CN105598613A - Full-automatic wire bonder welding head - Google Patents
Full-automatic wire bonder welding head Download PDFInfo
- Publication number
- CN105598613A CN105598613A CN201510950549.1A CN201510950549A CN105598613A CN 105598613 A CN105598613 A CN 105598613A CN 201510950549 A CN201510950549 A CN 201510950549A CN 105598613 A CN105598613 A CN 105598613A
- Authority
- CN
- China
- Prior art keywords
- voice coil
- coil motor
- strain
- rectangular block
- transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0247—Driving means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a full-automatic wire bonder welding head which solves the problems that in wire wedge bonding, the micro-force output stability is poor and control regulation is difficult. The full-automatic wire bonder welding head comprises a motor fixing frame (19), a voice coil motor, an industrial control computer and a wire-bonding ultrasonic transducer; piezoelectric ceramic (10) is arranged at the right end of the wire-bonding ultrasonic transducer, the left end of the wire-bonding ultrasonic transducer is connected with a riving knife (11), a voice coil motor stator (6) is fixedly connected to the lower end face of a micro-force actuating mechanism installing plate (1) in an inverted and hung mode, an elastic deformation rectangle block (2) is connected between the micro-force actuating mechanism installing plate and a transducer installing sleeve (9), the top end face of a voice coil motor rotor (7) is connected with the top end face of the transducer installing sleeve in an abutted mode, and the piezoelectric ceramic, the voice coil motor and a position sensor (8) are all electrically connected with the industrial control computer together. In the whole pressure stroke, the full-automatic wire bonder welding head is stable and reliable in pressure control and good in repeatability.
Description
Technical field
The present invention relates to a kind of wire bonder, particularly a kind of soldering tip of wire bonder.
Background technology
Full-automatic lead bonding machine is by completing the absorption location of chip and substrate, and the exactitude position of chopper and substrate pads can be realized the functions such as Bonding, base plate heating, automatic feeding, pressure control simultaneously, interconnected to realize the lead-in wire of chip chamber. Manual equipment at present mostly, what adopt is that cylinder and spring regulate, the mode of manual pressure, on wedge bonding uses automatically, manual pressure is unavailable, and cylinder regulates reaction partially slow, can not meet the demand of automatic wedge bonding at a high speed, and the common spring pressuring method adopting, output pressure changes greatly, causes bonding welding point unstable.
Summary of the invention
The invention provides a kind of full-automatic lead bonding machine soldering tip, solved the technical problem that small power output stability is poor and control and regulation are difficult existing in lead-in wire wedge bonding.
The present invention solves above technical problem by the following technical programs:
A kind of full-automatic lead bonding machine soldering tip, comprise motor fixing frame, voice coil motor, Industrial Control Computer and Bonding ultrasonic transducer, on motor fixing frame, be respectively arranged with motor and bearing, in bearing, be provided with rotating shaft, on rotating shaft, be provided with belt wheel, between belt wheel and the output shaft of motor, be provided with driving belt, lower end at rotating shaft is connected with retainer plate, right-hand member at Bonding ultrasonic transducer is provided with piezoelectric ceramics, left end at Bonding ultrasonic transducer is connected with chopper, the voice coil motor being provided with in upper and lower vertical direction on strain rectangular block passes through hole, be provided with left-hand thread hole at the left end of strain rectangular block, be provided with right-hand thread hole at the right-hand member of strain rectangular block, voice coil motor stator is to be fixedly hanging connected on the lower surface of retainer plate with being inverted, left connecting bolt links together the left end of strain rectangular block and retainer plate by the left-hand thread hole of the left end setting of strain rectangular block, the right-hand member of strain rectangular block is fixed together by the right connecting bolt in right-hand thread hole and transducer installation sleeve, in transducer installation sleeve, be provided with Bonding ultrasonic transducer, the voice coil motor arranging on strain rectangular block is provided with voice coil motor stator in by hole, together with the top end face apical grafting of the top end face of voice coil motor mover and transducer installation sleeve, be provided with position measurement portal frame at the right-hand member of transducer installation sleeve, position measurement portal frame is fixed together by portal frame connecting bolt and transducer installation sleeve, on retainer plate below the back timber of position measurement portal frame, be provided with position sensor, piezoelectric ceramics, voice coil motor and position sensor are electrically connected with Industrial Control Computer respectively.
