibre and enable PLC light
Backboard is vertical, and this aspect is unfavorable for integrating, and on the other hand increases the risk that optical fiber fractures, and deteriorates the antidetonation energy of system
Power；Another interface considers space problem, and 45 ° of micro-reflectors are increased between fiber array and light back board as interface, in fact
The vertical arrangement of light back board is showed, system compact is reliable.But the program implements complicated, design and reflecting mirror to space optical path
Production assembly has very high requirement.
Summary of the invention
It is an object of the present invention to overcome the above-mentioned drawbacks of the prior art and provide a kind of production simply, to work
Skill technical requirements are low, and facilitate light back board and fiber array the light back board interface patched.
The purpose of the present invention can be achieved through the following technical solutions: a kind of light back board interface, which is characterized in that this connects
It mouthful is 90 ° of curved waveguide array interfaces, by 1 or the array of N number of multimode lightguide chip portfolio for including 90 ° of bent lightguides
It constitutes, wherein N >=2.
The substrate of each multimode lightguide chip and the upper surface of adjacent multimode lightguide chip are complete by adhesive
It is bonded, and in multiple multimode lightguide chips 90 ° of bent lightguides bending direction it is consistent after bonding.
The multimode lightguide chip waveguide input with output section carry out optical polish, polishing angle be -8~+
8 °, one of section is docked with 1 or N channel fiber array in equipment, 1 or N channel wave on another section and light back board
Lead array docking.
The fibre core spacing that the thickness of the multimode lightguide chip is equal to fiber array subtracts adhesive phase thickness.
The bending radius of 90 ° of bent lightguides is 5000~50000 μm.
90 ° of bent lightguides are silicon substrate optical waveguide, silicon dioxide optical waveguide, GaAs optical waveguide, lithium niobate light
Waveguide, polymer optical wave guide or glass-based ion exchange optical waveguide.
The waveguide core diameter or the wide a height of 10~200um of sandwich layer of 90 ° of bent lightguides.
The adhesive is heat-curable glue, uv-curable glue or other kinds of polymer material.
The adhesive phase thickness is 0.5~100um.
The multimode lightguide chip is docked with fiber array and light back board respectively, and positioning card is arranged in interface
Slot carries out autoregistration plug.
Compared with prior art, the present invention is on the basis of keeping light back board to place vertically, using 90 ° of curved multimode light
Waveguide array realizes the good coupling of PLC light back board and fiber array, and the spacing for being bent multimode lightguide array passes through
The thickness of glass substrate can be controlled accurately, keep the butting error between fiber array and light back board smaller, and it is smaller right to realize
Connect loss.Interface production is simple, low to process specifications, and facilitates light back board and fiber array patch.
Detailed description of the invention
Fig. 1 is the array structure schematic diagram of N number of multimode lightguide chip portfolio for including 90 ° of bent lightguides；
The top view of Fig. 2 multimode lightguide chip；
Fig. 3 is the side view that multimode lightguide chip is connect with fiber array and light back board；
Fig. 4 is the perspective view that multimode lightguide chip is connect with fiber array and light back board.
Specific embodiment
The present invention is described in detail with specific embodiment below in conjunction with the accompanying drawings.
Embodiment 1:
As shown in Figure 1, a kind of light back board interface, by N number of 1 group of multimode lightguide chip for including 90 ° of bent lightguides 13
The array of conjunction is constituted, wherein N >=2.The upper table of the substrate 12 of each multimode lightguide chip and adjacent multimode lightguide chip
Face (multimode lightguide chip 1 and the adjacent surface of multimode lightguide chip 2 as shown in figure 1, referring to the upper of multimode lightguide chip 1
Surface 11) it is bonded completely by adhesive 14, and in multiple multimode lightguide chips 90 ° of bent lightguides bending direction
It is consistent after bonding.Adhesive is heat-curable glue, adhesive phase thickness 50um.
Wherein, the fibre core spacing that the thickness of each multimode lightguide chip is equal to fiber array subtracts adhesive phase thickness.
The bending radius of 90 ° of bent lightguides 13 is 10000 μm.90 ° of bent lightguides 13 are silicon substrate optical waveguide,
Its waveguide core diameter or a height of 100um of sandwich layer width.
As shown in Fig. 2, the waveguide input section 15 of the multimode lightguide chip 1 and output section 16 carry out optics throwing
Light, polishing angle are-8~+8 °, and (the optical fiber in such as Fig. 3-4 is docked with the N channel fiber array in equipment in one of section
Array A1 and fiber array A2), another section is docked with the N channel waveguide array on light back board B, multimode lightguide chip 1
Corresponding interface is interface C1 and interface C2, and the settable locating groove at interface C1 and interface C2 is realized and is similar to circuit back panel
The autoregistration plug of card slot.
Embodiment 2:
A kind of light back board interface: include:
1. being made of 1 90 ° curved multimode lightguide chips, it can be described as 90 ° of curved waveguide interfaces.Each chip
Substrate is bonded with the upper surface of another chip by the way that uv-curable glue is perfectly aligned, and 1wm/cm2 UV light is used after fitting
Change 5min.The bending direction of multimode lightguide is consistent after fitting.
The array of 2.90 ° of curved multimode lightguide chip compositions inputs in waveguide and exports section progress optical polish,
Polishing angle is 8 °.The one end in section is docked with the single port fiber array of 200 μm of fibre cores in equipment, the other end and light back board
On single straight wave guide docking.
3. chip with a thickness of 400 μm, the fibre core spacing of fiber array is 500 μm.
