CN105462366A - Preparation method of low-temperature sintering non-granular silver conductive ink - Google Patents
Preparation method of low-temperature sintering non-granular silver conductive ink Download PDFInfo
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- CN105462366A CN105462366A CN201511000726.6A CN201511000726A CN105462366A CN 105462366 A CN105462366 A CN 105462366A CN 201511000726 A CN201511000726 A CN 201511000726A CN 105462366 A CN105462366 A CN 105462366A
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 55
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 46
- 239000004332 silver Substances 0.000 title claims abstract description 46
- 238000002360 preparation method Methods 0.000 title claims abstract description 22
- 238000009766 low-temperature sintering Methods 0.000 title claims abstract description 15
- 239000000243 solution Substances 0.000 claims abstract description 18
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000005516 engineering process Methods 0.000 claims abstract description 13
- 238000007641 inkjet printing Methods 0.000 claims abstract description 10
- 150000001298 alcohols Chemical class 0.000 claims abstract description 8
- 239000008367 deionised water Substances 0.000 claims abstract description 8
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 8
- 229910001961 silver nitrate Inorganic materials 0.000 claims abstract description 8
- 159000000000 sodium salts Chemical class 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011259 mixed solution Substances 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 150000001412 amines Chemical class 0.000 claims abstract description 6
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000012266 salt solution Substances 0.000 claims abstract description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 18
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 14
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 14
- 238000003756 stirring Methods 0.000 claims description 14
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 12
- 238000005245 sintering Methods 0.000 claims description 10
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000007639 printing Methods 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 7
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 6
- 238000006243 chemical reaction Methods 0.000 claims description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- JJWLVOIRVHMVIS-UHFFFAOYSA-N isopropylamine Chemical compound CC(C)N JJWLVOIRVHMVIS-UHFFFAOYSA-N 0.000 claims description 5
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 claims description 4
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 claims description 4
- 150000003378 silver Chemical class 0.000 claims description 4
- 239000001509 sodium citrate Substances 0.000 claims description 4
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 claims description 4
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 229940116411 terpineol Drugs 0.000 claims description 3
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 claims description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- LZZYPRNAOMGNLH-UHFFFAOYSA-M Cetrimonium bromide Chemical compound [Br-].CCCCCCCCCCCCCCCC[N+](C)(C)C LZZYPRNAOMGNLH-UHFFFAOYSA-M 0.000 claims description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 2
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 2
- GVGUFUZHNYFZLC-UHFFFAOYSA-N dodecyl benzenesulfonate;sodium Chemical compound [Na].CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 GVGUFUZHNYFZLC-UHFFFAOYSA-N 0.000 claims description 2
- 229940093476 ethylene glycol Drugs 0.000 claims description 2
- 229960005150 glycerol Drugs 0.000 claims description 2
- 238000005374 membrane filtration Methods 0.000 claims description 2
- 239000000123 paper Substances 0.000 claims description 2
- 229920002401 polyacrylamide Polymers 0.000 claims description 2
- 229940113115 polyethylene glycol 200 Drugs 0.000 claims description 2
- 229940068886 polyethylene glycol 300 Drugs 0.000 claims description 2
- 229940068918 polyethylene glycol 400 Drugs 0.000 claims description 2