I shape groove through hole before and after being provided with in the strain rectangular block of being made by beryllium-bronze material in horizontal direction.
It is leaf spring that the present invention uses the strain rectangular block of beryllium-bronze material, elastic performance and the stability of full-automatic lead bonding machine soldering tip chopper are improved, the small power output area of wedge bonding that makes to go between of the voice coil motor with unlimited resolution ratio adopting is controlled at 5-150 gram force, pressure control resolution ± 3 gram force, and in whole pressure stroke, pressure control is reliable and stable, reproducible.
Brief description of the drawings
Fig. 1 is structural representation of the present invention;
Fig. 2 is the structural representation of strain rectangular block 2 of the present invention;
Fig. 3 is the structural principle schematic diagram of the present invention before 2 distortion of strain rectangular block;
Fig. 4 is the structural principle schematic diagram of the present invention after 2 distortion of strain rectangular block.
Detailed description of the invention
Below in conjunction with accompanying drawing, the present invention is described in detail:
A kind of full-automatic lead bonding machine soldering tip, comprise motor fixing frame 19, voice coil motor, Industrial Control Computer and Bonding ultrasonic transducer, on motor fixing frame 19, be respectively arranged with motor 18 and bearing 20, in bearing 20, be provided with rotating shaft 15, on rotating shaft 15, be provided with belt wheel 16, between belt wheel 16 and the output shaft of motor 18, be provided with driving belt 17, be connected with retainer plate 1 in the lower end of rotating shaft 15, be provided with piezoelectric ceramics 10 at the right-hand member of Bonding ultrasonic transducer, be connected with chopper 11 at the left end of Bonding ultrasonic transducer, the voice coil motor being provided with on strain rectangular block 2 in upper and lower vertical direction passes through hole 3, be provided with left-hand thread hole 4 at the left end of strain rectangular block 2, be provided with right-hand thread hole 5 at the right-hand member of strain rectangular block 2, voice coil motor stator 6 is to be fixedly hanging connected on the lower surface of retainer plate 1 with being inverted, left connecting bolt links together the left end of strain rectangular block 2 and retainer plate 1 by the left-hand thread hole 4 of the left end setting of strain rectangular block 2, the right-hand member of strain rectangular block 2 is fixed together by the right connecting bolt in right-hand thread hole 5 and transducer installation sleeve 9, in transducer installation sleeve 9, be provided with Bonding ultrasonic transducer, the voice coil motor arranging on strain rectangular block 2 is by being provided with voice coil motor stator 6 in hole 3, together with the top end face apical grafting of the top end face of voice coil motor mover 7 and transducer installation sleeve 9, be provided with position measurement portal frame 13 at the right-hand member of transducer installation sleeve 9, position measurement portal frame 13 is fixed together by portal frame connecting bolt 12 and transducer installation sleeve 9, on retainer plate 1 below the back timber of position measurement portal frame 13, be provided with position sensor 8, piezoelectric ceramics 10, voice coil motor and position sensor 8 are electrically connected with Industrial Control Computer respectively.
I shape groove through hole 14 before and after being provided with in the strain rectangular block 2 of being made by beryllium-bronze material in horizontal direction.
Voice coil motor of the present invention is under the control of industrial computer, and the mover of voice coil motor moves downward, and by apical grafting transducer installation sleeve 9, drives Bonding ultrasonic transducer to move downward, and makes chopper 11 complete welding action. Move downward in process at transducer installation sleeve 9, the right-hand member that transducer installation sleeve 9 draws strain rectangular block 2 moves downward, make the I-groove 14 in strain rectangular block 2 produce distortion, cause strain rectangular block 2 to produce tractive force upwards to transducer installation sleeve 9, realized the stable output of slight pressure; Transducer installation sleeve 9 moves downward and drives position measurement portal frame 13 to move downward simultaneously, position sensor 8 records the downward displacement of position measurement portal frame 13 and sends industrial computer to, industrial computer is controlled and reports to the police to realize by the size that judges displacement, adopt strain rectangular block 2 to add the design of voice coil motor, voice coil motor is designed in dynamometry foremost, reduce the transmission link of power.
