CN105472216A - Electrical support with buffering structure, and camera module group - Google Patents
Electrical support with buffering structure, and camera module group Download PDFInfo
- Publication number
- CN105472216A CN105472216A CN201510867694.3A CN201510867694A CN105472216A CN 105472216 A CN105472216 A CN 105472216A CN 201510867694 A CN201510867694 A CN 201510867694A CN 105472216 A CN105472216 A CN 105472216A
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- buffer structure
- electric support
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- cell
- described electric
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- 230000003139 buffering effect Effects 0.000 title claims abstract description 9
- 238000009434 installation Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 16
- 238000010276 construction Methods 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000002322 conducting polymer Substances 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 230000003319 supportive effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Studio Devices (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
The invention discloses an electrical support with a buffering structure, and a camera module group. The electrical support comprises a support part and a bottom part. The support part is connected to the bottom part, and is suitable for the installation of a light-sensing chip in a supporting manner. The bottom part is provided with the buffering structure, and is disposed at the bottom part in a bulged manner, so as to facilitate the buffering stitching installation.
Description
Technical field
The present invention relates to camera module field, further, relate to electric support and camera module that one has buffer structure.
Background technology
Along with and electronic equipment is required that light, compact needs become increasingly conspicuous, the thing followed is a no small challenge to the properties of electronic equipment, the camera module be such as widely used, modal is the camera module be arranged in smart mobile phone.The imaging requirements of the camera module being arranged at smart mobile phone product is improved constantly, requires that picture is clear, beautiful, but high-quality imaging effect, often need more, larger components and parts to match.Such as, pixel is larger, and chip area can corresponding increase, and drive the Passive components such as resistance capacitance also correspondingly to increase, namely module size also can be increasing, and meanwhile, the assembling difficulty of camera module also improves thereupon.Therefore, the high request of smart mobile phone product day by day lightening and the image quality to the camera module be arranged in smart mobile phone, has become two opposing and development trends of speeding on the surface.
Solve the problem for catering to, under the prerequisite that the use being applied to the electric support of camera module sample largely solves along with the development of camera module product high requestization, control the problem of camera module small product size, even reduced the problem of camera module volume, and simplified the assembling process of camera module, optimize the internal structure environment of camera module.
The described electric support being applied to camera module is produced forms various required form, size, and internal preset has connecting circuit, surface programming has connection pin and/or pad, be installed in described electric support for motor (optical lens is installed in described motor), the filter of installing described camera module, and electrically connect sensitive chip, the flexible circuit board of described camera module.Meanwhile, the reasonability of setting position between each assembly that described electric support is ensured described camera module, while realizing imaging effect high-quality, is more provided the beneficial effect of the dustfree environment needed for the clear imaging of each components and parts and simple assembling.
Comprise the camera module of described electric support in assembling procedure, the pin on the sensitive chip surface of described camera module and/or pad and the described pin on electric support surface and/or the electrical connection of pad are one of modes of the connection realized between described sensitive chip and described electric support.Comprise in the assembling procedure of the camera module of described electric support in routine, described sensitive chip and described electric support heat or under ultrasonic environment by together with pressing by outside force, the pin namely on described sensitive chip and/or pad and the connection between the pin and/or pad on described electric support surface heat or under ultrasonic environment by together with pressing by outside force.But, due to described sensitive chip and described electric support dough sheet evenness separately inconsistent, that is, there is surperficial flat degree difference in described sensitive chip and described electric support, pressure force in assembling process often cannot be uniformly applied to each pin being positioned at described sensitive chip surface and described electric rack surface and/or pad, cause being positioned at the part pin of described sensitive chip surface and described electric rack surface and/or pad overstress thus and damage, or stressed deficiency and that circuit is passed through is bad.Above-mentioned two kinds of phenomenons are final all goes out yield by the quality of the product of the described camera module of impact and product.
Summary of the invention
The electric support that one object of the present invention is to provide one to have a pressing buffer structure, it arranges buffer structure at electric rack surface, thus the element needing to be installed in described electric support is installed with being buffered.
Another object of the present invention is to provide the electric support that has a pressing buffer structure, wherein said buffer structure is distributed in described electric rack surface uniformly, makes the element uniform force be mounted, is entirely mounted.
Another object of the present invention is to provide the electric support that has a pressing buffer structure, wherein said buffer structure alleviates pressure when electric component is installed in electric support, improves the force resistance of electric support.
