CN105293578B - Method for manufacturing light shielding material and method for manufacturing light shielding structure - Google Patents
Method for manufacturing light shielding material and method for manufacturing light shielding structure Download PDFInfo
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- CN105293578B CN105293578B CN201410352475.7A CN201410352475A CN105293578B CN 105293578 B CN105293578 B CN 105293578B CN 201410352475 A CN201410352475 A CN 201410352475A CN 105293578 B CN105293578 B CN 105293578B
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- tungsten
- material manufacturing
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- 239000000463 material Substances 0.000 title claims abstract description 91
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 33
- 239000006185 dispersion Substances 0.000 claims abstract description 51
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 41
- 239000010937 tungsten Substances 0.000 claims abstract description 41
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical group [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 40
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 23
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 15
- 239000001301 oxygen Substances 0.000 claims abstract description 15
- 229910052729 chemical element Inorganic materials 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims description 83
- 239000002245 particle Substances 0.000 claims description 52
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 claims description 30
- 239000007789 gas Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 26
- 150000001875 compounds Chemical class 0.000 claims description 17
- 239000004925 Acrylic resin Substances 0.000 claims description 15
- 229920000178 Acrylic resin Polymers 0.000 claims description 15
- -1 Corvic Polymers 0.000 claims description 14
- 239000006229 carbon black Substances 0.000 claims description 13
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 11
- 239000011812 mixed powder Substances 0.000 claims description 11
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 11
- 229910021387 carbon allotrope Inorganic materials 0.000 claims description 9
- 239000010409 thin film Substances 0.000 claims description 9
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 8
- 229910052783 alkali metal Inorganic materials 0.000 claims description 8
- 239000000460 chlorine Substances 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 8
- DZKDPOPGYFUOGI-UHFFFAOYSA-N tungsten(iv) oxide Chemical compound O=[W]=O DZKDPOPGYFUOGI-UHFFFAOYSA-N 0.000 claims description 8
- 150000001340 alkali metals Chemical class 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000010955 niobium Substances 0.000 claims description 7
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 7
- 150000002910 rare earth metals Chemical class 0.000 claims description 7
- 239000010948 rhodium Substances 0.000 claims description 7
- 239000011669 selenium Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- 239000010936 titanium Substances 0.000 claims description 7
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052801 chlorine Inorganic materials 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 claims description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 4
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000006061 abrasive grain Substances 0.000 claims description 4
- 229910052787 antimony Inorganic materials 0.000 claims description 4
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052786 argon Inorganic materials 0.000 claims description 4
- 229910052785 arsenic Inorganic materials 0.000 claims description 4
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 4
- 229910052793 cadmium Inorganic materials 0.000 claims description 4
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 4
- 229910052731 fluorine Inorganic materials 0.000 claims description 4
- 239000011737 fluorine Substances 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- 229910021389 graphene Inorganic materials 0.000 claims description 4
- 229910052735 hafnium Inorganic materials 0.000 claims description 4
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052741 iridium Inorganic materials 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 4
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052762 osmium Inorganic materials 0.000 claims description 4
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052699 polonium Inorganic materials 0.000 claims description 4
- HZEBHPIOVYHPMT-UHFFFAOYSA-N polonium atom Chemical compound [Po] HZEBHPIOVYHPMT-UHFFFAOYSA-N 0.000 claims description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 4
- 229920000915 polyvinyl chloride Polymers 0.000 claims description 4
- 229910052702 rhenium Inorganic materials 0.000 claims description 4
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 4
- 229910052703 rhodium Inorganic materials 0.000 claims description 4
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 229910052711 selenium Inorganic materials 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000011593 sulfur Substances 0.000 claims description 4
- 229910052717 sulfur Inorganic materials 0.000 claims description 4
- 229910052715 tantalum Inorganic materials 0.000 claims description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052713 technetium Inorganic materials 0.000 claims description 4
- GKLVYJBZJHMRIY-UHFFFAOYSA-N technetium atom Chemical compound [Tc] GKLVYJBZJHMRIY-UHFFFAOYSA-N 0.000 claims description 4
- 229910052714 tellurium Inorganic materials 0.000 claims description 4
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052716 thallium Inorganic materials 0.000 claims description 4
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 229920001328 Polyvinylidene chloride Polymers 0.000 claims description 3
- 229920001807 Urea-formaldehyde Polymers 0.000 claims description 3
- 239000002585 base Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000013034 phenoxy resin Substances 0.000 claims description 3
- 229920006287 phenoxy resin Polymers 0.000 claims description 3
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 3
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920005668 polycarbonate resin Polymers 0.000 claims description 3
- 239000004431 polycarbonate resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001225 polyester resin Polymers 0.000 claims description 3
- 239000004645 polyester resin Substances 0.000 claims description 3
- 229920000570 polyether Polymers 0.000 claims description 3
- 239000005033 polyvinylidene chloride Substances 0.000 claims description 3
- 229920002050 silicone resin Polymers 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 239000003245 coal Substances 0.000 claims 8
- 230000003647 oxidation Effects 0.000 claims 8
- 238000007254 oxidation reaction Methods 0.000 claims 8
- 239000000956 alloy Substances 0.000 claims 6
- 229910045601 alloy Inorganic materials 0.000 claims 6
- 230000000873 masking effect Effects 0.000 claims 2
- 239000004793 Polystyrene Substances 0.000 claims 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 1
- 229920003180 amino resin Polymers 0.000 claims 1
- 229910052789 astatine Inorganic materials 0.000 claims 1
- RYXHOMYVWAEKHL-UHFFFAOYSA-N astatine atom Chemical compound [At] RYXHOMYVWAEKHL-UHFFFAOYSA-N 0.000 claims 1
- WGWACCCAJWZIML-UHFFFAOYSA-N benzene;buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N.C1=CC=CC=C1 WGWACCCAJWZIML-UHFFFAOYSA-N 0.000 claims 1
- 229920001038 ethylene copolymer Polymers 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 claims 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 229910052720 vanadium Inorganic materials 0.000 claims 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims 1
- 229910052725 zinc Inorganic materials 0.000 claims 1
- 239000011701 zinc Substances 0.000 claims 1
- 229910052726 zirconium Inorganic materials 0.000 claims 1
- 239000002019 doping agent Substances 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 11
- 230000035515 penetration Effects 0.000 abstract description 4
- 230000000903 blocking effect Effects 0.000 abstract description 2
- QFHCYMVKJALMHW-UHFFFAOYSA-J [W+4].C([O-])([O-])=O.C([O-])([O-])=O Chemical compound [W+4].C([O-])([O-])=O.C([O-])([O-])=O QFHCYMVKJALMHW-UHFFFAOYSA-J 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 57
- 239000010408 film Substances 0.000 description 26
- 238000002834 transmittance Methods 0.000 description 23
- 239000002994 raw material Substances 0.000 description 22
- 239000002270 dispersing agent Substances 0.000 description 19
- 239000000203 mixture Substances 0.000 description 18
- 239000002002 slurry Substances 0.000 description 18
- 239000000758 substrate Substances 0.000 description 16