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 2
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 2
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 2
- 239000002244 precipitate Substances 0.000 claims description 2
- 235000013772 propylene glycol Nutrition 0.000 claims description 2
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 239000001632 sodium acetate Substances 0.000 claims description 2
- 235000017281 sodium acetate Nutrition 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- 229940080264 sodium dodecylbenzenesulfonate Drugs 0.000 claims description 2
- DAJSVUQLFFJUSX-UHFFFAOYSA-M sodium;dodecane-1-sulfonate Chemical compound [Na+].CCCCCCCCCCCCS([O-])(=O)=O DAJSVUQLFFJUSX-UHFFFAOYSA-M 0.000 claims description 2
- 239000004034 viscosity adjusting agent Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 10
- 239000000976 ink Substances 0.000 description 48
- 229940071575 silver citrate Drugs 0.000 description 8
- QUTYHQJYVDNJJA-UHFFFAOYSA-K trisilver;2-hydroxypropane-1,2,3-tricarboxylate Chemical compound [Ag+].[Ag+].[Ag+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QUTYHQJYVDNJJA-UHFFFAOYSA-K 0.000 description 8
- 239000010408 film Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 239000012528 membrane Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- ZXSQEZNORDWBGZ-UHFFFAOYSA-N 1,3-dihydropyrrolo[2,3-b]pyridin-2-one Chemical compound C1=CN=C2NC(=O)CC2=C1 ZXSQEZNORDWBGZ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- LKZMBDSASOBTPN-UHFFFAOYSA-L silver carbonate Substances [Ag].[O-]C([O-])=O LKZMBDSASOBTPN-UHFFFAOYSA-L 0.000 description 3
- 229910001958 silver carbonate Inorganic materials 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- -1 pH regulators Substances 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000001878 scanning electron micrograph Methods 0.000 description 2
- CQLFBEKRDQMJLZ-UHFFFAOYSA-M silver acetate Chemical compound [Ag+].CC([O-])=O CQLFBEKRDQMJLZ-UHFFFAOYSA-M 0.000 description 2
- 229940071536 silver acetate Drugs 0.000 description 2
- NDVLTYZPCACLMA-UHFFFAOYSA-N silver oxide Chemical compound [O-2].[Ag+].[Ag+] NDVLTYZPCACLMA-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 244000248349 Citrus limon Species 0.000 description 1
- 235000005979 Citrus limon Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000003906 humectant Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
Abstract
本发明涉及导电墨水技术领域,具体地说是一种低温烧结无颗粒银导电墨水的制备方法。一种低温烧结无颗粒银导电墨水的制备方法,其特征在于:具体步骤如下:(1)将硝酸银和钠盐溶解在去离子水中,然后将钠盐溶液加入硝酸银溶液中,得到银盐;(2)将醇类和胺类溶解于溶剂中;(3)将步骤(1)中所得的银盐依次加入步骤(2)所得的混合溶液体系中,得到澄清透明溶液;(4)将粘度调节剂和表面张力调节剂加入步骤(3)所制备的溶液中,即得到可用于喷墨打印技术的无颗粒银导电墨水。同现有技术相比,提供一种稳定性良好,可低温烧结的无颗粒导电墨水及其制备方法,该导电墨水能在相对较低的银含量下保证良好的导电性,从而降低成本。
The invention relates to the technical field of conductive ink, in particular to a method for preparing low-temperature sintered particle-free silver conductive ink. A method for preparing a low-temperature sintered particle-free silver conductive ink, characterized in that the specific steps are as follows: (1) dissolving silver nitrate and sodium salt in deionized water, and then adding the sodium salt solution into the silver nitrate solution to obtain silver salt ; (2) dissolving alcohols and amines in a solvent; (3) adding the silver salt obtained in step (1) to the mixed solution system obtained in step (2) in turn to obtain a clear and transparent solution; (4) adding The viscosity regulator and the surface tension regulator are added to the solution prepared in step (3), and the particle-free silver conductive ink that can be used in inkjet printing technology is obtained. Compared with the prior art, it provides a particle-free conductive ink with good stability and low-temperature sintering and a preparation method thereof. The conductive ink can ensure good conductivity at a relatively low silver content, thereby reducing costs.
Description
技术领域 technical field
本发明涉及导电墨水技术领域,具体地说是一种低温烧结无颗粒银导电墨水的制备方法。 The invention relates to the technical field of conductive ink, in particular to a method for preparing low-temperature sintered particle-free silver conductive ink.
