CN105338784A - Cooling device and electronic equipment - Google Patents
Cooling device and electronic equipment Download PDFInfo
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- CN105338784A CN105338784A CN201410389975.8A CN201410389975A CN105338784A CN 105338784 A CN105338784 A CN 105338784A CN 201410389975 A CN201410389975 A CN 201410389975A CN 105338784 A CN105338784 A CN 105338784A
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Abstract
The invention discloses a cooling device, which is used for carrying out cooling on an electronic element for generating heat in electronic equipment. The cooling device comprises a metal heat plate and a heat pipe, wherein the heat pipe comprises a first end and a second end; direct heat conduction between the heat pipe and the metal heat plate can be achieved by the positional relationship between the first end and the metal heat plate; the heat pipe and the electronic element are arranged in parallel; and a first plane in which the heat pipe is located is vertical to a second plane in which the metal heat plate is located.
Description
Technical field
The present invention relates to the technical field of heat dissipation in electronic technology, particularly a kind of heat abstractor and electronic equipment.
Background technology
Along with the development of science and technology, electronic equipment have also been obtained development at full speed, and kind and the function of electronic equipment also get more and more.Conveniently carry and use, the volume of electronic equipment is more and more less has become a kind of trend.But due to the volume of electronic equipment own little, the heat causing electronic equipment internal element to produce is very concentrated and be not easy to be dispersed into electronic device exterior, like this, temperature in electronic equipment will be caused more and more higher, temperature is high arrive to a certain degree after, also can cause electronic equipment fluctuation of service, even damage the electronic component in electronic equipment.
In order to effectively dispel the heat to electronic equipment, in the electronic equipment of prior art, the compound mode of heat pipe and metallic heat radiating plate is adopted to dispel the heat, specifically, prior art is mainly for the heater element of horizontal positioned on pcb board, and therefore heat pipe and metallic heat radiating plate are horizontal positioned.The lower surface of heat pipe contacts with heater element, and the heat conduction produced by heater element by the Heat Conduction Material of therein is to the metallic heat radiating plate contacted with heat pipe upper surface, then by metallic heat radiating plate by absorb heat conduction to electronic equipment casing, finally by electronic equipment casing, heat conduction is gone out outside electronic equipment, thus reach the effect of heat radiation; If when heater element is vertically placed on circuit boards, when dispelling the heat by prior art, heat pipe need be bent.
Present inventor, in the process realizing technical scheme in the embodiment of the present application, finds that prior art at least exists following technical problem:
When heater element is vertically placed, because heat pipe of the prior art and metallic heat radiating plate are parallel construction, when adopting prior art to dispel the heat, the bending of heat pipe adds that metallic plate and heat pipe temperature distortion all can take larger space, and the electronic equipment of small size cannot meet the requirement of its deflect slope; Meanwhile, the bending of heat pipe can make the Heat Conduction Material in tube wall come off, or due to bending distortion cause air flux to reduce, extreme influence performance.
If heat pipe is not bent, namely heat pipe and metallic heat radiating plate are horizontal positioned, when heater element is vertically positioned in the electronic equipment of small size, its heat produced cannot conduct to metallic heat radiating plate fully, so cannot accomplish that the heat to the vertical heater element placed produces carries out samming.That is:
When there is the vertical heater element placed in electronic equipment of the prior art, the heat pipe of horizontal positioned and metallic heat radiating plate, existing can not fully to the technical problem that heater element dispels the heat.
When needing heat pipe vertically to place when the heater element that there is vertical placement in prior art electronic equipment, because the volume of electronic equipment is little, so electronic equipment of the prior art exists electronic equipment internal space cannot meet the technical problem that deformation when heat pipe is vertically placed requires.
Summary of the invention
The embodiment of the present application provides a kind of heat abstractor and electronic equipment, there is electronic equipment internal space and cannot meet for solving electronic equipment of the prior art the technical problem that deformation when heat pipe is vertically placed requires, reach the technique effect making the deformation of heat pipe be required to meet electronic equipment internal space.
The embodiment of the present application provides a kind of heat abstractor on the one hand, for dispelling the heat to the electronic component producing heat in electronic equipment, comprises metal hot plate; Heat pipe, there is first end and the second end, wherein, between described first end and described metal hot plate, position relationship can make direct heat conduction between described heat pipe and described metal hot plate, the placement parallel with described electronic component of described heat pipe, first plane at described heat pipe place is mutually vertical with second plane at described metal hot plate place.
