CN105470186B - For reaction chamber inward turning field stone disc Precise Position System - Google Patents
For reaction chamber inward turning field stone disc Precise Position System Download PDFInfo
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- CN105470186B CN105470186B CN201510912856.0A CN201510912856A CN105470186B CN 105470186 B CN105470186 B CN 105470186B CN 201510912856 A CN201510912856 A CN 201510912856A CN 105470186 B CN105470186 B CN 105470186B
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- reaction chamber
- graphite plate
- position system
- precise position
- inward turning
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 37
- 239000004575 stone Substances 0.000 title claims abstract description 16
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 52
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 52
- 239000010439 graphite Substances 0.000 claims abstract description 52
- 239000010453 quartz Substances 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 238000000034 method Methods 0.000 description 16
- 235000012431 wafers Nutrition 0.000 description 14
- 230000006872 improvement Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000010327 methods by industry Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses one kind to be used for reaction chamber inward turning field stone disc Precise Position System, including actuator, graphite plate, laser range finder and controller, the actuator is for driving graphite disc spins and stopping positioning, it is provided with the groove for placing wafer on the graphite plate, has opened a notch at the edge of the graphite plate；The laser range finder is used to measure the distance of graphite plate edge and U-shaped notch and sends PLC controller to, is judged by PLC controller and controlled the start and stop of actuator.The present invention has many advantages, such as that simple and compact for structure, easy to control, accuracy is high.
Description
Technical field
Present invention relates generally to semiconductor manufacturing equipment manufacturing fields, refer in particular to a kind of for reaction chamber inward turning field stone disc
Precise Position System.
Background technique
Vapour phase epitaxy method is a kind of important method for growing high-purity semiconductor material, refers to and puts in closed reaction cavity
Enter wafer substrate, under the conditions of temperature, pressure appropriate, reaction gas occurs chemical reaction product and is deposited on wafer substrate
Surface.The uniformity for being deposited on crystal column surface material is to evaluate the important indicator of this quality of materials, places wafer by rotation
The graphite plate objective table of substrate drives wafer substrate rotation, is with improving this uniformity important method.
Epitaxial growth equipment for large-scale production loads and unloads wafer using manipulator.It is served as a contrast according to the wafer of different size
There are the shallow grooves that size is matching, quantity is different in bottom, graphite plate upper surface, and manipulator will be brilliant by the gap of reaction chamber side
Circle substrate is placed into the groove of graphite plate.The position that manipulator picks and places piece every time is fixed and invariable, then only by turning
Dynamic graphite plate, each groove is successively accurately placed in below manipulator finger sucker, just can guarantee that dress takes piece correct every time.
It traditional positioning method or is positioned using close to switch, limit sensors or using servo motor, according to watching
The coded number that motor feedback is returned is taken to determine process station.Former approach, by closed, the high temperature high-cleanness, high environment reacted
It is required that determining difficult to realize；Later approach, in apparatus and process engineering, handling piece is the volume by remembeing before servo motor
Code pulse determines the position of groove.This positioning is limited only to motor level, by speed reducer backlash, support shaft and graphite plate
Error caused by junction just has no way of learning, the radius of graphite plate is larger, and lesser angular error leads to biggish line and misses
Difference.When continuous processing carries out, accumulative error constantly increases, and during load, wafer cannot be completely disposed in groove, makes
It is uneven at semiconductor material growing, the problems such as sediment pile groove, cleaning time is frequent.Graphite plate technique rotary course
In, since substrate slant setting is on groove, cause relative position increasing, possible operation fails when manipulator takes piece, sternly
Wafer is caused to damage when weight.
Summary of the invention
The technical problem to be solved in the present invention is that, for technical problem of the existing technology, the present invention provides one
Kind simple and compact for structure, easy to control, accuracy it is high be used for reaction chamber inward turning field stone disc Precise Position System.