" work " font groove is opened in the inside of described strain rectangular block 2, has effectively strengthened the elastic performance on its above-below direction. Its material is beryllium-bronze, and beryllium-bronze is precipitation-hardening alloy, and solid solution aging has very high intensity, hardness, elastic limit and fatigue limit after processing, and elastic hysteresis is little, and has anti-corrosion characteristic. These characteristics have well improved elastic performance, restorability energy and the stability of leaf spring, have effectively extended its working life.
Described voice coil motor is a kind of direct-driving motor, except avoided transmission link the same as linear electric motors exists the deficiencies such as gap, there is in theory unlimited resolution ratio, also have or not hysteresis, high response, high-speed, high acceleration, force characteristic is stable and control the advantages such as convenient, is more suitable for driving the small power output mechanism of frequent start-stop. Described voice coil motor meets the small power output area of lead-in wire wedge bonding and is controlled at 5-150gf(gram force), the requirement of pressure control resolution ± 3gf, and in whole pressure stroke, pressure control is reliable and stable, reproducible.
A method of work for the small power output mechanism of lead-in wire wedge bonding in full-automatic lead bonding machine soldering tip, comprises the following steps:
The first step, the I shape groove through hole 14 of horizontal direction is set in the strain rectangular block 2 of being made by beryllium-bronze material, on strain rectangular block 2, arrange along the voice coil motor of upper and lower vertical direction and pass through hole 3, at the left end of strain rectangular block 2, left-hand thread hole 4 is set, at the right-hand member of strain rectangular block 2, right-hand thread hole 5 is set, voice coil motor stator 6 is inverted and is fixedly hanging connected on the lower surface of retainer plate 1, the left-hand thread hole 4 that left connecting bolt arranges by the left end of strain rectangular block 2 is connected the left end of strain rectangular block 2 with the lower surface of retainer plate 1, the right-hand member of strain rectangular block 2 is fixedly connected with transducer installation sleeve 9 by the bolt in right-hand thread hole 5, in transducer installation sleeve 9, be provided with Bonding ultrasonic transducer, the voice coil motor along upper and lower vertical direction arranging on strain rectangular block 2 is by being provided with voice coil motor stator 6 in hole 3, together with the top end face apical grafting of the top end face of voice coil motor mover 7 and transducer installation sleeve 9, be provided with position measurement portal frame 13 on the right side of transducer installation sleeve 9, position measurement portal frame 13 is to be fixed together by portal frame connecting bolt 12 and transducer installation sleeve 9, on retainer plate 1 below the back timber of position measurement portal frame 13, be provided with position sensor 8, piezoelectric ceramics 10, voice coil motor and position sensor 8 are electrically connected with industrial computer respectively,
Second step, industrial computer send enabled instruction to voice coil motor, voice coil motor mover 7 stretches out downwards, drive transducer installation sleeve 9 to move downward, moving transducer installation sleeve 9 drives the right-hand member of strain rectangular block 2 to move downward, make the I-groove 14 in strain rectangular block 2 produce distortion, strain rectangular block 2 produces a tractive force upwards to transducer installation sleeve 9, be subject to the downward pressure of voice coil motor mover 7 with transducer installation sleeve 9 and reach balance, realized the precise and stable output of small power;
The 3rd step, move downward simultaneously at transducer installation sleeve 9, position sensor 8 records the downward displacement of position measurement portal frame 13 and sends industrial computer to, if this displacement exceedes predefined threshold value, industrial computer sends alarm signal.