- 229920002799 BoPET Polymers 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 230000003287 optical effect Effects 0.000 description 12
- 238000000227 grinding Methods 0.000 description 11
- QGLKJKCYBOYXKC-UHFFFAOYSA-N nonaoxidotritungsten Chemical compound O=[W]1(=O)O[W](=O)(=O)O[W](=O)(=O)O1 QGLKJKCYBOYXKC-UHFFFAOYSA-N 0.000 description 11
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 229910001930 tungsten oxide Inorganic materials 0.000 description 11
- 238000000498 ball milling Methods 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 238000007606 doctor blade method Methods 0.000 description 9
- 238000001132 ultrasonic dispersion Methods 0.000 description 9
- 229920000139 polyethylene terephthalate Polymers 0.000 description 7
- 239000005020 polyethylene terephthalate Substances 0.000 description 7
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 6
- 150000001342 alkaline earth metals Chemical class 0.000 description 6
- 229910052792 caesium Inorganic materials 0.000 description 6
- KOPBYBDAPCDYFK-UHFFFAOYSA-N caesium oxide Chemical compound [O-2].[Cs+].[Cs+] KOPBYBDAPCDYFK-UHFFFAOYSA-N 0.000 description 6
- 229910001942 caesium oxide Inorganic materials 0.000 description 6
- 239000011572 manganese Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 5
- 239000003574 free electron Substances 0.000 description 5
- 239000002609 medium Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000001228 spectrum Methods 0.000 description 4
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 3
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000002041 carbon nanotube Substances 0.000 description 3
- 229910021393 carbon nanotube Inorganic materials 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 229910052748 manganese Inorganic materials 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 3
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 3
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 239000011575 calcium Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- SKRWFPLZQAAQSU-UHFFFAOYSA-N stibanylidynetin;hydrate Chemical compound O.[Sn].[Sb] SKRWFPLZQAAQSU-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000005338 frosted glass Substances 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 238000000713 high-energy ball milling Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 150000003891 oxalate salts Chemical class 0.000 description 1
- VVRQVWSVLMGPRN-UHFFFAOYSA-N oxotungsten Chemical class [W]=O VVRQVWSVLMGPRN-UHFFFAOYSA-N 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 238000000411 transmission spectrum Methods 0.000 description 1
- PBYZMCDFOULPGH-UHFFFAOYSA-N tungstate Chemical compound [O-][W]([O-])(=O)=O PBYZMCDFOULPGH-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- HGBOYTHUEUWSSQ-UHFFFAOYSA-N valeric aldehyde Natural products CCCCC=O HGBOYTHUEUWSSQ-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
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- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0205—Diffusing elements; Afocal elements characterised by the diffusing properties
- G02B5/0236—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element
- G02B5/0242—Diffusing elements; Afocal elements characterised by the diffusing properties the diffusion taking place within the volume of the element by means of dispersed particles
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/02—Diffusing elements; Afocal elements
- G02B5/0268—Diffusing elements; Afocal elements characterized by the fabrication or manufacturing method
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
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- Chemical Kinetics & Catalysis (AREA)
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- Paints Or Removers (AREA)
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Abstract
本发明提供一种光遮蔽体材料、光遮蔽结构及其制造方法,其中光遮蔽结构包含:透明基材及薄膜,薄膜设于透明基材上,且薄膜具有多个分散体,其中多个分散体为掺杂的碳氧化钨,如式(I)所示:MxWCyOz式(I);其中M为掺杂物,掺杂物内含至少一种化学元素,W为钨,C为碳,O为氧,且0<x≦1,0<y≦1,0<z≦3。在此结构中,可由多个分散体均匀分布于薄膜中,进而于可见光波段具有良好的穿透性,且兼顾遮蔽红外光的功效。
The invention provides a light shielding material, a light shielding structure and a manufacturing method thereof. The light shielding structure includes: a transparent base material and a film, the film is provided on the transparent base material, and the film has multiple dispersions, wherein multiple dispersions The body is doped tungsten carbonate, as shown in formula (I): M x WC y O z formula (I); where M is the dopant, and the dopant contains at least one chemical element, W is tungsten, C is carbon, O is oxygen, and 0<x≦1, 0<y≦1, 0<z≦3. In this structure, multiple dispersions can be evenly distributed in the film, thereby having good penetration in the visible light band and taking into account the effect of blocking infrared light.
Description
技术领域technical field
本发明有关于一种光遮蔽体材料、光遮蔽结构及其制造方法,尤其是指一种可遮蔽红外光的光遮蔽体材料、光遮蔽结构及其制造方法。The invention relates to a light-shielding material, a light-shielding structure and a manufacturing method thereof, in particular to a light-shielding material capable of shielding infrared light, a light-shielding structure and a manufacturing method thereof.
背景技术Background technique
在现今的地球环境中,由于石化能源的大量使用,导致温室效应逐渐严重,其中最主要原因为可见光和近红外光(near-infrared)所产生的热能在地球内滞留,而使地球气温逐年增加。因此,节能减碳已经成为日益重要的课题。In today's global environment, due to the extensive use of fossil energy, the greenhouse effect is gradually becoming serious. The main reason is that the heat energy generated by visible light and near-infrared light stays in the earth, which makes the earth's temperature increase year by year. . Therefore, energy saving and carbon reduction has become an increasingly important issue.
太阳光辐射波长分布为300~2500纳米(nm),其中紫外线部分占14%,可见光部分占40%,红外线部分占44%。传统的玻璃具有透光效果,但保温隔热性能较差,因此科学家和工程师尝试将汽车及建筑物的窗户,涂上一层具有遮蔽红外光的金属薄膜,例如:含银或含铝的金属薄膜等,金属薄膜利用反射的方式达到遮蔽的效果。然而金属薄膜会阻断电磁波,对于车内的电子产品,如:GPS、ETC、行动通讯装置等,均有不良的影响。此外,一般制作金属薄膜大多利用物理气相沉积(PVD)或化学气相沉积(CVD)等方法,工艺成本及产品价格非常昂贵。The wavelength distribution of solar radiation is 300-2500 nanometers (nm), of which the ultraviolet part accounts for 14%, the visible part accounts for 40%, and the infrared part accounts for 44%. Traditional glass has a light-transmitting effect, but its thermal insulation performance is poor, so scientists and engineers try to coat the windows of cars and buildings with a metal film that can shield infrared light, such as metals containing silver or aluminum Thin films, etc., metal thin films use reflection to achieve the effect of shielding. However, the metal film will block electromagnetic waves, which will have adverse effects on the electronic products in the car, such as GPS, ETC, mobile communication devices, etc. In addition, generally, physical vapor deposition (PVD) or chemical vapor deposition (CVD) is used to make metal thin films, and the process cost and product price are very expensive.
过去也有利用深色颜料(dye或pigment)来阻隔太阳光,但此产品的可见光穿透度不佳,且对于红外光几乎完全没有阻隔的效果。In the past, dark pigments (dye or pigment) were also used to block sunlight, but this product has poor visible light penetration and has almost no blocking effect on infrared light.
目前部分市售的产品有采用LaB6、ATO(氧化锑锡)或ITO(氧化铟锡)等陶瓷化合物制成隔热膜,但LaB6会吸收可见光,导致颜色太深;而ATO和ITO对可见光的穿透率佳,但对红外光的遮蔽效果较不明显。At present, some commercially available products use ceramic compounds such as LaB 6 , ATO (antimony tin oxide) or ITO (indium tin oxide) to make heat insulation films, but LaB 6 will absorb visible light and cause the color to be too dark; The penetration rate of visible light is good, but the shielding effect on infrared light is less obvious.
此外,目前市面上尚有利用碱金属元素掺杂氧化钨的化合物的粉末或薄膜作为遮蔽红外线材料或电致色变组件,但由于材料本质的问题,导致可见光的穿透率和红外光的遮蔽仍然存在无法兼顾的现象。In addition, there are still powders or films of tungsten oxide compounds doped with alkali metal elements on the market as infrared shielding materials or electrochromic components, but due to the nature of the materials, the visible light transmittance and infrared shielding There are still inconsistencies.
发明内容Contents of the invention
因此,本发明的目的是在提供一种能够适度地阻挡可见光、并遮蔽红外光且不反射太阳光的光遮蔽体材料、光遮蔽结构及其制造方法,期待能解决上述的各种问题。Therefore, the object of the present invention is to provide a light-shielding body material, a light-shielding structure and a manufacturing method that can moderately block visible light, shield infrared light, and not reflect sunlight, and is expected to solve the above-mentioned various problems.
依据本发明的结构的实施方式,提出一种光遮蔽体材料,其为式(I)所示的掺杂的碳氧化钨,掺杂的碳氧化钨由掺杂物与碳同素异形体共掺杂含钨化合物而构成:According to the embodiment of the structure of the present invention, a kind of light-shielding body material is proposed, which is doped tungsten oxycarbide shown in formula (I), and doped tungsten oxycarbide is composed of dopant and carbon allotrope Doped with tungsten-containing compounds to form:
MxWCyOz 式(I);M x WC y O z formula (I);
其中M为掺杂物,掺杂物内含至少一种化学元素,W为钨,C为碳,O为氧,且0<x≦1,0<y≦1,0<z≦3。Wherein M is a dopant containing at least one chemical element, W is tungsten, C is carbon, O is oxygen, and 0<x≦1, 0<y≦1, 0<z≦3.
