CN105493015B - Capacitance touch screen - Google Patents
Capacitance touch screen Download PDFInfo
- Publication number
- CN105493015B CN105493015B CN201580000931.4A CN201580000931A CN105493015B CN 105493015 B CN105493015 B CN 105493015B CN 201580000931 A CN201580000931 A CN 201580000931A CN 105493015 B CN105493015 B CN 105493015B
- Authority
- CN
- China
- Prior art keywords
- pin
- touch screen
- capacitance touch
- substrate
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000010408 film Substances 0.000 claims description 24
- 239000010410 layer Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 239000002042 Silver nanowire Substances 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229920002521 macromolecule Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000010409 thin film Substances 0.000 claims description 2
- 239000002238 carbon nanotube film Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 abstract description 8
- 239000002184 metal Substances 0.000 abstract description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 239000002356 single layer Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Position Input By Displaying (AREA)
Abstract
A kind of capacitance touch screen (10) can connect with a flexible circuit board (FPC), which includes the first pin (32) of multiple spacing side by side settings.The capacitance touch screen (10) includes a substrate (12) and the lead district (24) for being set to the substrate (12), the lead district (24) includes the second pin (26) of multiple spacing side by side settings, the width of each second pin (26) is greater than the width of each first pin (32), and the spacing of adjacent second pin (26) is less than the spacing of adjacent first pin (32).Since the spacing of adjacent first pin (32) is larger, small metal ball included in the ACF on the first pin (32) connects the short circuit for being also not easy to be formed adjacent first pin (32).In addition, since the width that the width of second pin (26) is greater than each first pin (32) is also not easy short circuit even if slightly shifting between touch screen (10) and FPC (30) between pin.The combination of a kind of capacitance touch screen (10) and FPC (30) is also provided.
Description
Technical field
The present invention relates to touch screen more particularly to capacitance touch screens.
Background technique
Since current touch screen is with simplifying structure and reducing the demands such as cost, single-layer type touch screen has increasingly becomed one
Kind trend.Single-layer type touch screen refers to the conductive pattern being formed simultaneously on substrate for driving and incuding, and in pattern area
The interaction that driving and induction are realized by way of bridge formation or jump point is not needed.Due to the performance and biography of single-layer type touch screen
Single layer of uniting is built bridge or double-layer structure is close, therefore is rapidly developed, and can stablize scale of mass production at present.
The pin that single-layer type touch screen is used to connect flexible circuit board (FPC) is more, is with 5 cun or so of screen of single-ended outlet
Example, pin have more than 200.In this way, it is 0.27mm that a kind of design, which can be pitch (pitch) value, pin (pin) is wide
0.12mm, spacing (gap) the width 0.15mm between pin.FPC is identical as this design simultaneously, complete at bonding (bonding) in this way
Full contraposition, because spacing is wider, is not easy short circuit, but this design will affect contact resistance even if some deviations.
In the case where the spacing between needing the pin of touch screen and FPC is all made smaller situation, hot pressing FPC pin and touch
Shield so that anisotropic conductive band film (Anisotropic Conductive Film, ACF) attached on pin plays and electrically connects
When connecing pin and touch screen, the small metal ball that several um of diameter to more than ten um included in ACF are not waited easily is connected and shape
At adjacent leads short circuit.Simultaneously because pin is more, touch screen and FPC slightly deviation are easily formed short circuit.In addition, flexible base
Material size distortion is than more serious, and causing FPC pin to be gone up with screen, pin size is different to be exactly matched, and increases the risk of short circuit.
Summary of the invention
Embodiments of the present invention provide a kind of capacitance touch screen that can solve above-mentioned technical problem.
A kind of capacitance touch screen can be connect with a flexible circuit board (FPC), which includes multiple spacing side by side
The first pin being arranged.The capacitance touch screen includes a substrate and the lead district for being set to the substrate, which includes multiple
The second pin of spacing side by side setting, the width of each second pin are greater than the width of each first pin, between adjacent second pin
Away from the spacing for being less than adjacent first pin.
A kind of capacitance touch screen can be combined with flexible circuit board (FPC), which includes that multiple spacing side by side are set
The first pin set, the capacitance touch screen include a substrate and the lead district for being set to the substrate, the lead district include it is multiple simultaneously
Arrange spaced second pin.The width of each second pin is greater than the width of each first pin, the spacing of adjacent second pin
Less than the spacing of adjacent first pin, each second pin is electrically connected with corresponding first pin.
