CN105568234B - A kind of continous way coating apparatus - Google Patents
A kind of continous way coating apparatus Download PDFInfo
- Publication number
- CN105568234B CN105568234B CN201610061031.7A CN201610061031A CN105568234B CN 105568234 B CN105568234 B CN 105568234B CN 201610061031 A CN201610061031 A CN 201610061031A CN 105568234 B CN105568234 B CN 105568234B
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- China
- Prior art keywords
- chamber
- electrode plate
- negative electrode
- continous way
- substrate
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- 239000011248 coating agent Substances 0.000 title claims abstract description 24
- 238000000576 coating method Methods 0.000 title claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 34
- KRQUFUKTQHISJB-YYADALCUSA-N 2-[(E)-N-[2-(4-chlorophenoxy)propoxy]-C-propylcarbonimidoyl]-3-hydroxy-5-(thian-3-yl)cyclohex-2-en-1-one Chemical compound CCC\C(=N/OCC(C)OC1=CC=C(Cl)C=C1)C1=C(O)CC(CC1=O)C1CCCSC1 KRQUFUKTQHISJB-YYADALCUSA-N 0.000 claims abstract description 24
- 238000010407 vacuum cleaning Methods 0.000 claims abstract description 13
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 10
- 238000004544 sputter deposition Methods 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 239000000498 cooling water Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 42
- 239000002245 particle Substances 0.000 description 11
- 239000010409 thin film Substances 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000011552 falling film Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of continous way coating apparatus, including vacuum coating chamber, the vacuum coating chamber includes front chamber and rear chamber, supports target, negative electrode and backboard, the slide rack of dip-parallel setting by support frame in rear chamber, and the slide rack is used for carrying substrates；The positive electrode plate and negative electrode plate of dip-parallel setting are supported by support frame in the front chamber, substrate is between positive electrode plate and negative electrode plate by the way that the positive electrode plate plays aura with negative electrode plate under plated film vacuum pressure condition, forms vacuum cleaning apparatus；The slit that the front chamber is set with rear chamber by centre connects, and the slit is moved to rear chamber for substrate from front chamber.It is connected in the work aura region of continous way coating apparatus provided by the invention with cathode targets sputter area so that substrate does not contact the particulate in chamber before plated film, improves the quality of film layer.Meanwhile the aura cleaning before plated film can also improve the adhesive force of film layer and substrate, will not demoulding, fall film.
Description
Technical field
The present invention relates to liquid crystal display manufacturing technology field, and in particular to a kind of continous way coating apparatus.
Background technology
At present, the vacuum coating equipment of film layer is because the particulate (Particle) in itself chamber have impact on the matter of plated film
Amount, cause coated product to influence production yield because of dust in film, higher thin film transistor (TFT) especially is required to film layer
(Thin Film Transistor, referred to as：TFT) display product influences bigger.Dust is an important monitor control index in film,
Though using a piece leaf formula filming equipment, substrate can also touch the particulate (Particle) in chamber, cause film layer to pollute, with
Cause does not reach quality requirement.The problem of film layer is low with the adhesive force of substrate also be present using current vacuum coating equipment plated film,
Easy demoulding, fall film, cause film quality bad.
The content of the invention
The present invention provides a kind of continous way coating apparatus, by installing vacuum cleaning apparatus in coating chamber, makes film layer
With few particulate (Particle), the cleaning of aura before plated film can also improve the adhesive force of film layer and substrate, will not demoulding,
Fall film, improve film quality, the present invention is applied to require higher display, especially thin film transistor (TFT) to film quality
(TFT) display.
To solve the above problems, the technical solution adopted by the present invention is：
The present invention provides a kind of continous way coating apparatus, including vacuum coating chamber, before the vacuum coating chamber includes
Chamber and rear chamber, the front chamber and rear chamber are equipped with exhaust outlet, are supported tilt by support frame in chamber in the rear
The target, negative electrode and the backboard that be arranged in parallel, slide rack, the slide rack carries pulley, and for carrying substrates, the slide rack is led to
Cross pulley and guide rail and be moved to rear chamber from front chamber, the guide rail is supported by support frame, and front chamber and rear chamber are all provided with
State guide rail；The positive electrode plate and negative electrode plate of dip-parallel setting are supported by support frame in the front chamber, with cunning
Substrate in the slide rack of wheel is between positive electrode plate and negative electrode plate by the way that the positive electrode plate and negative electrode plate are true in plated film
Aura is played under the conditions of pneumatics power, forms vacuum cleaning apparatus；
The slit that the front chamber is set with rear chamber by centre is connected, and the slit is moved to for substrate from front chamber
Rear chamber.