前述实施方式中的其他实施例如下:前述的掺杂物可选自于碱金属(AlkaliMetals)、碱土金属(Alkaline Earth Metals)、稀土金属(Rare Earth Metals)、硼(B)、碳(C)、氟(F)、铝(Al)、硅(Si)、磷(P)、硫(S)、氯(Cl)、钛(Ti)、钒(V)、铬(Cr)、锰(Mn)、铁(Fe)、钴(Co)、镍(Ni)、铜(Cu)、锌(Zn)、镓(Ga)、锗(Ge)、砷(As)、硒(Se)、溴(Br)、锆(Zr)、铌(Nb)、钼(Mo)、锝(Tc)、钌(Ru)、铑(Rh)、钯(Pd)、银(Ag)、镉(Cd)、铟(In)、锡(Sn)、锑(Sb)、碲(Te)、碘(I)、铪(Hf)、钽(Ta)、铼(Re)、锇(Os)、铱(Ir)、铂(Pt)、金(Au)、汞(Hg)、铊(Tl)、铅(Pb)、铋(Bi)、钋(Po)及砈(At)所组成的族群中的一种。前述的碳同素异形体可选自于碳黑(carbon black)、石墨(graphite)、纳米碳管(carbon nanotube)及石墨烯(graphene)所组成的族群中的一种。前述的光遮蔽体材料为颗粒状,且光遮蔽体材料的粒径为1纳米(nm)至1000纳米(nm)。前述的光遮蔽体材料为颗粒状,且光遮蔽体材料的粒径1纳米(nm)至150纳米(nm)。Other examples in the aforementioned embodiments are as follows: the aforementioned dopant can be selected from alkali metals (AlkaliMetals), alkaline earth metals (Alkaline Earth Metals), rare earth metals (Rare Earth Metals), boron (B), carbon (C) , Fluorine (F), Aluminum (Al), Silicon (Si), Phosphorus (P), Sulfur (S), Chlorine (Cl), Titanium (Ti), Vanadium (V), Chromium (Cr), Manganese (Mn) , iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), zinc (Zn), gallium (Ga), germanium (Ge), arsenic (As), selenium (Se), bromine (Br) , zirconium (Zr), niobium (Nb), molybdenum (Mo), technetium (Tc), ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), cadmium (Cd), indium (In) , tin (Sn), antimony (Sb), tellurium (Te), iodine (I), hafnium (Hf), tantalum (Ta), rhenium (Re), osmium (Os), iridium (Ir), platinum (Pt) , Gold (Au), Mercury (Hg), Thallium (Tl), Lead (Pb), Bismuth (Bi), Polonium (Po) and Astatin (At). The aforementioned carbon allotrope can be selected from the group consisting of carbon black, graphite, carbon nanotube and graphene. The aforementioned light-shielding body material is granular, and the particle size of the light-shielding body material is 1 nanometer (nm) to 1000 nanometers (nm). The aforementioned light-shielding body material is granular, and the particle size of the light-shielding body material is 1 nanometer (nm) to 150 nanometers (nm).
依据本发明方法的实施方式,提出一种光遮蔽体材料制造方法,其步骤包含:准备粉末,其中粉末包含掺杂物、含钨化合物与碳同素异形体。添加研磨颗粒于粉末中,形成混合粉末。研磨混合粉末,得到初始原料。利用混合气体热处理初始原料,形成掺杂的碳氧化钨,如式(I)所示:According to an embodiment of the method of the present invention, a method for manufacturing a light-shielding body material is proposed, the steps of which include: preparing a powder, wherein the powder includes a dopant, a tungsten-containing compound, and a carbon allotrope. Abrasive particles are added to the powder to form a mixed powder. The mixed powder is ground to obtain the starting material. Utilize mixed gas heat treatment initial raw material, form doped tungsten oxycarbide, as shown in formula (I):
MxWCyOz 式(I);M x WC y O z formula (I);
其中M为掺杂物,掺杂物内含至少一种化学元素,W为钨,C为碳,O为氧,且0<x≦1,0<y≦1,0<z≦3。Wherein M is a dopant containing at least one chemical element, W is tungsten, C is carbon, O is oxygen, and 0<x≦1, 0<y≦1, 0<z≦3.
前述方法实施方式中的其他实施例如下:前述的含钨化合物可为三氧化钨粉末或二氧化钨粉末。前述的掺杂物可选自于碱金属(Alkali Metals)、碱土金属(AlkalineEarth Metals)、稀土金属(Rare Earth Metals)、硼(B)、碳(C)、氟(F)、铝(Al)、硅(Si)、磷(P)、硫(S)、氯(Cl)、钛(Ti)、钒(V)、铬(Cr)、锰(Mn)、铁(Fe)、钴(Co)、镍(Ni)、铜(Cu)、锌(Zn)、镓(Ga)、锗(Ge)、砷(As)、硒(Se)、溴(Br)、锆(Zr)、铌(Nb)、钼(Mo)、锝(Tc)、钌(Ru)、铑(Rh)、钯(Pd)、银(Ag)、镉(Cd)、铟(In)、锡(Sn)、锑(Sb)、碲(Te)、碘(I)、铪(Hf)、钽(Ta)、铼(Re)、锇(Os)、铱(Ir)、铂(Pt)、金(Au)、汞(Hg)、铊(Tl)、铅(Pb)、铋(Bi)、钋(Po)及砈(At)所组成的族群中的一种。前述的碳同素异形体可选自于碳黑(carbon black)、石墨(graphite)、纳米碳管(carbon nanotube)及石墨烯(graphene)所组成的族群中的一种。前述的研磨颗粒的材质可为碳化硅。前述的混合粉末的研磨颗粒与粉末的重量比可为8:1。前述的步骤研磨混合粉末中,可利用高能球磨机研磨30分钟至6小时。前述的混合气体可包含氢气、甲烷及氩气。前述的热处理温度可为100℃至1000℃,热处理时间可为1小时至12小时。Other examples in the aforementioned method implementation are as follows: the aforementioned tungsten-containing compound may be tungsten trioxide powder or tungsten dioxide powder. The aforementioned dopants can be selected from alkali metals (Alkali Metals), alkaline earth metals (Alkaline Earth Metals), rare earth metals (Rare Earth Metals), boron (B), carbon (C), fluorine (F), aluminum (Al) , silicon (Si), phosphorus (P), sulfur (S), chlorine (Cl), titanium (Ti), vanadium (V), chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co) , nickel (Ni), copper (Cu), zinc (Zn), gallium (Ga), germanium (Ge), arsenic (As), selenium (Se), bromine (Br), zirconium (Zr), niobium (Nb) , molybdenum (Mo), technetium (Tc), ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), cadmium (Cd), indium (In), tin (Sn), antimony (Sb) , tellurium (Te), iodine (I), hafnium (Hf), tantalum (Ta), rhenium (Re), osmium (Os), iridium (Ir), platinum (Pt), gold (Au), mercury (Hg) , thallium (Tl), lead (Pb), bismuth (Bi), polonium (Po) and astatite (At). The aforementioned carbon allotrope can be selected from the group consisting of carbon black, graphite, carbon nanotube and graphene. The aforementioned abrasive grains can be made of silicon carbide. The weight ratio of the abrasive particles to the powder in the aforementioned mixed powder may be 8:1. In the aforementioned step of grinding the mixed powder, a high-energy ball mill can be used to grind for 30 minutes to 6 hours. The aforementioned mixed gas may include hydrogen, methane and argon. The aforementioned heat treatment temperature may be 100° C. to 1000° C., and the heat treatment time may be 1 hour to 12 hours.