In order to solve the above technical problems, the invention adopts the following technical scheme:
One kind be used for reaction chamber inward turning field stone disc Precise Position System, including actuator, graphite plate, laser range finder and
Controller, the actuator are provided on the graphite plate for placing wafer for driving graphite disc spins and stopping positioning
The groove of piece has opened a notch at the edge of the graphite plate；The laser range finder is used to measure graphite plate edge
And U-shaped notch distance and send PLC controller to, judged by PLC controller and controlled the start and stop of actuator.
As a further improvement of the present invention: the actuator is connected with a harmonic wave speed reducing machine.
As a further improvement of the present invention: the actuator uses the combination of stepper motor and stepper motor driver.
As a further improvement of the present invention: the actuator is by supporting rotary shaft to be connected with graphite plate.
As a further improvement of the present invention: the notch is U-shaped notch.
As a further improvement of the present invention: the graphite plate is in a reaction chamber, the top of the reaction chamber
Reaction chamber observation window is offered on face, the laser range finder is detected by reaction chamber observation window.
As a further improvement of the present invention: the side of the reaction chamber is equipped with crack between a door and its frame baffle.
Compared with the prior art, the advantages of the present invention are as follows:
1, of the invention to be used for reaction chamber inward turning field stone disc Precise Position System, it is carried out using laser range finder vertical
Distance detects and is converted to the horizontal reference position of graphite plate, i.e., is judged by the calculating of PLC, dexterously sense laser ranging
Device is transformed into position sensor, and the start and stop of pulse control stepper motor are sent by PLC, realizes the high precision position control of graphite plate
System.
2, of the invention to be used for reaction chamber inward turning field stone disc Precise Position System, it can be with by no backlash harmonic wave speed reducing machine
Make the control of graphite plate edge definition within 0.1mm, to improve the accuracy of manipulator handling wafer substrate, reduces and take
The fragment rate of film releasing wafer, while Material growth high uniformity number of wafers is improved.
3, of the invention to be used for reaction chamber inward turning field stone disc Precise Position System, utilize reaction chamber upper cover quartz observing window
Directly detect the position of graphite plate, this isolated distance measuring method cleaning is pollution-free, while overcome 1000 DEG C of reaction chamber with
Influence of the upper high temperature to it.
Detailed description of the invention
Fig. 1 is principle schematic diagram of the present invention in specific application example.
Fig. 2 is the principle schematic diagram of present invention graphite plate in specific application example.
Fig. 3 is present invention control process schematic diagram in PLC controller in specific application example.
Marginal data:
1, actuator；2, harmonic wave speed reducing machine；3, rotary shaft is supported；4, graphite plate；5, reaction chamber；6, laser range finder；
7, reaction chamber observation window；8, notch；9, groove；10, crack between a door and its frame baffle.
Specific embodiment
The present invention is described in further details below with reference to Figure of description and specific embodiment.
As depicted in figs. 1 and 2, of the invention to be used for reaction chamber inward turning field stone disc Precise Position System, including actuator
1, graphite plate 4, laser range finder 6 and controller (such as: PLC controller).Actuator 1 is for driving graphite plate 4 to rotate and stop
It positions, the groove 9 for placing wafer is provided on graphite plate 4, it is for example U-shaped to have opened a notch 8(at the edge of graphite plate 4
Notch)；Laser range finder 6 is used to measure the distance at 4 edge of graphite plate and U-shaped notch 8 and sends PLC controller to, by PLC
Controller judges and controls the start and stop of actuator 1.The laser range finder 6 being in a fixed position is detecting above-mentioned U-shaped notch 8
Front and back, distance value has a jump, and PLC controller then determines base position according to this skip signal.In turn, PLC
The analog quantity variation that controller can be inputted according to laser range finder 6 judges, from the start and stop of control actuator 1, dexterously
The position collimation that graphite plate 4 rotates horizontally is converted by distance value.It is, being detected according to laser range finder 6 vertical
Distance jump calculates the determination for being dexterously changed into 4 horizontal reference position of graphite plate by PLC control.In detailed process, from
1 platelet disk is placed into the beginning of groove 9, and a piece of placement finishes to the end.Graphite plate 4 is just gone around, and laser range finder 6 is logical
The front and back detection to U-shaped notch 8 twice is crossed, to ensure that this dress (taking) blade technolgy operation wafer placement location is completely correct.