Optionally, described metal hot plate comprises upper surface, the lower surface relative with described upper surface, wherein, described position relationship is specially described first end and is connected to primary importance relation in the primary importance of described lower surface, or described position relationship is specially described first end and is welded in second place relation in described primary importance, or described position relationship is specially described first end and is integrally formed in the 3rd position relationship in the described primary importance of described lower surface.
Optionally, when described position relationship is described primary importance relation, the first cavity is formed between described lower surface and described upper surface, described first end is the first blind end and described second end is the second blind end, now, described heat pipe is have the hollow tube with unconnected second cavity of described first cavity, is filled with Heat Conduction Material in described first cavity and described second cavity.
Optionally, when described position relationship is second place relation or when described position relationship is the 3rd position relationship, described primary importance offers the first opening, described first end is the first openend, described second end is the second blind end, be formed with the first cavity between described lower surface and described upper surface, described heat pipe is the hollow tube of the second cavity had by described first opening and described first cavity connects, is filled with Heat Conduction Material in described first cavity and described second cavity.
Optionally, described lower surface is coated with thermal conductive material layer, offers at least one groove on the upper surface.
On the other hand, the embodiment of the present application also provides a kind of electronic equipment, and described electronic equipment comprises device housings, has in a bottom surface or described device housings and is provided with a circuit board; An electronic component, be vertically arranged on described bottom surface or be vertically arranged on described circuit board, described electronic component, when in running order, can produce heat; Metal hot plate, is fixedly installed on described device housings, and is formed with an accommodation space between described device housings; Heat pipe, tool first end and the second end, wherein, between described first end and described metal hot plate, position relationship can make direct heat conduction between described heat pipe and described metal hot plate, the placement parallel with described electronic component of described heat pipe, wherein, first plane at described heat pipe place is mutually vertical with second plane at described metal hot plate place.
Optionally, described device housings is made up of plastics or metal material.
Optionally, described metal hot plate comprises upper surface, the lower surface relative with described upper surface, wherein, described position relationship is specially described first end and is connected to primary importance relation in the primary importance of described lower surface, or described position relationship is specially described first end and is welded in second place relation in described primary importance or described first end and is integrally formed in the 3rd position relationship in the described primary importance of described lower surface.
Optionally, when described position relationship is primary importance relation, the first cavity is formed between described lower surface and described upper surface, described first end is the first blind end and described second end is the second blind end, now, described heat pipe is have the hollow tube with unconnected second cavity of described first cavity, is filled with Heat Conduction Material in described first cavity and described second cavity.
Optionally, when described position relationship is second place relation or described position relationship is the 3rd position relationship, described primary importance offers the first opening, described first end is the first openend, described second end is the second blind end, be formed with the first cavity between described lower surface and described upper surface, described heat pipe is the hollow tube of the second cavity had by described first opening and described first cavity connects, is filled with Heat Conduction Material in described first cavity and described second cavity.
Optionally, described lower surface is coated with thermal conductive material layer, offers at least one groove on the upper surface.
Optionally, the distance between described heat pipe and described electronic component is less than or equal to a predeterminable range.
Optionally, when described accommodation space is seal cavity, described electronic equipment also comprises phase-change material, and be placed in described accommodation space, described phase-change material is specially solid-liquid phase change material or solid-solid phase transition material.
Optionally, when described accommodation space is non-tight space, described electronic equipment also comprises phase-change material, and be placed in described accommodation space, described phase-change material is specially solid-solid phase transition material.
Above-mentioned one or more technical scheme in the embodiment of the present application, at least has one or more technique effects following:
One, technical scheme in the embodiment of the present application, due to described second plane at described first plane at described heat pipe place and described metal hot plate place is set to orthogonal position relationship, like this, utilize the described heat abstractor in the application when dispelling the heat to the vertical described heater element placed, without the need to described heat pipe is bent, the space that whole heat abstractor is taken diminishes, so, solve electronic equipment of the prior art to there is electronic equipment internal space and cannot meet the technical problem that deformation when heat pipe is vertically placed requires, reach the technique effect making the deformation of heat pipe be required to meet electronic equipment internal space.
Two, technical scheme in the embodiment of the present application, due to by parallel with described electronic component for described heat pipe placement, like this, when dispelling the heat to described electronic component, can not exist due to described heat pipe bending distortion and cause throughput to reduce, or because bending causes described heat pipe to break, and then the problem that the described Heat Conduction Material in described heat pipe is come off, like this, just can enable described heat pipe that the heat that the described heater element vertically placed produces is conducted to described metal hot plate fully, so, efficiently solve exist in prior art can not fully to the technical problem that heater element dispels the heat, achieve in the electronic equipment of small size fully to the technique effect that described vertical heater element dispels the heat.