依据本发明另一结构的实施方式,提出一种光遮蔽结构,其包含:透明基材及薄膜,薄膜被设置于透明基材上,且薄膜具有多个掺杂的碳氧化钨,如式(I)所示:According to the embodiment of another structure of the present invention, a light shielding structure is proposed, which includes: a transparent substrate and a film, the film is arranged on the transparent substrate, and the film has a plurality of doped tungsten oxycarbides, as shown in the formula ( I) Shown:
MxWCyOz 式(I);M x WC y O z formula (I);
其中M为掺杂物,掺杂物内含至少一种化学元素,W为钨,C为碳,O为氧,且0<x≦1,0<y≦1,0<z≦3。Wherein M is a dopant containing at least one chemical element, W is tungsten, C is carbon, O is oxygen, and 0<x≦1, 0<y≦1, 0<z≦3.
前述实施方式中的其他实施例如下:前述的薄膜厚度可为0.5微米(μm)至200微米(μm)。Other examples in the aforementioned embodiments are as follows: the thickness of the aforementioned film may be from 0.5 micrometers (μm) to 200 micrometers (μm).
依据本发明另一方法的实施方式,提出一种光遮蔽结构制造方法,其中制造方法的步骤包含:准备多个掺杂的碳氧化钨,掺杂的碳氧化钨如式(I)所示:According to the embodiment of another method of the present invention, a method for manufacturing a light-shielding structure is proposed, wherein the steps of the manufacturing method include: preparing a plurality of doped tungsten oxycarbide, and the doped tungsten oxycarbide is shown in formula (I):
MxWCyOz 式(I);M x WC y O z formula (I);
其中M为掺杂物,掺杂物内含至少一种元素,W为钨,C为碳,O为氧,且0<x≦1,0<y≦1,0<z≦3。添加溶剂,使多个掺杂的碳氧化钨均匀分散于溶剂。添加介质,得到分散液。涂布分散液于透明基材上。固化分散液的介质,形成薄膜。Wherein M is a dopant containing at least one element, W is tungsten, C is carbon, O is oxygen, and 0<x≦1, 0<y≦1, 0<z≦3. A solvent is added to uniformly disperse a plurality of doped tungsten oxycarbides in the solvent. The medium is added to obtain a dispersion. Spread the dispersion on a transparent substrate. Solidifies the medium of the dispersion to form a thin film.
前述实施方式中的其他实施例如下:前述的介质可选自于聚酯树脂、PI树脂、聚碳酸酯树脂、聚乙烯树脂、聚氯乙烯树脂、聚偏氯乙烯树脂、聚乙烯醇树脂、聚苯乙烯树脂、聚乙烯醇缩丁醛树脂、乙烯-醋酸乙烯共聚物、聚丙烯树脂、丙烯酸树脂、氟树脂、硅酮类树脂、苯氧基树脂、聚对苯二甲酸乙二醇酯树脂、聚氨基树脂、尿素树脂、丙烯腈-丁二烯-苯乙烯共聚物(ABS树脂)、聚醚树脂、聚酰胺、压克力树脂、环氧树脂及UV固化树脂所组成的族群中的一种。Other examples in the aforementioned embodiment are as follows: the aforementioned medium can be selected from polyester resin, PI resin, polycarbonate resin, polyethylene resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyvinyl alcohol resin, poly Styrene resin, polyvinyl butyral resin, ethylene-vinyl acetate copolymer, polypropylene resin, acrylic resin, fluororesin, silicone resin, phenoxy resin, polyethylene terephthalate resin, One of the group consisting of polyurethane resin, urea resin, acrylonitrile-butadiene-styrene copolymer (ABS resin), polyether resin, polyamide, acrylic resin, epoxy resin and UV curing resin .
附图说明Description of drawings
图1是本发明的光遮蔽体材料制造方法的流程图。Fig. 1 is a flow chart of the manufacturing method of the light-shielding body material of the present invention.
图2是本发明的光遮蔽结构制造方法的流程图。FIG. 2 is a flow chart of the manufacturing method of the light-shielding structure of the present invention.
图3A是本发明一实施例的光遮蔽结构。FIG. 3A is a light shielding structure according to an embodiment of the present invention.
图3B是本发明另一实施例的光遮蔽结构侧视图。FIG. 3B is a side view of a light shielding structure according to another embodiment of the present invention.
图4是本发明的光遮蔽体材料的颗粒粒径-频率图。Fig. 4 is a particle size-frequency diagram of the light-shielding body material of the present invention.
图5是本发明的光遮蔽结构的波长-穿透率图。FIG. 5 is a wavelength-transmittance graph of the light shielding structure of the present invention.
具体实施方式detailed description
由于三氧化钨(WO3)中不存在有效的自由电子,因此在可见光和近红外线区域的吸收及反射特性较差,不能有效地作为光遮蔽材料。当三氧化钨中的氧与钨的原子比例小于3时,即代表缺氧的状态或具有氧空缺,可知在氧化钨中生成了自由电子;尤其当氧与钨的原子比例小于2.2时,会有二氧化钨(WO2)的结晶相出现。因此,本发明通过添加掺杂物和碳进入三氧化钨的晶格中,以得到材料的化学稳定性,并控制氧与钨的原子比例小于3,使在氧化钨中生成必要量的自由电子,作为有效的光遮蔽体材料。Since there are no effective free electrons in tungsten trioxide (WO 3 ), the absorption and reflection properties in the visible and near-infrared regions are poor, and it cannot be effectively used as a light shielding material. When the atomic ratio of oxygen to tungsten in tungsten trioxide is less than 3, it represents an oxygen-deficient state or has oxygen vacancies. It can be seen that free electrons are generated in tungsten oxide; especially when the atomic ratio of oxygen to tungsten is less than 2.2, it will A crystalline phase of tungsten dioxide (WO 2 ) appears. Therefore, the present invention enters the crystal lattice of tungsten trioxide by adding dopants and carbon to obtain the chemical stability of the material, and controls the atomic ratio of oxygen to tungsten to be less than 3, so that a necessary amount of free electrons is generated in tungsten oxide , as an effective light-shielding material.
请参照图1,其是本发明的光遮蔽体材料制造方法的流程图。由图1可知,其步骤包含:步骤100,准备粉末,其中粉末包含掺杂物、含钨化合物与碳同素异形体。步骤110,添加研磨颗粒于粉末中,形成混合粉末。步骤120,研磨混合粉末,得到初始原料。步骤130,利用混合气体热处理初始原料,形成掺杂的碳氧化钨,所形成的掺杂的碳氧化钨如式(I)所示:Please refer to FIG. 1 , which is a flowchart of a method for manufacturing a light-shielding body material of the present invention. It can be known from FIG. 1 that the steps include: step 100, preparing powder, wherein the powder includes dopant, tungsten-containing compound and carbon allotrope. Step 110, adding abrasive particles to the powder to form a mixed powder. Step 120, grinding the mixed powder to obtain the initial raw material. In step 130, the initial raw material is heat-treated with a mixed gas to form doped tungsten oxycarbide, and the formed doped tungsten oxycarbide is shown in formula (I):
MxWCyOz 式(I);M x WC y O z formula (I);
其中M为掺杂物,掺杂物内含至少一种化学元素,W为钨,C为碳,O为氧,且0<x≦1,0<y≦1,0<z≦3。Wherein M is a dopant containing at least one chemical element, W is tungsten, C is carbon, O is oxygen, and 0<x≦1, 0<y≦1, 0<z≦3.
上述的含钨的化合物可选用三氧化钨粉末和/或二氧化钨粉末;另外,掺杂物M的来源是含有化学元素M的氧化物、氢氧化物、碳酸盐、钨酸盐、氯化物盐、硝酸盐、硫酸盐、草酸盐或氮氧化物等。The above-mentioned tungsten-containing compound can be selected from tungsten trioxide powder and/or tungsten dioxide powder; in addition, the source of dopant M is oxide, hydroxide, carbonate, tungstate, chlorine containing chemical element M Compound salts, nitrates, sulfates, oxalates or nitrogen oxides, etc.