Another object of the present invention is to provide the electric support that has a pressure buffer structure, pressure when wherein said buffer structure cushions that on electric support, element is installed, prevents element to be stamped when installing and damages, improve product yield.
Another object of the present invention is to provide the camera module that has a pressure buffer structure, it has a buffer structure and is arranged at electric support, the higher stability that camera module is had and reliability.
Another object of the present invention is to provide the camera module that has a pressure buffer structure, it, when external environment produces moving, has better electric stability.
Another object of the present invention is to provide the camera module that has a pressure buffer structure, described buffer structure can by one-time formed mode protruding be arranged at described electric support, to form a positive stop lug boss, tilt to prevent the uneven assembling caused of pressure force degree.
In order to realize above goal of the invention, an aspect of of the present present invention provides an electric support, it comprises bottom a cradle portion and one, described cradle portion is connected to described bottom, be suitable for supporting ground installation elements, described bottom has a buffer structure, be arranged at described bottom projectedly, install so that be buffered ground pressing.
According to one embodiment of the invention, described in the described electric support with buffer structure, buffer structure comprises multiple buffer cell, and described buffer cell is square, and cloth is local is arranged at described bottom.
According to one embodiment of the invention, described in the described electric support with buffer structure, buffer structure comprises multiple buffer cell, and to be that latticed cloth is local be arranged at described bottom to described buffer cell.
According to one embodiment of the invention, described in the described electric support with buffer structure, buffer structure comprises multiple buffer cell, and in laying, shape cloth is local is arranged at described bottom to described buffer cell.
According to one embodiment of the invention, described in the described electric support with buffer structure, buffer structure comprises at least one buffer cell, described buffer cell annularly layout placement in described bottom.
According to one embodiment of the invention, described in the described electric support with buffer structure, buffer cell is block structure.
According to one embodiment of the invention, the curved structure of buffer cell described in the described electric support with buffer structure.
According to one embodiment of the invention, described in the described electric support with buffer structure, buffering is in step-like structure.
According to one embodiment of the invention, described to have buffer cell in the electric support of buffer structure be hollow structure, and hollow position is suitable for arranging electric component.
According to one embodiment of the invention, described in the described electric support with buffer structure, bottom arranges electric component, and described buffer cell depends on described electric component and arranges.
According to one embodiment of the invention, described in the described electric support with buffer structure, the sectional area of buffer cell is greater than the sectional area of electric component.
According to one embodiment of the invention, described in the described electric support with buffer structure, electric component is pad or circuit pin.
According to one embodiment of the invention, described in the described electric support with buffer structure, cradle portion is boss type supporting construction, is suitable for installing a colour filter with supporting.
According to one embodiment of the invention, described in the described electric support with buffer structure, bottom is suitable for arranging a sensitive chip, and described buffer structure is between described sensitive chip and described bottom.
According to one embodiment of the invention, described in the described electric support with buffer structure, the material of buffer structure is selected from combination: insulating polymer, conducting polymer, in metal or metal oxide wherein one or more.
It will be appreciated by persons skilled in the art that the material of above-mentioned buffer structure only as an example, and do not limit the present invention.In actual applications, as long as the material of cushioning effect can be played.In addition, the shape of above-mentioned buffer structure also only as an example, and does not limit the present invention.In actual applications, shape miscellaneous can be designed to.
Another aspect of the present invention provides a camera module, comprising:
One lens assembly; With
One bracket component; Described lens assembly is installed on front side of described bracket component, and described bracket component comprises the aforesaid electric support with buffer structure.
According to one embodiment of the invention, described in the described camera module with buffer structure, bracket component comprises an electric component group, and described electric component group arranges and is installed on described electric support by described buffer structure cushioning supportive.
According to one embodiment of the invention, described in the described camera module with buffer structure, electric component is sensitive chip, and described sensitive chip comprises corresponding circuit pin respectively with described electric support, and described buffer structure depends on described circuit pin and arranges.
According to one embodiment of the invention, the height of buffer structure described in the described camera module with buffer structure is less than the gap after the pressing of described circuit pin between described sensitive chip and described electric support.
According to one embodiment of the invention, buffer structure described in the described camera module with buffer structure by one-time formed mode protruding be arranged at described electric support, to form a positive stop lug boss, tilt to prevent the uneven assembling that causes of pressure force degree.