背景技术 Background technique
由于各种电子设备在向着高精度、高密度、高稳定性和微细技术方向发展,导电墨水在太阳能电池、印制电路板(PCB)、薄膜晶体管(TFT)、有机发光二极管(OLED)、射频识别技术(RFID)等方面的应用越来越广泛。相比于掩膜印制技术,采用导电墨水打印技术具有操作方便、快速、分辨率高、减少原料浪费的特点,吸引了各方面人士的关注。特别是近年来可穿戴设备逐渐进入市场,人们对于柔性产品的需求也在增加。喷墨打印技术可以用于柔性电子产品的制备,相比于丝网印刷技术,其准确度更高,并且节约原料,所以是一项很有应用前景的技术。 Due to the development of various electronic devices in the direction of high precision, high density, high stability and micro technology, conductive inks are widely used in solar cells, printed circuit boards (PCB), thin film transistors (TFT), organic light emitting diodes (OLED), radio frequency The application of identification technology (RFID) and other aspects is becoming more and more extensive. Compared with mask printing technology, the use of conductive ink printing technology has the characteristics of convenient operation, high speed, high resolution, and reduced waste of raw materials, which has attracted the attention of people from all walks of life. Especially in recent years, wearable devices have gradually entered the market, and people's demand for flexible products is also increasing. Inkjet printing technology can be used for the preparation of flexible electronic products. Compared with screen printing technology, it has higher accuracy and saves raw materials, so it is a promising technology.
喷墨打印技术的关键在于墨水。对于印制电子行业,导电墨水的性能在很大程度上决定了产品的性能。常用的导电墨水大体可分为金属系导电墨水、碳系导电墨水和高分子系导电墨水,其中运用最广泛的要数金属系导电墨水。金属系导电墨水中的金属一般为纳米级的金、银、铜等,因为随着颗粒尺寸的减小,其烧结温度会逐渐降低,这将使得更多的材料可以作为喷墨打印的衬底。纳米金的导电性很好,但价格昂贵;纳米铜价格便宜,导电性与银相差不多,但是容易被氧化。相比之下,纳米银的化学稳定性良好,即使有少量氧化,得到的氧化银依然能够导电,因此对于应用环境没有苛刻的要求。并且,银的导电性最好,价格适中,这使得与银基导电墨水相关的研究工作有了很大的进展。 The key to inkjet printing technology is the ink. For the printed electronics industry, the performance of conductive ink determines the performance of the product to a large extent. Commonly used conductive inks can be roughly divided into metal-based conductive inks, carbon-based conductive inks, and polymer-based conductive inks, among which metal-based conductive inks are the most widely used. The metals in metal-based conductive inks are generally nano-scale gold, silver, copper, etc., because as the particle size decreases, the sintering temperature will gradually decrease, which will allow more materials to be used as substrates for inkjet printing . Nano-gold has good conductivity but is expensive; nano-copper is cheap and has similar conductivity to silver, but it is easily oxidized. In contrast, nano-silver has good chemical stability. Even with a small amount of oxidation, the obtained silver oxide can still conduct electricity, so there are no strict requirements for the application environment. Moreover, silver has the best conductivity and moderate price, which makes great progress in the research work related to silver-based conductive ink.
近年来,商业化的产品逐渐增多,这些纳米银导电墨水主要是由纳米银、连接剂、溶剂和助剂组成。通常纳米银导电墨水的制备方法为先制备纳米银溶胶,直接往里面添加保湿剂、pH调节剂、连接料、表面活性剂等,通过搅拌、过滤得到分散均匀的导电墨水。这种方法简单方便,但是银含量低,可能含有还原剂等杂质。另外,也有人将纳米银溶胶进行离心洗涤,真空干燥得到纳米银粉,再将其分散到溶剂中,添加增粘剂、固化促进剂、流平剂等助剂,搅拌均匀得到导电墨水。这种方法不能保证导电墨水的稳定性。对于颗粒型纳米银导电墨水,其稳定性是个关键问题。随着时间的延长,颗粒间会发生一定程度的团聚,容易导致打印机喷头的堵塞。而无颗粒银导电墨水由于不存在颗粒,故不会产生堵塞喷头的现象,因此具有广阔的应用前景。 In recent years, commercialized products have gradually increased. These nano-silver conductive inks are mainly composed of nano-silver, linkers, solvents and additives. Usually, the preparation method of nano-silver conductive ink is to prepare nano-silver sol, directly add humectants, pH regulators, binders, surfactants, etc., and obtain evenly dispersed conductive ink by stirring and filtering. This method is simple and convenient, but the silver content is low and may contain impurities such as reducing agents. In addition, some people also centrifugally wash the nano-silver sol, vacuum-dry it to obtain nano-silver powder, then disperse it in a solvent, add tackifiers, curing accelerators, leveling agents and other additives, and stir evenly to obtain conductive ink. This method does not guarantee the stability of the conductive ink. For particle-type nano-silver conductive ink, its stability is a key issue. With the extension of time, a certain degree of agglomeration will occur between the particles, which will easily lead to the clogging of the printer nozzle. The particle-free silver conductive ink does not have the phenomenon of clogging the nozzle due to the absence of particles, so it has broad application prospects.