上述的掺杂物(M)可选自于碱金属(Alkali Metals)、碱土金属(Alkaline EarthMetals)、稀土金属(Rare Earth Metals)、硼(B)、碳(C)、氟(F)、铝(Al)、硅(Si)、磷(P)、硫(S)、氯(Cl)、钛(Ti)、钒(V)、铬(Cr)、锰(Mn)、铁(Fe)、钴(Co)、镍(Ni)、铜(Cu)、锌(Zn)、镓(Ga)、锗(Ge)、砷(As)、硒(Se)、溴(Br)、锆(Zr)、铌(Nb)、钼(Mo)、锝(Tc)、钌(Ru)、铑(Rh)、钯(Pd)、银(Ag)、镉(Cd)、铟(In)、锡(Sn)、锑(Sb)、碲(Te)、碘(I)、铪(Hf)、钽(Ta)、铼(Re)、锇(Os)、铱(Ir)、铂(Pt)、金(Au)、汞(Hg)、铊(Tl)、铅(Pb)、铋(Bi)、钋(Po)及砈(At)所组成的族群中的一种。掺杂物的添加量越多时,也会增加自由电子的量,因此光遮蔽的效果也会增加,但x值接近1时,效果逐渐达到饱和。The above-mentioned dopant (M) can be selected from alkali metals (Alkali Metals), alkaline earth metals (Alkaline Earth Metals), rare earth metals (Rare Earth Metals), boron (B), carbon (C), fluorine (F), aluminum (Al), silicon (Si), phosphorus (P), sulfur (S), chlorine (Cl), titanium (Ti), vanadium (V), chromium (Cr), manganese (Mn), iron (Fe), cobalt (Co), nickel (Ni), copper (Cu), zinc (Zn), gallium (Ga), germanium (Ge), arsenic (As), selenium (Se), bromine (Br), zirconium (Zr), niobium (Nb), molybdenum (Mo), technetium (Tc), ruthenium (Ru), rhodium (Rh), palladium (Pd), silver (Ag), cadmium (Cd), indium (In), tin (Sn), antimony (Sb), tellurium (Te), iodine (I), hafnium (Hf), tantalum (Ta), rhenium (Re), osmium (Os), iridium (Ir), platinum (Pt), gold (Au), mercury (Hg), thallium (Tl), lead (Pb), bismuth (Bi), polonium (Po) and astatite (At). When the amount of dopant added increases, the amount of free electrons also increases, so the effect of light shielding also increases, but when the value of x is close to 1, the effect gradually reaches saturation.
此外,为了适度地调控掺杂的碳氧化钨材料中的自由电子的量、材料本身的化学稳定性和太阳光遮蔽的效能,本发明添加适量的碳同素异形体,取代部分的氧含量。前述的碳同素异形体可选自于碳黑(carbon black)、石墨(graphite)、纳米碳管(carbonnanotube)及石墨烯(graphene)所组成的族群中的一种。因此所形成的掺杂的碳氧化钨对全太阳光谱的波长范围均展现出优异的遮蔽特性,对于隔绝太阳热能相当有效。In addition, in order to moderately regulate the amount of free electrons in the doped tungsten oxycarbide material, the chemical stability of the material itself and the effectiveness of sunlight shielding, the present invention adds an appropriate amount of carbon allotrope to replace part of the oxygen content. The aforementioned carbon allotrope can be selected from the group consisting of carbon black, graphite, carbon nanotube and graphene. Therefore, the formed doped tungsten oxycarbide exhibits excellent shielding characteristics for the wavelength range of the whole solar spectrum, and is quite effective for insulating solar heat energy.
前述步骤120中,为了获得均匀混合的掺杂的碳氧化钨,本发明将适量比例的含W、M和C的原料秤重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨30分钟至6小时后,可获得混合均匀的混合粉末。In the aforementioned step 120, in order to obtain uniformly mixed doped tungsten oxycarbide, the present invention weighs an appropriate amount of raw materials containing W, M and C and puts them into a ball mill jar, and the built-in diameters are 5mm and 10mm. Pure silicon carbide abrasive particles, the weight ratio of the abrasive particles to the powder is 8:1, and after ball milling with a high-energy ball mill for 30 minutes to 6 hours, a uniformly mixed powder can be obtained.
前述步骤130中,混合粉末在惰性及/或还原性气体环境中进行热处理,热处理的温度是100℃-1000℃,时间为1小时-12小时;惰性及/或还原性混合气体中包括任意比例的氩气(Ar)、氮气(N2)、氢气(H2)或甲烷(CH4),一般使用氢气(5vol%)+甲烷(5vol%)+氩气(90vol%)为较佳的条件。In the aforementioned step 130, the mixed powder is heat-treated in an inert and/or reducing gas environment, the temperature of the heat treatment is 100°C-1000°C, and the time is 1 hour-12 hours; the inert and/or reducing mixed gas includes any proportion of Argon (Ar), nitrogen (N 2 ), hydrogen (H 2 ) or methane (CH 4 ), generally using hydrogen (5vol%) + methane (5vol%) + argon (90vol%) is a better condition .
请参照图2,其是本发明的光遮蔽结构的制造方法流程图,其步骤包含:步骤200,准备多个分散体,其中多个分散体为掺杂的碳氧化钨。步骤210,添加溶剂,使多个分散体均匀分散于溶剂。步骤220,添加介质,得到分散液。步骤230,涂布分散液于透明基材上。步骤240,固化分散液的介质,形成薄膜。Please refer to FIG. 2 , which is a flowchart of the manufacturing method of the light-shielding structure of the present invention, and its steps include: Step 200 , preparing a plurality of dispersions, wherein the plurality of dispersions are doped tungsten oxycarbide. Step 210, adding a solvent so that the plurality of dispersions are evenly dispersed in the solvent. Step 220, adding a medium to obtain a dispersion. Step 230, coating the dispersion on the transparent substrate. Step 240, curing the dispersion medium to form a thin film.
上述步骤200中的多个分散体,是利用图1的制造方法所制备出的掺杂的碳氧化钨。The plurality of dispersions in the above step 200 are doped tungsten oxycarbides prepared by the manufacturing method in FIG. 1 .
上述步骤210中的溶剂是以甲苯和分散剂以重量比6:1混合而成。The solvent in the above step 210 is prepared by mixing toluene and dispersant at a weight ratio of 6:1.
上述步骤220中的介质可选自于聚酯树脂、PI树脂、聚碳酸酯树脂、聚乙烯树脂、聚氯乙烯树脂、聚偏氯乙烯树脂、聚乙烯醇树脂、聚苯乙烯树脂、聚乙烯醇缩丁醛树脂、乙烯-醋酸乙烯共聚物、聚丙烯树脂、丙烯酸树脂、氟树脂、硅酮类树脂、苯氧基树脂、聚对苯二甲酸乙二醇酯树脂、聚氨基树脂、尿素树脂、丙烯腈-丁二烯-苯乙烯共聚物(ABS树脂)、聚醚树脂、聚酰胺、压克力树脂、环氧树脂及UV固化树脂所组成的族群中的一种。The medium in the above step 220 can be selected from polyester resin, PI resin, polycarbonate resin, polyethylene resin, polyvinyl chloride resin, polyvinylidene chloride resin, polyvinyl alcohol resin, polystyrene resin, polyvinyl alcohol Butyral resin, ethylene-vinyl acetate copolymer, polypropylene resin, acrylic resin, fluororesin, silicone resin, phenoxy resin, polyethylene terephthalate resin, polyurethane resin, urea resin, One of acrylonitrile-butadiene-styrene copolymer (ABS resin), polyether resin, polyamide, acrylic resin, epoxy resin and UV curing resin.
上述步骤230中的涂布方法是能够在透明基材的表面上均匀地涂布含有多个分散体的分散液即可,涂布方法包括:线棒涂布法、凹版涂布法、喷雾涂布法、浸渍涂布法、狭缝涂布法、旋转涂布法、棒状涂布法、滚筒涂布法或刮刀涂布法。The coating method in the above step 230 is that the dispersion liquid containing multiple dispersions can be evenly coated on the surface of the transparent substrate. The coating method includes: wire bar coating method, gravure coating method, spray coating Cloth, dip, slot, spin, rod, roll, or knife coater.