Accompanying drawing explanation
Fig. 1 is the cutaway view with the camera module of buffer structure according to above preferred embodiment of the present invention.
Fig. 2 be according to above preferred embodiment of the present invention the structural representation of buffer structure.
Fig. 3 is the vertical view of the buffer structure according to above preferred embodiment of the present invention.
Fig. 4 A, 4B, 4C and 4D are the different layouts of the buffer structure according to above preferred embodiment of the present invention.
Fig. 5 A, 5B and 5C are the difformity schematic diagrames of the buffer structure according to above preferred embodiment of the present invention.
Embodiment
Below describe and realize the present invention for disclosing the present invention to enable those skilled in the art.Preferred embodiment in below describing only as an example, it may occur to persons skilled in the art that other apparent modification.The general principle of the present invention defined in the following description can be applied to other embodiments, deformation program, improvement project, equivalent and not deviate from the other technologies scheme of the spirit and scope of the present invention.
Referring to figs. 1 through the camera module that Fig. 3 is according to first preferred embodiment of the present invention.The electric part of described camera module is provided with a buffer structure, install with being buffered when circuit element in camera module is mounted, and mounted rear circuit element can keep good structural stability, the instability making the circuit element in camera module reduce the impact of external environment to cause, as camera module shaken, shake etc.
The described camera module with buffer structure comprises lens assembly 10 and a bracket component 20, and described lens assembly 10 is installed on described bracket component 20 with being supported.
In one embodiment of this invention, described lens assembly 10 comprises camera lens 11 and a motor 12, described motor 12 is installed on front side of described bracket component 20, and described camera lens is installed on described motor 12, makes described camera lens 11 be positioned at the front side of described bracket component 20.
Described bracket component 20 comprises electric support 21 and an electric component group 22, and described electric component is installed on described electric support, to form the electric part of described camera module.That is, by the ray cast of described lens assembly 10 incidence to the electric component group 22 being arranged at described electric support 21, thus optical information is changed into telecommunications breath, the image of record picked-up.
Described electric support 21 to comprise bottom a cradle portion 211 and one 212, described cradle portion 211 is connected on described bottom 212, be suitable for described motor 12 being installed with supporting, described buffer structure is arranged at described bottom 212, so that each element of described electric component group 22 is installed on position, described bottom 212 with being buffered.
Those skilled in the art should be understood that, described lens assembly 10 can be a tight shot assembly, also can be zoom lens assemblies, and the element therefore connected described in described cradle portion 211 is not limited to motor 12, also can be lens bracket or other parts.The type of described lens assembly 10 is not restriction of the present invention.
Citing ground, in one embodiment of the invention, described electric support 21 is formed the support shape structure of hollow by recessing in a PCB, the described bottom 212 of described electric support 21 forms the bottom of described groove, for arranging described electric component group 22, and the described cradle portion 211 of described electric support 21 forms the sidewall of described groove, for motor described in support and connection 12.Therefore, in this embodiment, described cradle portion 211 is connected to described bottom 212 integratedly.Described electric support 21 can by formed in mould mode one-shot forming.
Be worth mentioning and be, the element in described electric component group 22 can be circuit element, circuit pin, pad, chip etc.
In one embodiment of this invention, described buffer structure 100 is arranged at the described bottom 212 of described electric support 21 projectedly, described buffer structure 100 is arranged with the element in described electric component group 22 or subelement, when being installed on described electric support 21 with other element of the described electric component group 22 made by pressing, the instantaneous pressure that the electric component on described electric support 21 and described electric support 21 is subject to is buffered.
According to one embodiment of the invention, described electric support can do stepped, for carrying IRCF or eyeglass.The Passive components such as described electric support built-in capacity, resistance.Described electric support can arrange pad, pin in step-like main body, to do circuit interconnects with chip, motor.
In one embodiment of this invention, described supporting construction 100 is arranged at the blank position of the described bottom 212 of described electric support 21, that is, described supporting construction 100 is arranged at the periphery of described bottom 212 or does not install the clear position of any electric component.
In another embodiment of the invention, described supporting construction 100 is arranged at the peripheral position of each element or subelement in described electric component group 22.That is, the position of described supporting construction 100 is arranged with the position of each element of described electric component group 22.Thus the instantaneous pressure making corresponding electric component 22 be subject to is buffered.