Further, the front chamber is work aura region, and the rear chamber is cathodic sputtering aura region.
Further, the plated film vacuum pressure range that the vacuum cleaning apparatus plays aura is 0.1-10Pa, sputtering voltage
Scope lies prostrate for 1000-2000.
Further, it is provided with cooling water pipe on the positive electrode plate and negative electrode plate, negative electrode and backboard.
Further, the positive electrode plate and negative electrode plate are stainless steel plate or copper coin.
Further, the backboard is copper backboard.
The beneficial effects of the present invention are：
In continous way coating apparatus provided by the invention, substrate tilts plated film, and installs vacuum cleaning apparatus, continous way
The work aura region of coating apparatus is connected with cathode targets sputter area so that substrate does not contact micro- in chamber before plated film
Grain (Particle), improve the quality of film layer.Meanwhile the aura cleaning before plated film can also improve the attachment of film layer and substrate
Power, will not demoulding, fall film, the present invention is suitable for thin film transistor (TFT) (TFT) display higher to film quality requirement.
Brief description of the drawings
Fig. 1 is the structural representation of the continous way coating apparatus of the present invention；
Fig. 2 is the implementation view of the continous way coating apparatus of the present invention.
Embodiment
Specifically illustrate embodiments of the present invention below in conjunction with the accompanying drawings, accompanying drawing is only for reference and explanation uses, and does not form pair
The limitation of scope of patent protection of the present invention.
Embodiment 1：
As shown in figure 1, the present embodiment provides a kind of continous way coating apparatus, including vacuum coating chamber, the Vacuum Deposition
Membrane cavity room includes front chamber 1 and rear chamber 2, and the front chamber 1 and rear chamber 2 are equipped with exhaust outlet 10,20, in the rear chamber 2
Interior target 22, negative electrode and backboard 23, the slide rack 24 that dip-parallel setting is supported by support frame 21, the slide rack 24 carry
Pulley 25, for carrying substrates 3, the slide rack 24 is moved to rear chamber 2, institute by pulley 25 and guide rail 26 from front chamber 1
State guide rail 26 to be supported by support frame 21, front chamber 1 and rear chamber 2 are equipped with the guide rail 26；Pass through branch in the front chamber 1
Support 11 supports the positive electrode plate 12 of dip-parallel setting and negative electrode plate 13, and substrate 3 is from positive electrode plate 12 and negative electrode plate 13
Between aura played under plated film vacuum pressure condition by, the positive electrode plate 12 and negative electrode plate 13, form vacuum cleaning and set
It is standby, dry vacuum cleaning is carried out to substrate；The vacuum cleaning apparatus normally plays the plated film vacuum pressure range that aura works
0.1-10Pa, sputtering voltage scope are 1000-2000 volts, sputtering amount also very pettiness.
The slit 4 that the front chamber 1 is set with rear chamber 2 by centre connects, and the slit 4 is for substrate 3 with cunning
In the slide rack 24 of wheel 25 rear chamber 2 is moved to from front chamber 1.The front chamber 1 is work aura region, the rear chamber 2
For cathodic sputtering aura region.So, the work aura region of vacuum cleaning apparatus connects with cathodic sputtering aura region, so
Target coating film area is directly entered after substrate vacuum cleaned, substrate does not contact with the particulate (Particle) in chamber, and it is heavy to ensure
The particulate (Particle) of integrated membrane layer is fewer, reduces film layer dust.Simultaneously as the aura particle before plated film is to substrate
Cleaning treatment, the adhesive force of film layer and substrate can be increased, be not in that the problems such as falling film, the demoulding, ensure that depositional coating
High quality.
Cooling water pipe 5 is provided with the positive electrode plate 12 and negative electrode plate 13, negative electrode and backboard 23.
The positive electrode plate 12 and negative electrode plate 13 are stainless steel plate or copper coin.The backboard 23 is copper backboard.
The present invention is set using substrate tilting, and one side substrate glass will not fall piece because of vertical lacing film, also will not
The flow because horizontal setting, or because the deposit of target influences the quality of film layer.