The measure that applies of Bonding pressure of the present invention mainly completes by the moment of controlling voice coil motor. Its detailed process is first to utilize height finder system to make vertical direction touch the object that need to exert pressure, then by controlling the moment increase of voice coil motor or reducing to realize the control that the small power of lead-in wire wedge bonding is exported. In welding process, chopper 11 is realized the output of slight pressure by small displacement downwards, be changed to H2 in the value of this process Position Sensor 8 from H1. Δ H=H1-H2 has not only shown the micro-displacement of chopper vertical direction, has also reflected the size of each solder joint amount of plastic deformation simultaneously. Described position sensor 8 is a kind of high-resolution sensors with integrated temperature compensation, has realized the sensitive feedback of bonding pressure. Adopt Output pressure close-loop control mode simultaneously, effectively improve stability and the accuracy of bonding pressure. Guarantee the moulding deflection uniformity of welding quality and each solder joint.
Described voice coil motor has without lagging behind, high response, high-speed, high acceleration, force characteristic are stable and control the advantages such as convenient, voice coil motor adopts larger electric constant, can the very little power of very large Current Control (5-150gf) export, be suitable for driving the small power output mechanism of frequent start-stop. The small power output area of the wedge bonding that makes to go between is controlled at 5-150gf, pressure control resolution ± 3gf, and in whole pressure stroke, pressure control is reliable and stable, reproducible.
Claims (2)
1. a full-automatic lead bonding machine soldering tip, comprise motor fixing frame (19), voice coil motor, Industrial Control Computer and Bonding ultrasonic transducer, on motor fixing frame (19), be respectively arranged with motor (18) and bearing (20), in bearing (20), be provided with rotating shaft (15), on rotating shaft (15), be provided with belt wheel (16), between belt wheel (16) and the output shaft of motor (18), be provided with driving belt (17), be connected with retainer plate (1) in the lower end of rotating shaft (15), be provided with piezoelectric ceramics (10) at the right-hand member of Bonding ultrasonic transducer, be connected with chopper (11) at the left end of Bonding ultrasonic transducer, it is characterized in that, the voice coil motor being provided with on strain rectangular block (2) in upper and lower vertical direction passes through hole (3), be provided with left-hand thread hole (4) at the left end of strain rectangular block (2), be provided with right-hand thread hole (5) at the right-hand member of strain rectangular block (2), voice coil motor stator (6) is to be fixedly hanging connected on the lower surface of retainer plate (1) with being inverted, the left-hand thread hole (4) that left connecting bolt arranges by the left end of strain rectangular block (2) links together the left end of strain rectangular block (2) and retainer plate (1), the right-hand member of strain rectangular block (2) is fixed together by the right connecting bolt in right-hand thread hole (5) and transducer installation sleeve (9), in transducer installation sleeve (9), be provided with Bonding ultrasonic transducer, be provided with voice coil motor stator (6) at the upper voice coil motor arranging of strain rectangular block (2) in by hole (3), together with the top end face apical grafting of the top end face of voice coil motor mover (7) and transducer installation sleeve (9), be provided with position measurement portal frame (13) at the right-hand member of transducer installation sleeve (9), position measurement portal frame (13) is fixed together by portal frame connecting bolt (12) and transducer installation sleeve (9), on retainer plate (1) below the back timber of position measurement portal frame (13), be provided with position sensor (8), piezoelectric ceramics (10), voice coil motor and position sensor (8) are electrically connected with Industrial Control Computer respectively.