With reference to Fig. 1, Fig. 2, according to one embodiment of the invention, described electric component group 22 comprises a sensitive chip 221, and described sensitive chip is installed in the described bottom 212 of described electric support 21.The described camera lens 11 of described lens assembly 10 is positioned at above described sensitive chip 221.Light through described camera lens 11 arrives described sensitive chip 221, thus photoresponse, optical information is changed into telecommunications breath, the image information of records photographing.
Described sensitive chip 221 has circuit pin 222, and the described bottom 212 of described electric support 21 arranges corresponding circuit pin 222, thus the electric component that the described bottom 212 of described sensitive chip 221 and described electric support 21 is arranged is electrically connected.
It is worth mentioning that, described sensitive chip 221 is combined by pressing by outside force under heating or ultrasonic environment when installing, due to the structural limitations of described sensitive chip 22 and described electric support 21 self, surface planarity all there are differences, therefore, in the prior art, the discontinuity between described sensitive chip 22 and described electric support 21, is easy to the damage causing described circuit pin 222.And according to this embodiment of the invention, around the described circuit pin 222 that the described bottom 212 of described electric support 21 is arranged, described supporting construction is set, thus described circuit pin 222 is being buffered by the pressure in the process of pressing, and stressed trend homogenizing.Protruding described buffer structure 100 designs and can improve the upper limit that electric support entirety bears pressure and impulsive force, reduces the operation easier of process for pressing, improves the reliability of camera module.
Further, with reference to Fig. 3, in one embodiment of this invention, described buffer structure 100 is arranged at each described circuit pin 222 or the described circuit pin 222 of part around.In this embodiment, the height of described supporting construction 100 is less than the height of described pin.Especially, in one embodiment, described buffer structure 100 is arranged according to the shape of described circuit pin 222.Citing ground, when the shape of described circuit pin 222 is square, described buffer structure 100 is surrounded on around described circuit pin 222 with being square.And described buffer structure 100 overlook the area that area is greater than described circuit pin 222, enable described circuit pin 222 reduce rapidly when compressive deformation exceedes design load to be additionally stressed, ensure that described circuit pin 222 can not be impaired.
According to one embodiment of the invention, described buffer structure 100 comprises at least one buffer cell 110, and described buffer cell 110 is arranged at each described circuit pin 222 or the described circuit pin 222 of part around.In one embodiment of this invention, the distribution of described buffer cell 110 is arranged with the distribution of described circuit pin 222.
With reference to the different layouts that Fig. 4 A to Fig. 4 D is described buffer structure.The layout of described buffer structure can be arranged as required, and is not limited to be arranged at around described circuit pin 222, or arranges according to the shape of described circuit pin 222.
With reference to Fig. 4 A, the cloth tool that the described buffer cell 110 of described buffer structure 100 is square, that is, described buffer cell 110 is arranged at the described bottom 212 of described electric support 21, corresponding with described sensitive chip 22 corner location, thus described in described sensitive chip 22 corner location cushioning supportive sensitive chip 22.
With reference to Fig. 4 B, the described buffer cell 110 of described buffer structure 100 is arranged on ground in grid, in the described bottom 212 of described electric support 21, position between described sensitive chip 22 and described bottom 212, thus in pressing manufacture process, cushion the stressed of described sensitive chip 22 and described electric support 21 on the whole equably.
With reference to Fig. 4 C, described in described buffer structure 100, buffer cell 110 is in dot matrix layout, is arranged at described electric support 21 and described bottom 212, position between prime number sensitive chip 22 and described bottom 212.
With reference to Fig. 4 D, the described buffer cell 110 of described buffer structure 100 is arranged ringwise, is arranged at the described bottom 212 of described electric support 21, position between described sensitive chip 22 and described bottom 212.Especially, when each described buffer cell 110 is interconnected, formed an annular, buffer structure 100 described in continuous print.
It is worth mentioning that, according to embodiments of the invention, the described buffer cell 110 of described buffer structure 100 can arrange different layouts as required, and the shape of described buffer cell 110 also can be arranged as required.In the above embodiment of the present invention, described buffer cell 110 is in hollow square cylindrical bodies, and shapes still different in other embodiments of the invention.
With reference to Fig. 5 A to 5C, it is the difformity schematic diagram of the described buffer cell 110 of the described buffer structure 100 of above preferred embodiment of the present invention.