From the foregoing, it will be observed that the present invention can be during continuous production processes, dress (taking) piece is all to position before and after each technique
It is detected and is positioned, so as to avoid accumulated error.
In specific application example, actuator 1 is by supporting rotary shaft 3 to be connected with graphite plate 4.
It further include harmonic wave speed reducing machine 2 in specific application example, which is used to increase motor output torque,
It reduces and the inertia of motor is impacted when graphite plate 4 stops.
In specific application example, actuator 1 can use stepper motor and stepper motor driver according to actual needs
Combination.
In specific application example, entire graphite plate 4 is in a reaction chamber 5, and on the top surface of reaction chamber 5
Reaction chamber observation window 7 is offered, laser range finder 6 can be detected by reaction chamber observation window 7.Further, reaction chamber
The side of room 5 is equipped with crack between a door and its frame baffle 10.Reaction chamber observation window 7(quartz observing window is penetrated by laser range finder 6) detect it
Linear distance of the lower surface to 4 top surface edge of graphite plate.This isolated distance measuring method cleaning is pollution-free, overcomes simultaneously
1000 DEG C of reaction chamber or more influences of the high temperature to it.
Referring to Fig. 3, for the present invention in specific application example control process schematic diagram in PLC controller.Normal process mistake
Cheng Zhong, stepper motor drive graphite plate 4 at the uniform velocity to rotate by harmonic wave speed reducing machine 2.When receiving load and piece being taken to instruct, stepping electricity
The revolving speed of machine reduces, and rotates at a slow speed.Laser range finder 6 can penetrate narrow reaction chamber observation window 7(quartz observing window), detection
4 edge upper surface of graphite plate is the distance between to 6 lower surface of laser range finder, once detect U-shaped notch 8, the distance of measurement
Value will become larger moment.Measured value is input in PLC control by laser range finder 6, and PLC is judged according to numerical value change, and
It ceases and desist order to stepper motor driver transmission.At this point, the stop position of graphite plate 4 is just used as load and takes a reference value of piece,
According to this reference value, PLC control controls stepper motor successively partition running in 9 quantity of groove according to graphite plate 4, all recessed
When slot 9 all fills or piece is taken to complete, 4 turns of graphite plate one week complete, when laser range finder 6 detects U-shaped notch 8 again, illustrates to fill
Take piece operation errorless.This positioning method is compared to servo motor absolute fix mode, after graphite plate 4 can be overcome to continuously run
There are error caused by mechanical junction or continuous dress to take blade technolgy cumulative errors, reaches very high positioning accuracy, effectively extend
4 position correction of graphite plate and clean interval time.Generally speaking, PLC control saves last detected value, this is examined
Measured value makes the difference with last value, and when difference is greater than the set value, PLC controller issues motor halt instruction immediately.At PLC
It manages speed quickly, detects that hop value can be ignored to the distance that graphite plate 4 rotates motor is stopped by PLC.
The above is only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment,
All technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art
For those of ordinary skill, several improvements and modifications without departing from the principles of the present invention should be regarded as protection of the invention
Range.