Three, technical scheme in the embodiment of the present application, due to described phase-change material is positioned in described accommodation space, because described phase-change material has heat absorption capacity and heat storage capacity, like this, in the conduction process of described metallic plate, described phase-change material just can absorb a part of heat of described metal hot plate, reduce the temperature of described metal hot plate, simultaneously can also by a part of heat conduction from described metal hot plate to described shell, and conduct to outside described equipment by described shell, so, achieve further the technique effect improving electronic equipment dissipating heat ability.
Four, the technical scheme in the embodiment of the present application, owing to phase-change material being positioned in described accommodation space, because described phase-change material has heat storage capacity, like this, carrying out in radiation processes to described heater element, by absorbing heat, the change of form will be there is, as become liquid from solid in described phase-change material, and then realize the function of heat accumulation, so just can effectively reduce the heat conducting to described shell, so, achieve the technique effect of the temperature effectively reducing described shell.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described by the accompanying drawing used required in describing embodiment below, apparently, the accompanying drawing in the following describes is only some embodiments of the present invention.
Fig. 1 is the structural representation of the application first better embodiment electronic equipment;
Fig. 2 is the metal hot plate enlarged drawing of electronic equipment in Fig. 1;
Fig. 3 is the structural representation of the local state of electronic equipment in Fig. 1;
Fig. 4 is the structural representation of another state of local of electronic equipment in Fig. 1;
Fig. 5 is the profile of heat pipe along the first plane of electronic equipment in Fig. 1;
Fig. 6 is the structural representation of the application second better embodiment electronic equipment;
Fig. 7 is the status architecture schematic diagram of heat abstractor in Fig. 6;
Fig. 8 is another status architecture schematic diagram of heat abstractor in Fig. 6.
Embodiment
The embodiment of the present application provides a kind of heat abstractor and electronic equipment, there is electronic equipment internal space and cannot meet for solving electronic equipment of the prior art the technical problem that deformation when heat pipe is vertically placed requires, reach the technique effect making the deformation of heat pipe be required to meet electronic equipment internal space.
Technical scheme in the embodiment of the present application is for solving the problem, and general thought is as follows:
A kind of heat abstractor, for dispelling the heat to the electronic component producing heat in electronic equipment, comprises metal hot plate; Heat pipe, there is first end and the second end, wherein, between described first end and described metal hot plate, position relationship can make direct heat conduction between described heat pipe and described metal hot plate, the placement parallel with described electronic component of described heat pipe, first plane at described heat pipe place is mutually vertical with second plane at described metal hot plate place.
Above-mentioned heat abstractor is by being set to orthogonal position relationship by described second plane at described first plane at described heat pipe place and described metal hot plate place, like this, utilize the described heat abstractor in the application when dispelling the heat to the vertical described heater element placed, without the need to described heat pipe is bent, the space that whole heat abstractor is taken diminishes, so, solve electronic equipment of the prior art to there is electronic equipment internal space and cannot meet the technical problem that deformation when heat pipe is vertically placed requires, reach the technique effect making the deformation of heat pipe be required to meet electronic equipment internal space.
In order to better understand technique scheme, below by accompanying drawing and specific embodiment, technical solution of the present invention is described in detail, the specific features being to be understood that in the embodiment of the present invention and embodiment is the detailed description to technical solution of the present invention, instead of the restriction to technical solution of the present invention, when not conflicting, the technical characteristic in the embodiment of the present invention and embodiment can combine mutually.
Embodiment one
As shown in Figure 1, be the structural representation of the application first better embodiment electronic equipment.In actual applications, described electronic equipment can be notebook computer, projecting apparatus etc., can be also other electronic equipment, and at this, just differing one schematically illustrates.In specific descriptions below, will be notebook computer for described electronic equipment, be described.
A kind of electronic equipment, comprises device housings 10, has in a bottom surface 11 or device housings 10 and be provided with a circuit board 12; An electronic component 20, be vertically arranged on bottom surface 11 or vertically arrange on the circuit board 12, electronic component 20, when in running order, can produce heat; Metal hot plate 30, is fixedly installed on device housings 10, and is formed with an accommodation space 31 between device housings 10, and metal hot plate 30 comprises upper surface 32, the lower surface 33 relative with upper surface 32, is formed with the first cavity 34 between upper surface 32 and lower surface 33; Heat pipe 40, there is first end 41 and the second end 42, wherein, between first end 41 and metal hot plate 30, position relationship can make direct heat conduction between heat pipe 40 and metal hot plate 30, heat pipe 40 placement parallel with electronic component 20, wherein, first plane at heat pipe 40 place is mutually vertical with second plane at metal hot plate 30 place.