随着电子产品向柔性化方向发展,承印基材也由传统的玻璃等硬质基材转变为PET、PI等塑料基材。对于塑料基材,其能承受的最高温度较玻璃来说相对较低。因此,只有能够低温烧结的导电墨水才能满足使用要求。开发出能低温烧结,并且具有良好导电性的墨水也变得极为迫切。 With the development of electronic products in the direction of flexibility, printing substrates have also changed from traditional hard substrates such as glass to plastic substrates such as PET and PI. For plastic substrates, the maximum temperature it can withstand is relatively lower than that of glass. Therefore, only conductive inks capable of low-temperature sintering can meet the requirements for use. It is extremely urgent to develop inks that can be sintered at low temperature and have good conductivity.
发明内容 Contents of the invention
本发明为克服现有技术的不足,提供一种稳定性良好,可低温烧结的无颗粒导电墨水及其制备方法,该导电墨水能在相对较低的银含量下保证良好的导电性,从而降低成本。 In order to overcome the deficiencies of the prior art, the present invention provides a kind of good stability, low-temperature sinterable particle-free conductive ink and its preparation method. The conductive ink can ensure good conductivity at a relatively low silver content, thereby reducing the cost.
为实现上述目的,设计一种低温烧结无颗粒银导电墨水的制备方法,其特征在于:具体步骤如下: In order to achieve the above object, a method for preparing a low-temperature sintering particle-free silver conductive ink is designed, which is characterized in that: the specific steps are as follows:
(1)将硝酸银和一种或者两种钠盐按化学反应方程式中系数比分别称量,分别溶解在去离子水中,直至完全溶解,然后将钠盐溶液逐滴加入硝酸银溶液中,搅拌直至反应完全,将反应得到的沉淀物进行避光抽滤并干燥,得到不同的难溶性银盐; (1) Weigh silver nitrate and one or two sodium salts according to the coefficient ratio in the chemical reaction equation, respectively dissolve them in deionized water until they are completely dissolved, then add the sodium salt solution dropwise to the silver nitrate solution, and stir Until the reaction is complete, the precipitate obtained by the reaction is filtered and dried in the dark to obtain different insoluble silver salts;
(2)将醇类和胺类溶解于溶剂中,其体积比为1:2~2:1,在室温下搅拌均匀; (2) Dissolve alcohols and amines in a solvent with a volume ratio of 1:2~2:1, and stir evenly at room temperature;
(3)将步骤(1)中所得的一种或两种银盐依次加入步骤(2)所得的混合溶液体系中,持续搅拌,至银盐完全溶解,得到澄清透明溶液,然后经过0.22~0.45um滤膜过滤; (3) Add one or two silver salts obtained in step (1) into the mixed solution system obtained in step (2) in sequence, and continue to stir until the silver salt is completely dissolved to obtain a clear and transparent solution, and then pass through 0.22~0.45 um membrane filtration;
(4)将适量的粘度调节剂和表面张力调节剂加入步骤(3)所制备的溶液中,搅拌均匀,即得到可用于喷墨打印技术的无颗粒银导电墨水。 (4) Add an appropriate amount of viscosity regulator and surface tension regulator into the solution prepared in step (3), and stir evenly to obtain a particle-free silver conductive ink that can be used in inkjet printing technology.
所述的钠盐为碳酸钠、乙酸钠、柠檬酸钠中的一种或两种组合。 The sodium salt is one or a combination of sodium carbonate, sodium acetate and sodium citrate.