In an embodiment of the present invention, the vertical plated film of continous way plated film, also referred to as In-line, with slide rack (Carriers)
Carrying substrates glass, formed by entering slice room, surge chamber, transition chamber, coating chamber etc..Due to each chamber of continous way coating apparatus
Particulate (Particle) in room influences the quality of plated film film layer, so being entered before substrate coating by vacuum cleaning apparatus to it
Row cleaning, removes the particulate (Particle) on substrate, and due to the work aura region of this vacuum cleaning apparatus and cathode target
The sputtering aura region of material is connected, and such substrate direct plated film after cleaning, is not in contact with chamber chamber particle (Particle)
Chance, reduce the quantity of particulate on substrate, meanwhile, after substrate surface carries out aura cleaning, also improve film layer and substrate
Adhesive force, demoulding is not had, falls the problems such as film, ensure that the quality of plated film film layer.
Such as above-mentioned embodiment is the preferable embodiment of the present invention, but embodiments of the present invention are not by above-described embodiment
Limitation, other any Spirit Essences without departing from the present invention with made under principle change, modification, replacement, combine, letter
Change, should be equivalent substitute mode, be included within protection scope of the present invention.
Claims (6)
1. a kind of continous way coating apparatus, including vacuum coating chamber, the vacuum coating chamber includes front chamber and rear chamber,
The front chamber and rear chamber are equipped with exhaust outlet, it is characterised in that：
The dip-parallel target for being provided as negative electrode and backboard, slide rack, institute are supported by support frame in chamber in the rear
State slide rack and be used for carrying substrates；The positive electrode plate and negative electricity of dip-parallel setting are supported by support frame in the front chamber
Pole plate, substrate is between positive electrode plate and negative electrode plate by the way that the positive electrode plate is with negative electrode plate in plated film vacuum pressure bar
Aura is played under part, forms vacuum cleaning apparatus；
The slit that the front chamber is set with rear chamber by centre connects, and the slit is moved to back cavity for substrate from front chamber
Room.
2. continous way coating apparatus according to claim 1, it is characterised in that：
The front chamber is work aura region, and the rear chamber is cathodic sputtering aura region.
3. continous way coating apparatus according to claim 1, it is characterised in that：
The plated film vacuum pressure range that the vacuum cleaning apparatus plays aura is 0.1-10Pa, and sputtering voltage scope is 1000-
2000 volts.
4. continous way coating apparatus according to claim 1, it is characterised in that：
Cooling water pipe is provided with the positive electrode plate and negative electrode plate, negative electrode and backboard.
5. the continous way coating apparatus according to claim 1 or 4, it is characterised in that：
The positive electrode plate and negative electrode plate are stainless steel plate or copper coin.
6. the continous way coating apparatus according to claim 1 or 4, it is characterised in that：
The backboard is copper backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610061031.7A CN105568234B (en) | 2016-01-28 | 2016-01-28 | A kind of continous way coating apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610061031.7A CN105568234B (en) | 2016-01-28 | 2016-01-28 | A kind of continous way coating apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105568234A CN105568234A (en) | 2016-05-11 |
| CN105568234B true CN105568234B (en) | 2018-01-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610061031.7A Active CN105568234B (en) | 2016-01-28 | 2016-01-28 | A kind of continous way coating apparatus |
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| Country | Link |
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| CN (1) | CN105568234B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109957771A (en) * | 2017-12-14 | 2019-07-02 | 湘潭宏大真空技术股份有限公司 | Hand-set lid color film horizontal film coating production line |
| CN109957782A (en) * | 2017-12-14 | 2019-07-02 | 湘潭宏大真空技术股份有限公司 | Mobile phone glass cover board metal flag vacuum coating production line |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5689051B2 (en) * | 2011-11-25 | 2015-03-25 | 株式会社神戸製鋼所 | Ion bombardment equipment |
| TW201326436A (en) * | 2011-12-19 | 2013-07-01 | Juant Technology Co Ltd | Double-sided coating method suitable for passive component |
| EP2650135A1 (en) * | 2012-04-12 | 2013-10-16 | KBA-NotaSys SA | Intaglio printing plate coating apparatus |
| CN103898480A (en) * | 2014-03-25 | 2014-07-02 | 侯光辉 | A device and method for continuously vacuum-coating a waterproof film on an electronic device |
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| Publication number | Publication date |
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| CN105568234A (en) | 2016-05-11 |
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