In order to improving radiating effect, in the embodiment of the present application, also on lower surface 33, thermal conductive material layer is coated with.For ensureing radiating effect, the thermal conductive material layer be coated with should be the good material of thermal conductivity, as Cu powder, nano-fluid etc.
In specific implementation process, when electronic equipment is described notebook computer, device housings 10 is notebook computer casing, and device housings 10 is made up of plastics or metal material.Specifically be: the shell being provided with the notebook computer main body part of keyboard; An electronic component 20 is the electronic component of a vertical placement in described notebook computer casing, such as: processor, video card, hard disk etc.
In order to improve radiating effect, in the embodiment of the present application, as shown in Figure 2, at least one groove 35 is offered by the upper surface 32 of metal hot plate 30, at least one groove 35 can by the process making upper surface 32, being formed by the die casting with Baltimore groove, also can be formed by directly etching on upper surface 32.When at least one groove 35 is formed by the die casting with Baltimore groove, then at least one groove 35, the degree of depth of each groove must be less than the degree of depth of the first cavity 34; When at least one groove 35 is formed by etching on upper surface 32, then at least one groove 35, the degree of depth of each groove must be less than the thickness of upper surface 32.
In the embodiment of the present application, for ensureing heat-conducting effect, at least one groove 35 is formed by the die casting with Baltimore groove, because the thickness of at least one groove 35 of casting is identical with the thickness of upper surface 32, so in the process of heat conduction, can ensure that the bottom of at least one groove 35 can not be too high and melt due to temperature, and upper surface 32 can not be subject to physical damage because of etching, and then ensure that metal hot plate 30 can work better.
In the embodiment of the present application, at least one groove 35 makes to be formed with an accommodation space 31 between metal hot plate 30 and described notebook computer casing.Accommodation space 31 can be enclosure space, also can be non-enclosure space, and be specifically described notebook computer for electronic equipment, metal hot plate 30 can be fitted completely with described notebook computer casing, and then forms enclosure space; Metal hot plate 30 also can and described notebook computer casing between leave certain gap, and then formed non-close space.
In order to improving radiating effect, in present application example, as shown in Figure 2, described electronic equipment also comprises phase-change material 50, is placed in accommodation space 31.For described electronic equipment for notebook computer, because phase-change material 50 has heat absorption capacity, like this, in the conduction process of metallic plate 30, phase-change material 50 just can absorb a part of heat of metal hot plate 30, reduce the temperature of metal hot plate 30, simultaneously can also by a part of heat conduction from metal fever plate 30 to described notebook computer casing, and by described notebook computer casing by outside heat conduction to described notebook computer, so, the further heat-sinking capability of the described notebook computer of raising; Simultaneously, because phase-change material 50 has heat storage capacity, like this, carrying out in radiation processes to described processor, phase-change material 50 is by absorbing heat, the change of form will be there is, as become liquid from solid, and then realizing the function of heat accumulation, so just can effectively reduce the heat conducting to described notebook computer casing, so, effectively reduce the temperature of described notebook computer casing.
Further, phase-change material 50 has two kinds, is specially solid-liquid phase change material or solid-solid phase transition material.When adopting solid-liquid phase change material, accommodation space 31 is enclosure space, can prevent phase-change material 50 in thermal histories, be melted into overflow accommodation space 31 like this, damages electronic component; When adopting solid-solid phase transition material, accommodation space 31 can be enclosure space, can be also non-close space, because solid-solid phase transition material is in thermal histories, larger deformation can not occur, and can not produce liquid, so can not overflow from accommodation space 31.
In the application's specific embodiment, when adopting solid-liquid phase change material and closed accommodation space 31, as the above analysis, the abundant conduction electron device external of the heat that this mode can make electronic component 20 produce, improves heat-sinking capability to greatest extent.
In the embodiment of the present application, when being arranged in described notebook computer casing by heat pipe 40, in order to ensure radiating effect, normally heat pipe 40 is arranged on the larger surrounding electronic component of caloric value, or the region that heat-generating electronic elements is concentrated.As: around processor as described in heat pipe 40 can being arranged on, also heat pipe 40 can be arranged on around hard disk.Certainly, those skilled in the art, according to actual needs, can also determine the setting position of heat pipe 40, and at this, the application just differs and one to schematically illustrate.