所述的醇类为碳原子数小于4的醇类,包括甲醇、乙醇、乙二醇、丙三醇、1,2-丙二醇、异丙醇、丁醇中的一种或多种组合。 The alcohols are alcohols with less than 4 carbon atoms, including one or more combinations of methanol, ethanol, ethylene glycol, glycerol, 1,2-propanediol, isopropanol, and butanol.
所述的胺类为甲胺、二乙胺、丁胺、氨水、异丙胺、乙二胺、丙二胺、1,3-丙二胺、乙醇胺、二乙醇胺、三乙醇胺中的一种或多种组合。 The amines are one or more of methylamine, diethylamine, butylamine, ammonia water, isopropylamine, ethylenediamine, propylenediamine, 1,3-propylenediamine, ethanolamine, diethanolamine, triethanolamine kind of combination.
所述的溶剂为去离子水、乙醇、异丙醇、乙二醇中的一种或两种组合。 The solvent is one or a combination of deionized water, ethanol, isopropanol, and ethylene glycol.
所述的粘度调节剂为聚乙二醇200、聚乙二醇300、聚乙二醇400、乙二醇、丙三醇、一缩二乙二醇、1,2-丙二醇、松油醇中的一种或多种组合。 Described viscosity modifier is polyethylene glycol 200, polyethylene glycol 300, polyethylene glycol 400, ethylene glycol, glycerol, diethylene glycol, 1,2-propylene glycol, terpineol one or more combinations of .
所述的表面张力调节剂为聚乙烯吡咯烷酮、十二烷基磺酸钠、聚丙烯酰胺、十六烷基三甲基溴化铵、十二烷基苯磺酸钠中的一种或多种组合。 The surface tension modifier is one or more of polyvinylpyrrolidone, sodium dodecylsulfonate, polyacrylamide, cetyltrimethylammonium bromide, sodium dodecylbenzenesulfonate combination.
所述的无颗粒银导电墨水为稳定的透明澄清溶液;无颗粒银导电墨水的银含量为5%~20%;无颗粒银导电墨水的粘度为2cP~20cP。 The particle-free silver conductive ink is a stable transparent clear solution; the silver content of the particle-free silver conductive ink is 5%-20%; the particle-free silver conductive ink has a viscosity of 2cP-20cP.
所述的无颗粒银导电墨水的烧结温度可低至90℃,优选为100℃~140℃。 The sintering temperature of the particle-free silver conductive ink can be as low as 90°C, preferably 100°C-140°C.
所述的无颗粒银导电墨水通过喷墨打印方式在多种承印基材上成膜,再经过加热烧结等处理得到导电性良好,附着性能优异的导电图案,所述的承印基材为玻璃,硅片,纸张,塑料,陶瓷,所述的塑料为聚对苯二甲酸类塑料、聚氨酯、聚丙烯腈、聚酰亚胺等。 The particle-free silver conductive ink is formed into a film on a variety of printing substrates by inkjet printing, and then processed by heating and sintering to obtain a conductive pattern with good conductivity and excellent adhesion. The printing substrate is glass. Silicon wafers, paper, plastics, ceramics, the plastics are polyethylene terephthalate plastics, polyurethane, polyacrylonitrile, polyimide and the like.
本发明同现有技术相比,提供一种稳定性良好,可低温烧结的无颗粒导电墨水及其制备方法,该导电墨水能在相对较低的银含量下保证良好的导电性,从而降低成本。 Compared with the prior art, the present invention provides a particle-free conductive ink with good stability and low-temperature sintering and its preparation method. The conductive ink can ensure good conductivity at a relatively low silver content, thereby reducing costs .
该方法通过将一定量的银盐加入醇类和胺类的混合溶液中,搅拌至完全溶解后过滤得到,操作方法简单;可低温烧结的无颗粒纳米银导电墨水很适用于喷墨打印技术。 The method is obtained by adding a certain amount of silver salt into a mixed solution of alcohols and amines, stirring until completely dissolved, and then filtering. The operation method is simple; the particle-free nano-silver conductive ink that can be sintered at low temperature is very suitable for inkjet printing technology.