Under technical solution of the present invention, the width of each second pin is greater than the width of each first pin, and adjacent second draws
The spacing of foot is less than the spacing of adjacent first pin, and therefore, small metal ball included in the ACF on the first pin connects
Also it is not easy to form the short circuit of adjacent first pin.In addition, the width due to second pin is greater than the width of each first pin, even if
It slightly shifts between touch screen and FPC, is also not easy that short circuit occurs because of the short circuit of the first pin between second pin.Such as
This, the bonding yield between touch screen and FPC is improved, therefore production cost also reduces.
Detailed description of the invention
Following drawings is used to combine specific embodiment each embodiment that the present invention will be described in detail.It should be appreciated that attached
Each element illustrated in figure does not represent actual size and proportionate relationship, merely to clearly illustrating and illustrating what is come and show
It is intended to, is not construed as limitation of the present invention.
Fig. 1 is the plan view that the capacitance touch screen that better embodiment of the present invention provides and FPC are in discrete state.
Fig. 2 is the side schematic view for illustrating the capacitance touch screen that Fig. 1 is made in the way of radium-shine.
Fig. 3 is the part enlarged plan view of the capacitance touch screen of Fig. 1.
Fig. 4 be Fig. 1 capacitance touch screen and the respective pin of FPC be in do not contact with each other state when schematic diagram.
Fig. 5 is the schematic diagram when pin of Fig. 4 respectively contacts.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with multiple embodiments and
Attached drawing, the present invention will be described in further detail.It should be appreciated that the specific embodiments described herein are only used to explain
The present invention is not intended to limit the present invention.
Incorporated by reference to Fig. 1, it illustrates the plane views that discrete state is in front of capacitance touch screen 10 and the mutual bonding of FPC30
Figure, FPC30 have the first pin 32, and capacitance touch screen 10 has a second pin 26 for connecting with the first pin 32, and first
And the detailed construction of second pin 32,26 see below.Please in conjunction with Fig. 2 and Fig. 3, which respectively show capacitance touch screens 10
Lateral plan and part enlarged plan view.Capacitance touch screen 10 includes the conductive layer 14 of substrate 12 and setting on the base substrate 12.
Substrate 12 can be made of clear material, such as glass or polyethylene terephthalate (Polyethylene
Terephthalate, PET), in favor of making the display screen mould group or other applications for needing transparent characteristic with touch function
Scene.When needing capacitance touch screen 10 to have flexible, optional PET makes substrate 12, and PET has translucency and flexibility good, easily
In manufacture the advantages that.In the present embodiment, the thickness of substrate 12 made of PET is about 0.015 to 0.2 millimeter (mm), excellent
It is selected as 0.1mm, the substrate in this thickness has preferable flexibility.Certainly, in the case where other without transparent characteristic, base
Material 12 can also be made of nontransparent material, such as metal.
What conductive layer 14 can be electrically conducting transparent includes the film of the metal of nanometer dimension, such as includes the list of nanometer dimension
One metal, alloy, metallic compound or its any of the above combine the film to be formed, film, packet for example including nano metal silk
Film, the film including nano metal grid for including nano-metal particle, naturally it is also possible to be that graphene film, carbon nanotube are thin
Film, organic conductive macromolecule thin polymer film, tin indium oxide (Indium Tin Oxide, ITO) film or any of the above group
It closes.In the present embodiment, conductive layer 14 is the silver nanowire film of electrically conducting transparent, is to include one layer to have silver nanowire
The film of polymeric matrix, disordered uniform is distributed silver nanowire in the film, so that film has transparent and conductive feature.It receives
Meter Yin Si film can be set up by way of coating, silk-screen or injection to substrate 12.
Preferably, capacitance touch screen 10 further includes being located at protective layer 16 of the substrate 12 back to 14 side of conductive layer, protective layer
16 can be fixed to substrate 12 by coating method by scratch resistance material, such as polycarbonate material etc..
Conductive layer 14, which is formed on by radium-shine mode by laser 11, is located in the middle sensing area 22 and positioned at edge
Lead district 24.Specifically, the parameter for adjusting laser 11, may make laser 11 in a manner of not removing by silver nanowire film
The characteristic of electrically conducting transparent becomes transparent and non-conductive.The laser parameter includes pulse width, pulse flux, pulse energy,
Spot size, pulse recurrence rate etc., after rotating parameter appropriate, the silver nanowire in illuminated part will become not leading from conduction
Electricity, meanwhile, the transparency of illuminated part hardly happens change, moreover, the illuminated part of silver nanowire film is hardly
There is any the case where being stripped.Certainly, in other embodiments, lead district 24 can also pass through yellow light work by conductive layer 14
Skill or silk-screen are formed.