When specifically arranging the position of heat pipe 40, for ensureing that the heat of electronic component 20 fully conducts by heat pipe 40, the distance between heat pipe 40 and electronic component 20 needs to be less than or equal to a predeterminable range.For described notebook computer, the position of heat pipe 40 can be set to directly contact with processor, or the position of heat pipe 40 is set to leave certain gap between processor, as: heat pipe 40 and processor are separated by 0.5cm or 0.8cm, certainly, those skilled in the art according to actual needs, can determine the size in concrete gap.In the embodiment of the present application, in order to ensure radiating effect, be usually set to the position of heat pipe 40 directly contact with electronic component 20, like this, the heat that electronic component 20 produces can conduct to heat pipe 40 fully, reduces the temperature of electronic component 20 in time.
When specifically arranging the position of heat pipe 40, first plane at heat pipe 40 place is mutually vertical with second plane at metal hot plate 30 place, and wherein, described first plane is the plane at the section place of first end 41 to the second end 42 of heat pipe 40.The first end 41 of heat pipe 40 has three kinds of modes with the position relationship of metal hot plate 30, be specially first end 41 and be connected to primary importance relation in the primary importance 36 of lower surface 33, or first end 41 is welded in the second place relation in primary importance 36, or first end 41 is integrally formed in the 3rd position relationship in the primary importance 36 of lower surface 33.To be described respectively below:
As shown in Figure 3, when first end 41 is primary importance relation with the position relationship of metal hot plate 30, the first cavity 34 is formed between lower surface 33 and upper surface 32, first end 41 is the first blind end 43 and the second end 42 is the second blind end 44, now, heat pipe 40 is for having the hollow tube of unconnected second cavity 45 with the first cavity 34, and be filled with Heat Conduction Material in the first cavity 34 and the second cavity 45, Heat Conduction Material is specially as Cu powder, nano-fluid etc.
In specific implementation process, metal hot plate 30 and heat pipe 40 are two entirety independently, first blind end 43 can be directly contact with the position relationship of lower surface 33, also can leave certain interval, as: interval 0.5cm or 0.8cm etc. between the first blind end 43 and lower surface 33; As shown in Figure 5, the shape of heat pipe 40 can be linear pattern also can be shaped form, and certainly, those skilled in the art can according to actual needs, determine directly contact or leave certain interval.
As shown in Figure 4, when first end 41 and the position relationship of metal hot plate 30 be second place relation or the 3rd position relationship time, now, primary importance 36 offers the first opening 37, corresponding, first end 41 is the first openend 46, second end 42 is the second blind end 47, the first cavity 34 is formed between lower surface 33 and upper surface 32, heat pipe 40 is for having the hollow tube of the second cavity 48 be communicated with the first cavity 34 by the first opening 37, be filled with Heat Conduction Material in first cavity 34 and the second cavity 48, Heat Conduction Material is specially Cu powder, nano-fluid etc.
In specific implementation process, metal hot plate 30 is the entirety be communicated with heat pipe 40, has two kinds of production methods, is specially: be welded on lower surface 33 by heat pipe 40 by the first opening 37, or directly metal hot plate 30 and heat pipe 40 integrally casting is formed.
In the embodiment of the application, be described notebook computer for electronic equipment, concrete radiation processes is: processor is after generation heat, first heat conduction is given the heat pipe 40 contacted with processor, heat pipe 40 is by inner Heat Conduction Material, by heat conduction to the lower surface 33 be connected with heat pipe 40, lower surface 33 is by the Heat Conduction Material in metal hot plate 30, by heat conduction to upper surface 32, the phase-change material 50 contacted with upper surface 32, absorb a part of heat, reduce the temperature of upper surface 32; By changing the form of self, storing a part of heat, reducing the heat conducting to notebook computer shell; Meanwhile, the heat conduction of remainder that conducted by upper surface 32 to notebook computer casing, conducts to outside laptop devices by notebook computer casing, finally achieves the heat radiation to processor by phase-change material 50.
Embodiment two
As shown in Figure 6, be the structural representation of the application second better embodiment heat abstractor, for dispelling the heat to the electronic component producing heat in electronic equipment.In actual applications, described electronic equipment can be notebook computer, projecting apparatus etc., can be also other electronic equipment, and at this, just differing one schematically illustrates.In specific descriptions below, will be notebook computer for described electronic equipment, be described.