2. a kind of full-automatic lead bonding machine soldering tip according to claim 1, is characterized in that, the I shape groove through hole (14) before and after being provided with in the strain rectangular block (2) of being made up of beryllium-bronze material in horizontal direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510950549.1A CN105598613A (en) | 2015-12-18 | 2015-12-18 | Full-automatic wire bonder welding head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510950549.1A CN105598613A (en) | 2015-12-18 | 2015-12-18 | Full-automatic wire bonder welding head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105598613A true CN105598613A (en) | 2016-05-25 |
Family
ID=55979231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510950549.1A Pending CN105598613A (en) | 2015-12-18 | 2015-12-18 | Full-automatic wire bonder welding head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105598613A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106641146A (en) * | 2016-09-22 | 2017-05-10 | 宁波尚进自动化科技有限公司 | Connecting rod mechanism |
| CN109175652A (en) * | 2018-10-24 | 2019-01-11 | 昆山佰奥智能装备股份有限公司 | XZ fine adjustment mould group |
| CN110246778A (en) * | 2019-03-05 | 2019-09-17 | 大连佳峰自动化股份有限公司 | A kind of pivot angle is separable and binds the adjustable binding mechanism of power |
| CN111933554A (en) * | 2020-09-15 | 2020-11-13 | 西安贝伦环保科技有限公司 | Chip packaging manufacturing equipment |
| CN113814623A (en) * | 2021-11-23 | 2021-12-21 | 大族激光科技产业集团股份有限公司 | Welding force correction method and correction device |
| CN114388407A (en) * | 2021-12-24 | 2022-04-22 | 凌波微步半导体设备(常熟)有限公司 | Bonding head device and bonding machine |
| US20220134469A1 (en) * | 2020-11-05 | 2022-05-05 | Kulicke And Soffa Industries, Inc. | Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods |
| CN116871748A (en) * | 2023-06-28 | 2023-10-13 | 宁波尚进自动化科技有限公司 | Temperature compensation device and method for force control system |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
| US5950903A (en) * | 1997-03-13 | 1999-09-14 | F & K Delvotec Bondtechnik Gmbh | Bonding head |
| US5979737A (en) * | 1997-02-06 | 1999-11-09 | F & K Delvotec Bondtechnik Gmbh | Ultrasonic bonding head comprising a linear motor for adjusting the pressure according to a piezo detector |
| US6439448B1 (en) * | 1999-11-05 | 2002-08-27 | Orthodyne Electronics Corporation | Large wire bonder head |
| US6616030B2 (en) * | 2001-05-07 | 2003-09-09 | West Bond, Inc. | Gantry mounted ultrasonic wire bonder with orbital bonding tool head |
| CN101777505A (en) * | 2009-12-29 | 2010-07-14 | 天津大学 | Rotating lead bonding joint device |
| CN101920395A (en) * | 2010-09-07 | 2010-12-22 | 中国科学院长春光学精密机械与物理研究所 | Ultrasonic Aluminum Wire Pressure Welding Machine Head |
| CN102343477A (en) * | 2010-08-02 | 2012-02-08 | 北京中电科电子装备有限公司 | Bonding head device |
| CN102945813A (en) * | 2012-10-25 | 2013-02-27 | 广东工业大学 | Bonding head device applied to full-automatic wire bonding device |
| TWM490346U (en) * | 2014-06-27 | 2014-11-21 | Univ Chien Hsin Sci & Tech | Wing protection mechanism of rotary wing aircraft |
-
2015
- 2015-12-18 CN CN201510950549.1A patent/CN105598613A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
| US5979737A (en) * | 1997-02-06 | 1999-11-09 | F & K Delvotec Bondtechnik Gmbh | Ultrasonic bonding head comprising a linear motor for adjusting the pressure according to a piezo detector |
| US5950903A (en) * | 1997-03-13 | 1999-09-14 | F & K Delvotec Bondtechnik Gmbh | Bonding head |
| US6439448B1 (en) * | 1999-11-05 | 2002-08-27 | Orthodyne Electronics Corporation | Large wire bonder head |
| US6616030B2 (en) * | 2001-05-07 | 2003-09-09 | West Bond, Inc. | Gantry mounted ultrasonic wire bonder with orbital bonding tool head |
| CN101777505A (en) * | 2009-12-29 | 2010-07-14 | 天津大学 | Rotating lead bonding joint device |
| CN102343477A (en) * | 2010-08-02 | 2012-02-08 | 北京中电科电子装备有限公司 | Bonding head device |
| CN101920395A (en) * | 2010-09-07 | 2010-12-22 | 中国科学院长春光学精密机械与物理研究所 | Ultrasonic Aluminum Wire Pressure Welding Machine Head |
| CN102945813A (en) * | 2012-10-25 | 2013-02-27 | 广东工业大学 | Bonding head device applied to full-automatic wire bonding device |