上述的透明基材可以根据不同的目的选用PET、丙烯酸类树脂、聚氨酯、聚碳酸酯、聚乙烯、乙烯一醋酸乙烯共聚体、聚氯乙烯或氟树脂或玻璃。The above-mentioned transparent substrate can be selected from PET, acrylic resin, polyurethane, polycarbonate, polyethylene, ethylene-vinyl acetate copolymer, polyvinyl chloride or fluororesin or glass according to different purposes.
请参照图3A,其是本发明一实施例的光遮蔽结构侧视图。由图3A可知,本发明的光遮蔽结构300包含:透明基材310及薄膜320,薄膜320被设置于透明基材310上,薄膜320的厚度介于0.5微米(μm)至200微米(μm)之间,且薄膜320内具有多个分散体321,其中多个分散体321为掺杂的碳氧化钨,如式(I)所示:Please refer to FIG. 3A , which is a side view of a light shielding structure according to an embodiment of the present invention. It can be seen from FIG. 3A that the light-shielding structure 300 of the present invention includes: a transparent substrate 310 and a film 320. The film 320 is disposed on the transparent substrate 310. The thickness of the film 320 is between 0.5 micrometers (μm) and 200 micrometers (μm). Between, and there are multiple dispersions 321 in the film 320, wherein the multiple dispersions 321 are doped tungsten oxycarbide, as shown in formula (I):
MxWCyOz 式(I);M x WC y O z formula (I);
其中M为掺杂物,掺杂物内含至少一种化学元素,W为钨,C为碳,O为氧,且0<x≦1,0<y≦1,0<z≦3。Wherein M is a dopant containing at least one chemical element, W is tungsten, C is carbon, O is oxygen, and 0<x≦1, 0<y≦1, 0<z≦3.
请参照图3B,其是本发明另一实施例的光遮蔽结构侧视图。由图3B可知,本发明的光遮蔽结构300包含:两透明基材310及薄膜320,薄膜320被设置于两透明基材310之间;该实施例是将前述的分散液中添加三乙二醇、二异辛酸酯及聚乙烯醇丁醛所组成的族群中的一种,使分散液具有黏性,将两透明基材310黏着于一体;首先先将具黏性的分散液拉伸成形为一薄膜320,其后将薄膜320置于两透明基材310之间,利用热压合法使其成为图3B所示的光遮蔽结构300,该实施例可用于防爆玻璃。Please refer to FIG. 3B , which is a side view of a light shielding structure according to another embodiment of the present invention. It can be seen from FIG. 3B that the light-shielding structure 300 of the present invention includes: two transparent substrates 310 and a film 320, and the film 320 is arranged between the two transparent substrates 310; One of the group consisting of alcohol, diisocaprylate and polyvinyl butyraldehyde makes the dispersion viscous and adheres the two transparent substrates 310 together; first stretch the viscous dispersion It is formed into a thin film 320, and then the thin film 320 is placed between two transparent substrates 310, and the light shielding structure 300 shown in FIG. 3B is formed by hot pressing. This embodiment can be used for explosion-proof glass.
本发明的光遮蔽结构300的又一实施例(未表示在附图中)将多个分散体321分散于透明基材310内,首先先将透明基材310浸入前述的分散液中,接着提高温度使透明基材310呈熔融状态,使分散体321与熔融状态的透明基材310混合,降温后使其成形为板状或膜状。例如:透明基材310选用PET树脂,使其浸入分散液后,使PET树脂表面具有多个分散体321,接着加热至PET的熔融温度,进行混合并冷却,可以制备含有多个分散体321的PET树脂。Another embodiment of the light-shielding structure 300 of the present invention (not shown in the accompanying drawings) disperses a plurality of dispersions 321 in the transparent substrate 310, firstly immersing the transparent substrate 310 in the aforementioned dispersion liquid, and then increasing The temperature makes the transparent base material 310 into a molten state, and the dispersion 321 is mixed with the molten transparent base material 310 , and formed into a plate shape or a film shape after cooling down. For example: the transparent substrate 310 is made of PET resin, after it is immersed in the dispersion liquid, the surface of the PET resin has multiple dispersions 321, and then heated to the melting temperature of PET, mixed and cooled, and a composite material containing multiple dispersions 321 can be prepared. PET resin.
前述的分散体321具有六方晶系结晶结构时,其可见光区域的穿透率及远红外光区域的吸收亦较佳。若分散体321是非晶质相、正方晶系或立方晶系的钨青铜的结构时,其可见光区域的穿透率及远红外光区域的吸收效果较差。When the aforementioned dispersion 321 has a hexagonal crystal structure, its transmittance in the visible light region and absorption in the far infrared region are also better. If the dispersion 321 has an amorphous phase, tetragonal or cubic tungsten bronze structure, its transmittance in the visible light region and absorption effect in the far infrared region are poor.
由于本发明的薄膜320可大量吸收近红外线和远红外线区域的能量,以及部分可见光区的能量,因此薄膜320其外观色调为蓝色到绿色。Since the film 320 of the present invention can absorb a large amount of energy in the near-infrared and far-infrared regions, as well as part of the energy in the visible light region, the appearance of the film 320 is blue to green.
当分散体321的粒径太大时,由于几何散射或米氏散射(Mie scattering),导致利用分散体321制作的薄膜320在可见光区域形成类似磨砂玻璃那样而不能得到鲜明的透明性;因此本发明的分散体321的粒径控制于1纳米-1000纳米之间,可避免上述的现象,在用于光学领域的用途上,可获得清晰的影像。When the particle size of the dispersion 321 is too large, due to geometric scattering or Mie scattering (Mie scattering), the thin film 320 made of the dispersion 321 is formed in the visible light region similar to frosted glass and cannot obtain clear transparency; The particle size of the inventive dispersion 321 is controlled between 1 nanometer and 1000 nanometers, which can avoid the above-mentioned phenomenon, and can obtain clear images when used in the optical field.
请参照图4,其是本发明的光遮蔽体材料的颗粒粒径-频率图。本发明的光遮蔽材料(分散体)的颗粒粒径是以粒径分析仪(Mastersizer,Malvern,UK)测定,采用雷射绕射技术Laser Diffraction Scattering(ISO 13320规范)测量颗粒粒径。当激光束穿过分散的颗粒样品时,产生不同角度与强度散射光讯号,同时测量记录散射光光谱图,进而分析计算完成散射光谱图的颗粒粒度分布。由图4可知,以光遮蔽材料原子比Cs:W:C=0.32:1:0.4为例,经500℃/1hr的热处理后的颗粒粒径-频率图分布如图4所示,图中的横轴为粒径,单位是纳米(nm),纵轴是频率,单位是%;图中所制备出光遮蔽材料的粒径均小于140纳米(nm),经统计计算后的结果可知:D50(中位径;图4的曲线中累积分布为50%时的最大颗粒的等效粒径)为54nm,D90(图4的曲线中累积分布为90%时的最大颗粒的等效粒径)为110nm。Please refer to FIG. 4 , which is a particle size-frequency diagram of the light-shielding body material of the present invention. The particle size of the light-shielding material (dispersion) of the present invention is measured by a particle size analyzer (Mastersizer, Malvern, UK), and the particle size is measured by Laser Diffraction Scattering (ISO 13320 specification). When the laser beam passes through the dispersed particle sample, scattered light signals of different angles and intensities are generated, and the scattered light spectrum is measured and recorded at the same time, and then the particle size distribution of the scattered light spectrum is analyzed and calculated. It can be seen from Fig. 4 that, taking the atomic ratio Cs:W:C=0.32:1:0.4 of the light-shielding material as an example, the distribution of the particle size-frequency diagram after heat treatment at 500°C/1hr is shown in Fig. 4. The horizontal axis is the particle size, the unit is nanometer (nm), the vertical axis is the frequency, the unit is %; the particle size of the light shielding material prepared in the figure is all less than 140 nanometers (nm), the result after statistical calculation shows that: D 50 (median diameter; the equivalent particle diameter of the largest particle when the cumulative distribution is 50% in the curve of Fig. 4) is 54nm, D90 (the equivalent particle diameter of the largest particle when the cumulative distribution is 90% in the curve of Fig. 4 ) is 110nm.