A kind of heat abstractor, comprising:
Metal hot plate 60;
Heat pipe 70, there is first end 71 and the second end 72, wherein, between first end 71 and metal hot plate 60, position relationship can make direct heat conduction between heat pipe 70 and metal hot plate 60, heat pipe 70 placement parallel with described electronic component, first plane 73 at heat pipe 70 place is mutually vertical with second plane 61 at metal hot plate place.
In the embodiment of the present application, metal hot plate 60 comprises upper surface 62, the lower surface 63 relative with upper surface 62, is formed with the first cavity 64 between lower surface 63 and upper surface 62.In order to improving radiating effect, also on lower surface 63, be coated with thermal conductive material layer.For ensureing radiating effect, the thermal conductive material layer be coated with should be the good material of thermal conductivity, as Cu powder, nano-fluid etc.
In specific implementation process, when electronic equipment is described notebook computer, described electronic component is an electronic component vertically placed in notebook computer, such as: processor, video card, hard disk etc.
In order to improve radiating effect, in the embodiment of the present application, at least one groove 65 is offered by the upper surface 62 of metal hot plate 60, at least one groove 65 can by the process making upper surface 62, being formed by the die casting with Baltimore groove, also can be formed by directly etching on upper surface 62.When at least one groove 65 is formed by the die casting with Baltimore groove, then at least one groove 65, the degree of depth of each groove must be less than the degree of depth of the first cavity 64; When at least one groove 65 is formed by etching on upper surface 62, then at least one groove 65, the degree of depth of each groove must be less than the thickness of upper surface 62.
In the embodiment of the present application, for ensureing heat-conducting effect, at least one groove 65 is formed by the die casting with Baltimore groove, because the thickness of at least one groove 65 of casting is identical with the thickness of upper surface 62, so in the process of heat conduction, can ensure that the bottom of at least one groove 65 can not be too high and melt due to temperature, and upper surface 62 can not be subject to physical damage because of etching, and then ensure that metal hot plate 60 can work better.
In the embodiment of the present application, when being arranged in described notebook computer casing by heat pipe 70, in order to ensure radiating effect, normally heat pipe 70 is arranged on the larger surrounding electronic component of caloric value, or the region that heat-generating electronic elements is concentrated.As: around processor as described in heat pipe 70 can being arranged on, also heat pipe 70 can be arranged on around hard disk.Certainly, those skilled in the art, according to actual needs, can also determine the setting position of heat pipe 40, and at this, the application just differs and one to schematically illustrate.
When specifically arranging the position of heat pipe 70, first plane 73 at heat pipe 70 place is mutually vertical with second plane 61 at metal hot plate 60 place, and wherein, described first plane is the plane at the section place of first end 71 to the second end 72 of heat pipe 70.The first end 71 of heat pipe 70 has three kinds of modes with the position relationship of metal hot plate 60, be specially first end 71 and be connected to primary importance relation in the primary importance 66 of lower surface 63, or first end 71 is welded in the second place relation in primary importance 66, or first end 71 is integrally formed in the 3rd position relationship in the primary importance 66 of lower surface 63.To be described respectively below:
As shown in Figure 7, when first end 71 is primary importance relation with the position relationship of metal hot plate 60, the first cavity 64 is formed between lower surface 63 and upper surface 62, first end 71 is the first blind end 74 and the second end 72 is the second blind end 75, now, heat pipe 70 is for having the hollow tube of unconnected second cavity 76 with the first cavity 64, and be filled with Heat Conduction Material in the first cavity 64 and the second cavity 76, Heat Conduction Material is specially as Cu powder, nano-fluid etc.
In specific implementation process, metal hot plate 60 and heat pipe 70 are two entirety independently, first blind end 74 can be directly contact with the position relationship of lower surface 63, also can leave certain interval, as: interval 0.5cm or 0.8cm etc. between the first blind end 74 and lower surface 63; The shape of heat pipe 70 can be linear pattern also can be shaped form, and certainly, those skilled in the art can according to actual needs, determine directly contact or leave certain interval.
As shown in Figure 8, when first end 71 and the position relationship of metal hot plate 60 be second place relation or the 3rd position relationship time, now, in primary importance, 66 offer the first opening 67, corresponding, first end 71 is the first openend 77, second end 72 is the second blind end 78, the first cavity 64 is formed between lower surface 63 and upper surface 62, heat pipe 70 is for having the hollow tube of the second cavity 79 be communicated with the first cavity 64 by the first opening 67, be filled with Heat Conduction Material in first cavity 64 and the second cavity 79, Heat Conduction Material is specially Cu powder, nano-fluid etc.