50000 μm of the bending radius of 4.90 ° of curved multimode lightguides
5.90 ° of curved multimode lightguides are glass-based ion exchange optical waveguide.
The waveguide core diameter of 6.90 ° of curved multimode lightguides is 200 μm.
7. uv-curable glue bondline thickness is 100 μm.
Embodiment 3:
A kind of light back board interface, comprising:
1. being made of 128 90 ° curved multimode lightguide chips, it can be described as 90 ° of curved waveguide interfaces.Each chip
Substrate and the upper surface of another chip be bonded by the way that uv-curable glue is perfectly aligned, using heat-curable glue 200 after fitting
Solidify 2 hours at DEG C.The bending direction of multimode lightguide is consistent after fitting.
The array of 2.90 ° of curved multimode lightguide chip compositions inputs in waveguide and exports section progress optical polish,
Polishing angle is 0 °.The one end in section is docked with 128 fiber port arrays of 15 μm of fibre cores in equipment, the other end and light back board
On 128 end straight wave guide arrays docking.
3. chip with a thickness of 126.5 μm, the fibre core spacing of fiber array is 127um.
5000 μm of the bending radius of 4.90 ° of curved multimode lightguides
5.90 ° of curved multimode lightguides are silicon substrate optical waveguide.
The wide height of the waveguide of 6.90 ° of curved multimode lightguides is 10 μm.
7. heat-curable glue bondline thickness is 0.5 μm.
Embodiment 4:
A kind of light back board interface, comprising:
1. being made of 32 90 ° curved multimode lightguide chips, it can be described as 90 ° of curved waveguide interfaces.Each chip
Substrate and the upper surface of another chip be bonded by the way that uv-curable glue is perfectly aligned, polyimide polymer is used after fitting
Solidify 1 hour at 120 DEG C.The bending direction of multimode lightguide is consistent after fitting.
The array of 2.90 ° of curved multimode lightguide chip compositions inputs in waveguide and exports section progress optical polish,
Polishing angle is -4.5 °.The one end in section is docked with 32 fiber port arrays of 50 μm of fibre cores in equipment, and the other end and light are carried on the back
32 end straight wave guide arrays docking on plate.
3. chip with a thickness of 240 μm, the fibre core spacing of fiber array is 250um.
20000 μm of the bending radius of 4.90 ° of curved multimode lightguides
5.90 ° of curved multimode lightguides are polymer optical wave guide.
The waveguide of 6.90 ° of curved multimode lightguides is a height of 50 μm wide.
7. heat-curable glue bondline thickness is 10 μm.
Claims (9)
1. a kind of light back board interface, which is characterized in that the interface is 90 ° of curved waveguide array interfaces, by 1 or N number of includes 90 °
The array of the multimode lightguide chip portfolio of bent lightguide is constituted, wherein N >=2；
The substrate of each multimode lightguide chip and the upper surface of adjacent multimode lightguide chip are perfectly aligned by adhesive
Bonding, and in multiple multimode lightguide chips 90 ° of bent lightguides bending direction it is consistent after bonding.
2. a kind of light back board interface according to claim 1, which is characterized in that the waveguide of the multimode lightguide chip
Input carries out optical polish with output section, and polishing angle is -8 °~+8 °, 1 or N channel on one of section and equipment
Fiber array docking, another section is docked with 1 or N channel waveguide array on light back board.
3. a kind of light back board interface according to claim 1, which is characterized in that the thickness of the multimode lightguide chip
Fibre core spacing equal to fiber array subtracts adhesive phase thickness.
4. a kind of light back board interface according to claim 1, which is characterized in that the bending of 90 ° of bent lightguides
Radius is 5000~50000 μm.
5. a kind of light back board interface according to claim 1, which is characterized in that 90 ° of bent lightguides are silicon substrate
Optical waveguide, silicon dioxide optical waveguide, GaAs optical waveguide, lithium niobate fiber waveguide, polymer optical wave guide or glass base ion exchange
Optical waveguide.
6. a kind of light back board interface according to claim 1, which is characterized in that the waveguide of 90 ° of bent lightguides
Core diameter or sandwich layer are a height of 10~200 μm wide.
7. a kind of light back board interface according to claim 1, which is characterized in that the adhesive is heat-curable glue or purple
Outer solidification glue.
8. a kind of light back board interface according to claim 1, which is characterized in that the adhesive phase thickness be 0.5~
100μm。
9. a kind of light back board interface according to claim 1, which is characterized in that the multimode lightguide chip respectively with
Fiber array and light back board docking are arranged locating groove in interface, carry out autoregistration plug.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610226966.6A CN105676353B (en) | 2016-04-13 | 2016-04-13 | A kind of light back board interface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610226966.6A CN105676353B (en) | 2016-04-13 | 2016-04-13 | A kind of light back board interface |
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| Publication Number | Publication Date |
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| CN105676353A CN105676353A (en) | 2016-06-15 |
| CN105676353B true CN105676353B (en) | 2019-03-19 |
Family
ID=56309706
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|---|---|
| CN105676353A (en) | 2016-06-15 |
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Effective date of registration: 20200526 Address after: 213000 Jiangsu province west of the city of Changzhou Taihu science and Technology Industrial Park Dragon Road No. 2 Patentee after: Changzhou optical core integrated optics Co., Ltd Address before: 215400 Taicang Economic Development Zone, Jiangsu, Qingdao West Road, No. 38, No. Patentee before: SUZHOU OPTICORE INTEGRATED OPTICAL Co.,Ltd. |
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