制备方法简单,成本低;可低温烧结,导电性好,方块电阻可低至0.01Ω/□;墨水为澄清透明无颗粒溶液,稳定性好;适用于喷墨印刷电子技术。 The preparation method is simple and the cost is low; it can be sintered at low temperature, has good conductivity, and the sheet resistance can be as low as 0.01Ω/□; the ink is a clear and transparent solution without particles, and has good stability; it is suitable for inkjet printing electronic technology.
附图说明 Description of drawings
图1为本发明实施例1中制备的柠檬酸银的XRD图谱。 Fig. 1 is the XRD spectrum of the silver citrate prepared in the embodiment 1 of the present invention.
图2为本发明实施例1中的100℃烧结的SEM图。 Fig. 2 is an SEM image of sintering at 100°C in Example 1 of the present invention.
图3为本发明实施例4中的调过粘度的墨水经喷墨打印机打印后,在140℃烧结的SEM图。 Fig. 3 is a SEM image of the viscosity-adjusted ink in Example 4 of the present invention printed by an inkjet printer and sintered at 140°C.
图4为本发明实施例4中的墨水在不同烧结温度下的方块电阻值。 Fig. 4 is the sheet resistance value of the ink in Example 4 of the present invention at different sintering temperatures.
具体实施方式 detailed description
实施例1 Example 1
将8.823g柠檬酸钠溶解在40ml去离子水中,将15.288g硝酸银溶解在40ml去离子水中,然后将柠檬酸钠溶液逐滴加入硝酸银的水溶液中,室温下搅拌2小时后,置于布氏漏斗中避光抽滤,用去离子水洗涤2次,继续抽滤至得到干燥的白色粉末,对其进行XRD表征,如图1所示,与PDF#01-0030完全吻合,证明为柠檬酸银。 Dissolve 8.823g of sodium citrate in 40ml of deionized water, dissolve 15.288g of silver nitrate in 40ml of deionized water, then add the sodium citrate solution dropwise into the aqueous solution of silver nitrate, stir at room temperature for 2 hours, and place on a cloth filter in a dark funnel, wash twice with deionized water, and continue to filter until a dry white powder is obtained, which is characterized by XRD, as shown in Figure 1, which is completely consistent with PDF#01-0030, and it is proved to be lemon acid silver.
将5ml甲醇、2ml异丙胺和3ml异丙醇混合均匀,恒温至室温,再加入2.0g柠檬酸银,在室温下搅拌1小时,得到浅黄色的透明溶液,经0.45um滤膜过滤后,得到柠檬酸银导电墨水。 Mix 5ml of methanol, 2ml of isopropylamine and 3ml of isopropanol evenly, keep the temperature to room temperature, then add 2.0g of silver citrate, and stir at room temperature for 1 hour to obtain a light yellow transparent solution, which is filtered through a 0.45um filter membrane to obtain Silver citrate conductive ink.
用滴涂的方法将墨水滴在玻璃片上,在100℃处理30min,用RTS-8四探针测试仪测得方块电阻达到0.06Ω/□,对得到的银膜进行SEM表征,如图2所示。该导电墨水在室温下放置3个月后,溶液无明显沉淀产生,稳定性良好。 The ink was dropped on the glass sheet by the method of drip coating, and treated at 100°C for 30 minutes, and the square resistance was measured by the RTS-8 four-probe tester to reach 0.06Ω/□, and the obtained silver film was characterized by SEM, as shown in Figure 2 Show. After the conductive ink was placed at room temperature for 3 months, the solution had no obvious precipitation and had good stability.
实施例2 Example 2
柠檬酸银固体粉末的制备方法与实施例1中相同,碳酸银固体粉末的制备方法如实施例1中柠檬酸银的制备方法。 The preparation method of silver citrate solid powder is identical with embodiment 1, and the preparation method of silver carbonate solid powder is as the preparation method of silver citrate among the embodiment 1.