In specific implementation process, metal hot plate 60 is the entirety be communicated with heat pipe 70, has two kinds of production methods, is specially: be welded on lower surface 63 by heat pipe 70 by the first opening 67, or directly metal hot plate 60 and heat pipe 70 integrally casting is formed.
In the embodiment of the application, be described notebook computer for electronic equipment, concrete radiation processes is: processor is after generation heat, first heat conduction is given the heat pipe 70 contacted with processor, heat pipe 70 passes through inner Heat Conduction Material, by heat conduction to the lower surface 63 be connected with heat pipe 70, lower surface 63 is by the Heat Conduction Material in metal hot plate 60, by heat conduction to upper surface 62, finally conduct to outside laptop devices, finally achieve the heat radiation to processor.
By the above-mentioned one or more technical scheme in the embodiment of the present application, at least there are one or more technique effects following:
One, technical scheme in the embodiment of the present application, due to described second plane at described first plane at described heat pipe place and described metal hot plate place is set to orthogonal position relationship, like this, utilize the described heat abstractor in the application when dispelling the heat to the vertical described heater element placed, without the need to described heat pipe is bent, the space that whole heat abstractor is taken diminishes, so, solve electronic equipment of the prior art to there is electronic equipment internal space and cannot meet the technical problem that deformation when heat pipe is vertically placed requires, reach the technique effect making the deformation of heat pipe be required to meet electronic equipment internal space.
Two, technical scheme in the embodiment of the present application, due to by parallel with described electronic component for described heat pipe placement, like this, when dispelling the heat to described electronic component, can not exist due to described heat pipe bending distortion and cause throughput to reduce, or because bending causes described heat pipe to break, and then the problem that the described Heat Conduction Material in described heat pipe is come off, like this, just can enable described heat pipe that the heat that the described heater element vertically placed produces is conducted to described metal hot plate fully, so, efficiently solve exist in prior art can not fully to the technical problem that heater element dispels the heat, achieve in the electronic equipment of small size fully to the technique effect that described vertical heater element dispels the heat.
Three, technical scheme in the embodiment of the present application, due to described phase-change material is positioned in described accommodation space, because described phase-change material has heat absorption capacity and heat storage capacity, like this, in the conduction process of described metallic plate, described phase-change material just can absorb a part of heat of described metal hot plate, reduce the temperature of described metal hot plate, simultaneously can also by a part of heat conduction from described metal hot plate to described shell, and conduct to outside described equipment by described shell, so, achieve further the technique effect improving electronic equipment dissipating heat ability.
Four, the technical scheme in the embodiment of the present application, owing to phase-change material being positioned in described accommodation space, because described phase-change material has heat storage capacity, like this, carrying out in radiation processes to described heater element, by absorbing heat, the change of form will be there is, as become liquid from solid in described phase-change material, and then realize the function of heat accumulation, so just can effectively reduce the heat conducting to described shell, so, achieve the technique effect of the temperature effectively reducing described shell.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (14)
1. a heat abstractor, for dispelling the heat to the electronic component producing heat in electronic equipment, comprising:
Metal hot plate;
Heat pipe, there is first end and the second end, wherein, between described first end and described metal hot plate, position relationship can make direct heat conduction between described heat pipe and described metal hot plate, the placement parallel with described electronic component of described heat pipe, first plane at described heat pipe place is mutually vertical with second plane at described metal hot plate place.
2. heat abstractor as claimed in claim 1, it is characterized in that, described metal hot plate comprises upper surface, the lower surface relative with described upper surface, wherein, described position relationship is specially described first end and is connected to primary importance relation in the primary importance of described lower surface, or described position relationship is specially described first end and is welded in second place relation in described primary importance, or described position relationship is specially described first end and is integrally formed in the 3rd position relationship in the described primary importance of described lower surface.
3. heat abstractor as claimed in claim 2, it is characterized in that, when described position relationship is described primary importance relation, the first cavity is formed between described lower surface and described upper surface, described first end is the first blind end and described second end is the second blind end, now, described heat pipe is have the hollow tube with unconnected second cavity of described first cavity, is filled with Heat Conduction Material in described first cavity and described second cavity.
4. heat abstractor as claimed in claim 2, it is characterized in that, when described position relationship is second place relation or when described position relationship is the 3rd position relationship, described primary importance offers the first opening, described first end is the first openend, described second end is the second blind end, the first cavity is formed between described lower surface and described upper surface, described heat pipe is the hollow tube of the second cavity had by described first opening and described first cavity connects, is filled with Heat Conduction Material in described first cavity and described second cavity.