请参照图5,其是本发明的光遮蔽结构的波长-穿透率图。将图4的光遮蔽体材料(光遮蔽材料原子比Cs:W:C=0.32:1:0.4)涂布于PET膜上,形成本发明的光遮蔽体结构,其波长-穿透率曲线如图5所示,图中横轴为光的波长,单位是纳米(nm),纵轴为穿透率,单位是%;由图5可知,其透光部分的波长为380nm-780nm的光线(例如波长500nm的可见光的穿透率为69%),波长1000nm的红外光的穿透率为3%,波长1500nm的红外线穿透率为1%,因此本发明的光遮蔽结构发挥出对可见光区域的光线有良好穿透性,而对红外光区域具有优异的遮蔽特性。Please refer to FIG. 5 , which is a wavelength-transmittance diagram of the light shielding structure of the present invention. The light-shielding body material of Fig. 4 (light-shielding material atomic ratio Cs:W:C=0.32:1:0.4) is coated on the PET film, forms the light-shielding body structure of the present invention, and its wavelength-transmittance curve is as follows As shown in Figure 5, the horizontal axis is the wavelength of light in the figure, and the unit is nanometer (nm), and the vertical axis is the transmittance, and the unit is %; As can be seen from Figure 5, the wavelength of its light-transmitting part is the light of 380nm-780nm ( For example, the transmittance of visible light with a wavelength of 500nm is 69%), the transmittance of infrared light with a wavelength of 1000nm is 3%, and the transmittance of infrared light with a wavelength of 1500nm is 1%. The light has good penetration, and has excellent shielding properties in the infrared region.
以下列举实施例对本发明进行更为详细的说明。The following examples are given to describe the present invention in more detail.
对比例comparative example
对比例中使用作为透明基材的PET膜的光学特性,其厚度为23μm。在整个太阳光谱范围(300nm-2500nm)的光穿透率为89.2%以上,可见光区的穿透率约90%,红外光区的穿透率约85%,太阳光的遮蔽效果不佳。Optical properties of a PET film having a thickness of 23 μm as a transparent substrate were used in the comparative example. The light transmittance in the entire solar spectrum range (300nm-2500nm) is more than 89.2%, the transmittance in the visible region is about 90%, and the transmittance in the infrared region is about 85%. The shielding effect of sunlight is not good.
实施例1Example 1
将231.84g的三氧化钨、45.09g的氧化铯、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是500℃,时间为1小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为50m2/g。Weigh 231.84g of tungsten trioxide, 45.09g of cesium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm, and the weight of the abrasive particles and powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 500°C, and the time is 1 hour; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 50 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知Cs:W:C=0.32:1:0.4,此结果为原子比,显示Cs和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed by energy dispersive spectrometer (EDS), and the result shows that Cs:W:C=0.32:1:0.4, which is the atomic ratio, showing that Cs and C have been doped into tungsten oxide during the heat treatment process, form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与压克力树脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing the slurry with the acrylic resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以100℃的热空气干燥10分钟,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;测定此结构的光穿透率图谱如图5所示,其光学特性列于表1,其中可见光的平均穿透率为65%,遮蔽系数(SC)为0.42。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then dried with hot air at 100°C for 10 minutes to obtain the translucent and blue light-shielding film of the present invention, the thickness of which was The optical transmittance spectrum of this structure is shown in Figure 5, and its optical properties are listed in Table 1, wherein the average transmittance of visible light is 65%, and the shading coefficient (SC) is 0.42.
实施例2Example 2
将231.84g的三氧化钨、31g的氧化钠、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是500℃,时间为1小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为53m2/g。Weigh 231.84g of tungsten trioxide, 31g of sodium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm. The weight ratio of abrasive particles to powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 500°C, and the time is 1 hour; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 53 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知Na:W:C=0.9:1:0.2,此结果为原子比,显示Na和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed with an energy dispersive spectrometer (EDS). The result shows that Na:W:C=0.9:1:0.2, which is the atomic ratio, indicating that Na and C have been doped into tungsten oxide during the heat treatment process. form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与压克力树脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing the slurry with the acrylic resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以100℃的热空气干燥10分钟,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;其光学特性列于表1,其中可见光的平均穿透率为70%,遮蔽系数(SC)为0.45。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then dried with hot air at 100°C for 10 minutes to obtain the translucent and blue light-shielding film of the present invention, the thickness of which was Its optical properties are listed in Table 1, wherein the average visible light transmittance is 70%, and the shading coefficient (SC) is 0.45.
实施例3Example 3
将231.84g的三氧化钨、13.9g的氧化铟、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是500℃,时间为1小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为51m2/g。Weigh 231.84g of tungsten trioxide, 13.9g of indium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm. The weight of the abrasive particles and powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 500°C, and the time is 1 hour; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 51 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知In:W:C=0.1:1:0.4,此结果为原子比,显示In和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed by energy dispersive spectrometer (EDS). The result shows that In:W:C=0.1:1:0.4, which is the atomic ratio, indicating that In and C have been doped into tungsten oxide during the heat treatment process. form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与压克力树脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing the slurry with the acrylic resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以100℃的热空气干燥10分钟,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;其光学特性列于表1,其中可见光的平均穿透率为55%,遮蔽系数(SC)为0.50。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then dried with hot air at 100°C for 10 minutes to obtain the translucent and blue light-shielding film of the present invention, the thickness of which was Its optical properties are listed in Table 1, wherein the average visible light transmittance is 55%, and the shading coefficient (SC) is 0.50.
实施例4Example 4
将231.84g的三氧化钨、8.4g的氧化钙、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是500℃,时间为1小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为54m2/g。Weigh 231.84g of tungsten trioxide, 8.4g of calcium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm. The weight of the abrasive particles and powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 500°C, and the time is 1 hour; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 54 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知Ca:W:C=0.15:1:0.2,此结果为原子比,显示Ca和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed with an energy dispersive spectrometer (EDS). The result shows that Ca:W:C=0.15:1:0.2, which is an atomic ratio, indicating that Ca and C have been doped into tungsten oxide during the heat treatment process. form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与压克力树脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing the slurry with the acrylic resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以100℃的热空气干燥10分钟,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;其光学特性列于表1,其中可见光的平均穿透率为62%,遮蔽系数(SC)为0.45。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then dried with hot air at 100°C for 10 minutes to obtain the translucent and blue light-shielding film of the present invention, the thickness of which was Its optical properties are listed in Table 1, wherein the average visible light transmittance is 62%, and the shading coefficient (SC) is 0.45.
实施例5Example 5
将231.84g的三氧化钨、45.09g的氧化铯、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是750℃,时间为1小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为46m2/g。Weigh 231.84g of tungsten trioxide, 45.09g of cesium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm, and the weight of the abrasive particles and powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 750°C, and the time is 1 hour; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 46 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知Cs:W:C=0.32:1:0.4,此结果为原子比,显示Cs和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed by energy dispersive spectrometer (EDS), and the result shows that Cs:W:C=0.32:1:0.4, which is the atomic ratio, showing that Cs and C have been doped into tungsten oxide during the heat treatment process, form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与压克力树脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing the slurry with the acrylic resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以100℃的热空气干燥10分钟,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;其光学特性列于表1,其中可见光的平均穿透率为68%,遮蔽系数(SC)为0.40。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then dried with hot air at 100°C for 10 minutes to obtain the translucent and blue light-shielding film of the present invention, the thickness of which was Its optical properties are listed in Table 1, wherein the average visible light transmittance is 68%, and the shading coefficient (SC) is 0.40.