将2g柠檬酸银和0.16g碳酸银依次溶解在5ml甲醇、3ml异丙醇和4.3ml异丙胺组成的混合液中,室温下搅拌1小时,得到浅黄色透明溶液,经0.45um滤膜过滤后,得到银含量约为13%的无颗粒银导电墨水。 2g of silver citrate and 0.16g of silver carbonate were successively dissolved in a mixed solution consisting of 5ml of methanol, 3ml of isopropanol and 4.3ml of isopropylamine, and stirred at room temperature for 1 hour to obtain a light yellow transparent solution, which was filtered through a 0.45um filter membrane. A particle-free silver conductive ink with a silver content of about 13% was obtained.
用滴涂的方法将墨水滴在玻璃片上,经120℃处理2min,用四探针测试仪测得方块电阻可低至0.06Ω/□。 Drop the ink on the glass sheet by drip coating, and treat it at 120°C for 2 minutes. The sheet resistance measured by a four-probe tester can be as low as 0.06Ω/□.
将所得墨水用一缩二乙二醇调节粘度至5~15mPa·s,经喷墨打印机打印,在100℃下烧结,在100℃烧结20min后,其膜层的方块电阻为0.1Ω/□。 The resulting ink was adjusted to a viscosity of 5-15mPa·s with diethylene glycol, printed by an inkjet printer, and sintered at 100°C. After sintering at 100°C for 20min, the sheet resistance of the film layer was 0.1Ω/□.
实施例3 Example 3
乙酸银固体粉末的制备方法如实施例1中柠檬酸银的制备方法。 The preparation method of silver acetate solid powder is as the preparation method of silver citrate among the embodiment 1.
将1.6g乙酸银溶解在3ml甲醇、1.5ml乙醇和2ml乙醇胺组成的混合溶液中,室温下搅拌1小时,得到浅黄色透明溶液,经0.45um滤膜过滤后,得到无颗粒银导电墨水。 Dissolve 1.6g of silver acetate in a mixed solution consisting of 3ml of methanol, 1.5ml of ethanol and 2ml of ethanolamine, and stir at room temperature for 1 hour to obtain a light yellow transparent solution. After filtering through a 0.45um filter membrane, a particle-free silver conductive ink is obtained.
用滴涂的方法将墨水滴在玻璃片上,经140℃处理2min,用四探针测试仪测得方块电阻可低至0.06Ω/□。 Drop the ink on the glass plate by drip coating, and treat it at 140°C for 2 minutes. The sheet resistance measured by a four-probe tester can be as low as 0.06Ω/□.
实施例4 Example 4
将16g柠檬酸银和2.5g碳酸银依次溶解在40ml甲醇、24ml异丙醇和37ml异丙胺组成的混合溶液中,室温下搅拌1小时,得到浅黄色透明溶液,经0.45um滤膜过滤后,得到无颗粒银导电墨水。 16g of silver citrate and 2.5g of silver carbonate were successively dissolved in a mixed solution composed of 40ml of methanol, 24ml of isopropanol and 37ml of isopropylamine, stirred at room temperature for 1 hour to obtain a light yellow transparent solution, which was filtered through a 0.45um filter membrane to obtain Particle-free silver conductive ink.
将上述墨水直接用在A4平板打印机中,在PET上成膜,在140℃烧结20min后,得到膜层的方块电阻为0.41Ω/□。 The above ink was directly used in an A4 flatbed printer to form a film on PET, and after sintering at 140° C. for 20 minutes, the sheet resistance of the obtained film layer was 0.41Ω/□.
将上述墨水用松油醇调节粘度至11mPa·s,通过DimatixQS-256/10喷头进行打印,在140℃烧结20min后,得到方块电阻为0.02Ω/□的银膜,其表面形貌如图3所示。打印两遍后在不同温度下热处理,其方块电阻与温度的关系如图4所示。 Adjust the viscosity of the above ink to 11mPa s with terpineol, and print it through the DimatixQS-256/10 nozzle. After sintering at 140°C for 20min, a silver film with a sheet resistance of 0.02Ω/□ was obtained. The surface morphology is shown in Figure 3 shown. After printing twice, heat treatment at different temperatures, the relationship between sheet resistance and temperature is shown in Figure 4.
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Application publication date: 20160406 |