With reference to Fig. 5 A, when described buffer cell 100 is arranged according to described circuit pin 222, and when the structure of described circuit pin is square, the shape of described buffer cell 110 is corresponding hollow square cylindrical bodies.
With reference to Fig. 5 B, the shape of described buffer cell 110 is the arcuate structure of gradual change, thus make described sensitive chip 22 and described electrically between 21 buffering produce gradual change with shape, make it more meet structural mechanics principle.
With reference to Fig. 5 C, the shape of described buffer cell 110 is stepped ramp type, make described sensitive chip 22 and described electrically between 21 buffering produce gradual change with shape, and relative to arcuate structure, be easier to manufacture.
Above-mentioned Fig. 5 A, in 5B, 5C, be square being described for the anaclitic object of described buffer cell 110, therefore hollow structure is all square, and those skilled in the art should be understood that, the anaclitic object of described buffer cell 110 is not that the present invention limits, described buffer cell 110 can be selected to depend on different objects, or do not depend on and arrange independently, therefore, described buffer cell can be difform hollow structure, also can be entity structure, non-hollow.
It is worth mentioning that, the material of described buffer structure 100 can be selected from combination: insulating polymer, conducting polymer, in metal or metal oxide wherein one or more.
It is worth mentioning that, in the process manufactured, described supporting construction 100 can by one-time formed mode, protruding process is done in the described bottom 212 of described electric support 21, thus the protruding buffer structure of shape all-in-one-piece, thus cushion by described buffer structure the huge pressure force that each electric component and described electric support 21 be subject to, the huge pressure force that the circuit pin particularly cushioning connection is subject to.
Described buffer structure 100, highly slightly lower than the design gaps after pressing, needs, for described circuit draws 222 pin prearrangement of deformation amount spaces, to ensure that described circuit pin 222 pressurized is abundant according to pressure.
Described bracket component 20 also comprises a colour filter 23, is installed on the described cradle portion 211 of described electric support 21 with being supported.Further, in one embodiment, described cradle portion 211 forms the supporting construction of a boss type, thus supports the described colour filter 23 of ground connection.When obtaining image, light through reflections off objects enters described camera lens 11, described colour filter 23 is arrived after the optical effect of described camera lens 11, and then through the color filtration of described colour filter, arriving is positioned on the described sensitive chip 221 of the described bottom 212 of described electric support 21, described sensitive chip 221 photoresponse, changes light signal into the signal of telecommunication, thus completes the gatherer process of whole image.
The structure of described buffering not only make the described electric support 21 of described bracket component 20 and electric component when assembling between pressure force be buffered, share the local pressure that electric component is subject to, make electric support and electric component all not easily damaged, improve the yield of product, and assembly 20 entirety bears the upper limit of pressure and impulsive force between improving electrically, reduce the operation easier of process for pressing, improve the reliability of camera module, reduce the change of external environment, as vibration, on the impact of the stability of electric component in camera module.
One skilled in the art will understand that the embodiments of the invention shown in foregoing description and accompanying drawing only limit the present invention as an example and not.Object of the present invention is complete and effectively realize.Function of the present invention and structural principle are shown in an embodiment and are illustrated, do not deviating under described principle, embodiments of the present invention can have any distortion or amendment.
Claims (20)
1. an electric support with buffer structure, is characterized in that, comprising:
One cradle portion; With
Bottom one; Described cradle portion is connected to described bottom, is suitable for supporting ground installation elements, and described bottom has a buffer structure, it is arranged at described bottom projectedly, installs so that be buffered ground pressing.
2. the electric support with buffer structure according to claim 1, wherein said buffer structure comprises multiple buffer cell, and described buffer cell is square, and cloth is local is arranged at described bottom.
3. the electric support with buffer structure according to claim 1, wherein said buffer structure comprises multiple buffer cell, and to be that latticed cloth is local be arranged at described bottom to described buffer cell.
4. the electric support with buffer structure according to claim 1, wherein said buffer structure comprises multiple buffer cell, and in laying, shape cloth is local is arranged at described bottom to described buffer cell.
5. the electric support with buffer structure according to claim 1, wherein said buffer structure comprises at least one buffer cell, described buffer cell annularly layout placement in described bottom.
6., according to the arbitrary described electric support with buffer structure of claim 2 to 5, wherein said buffer cell is block structure.