Sensing area 22 has for sensing the pattern 26 touched, and (figure is not from the line and alignment of the extraction of pattern 26
Mark), wherein line and alignment are arranged at the side of sensing area 22.Have in lead district 24 it is multiple irradiated by laser 11 it is linear
At above-mentioned second pin 26, each second pin 26 is connected to corresponding line and alignment, in order to line with alignment by drawing
The connection of first pin 32 of the second pin 26 and FPC in line area 24 and be connected to external circuit.
Incorporated by reference to Fig. 4 and Fig. 5, it is capacitance touch screen and the respective pin 26 and 32 of FPC is in and does not contact with each other and phase
Schematic diagram when mutual contact condition.The width B2 of the second pin 26 of capacitance touch screen is greater than the width B1 of the first pin of FPC 32,
The spacing A2 of adjacent second pin 26 is less than the spacing A1 of adjacent first pin 32.In this way, each first pin 32 and corresponding
When two pins 26 are electrically connected, since the spacing of adjacent first pin 32 is larger, little Jin included in the ACF on the first pin 32
Belong to ball and connects the short circuit for being also not easy to be formed adjacent first pin 32.In addition, the width due to second pin 26 is greater than each the
The width of one pin 32 is also not easy between second pin 26 because of the first pin even if slightly shifting between touch screen and FPC
32 short circuit and short circuit occurs.In this way, the bonding yield between touch screen 10 and FPC30 is improved, production cost also because
This is reduced.
Preferably, each first pin 32 is located among a corresponding second pin 26, to reduce the risk of short circuit.
The foregoing is merely better embodiments of the invention, are not intended to limit the invention, all of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within spirit and principle.
Claims (11)
1. a kind of capacitance touch screen can be connect with a flexible circuit board (FPC), which includes that multiple spacing side by side are set
The first pin set, which is characterized in that the capacitance touch screen includes a substrate and the lead district for being set to the substrate, the lead district
Second pin including the setting of multiple spacing side by side, the width of each second pin are greater than the width of each first pin, and adjacent second
The spacing of pin is less than the spacing of adjacent first pin；Wherein, the substrate is made of clear material, which also wraps
The conductive layer for being set to the substrate and the protective layer positioned at substrate back to conductive layer side are included, the protective layer is by scratch resistance material
Substrate is fixed to by coating method.
2. capacitance touch screen as described in claim 1, which is characterized in that multiple first pin is passed through radium-shine by the conductive layer
It is formed.
3. capacitance touch screen as described in claim 1, which is characterized in that multiple first pin passes through yellow light by the conductive layer
Technique or silk-screen are formed.
4. capacitance touch screen as claimed in claim 2 or claim 3, which is characterized in that the conductive layer includes the gold with nanometer dimension
One of the film of category, carbon nano-tube film, graphene film, organic conductive macromolecule film, ito thin film or any combination thereof.
5. capacitance touch screen as claimed in claim 2 or claim 3, which is characterized in that the conductive layer includes silver nanowire film.
6. a kind of capacitance touch screen can be combined with flexible circuit board (FPC), which includes multiple spacing side by side settings
The first pin, which includes a substrate and the lead district for being set to the substrate, the lead district include it is multiple side by side
Spaced second pin, which is characterized in that the width of each second pin is greater than the width of each first pin, and adjacent second draws
The spacing of foot is less than the spacing of adjacent first pin, and each second pin is electrically connected with corresponding first pin；Wherein, institute
It states substrate to be made of clear material, which further includes being set to the conductive layer of the substrate and positioned at substrate back to leading
The protective layer of electric layer side, the protective layer are fixed to substrate by coating method by scratch resistance material.
7. capacitance touch screen as claimed in claim 6, which is characterized in that each first pin is located at a corresponding second pin
It is intermediate.
8. capacitance touch screen as claimed in claim 6, which is characterized in that multiple first pin is passed through radium-shine by the conductive layer
It is formed.
9. capacitance touch screen as claimed in claim 6, which is characterized in that multiple first pin passes through yellow light by the conductive layer
Technique or silk-screen are formed.
10. capacitance touch screen as claimed in claim 8 or 9, which is characterized in that the conductive layer includes the gold with nanometer dimension
Belong to one of film, carbon nano-tube film, graphene film, organic conductive macromolecule film, ITO or any combination thereof.