| TWM490346U (en) * | 2014-06-27 | 2014-11-21 | Univ Chien Hsin Sci & Tech | Wing protection mechanism of rotary wing aircraft |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106641146A (en) * | 2016-09-22 | 2017-05-10 | 宁波尚进自动化科技有限公司 | Connecting rod mechanism |
| CN109175652A (en) * | 2018-10-24 | 2019-01-11 | 昆山佰奥智能装备股份有限公司 | XZ fine adjustment mould group |
| CN109175652B (en) * | 2018-10-24 | 2024-07-16 | 昆山佰奥智能装备股份有限公司 | XZ precise adjustment module |
| CN110246778A (en) * | 2019-03-05 | 2019-09-17 | 大连佳峰自动化股份有限公司 | A kind of pivot angle is separable and binds the adjustable binding mechanism of power |
| CN111933554A (en) * | 2020-09-15 | 2020-11-13 | 西安贝伦环保科技有限公司 | Chip packaging manufacturing equipment |
| US20220134469A1 (en) * | 2020-11-05 | 2022-05-05 | Kulicke And Soffa Industries, Inc. | Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods |
| US11597031B2 (en) * | 2020-11-05 | 2023-03-07 | Kulicke And Soffa Industries, Inc. | Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods |
| US20230166348A1 (en) * | 2020-11-05 | 2023-06-01 | Kulicke And Soffa Industries, Inc. | Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods |
| US11865633B2 (en) | 2020-11-05 | 2024-01-09 | Kulicke And Soffa Industries, Inc. | Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods |
| CN113814623A (en) * | 2021-11-23 | 2021-12-21 | 大族激光科技产业集团股份有限公司 | Welding force correction method and correction device |
| CN114388407A (en) * | 2021-12-24 | 2022-04-22 | 凌波微步半导体设备(常熟)有限公司 | Bonding head device and bonding machine |
| CN114388407B (en) * | 2021-12-24 | 2023-02-17 | 凌波微步半导体设备(常熟)有限公司 | Bonding head device and bonding machine |
| CN116871748A (en) * | 2023-06-28 | 2023-10-13 | 宁波尚进自动化科技有限公司 | Temperature compensation device and method for force control system |
| CN116871748B (en) * | 2023-06-28 | 2024-03-26 | 宁波尚进自动化科技有限公司 | Temperature compensation device and method for force control system |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105598613A (en) | Full-automatic wire bonder welding head | |
| CN103962824B (en) | A kind of press fit device | |
| CN101032779A (en) | Arc stud welding gun and the welding method thereof | |
| CN108380786B (en) | Intelligent overload protection device of press and control method | |
| CN105590874A (en) | Operating method of micro force output mechanism for wedge bonding of lead wire | |
| CN101432084B (en) | Die cushion control device for press machine | |
| CN101389421A (en) | Cushion load control device and press machine having cushion load control device | |
| CN110901128A (en) | A screen self-adaptive pressure maintaining mechanism and pressure maintaining method thereof | |
| CN109759822B (en) | an automatic press | |
| EP2682231A1 (en) | Reciprocating servo control device for mainshaft of honing machine | |
| CN103671293B (en) | Floating weight of banbury mixer oil cylinder hydraulic control method and device | |
| JPH0270400A (en) | Method and device for reducing punching stress in a punching machine with a fixed contact tool | |
| CN105552002A (en) | Lead wedge bonding micro force output mechanism | |
| CN115799121A (en) | Semiconductor packaging strength adjusting type laminating device | |
| CN203747692U (en) | Precise adjustment control system for micro power | |
| CN110757883B (en) | Precise motion control method based on automatic compensation of position and pressure | |
| CN102120254A (en) | Direct-drive crystallizer vibration generating device and non-sinusoidal vibration method | |
| CN214588758U (en) | Double-guide-rail die bonding swing arm device | |
| CN103856102B (en) | Fine adjustment control system and the control method thereof of microkinetic | |
| CN204413514U (en) | Assembly press | |
| CN202021540U (en) | Linear motor driving device for reciprocating follow-up control of spindle of honing machine | |
| CN202934203U (en) | Multi-position micro-pressure control device | |
| CN208437565U (en) | Intelligent overload protection device for press machine | |
| CN204914575U (en) | A eccentric wheel location structure for 3D printer | |
| CN204771110U (en) | Welding machine copper line tracker |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160525 |
|
| WD01 | Invention patent application deemed withdrawn after publication |