7. according to the arbitrary described electric support with buffer structure of claim 2 to 5, the curved structure of wherein said buffer cell.
8., according to the arbitrary described electric support with buffer structure of claim 2 to 5, wherein said buffering is step-like structure.
9., according to the arbitrary described electric support with buffer structure of claim 2 to 5, wherein buffer cell is hollow structure, and hollow position is suitable for arranging electric component.
10., according to the arbitrary described electric support with buffer structure of claim 2 to 5, wherein said bottom arranges electric component, and described buffer cell depends on described electric component and arranges.
The 11. electric supports with buffer structure according to claim 10, the sectional area of wherein said buffer cell is greater than the sectional area of electric component.
The 12. electric supports with buffer structure according to claim 11, wherein said electric component is pad or circuit pin.
13. according to the arbitrary described electric support with buffer structure of claim 2 to 5, and wherein said cradle portion is boss type supporting construction, is suitable for installing a colour filter with supporting.
14. according to the arbitrary described electric support with buffer structure of claim 2 to 5, and wherein said bottom is suitable for arranging a sensitive chip, and described buffer structure is between described sensitive chip and described bottom.
15. according to the arbitrary described electric support with buffer structure of claim 2 to 5, and the material of wherein said buffer structure is selected from combination: insulating polymer, conducting polymer, in metal or metal oxide wherein one or more.
16. 1 camera modules, is characterized in that, comprising:
One lens assembly; With
One bracket component; Described lens assembly is installed on front side of described bracket component, and described bracket component comprises according to the arbitrary described electric support with buffer structure of claim 1 to 12.
17. camera modules with buffer structure according to claim 16, wherein said bracket component comprises an electric component group, and described electric component group arranges and is installed on described electric support by described buffer structure cushioning supportive.
18. want its camera module with buffer structure described in 17 according to right, and wherein said electric component is sensitive chip, and described sensitive chip comprises corresponding circuit pin respectively with described electric support, and described buffer structure depends on the setting of described circuit pin.
19. camera modules with buffer structure according to claim 18, the height of wherein said buffer structure is less than the gap after the pressing of described circuit pin between described sensitive chip and described electric support.
20. camera modules with buffer structure according to claim 16, wherein said buffer structure by one-time formed mode protruding be arranged at described electric support, to form a positive stop lug boss, tilt to prevent the uneven assembling that causes of pressure force degree.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510867694.3A CN105472216B (en) | 2015-12-01 | 2015-12-01 | Electric support and camera module with buffer structure |
| KR1020187016917A KR102116623B1 (en) | 2015-11-13 | 2016-11-14 | Video camera module and its electrical support and assembly method |
| EP16863702.3A EP3376751B1 (en) | 2015-11-13 | 2016-11-14 | Camera module, electrical support thereof, and assembling method therefor |
| PCT/CN2016/105724 WO2017080526A1 (en) | 2015-11-13 | 2016-11-14 | Camera module, electrical support thereof, and assembling method therefor |
| JP2018544394A JP6817321B2 (en) | 2015-11-13 | 2016-11-14 | Camera module and its electrical support and assembly method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510867694.3A CN105472216B (en) | 2015-12-01 | 2015-12-01 | Electric support and camera module with buffer structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105472216A true CN105472216A (en) | 2016-04-06 |
| CN105472216B CN105472216B (en) | 2020-01-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510867694.3A Active CN105472216B (en) | 2015-11-13 | 2015-12-01 | Electric support and camera module with buffer structure |
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| Country | Link |
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| CN (1) | CN105472216B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017080526A1 (en) * | 2015-11-13 | 2017-05-18 | 宁波舜宇光电信息有限公司 | Camera module, electrical support thereof, and assembling method therefor |
| CN106791309A (en) * | 2016-12-23 | 2017-05-31 | 江苏正桥影像科技股份有限公司 | A kind of ultra-thin anticollision motor bracket |
| CN107888816A (en) * | 2017-12-19 | 2018-04-06 | 广东欧珀移动通信有限公司 | Camera lens support component, injection moulding process, chip assembly, camera and electronic equipment |
| WO2021027445A1 (en) * | 2019-08-15 | 2021-02-18 | 宁波舜宇光电信息有限公司 | Photosensitive assembly, camera module and manufacturing method thereof |
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