11. capacitance touch screen as claimed in claim 8 or 9, which is characterized in that the conductive layer includes silver nanowire film.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2015/072454 WO2016123811A1 (en) | 2015-02-06 | 2015-02-06 | Capacitive touch screen and combination of same with flexible circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105493015A CN105493015A (en) | 2016-04-13 |
| CN105493015B true CN105493015B (en) | 2019-04-30 |
Family
ID=55678490
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580000931.4A Expired - Fee Related CN105493015B (en) | 2015-02-06 | 2015-02-06 | Capacitance touch screen |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105493015B (en) |
| WO (1) | WO2016123811A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3451132A4 (en) * | 2016-04-26 | 2019-11-20 | Fujikura Ltd. | Wiring body, wiring body assembly, wiring substrate, and touch sensor |
| CN106775170B (en) * | 2017-01-18 | 2020-06-09 | 昆山国显光电有限公司 | Flexible circuit board and self-capacitance touch display screen |
| CN107315497A (en) * | 2017-05-31 | 2017-11-03 | 深圳欧菲光科技股份有限公司 | Contact panel and display device |
| CN107402682B (en) * | 2017-07-31 | 2021-08-10 | 张家港康得新光电材料有限公司 | Touch screen and manufacturing method thereof |
| US10774454B2 (en) | 2017-12-01 | 2020-09-15 | Haier Us Appliance Solutions, Inc. | User interface with capacitive touch sensor |
| WO2019113824A1 (en) * | 2017-12-13 | 2019-06-20 | 深圳市柔宇科技有限公司 | Flexible touch display device and touch compensation method |
| CN109739037B (en) * | 2018-11-23 | 2023-12-15 | 深圳市新盈恒科技有限公司 | Liquid crystal display of convenient maintenance |
| CN112072428B (en) * | 2020-07-13 | 2022-02-18 | 无锡市科虹标牌有限公司 | Pressing process of metal contact pin for touch film connector |
| CN113625154A (en) * | 2021-08-11 | 2021-11-09 | 翔实光电科技(昆山)有限公司 | False pressure testing device for touch screen and using method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1553430A (en) * | 2003-06-04 | 2004-12-08 | 友达光电股份有限公司 | LCD drive IC packaging assembly |
| CN2704863Y (en) * | 2002-08-21 | 2005-06-15 | 精工爱普生株式会社 | Mounting structures of semiconductor devices, electro-optical devices, and electronic equipment |
| CN201097037Y (en) * | 2007-11-06 | 2008-08-06 | 上海广电光电子有限公司 | Lcd |
| CN103094737A (en) * | 2011-11-05 | 2013-05-08 | 宝宸（厦门）光学科技有限公司 | Pin structure and pin connecting structure |
| CN203894715U (en) * | 2014-04-01 | 2014-10-22 | 深圳市柔宇科技有限公司 | Flexible touch screen and touch device |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4560026B2 (en) * | 2006-10-04 | 2010-10-13 | セイコーエプソン株式会社 | Flexible substrate, electro-optical device including the same, and electronic apparatus |
| CN101216619B (en) * | 2008-01-10 | 2010-09-22 | 友达光电股份有限公司 | Flat panel display and method of manufacturing the same, and electro-optical device and method of manufacturing the same |
| JP5125632B2 (en) * | 2008-03-10 | 2013-01-23 | セイコーエプソン株式会社 | Mounting structure and electro-optical device |
| TW201123377A (en) * | 2009-12-16 | 2011-07-01 | Raydium Semiconductor Corp | Electronic chip and substrate with void |
| CN202585815U (en) * | 2011-11-05 | 2012-12-05 | 宝宸（厦门）光学科技有限公司 | Pin structure and pin connection structure |
-
2015
- 2015-02-06 WO PCT/CN2015/072454 patent/WO2016123811A1/en active Application Filing
- 2015-02-06 CN CN201580000931.4A patent/CN105493015B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2704863Y (en) * | 2002-08-21 | 2005-06-15 | 精工爱普生株式会社 | Mounting structures of semiconductor devices, electro-optical devices, and electronic equipment |
| CN1553430A (en) * | 2003-06-04 | 2004-12-08 | 友达光电股份有限公司 | LCD drive IC packaging assembly |
| CN201097037Y (en) * | 2007-11-06 | 2008-08-06 | 上海广电光电子有限公司 | Lcd |
| CN103094737A (en) * | 2011-11-05 | 2013-05-08 | 宝宸（厦门）光学科技有限公司 | Pin structure and pin connecting structure |
| CN203894715U (en) * | 2014-04-01 | 2014-10-22 | 深圳市柔宇科技有限公司 | Flexible touch screen and touch device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016123811A1 (en) | 2016-08-11 |
| CN105493015A (en) | 2016-04-13 |
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Address after: Shenzhen City, Guangdong province 518052 Keyuan Road, Nanshan District science and Technology Park No. 15 Science Park Sinovac A4-1501 Patentee after: Shenzhen Ruoyu Technology Co.,Ltd. Address before: Shenzhen City, Guangdong province 518052 Keyuan Road, Nanshan District science and Technology Park No. 15 Science Park Sinovac A4-1501 Patentee before: SHENZHEN ROYOLE TECHNOLOGIES Co.,Ltd. |
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