实施例6Example 6
将231.84g的三氧化钨、45.09g的氧化铯、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是1000℃,时间为1小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为42m2/g。Weigh 231.84g of tungsten trioxide, 45.09g of cesium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm, and the weight of the abrasive particles and powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 1000°C, and the time is 1 hour; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 42 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知Cs:W:C=0.32:1:0.4,此结果为原子比,显示Cs和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed by energy dispersive spectrometer (EDS), and the result shows that Cs:W:C=0.32:1:0.4, which is the atomic ratio, showing that Cs and C have been doped into tungsten oxide during the heat treatment process, form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与压克力树脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing the slurry with the acrylic resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以100℃的热空气干燥10分钟,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;其光学特性列于表1,其中可见光的平均穿透率为62%,遮蔽系数(SC)为0.42。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then dried with hot air at 100°C for 10 minutes to obtain the translucent and blue light-shielding film of the present invention, the thickness of which was Its optical properties are listed in Table 1, wherein the average visible light transmittance is 62%, and the shading coefficient (SC) is 0.42.
实施例7Example 7
将231.84g的三氧化钨、45.09g的氧化铯、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是750℃,时间为5小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为41m2/g。Weigh 231.84g of tungsten trioxide, 45.09g of cesium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm, and the weight of the abrasive particles and powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 750°C, and the time is 5 hours; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 41 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知Cs:W:C=0.32:1:0.4,此结果为原子比,显示Cs和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed by energy dispersive spectrometer (EDS), and the result shows that Cs:W:C=0.32:1:0.4, which is the atomic ratio, showing that Cs and C have been doped into tungsten oxide during the heat treatment process, form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与压克力树脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing the slurry with the acrylic resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以100℃的热空气干燥10分钟,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;其光学特性列于表1,其中可见光的平均穿透率为67%,遮蔽系数(SC)为0.41。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then dried with hot air at 100°C for 10 minutes to obtain the translucent and blue light-shielding film of the present invention, the thickness of which was Its optical properties are listed in Table 1, in which the average visible light transmittance is 67%, and the shading coefficient (SC) is 0.41.
实施例8Example 8
将231.84g的三氧化钨、45.09g的氧化铯、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是750℃,时间为10小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为38m2/g。Weigh 231.84g of tungsten trioxide, 45.09g of cesium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm, and the weight of the abrasive particles and powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 750°C, and the time is 10 hours; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 38 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知Cs:W:C=0.32:1:0.4,此结果为原子比,显示Cs和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed by energy dispersive spectrometer (EDS), and the result shows that Cs:W:C=0.32:1:0.4, which is the atomic ratio, showing that Cs and C have been doped into tungsten oxide during the heat treatment process, form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与压克力树脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing the slurry with the acrylic resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以100℃的热空气干燥10分钟,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;其光学特性列于表1,其中可见光的平均穿透率为64%,遮蔽系数(SC)为0.42。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then dried with hot air at 100°C for 10 minutes to obtain the translucent and blue light-shielding film of the present invention, the thickness of which was Its optical properties are listed in Table 1, wherein the average visible light transmittance is 64%, and the shading coefficient (SC) is 0.42.
实施例9Example 9
将231.84g的三氧化钨、45.09g的氧化铯、和12g的碳黑称重后置入球磨罐中,内装直径5mm和10mm两种规格的高纯度碳化硅研磨颗粒,研磨颗粒和粉末的重量比为8:1,利用高能球磨机球磨1小时后,可获得混合均匀的光遮蔽材料粉末的初始原料。将此初始原料在混合气体环境中进行热处理,热处理的温度是750℃,时间为5小时;混合气体为H2(5vol%)+CH4(5vol%)+Ar(90vol%),压力是1大气压。可获得光遮蔽材料粉末,此粉末的比表面积为41m2/g。Weigh 231.84g of tungsten trioxide, 45.09g of cesium oxide, and 12g of carbon black and put them into a ball mill jar, which contains two specifications of high-purity silicon carbide abrasive particles with a diameter of 5mm and 10mm, and the weight of the abrasive particles and powder The ratio is 8:1, and after 1 hour of ball milling with a high-energy ball mill, the initial raw material of uniformly mixed light-shielding material powder can be obtained. The initial raw material is heat-treated in a mixed gas environment, the temperature of the heat treatment is 750°C, and the time is 5 hours; the mixed gas is H 2 (5vol%)+CH 4 (5vol%)+Ar (90vol%), and the pressure is 1 atmospheric pressure. A light-shielding material powder was obtained, and the specific surface area of this powder was 41 m 2 /g.
以能量分散光谱仪(EDS)分析此粉末的化学组成,结果可知Cs:W:C=0.32:1:0.4,此结果为原子比,显示Cs和C在热处理过程中已掺杂进入氧化钨中,形成新的化合物。The chemical composition of the powder was analyzed by energy dispersive spectrometer (EDS), and the result shows that Cs:W:C=0.32:1:0.4, which is the atomic ratio, showing that Cs and C have been doped into tungsten oxide during the heat treatment process, form new compounds.
将此光遮蔽材料的粉末与甲苯和分散剂充分混合,粉末、甲苯、与分散剂的重量比为3:6:1;随后进行超声波分散和研磨,可得平均粒径为60nm的浆料;将此浆料与UV数脂以重量比1:9的比例混合,可得本发明的光遮蔽材料分散体。Fully mix the powder of the light-shielding material with toluene and dispersant, the weight ratio of powder, toluene, and dispersant is 3:6:1; then perform ultrasonic dispersion and grinding to obtain a slurry with an average particle size of 60nm; The light-shielding material dispersion of the present invention can be obtained by mixing this slurry with UV resin at a weight ratio of 1:9.
将此光遮蔽材料分散体以刮刀涂布法涂布于对比例的PET膜上,随后以紫外光固化数脂,得到本发明的半透明且呈现蓝色的光遮蔽薄膜,其厚度为10μm;其光学特性列于表1,其中可见光的平均穿透率为70%,遮蔽系数(SC)为0.40。The light-shielding material dispersion was coated on the PET film of the comparative example by doctor blade coating method, and then the resin was cured with ultraviolet light to obtain the translucent and blue light-shielding film of the present invention, with a thickness of 10 μm; Its optical properties are listed in Table 1, wherein the average transmittance of visible light is 70%, and the shading coefficient (SC) is 0.40.
表1Table 1
上述的遮蔽系数(Shading Coefficient;SC)为各实施例(1-9)与对比例(厚度为23μm的PET膜)在相同的光线照射环境的比值。遮蔽系数数值越小,代表实施例对光线有较佳的“遮蔽”的效果。The above-mentioned shading coefficient (Shading Coefficient; SC) is the ratio of each example (1-9) and the comparative example (PET film with a thickness of 23 μm) in the same light irradiation environment. The smaller the value of the shading coefficient, the better the "shading" effect of the embodiment on the light.
综上所述,本发明的光遮蔽体材料、光遮蔽结构及其制造方法具有以下几点优势:In summary, the light-shielding body material, light-shielding structure and manufacturing method of the present invention have the following advantages:
其一,光遮蔽体材料及光遮蔽结构中的MxWCyOz为掺杂的碳氧化钨,利用此光遮蔽体材料所制成的光遮蔽结构可同时兼具高可见光穿透率与高红外线遮蔽性。First, the M x WC y O z in the light-shielding material and the light-shielding structure is doped tungsten carbide, and the light-shielding structure made of this light-shielding material can have both high visible light transmittance and High infrared shielding.
其二,制造方法有别于现有技术使用湿式工艺,本发明为全干式工艺,不仅可以避免工艺中所产生具高腐蚀性或高污染性的副产物,且经过高能球磨处理后的初始粉末,会产生合金现象,形成分子级的均匀混合的初始原料。Second, the manufacturing method is different from the wet process used in the prior art. The present invention is an all-dry process, which can not only avoid highly corrosive or highly polluting by-products produced in the process, but also the initial high-energy ball milling process Powder, alloying occurs, forming homogeneously mixed starting materials at the molecular level.
虽然本发明已以实施方式揭露如上,然其并非用以限定本发明,任何本领域内技术人员,在不脱离本发明的精神和范围内,应当可作各种的更动与修饰,因此本发明的保护范围应当以权力要求所界定的为准。Although the present invention has been disclosed above in terms of implementation, it is not intended to limit the present invention. Any person skilled in the art should be able to make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the present invention The scope of protection of an invention shall be defined by the claims.
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