5. heat abstractor as claimed in claim 2, is characterized in that, described lower surface is coated with thermal conductive material layer, offer at least one groove on the upper surface.
6. an electronic equipment, comprising:
Device housings, has in a bottom surface or described device housings and is provided with a circuit board;
An electronic component, be vertically arranged on described bottom surface or be vertically arranged on described circuit board, described electronic component, when in running order, can produce heat;
Metal hot plate, is fixedly installed on described device housings, and is formed with an accommodation space between described device housings;
Heat pipe, there is first end and the second end, wherein, between described first end and described metal hot plate, position relationship can make direct heat conduction between described heat pipe and described metal hot plate, the placement parallel with described electronic component of described heat pipe, wherein, first plane at described heat pipe place is mutually vertical with second plane at described metal hot plate place.
7. electronic equipment as claimed in claim 6, it is characterized in that, described device housings is made up of plastics or metal material.
8. electronic equipment as claimed in claim 6, it is characterized in that, described metal hot plate comprises upper surface, the lower surface relative with described upper surface, wherein, described position relationship is specially described first end and is connected to primary importance relation in the primary importance of described lower surface, or described position relationship is specially described first end and is welded in second place relation in described primary importance or described first end and is integrally formed in the 3rd position relationship in the described primary importance of described lower surface.
9. electronic equipment as claimed in claim 8, it is characterized in that, when described position relationship is primary importance relation, the first cavity is formed between described lower surface and described upper surface, described first end is the first blind end and described second end is the second blind end, now, described heat pipe is have the hollow tube with unconnected second cavity of described first cavity, is filled with Heat Conduction Material in described first cavity and described second cavity.
10. electronic equipment as claimed in claim 8, it is characterized in that, when described position relationship is second place relation or described position relationship is the 3rd position relationship, described primary importance offers the first opening, described first end is the first openend, described second end is the second blind end, the first cavity is formed between described lower surface and described upper surface, described heat pipe is the hollow tube of the second cavity had by described first opening and described first cavity connects, is filled with Heat Conduction Material in described first cavity and described second cavity.
11. electronic equipments as described in claim arbitrary in claim 8-10, described lower surface are coated with thermal conductive material layer, offer at least one groove on the upper surface.
12. electronic equipments as described in claim arbitrary in claim 6-10, it is characterized in that, the distance between described heat pipe and described electronic component is less than or equal to a predeterminable range.
13. electronic equipments as described in claim arbitrary in claim 6-10, it is characterized in that, when described accommodation space is seal cavity, described electronic equipment also comprises phase-change material, be placed in described accommodation space, described phase-change material is specially solid-liquid phase change material or solid-solid phase transition material.
14. electronic equipments as described in claim arbitrary in claim 6-10, it is characterized in that, when described accommodation space is non-tight space, described electronic equipment also comprises phase-change material, be placed in described accommodation space, described phase-change material is specially solid-solid phase transition material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410389975.8A CN105338784A (en) | 2014-08-08 | 2014-08-08 | Cooling device and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410389975.8A CN105338784A (en) | 2014-08-08 | 2014-08-08 | Cooling device and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105338784A true CN105338784A (en) | 2016-02-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410389975.8A Pending CN105338784A (en) | 2014-08-08 | 2014-08-08 | Cooling device and electronic equipment |
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| Country | Link |
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| CN (1) | CN105338784A (en) |
Cited By (6)
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| CN105744425A (en) * | 2016-04-29 | 2016-07-06 | 广东欧珀移动通信有限公司 | Handset assembly and mobile terminal |
| CN105792619A (en) * | 2016-04-29 | 2016-07-20 | 广东欧珀移动通信有限公司 | Heat sink and mobile terminal |
| CN106028741A (en) * | 2016-04-29 | 2016-10-12 | 广东欧珀移动通信有限公司 | Heat pipe and mobile terminal |
| CN111315190A (en) * | 2020-02-28 | 2020-06-19 | 维沃移动通信有限公司 | Electronic device |
| CN112087935A (en) * | 2020-10-26 | 2020-12-15 | 歌尔光学科技有限公司 | Electronic equipment and heat conduction hinge structure thereof |
| CN114503794A (en) * | 2019-10-16 | 2022-05-13 | 大众汽车股份公司 | Electronic system with heat exchange equipment |
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| CN112087935B (en) * | 2020-10-26 | 2022-11-04 | 歌尔光学科技有限公司 | Electronic equipment and heat conduction hinge structure thereof |
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