Claims (6)
1. one kind is used for reaction chamber inward turning field stone disc Precise Position System, which is characterized in that including actuator (1), graphite plate
(4), laser range finder (6) and PLC controller, the actuator (1) is for driving graphite plate (4) to rotate and stop positioning, institute
The groove (9) being provided on graphite plate (4) for placing wafer is stated, has opened a notch at the edge of the graphite plate (4)
(8)；The laser range finder (6) is used to measure the distance at graphite plate (4) edge and notch (8) and sends PLC control to
Device, is judged by PLC controller and is controlled the start and stop of actuator (1), and the graphite plate (4) is in a reaction chamber (5)
In, it is offered quartz observing window (7) on the top surface of the reaction chamber (5), the laser range finder (6) passes through quartz observing window
(7) it is detected.
2. according to claim 1 be used for reaction chamber inward turning field stone disc Precise Position System, which is characterized in that the drive
Moving part (1) is connected with a harmonic wave speed reducing machine (2).
3. according to claim 1 be used for reaction chamber inward turning field stone disc Precise Position System, which is characterized in that the drive
Moving part (1) uses the combination of stepper motor and stepper motor driver.
4. according to claim 1 be used for reaction chamber inward turning field stone disc Precise Position System, which is characterized in that the drive
Moving part (1) is by supporting rotary shaft (3) to be connected with graphite plate (4).
5. reaction chamber inward turning field stone disc Precise Position System is used for described according to claim 1~any one of 4, it is special
Sign is that the notch (8) is U-shaped notch.
6. according to claim 1 be used for reaction chamber inward turning field stone disc Precise Position System, which is characterized in that described anti-
The side of chamber (5) is answered to be equipped with crack between a door and its frame baffle (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510912856.0A CN105470186B (en) | 2015-12-11 | 2015-12-11 | For reaction chamber inward turning field stone disc Precise Position System |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510912856.0A CN105470186B (en) | 2015-12-11 | 2015-12-11 | For reaction chamber inward turning field stone disc Precise Position System |
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| Publication Number | Publication Date |
|---|---|
| CN105470186A CN105470186A (en) | 2016-04-06 |
| CN105470186B true CN105470186B (en) | 2019-02-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510912856.0A Active CN105470186B (en) | 2015-12-11 | 2015-12-11 | For reaction chamber inward turning field stone disc Precise Position System |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109939952B (en) * | 2019-03-15 | 2021-04-09 | 福建省福联集成电路有限公司 | Device for judging unfilled corner of wafer |
| CN111002106A (en) * | 2019-12-20 | 2020-04-14 | 珠海格力智能装备有限公司 | Laser-based flange locating device and locating method thereof |
| CN111086993A (en) * | 2019-12-27 | 2020-05-01 | 攀钢集团西昌钢钒有限公司 | A kind of CDQ coke drum rotation control system and method |
| CN113322449B (en) * | 2021-05-26 | 2022-10-21 | 北京北方华创微电子装备有限公司 | Semiconductor process equipment and bearing device thereof |
| CN115161766B (en) * | 2022-07-14 | 2024-04-26 | 中国电子科技集团公司第四十八研究所 | Graphite base rotating structure of silicon epitaxial device and graphite base horizontal adjustment method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768975A (en) * | 2011-05-05 | 2012-11-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cassette positioning mechanism and chamber device with same |
| CN104051316A (en) * | 2014-06-23 | 2014-09-17 | 厦门市三安光电科技有限公司 | Graphite carrier plate with adjustable local temperature field |
| CN104425328A (en) * | 2013-09-06 | 2015-03-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Tray origin positioning system and tray origin positioning method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2010679A (en) * | 2012-05-23 | 2013-11-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
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2015
- 2015-12-11 CN CN201510912856.0A patent/CN105470186B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102768975A (en) * | 2011-05-05 | 2012-11-07 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Cassette positioning mechanism and chamber device with same |
| CN104425328A (en) * | 2013-09-06 | 2015-03-18 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Tray origin positioning system and tray origin positioning method |
| CN104051316A (en) * | 2014-06-23 | 2014-09-17 | 厦门市三安光电科技有限公司 | Graphite carrier plate with adjustable local temperature field |
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| CN105470186A (en) | 2016-04-06 |
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