CN105280506B - The resin encapsulation method and resin encapsulation equipment of electronic unit - Google Patents

Abstract

The invention relates to a resin encapsulation method and a resin encapsulation device for electronic components. Cost reduction for manufacturing a resin-encapsulated device and simplification of maintenance and inspection operations thereof are achieved by employing a simple resin-encapsulation method and a simple mold structure when using a high-fluidity resin material. A resin sealing mold including an upper mold and a lower mold is provided, and the upper mold and the lower mold can be opened and closed by a mold opening and closing mechanism. The cavity block is arranged to be able to move to the parting surface of the upper mold along the mold opening and closing direction via a floating mechanism having a floating pin. A cavity and an air vent slot communicating with the cavity are arranged on the parting surface of the cavity block. Fitting holes facing the direction of mold opening and closing are provided at the connection portion between the cavity and the vent hole groove. On the floating pin holder corresponding to the fitting hole, the air vent block is arranged along the mold opening and closing direction. Fit the vent block to the fitting hole slidably and tightly.

Description

Resin encapsulation method and resin encapsulation device for electronic components

technical field

The present invention relates to an improvement of a resin encapsulation method for electronic components for encapsulating and molding small electronic components such as semiconductor lead frames or semiconductor chips on semiconductor substrates using a resin material and an electronic component resin encapsulation apparatus for implementing the method .

In more detail, it relates to an improved resin encapsulation method and resin encapsulation device, when resin encapsulation is performed on electronic components placed on a resin encapsulation pre-substrate placed in a cavity of a resin encapsulation mold, the resin encapsulation in the cavity can be prevented. The resin unfilled state and the void inside and outside the resin package are formed, and resin leakage from the vent hole connecting the inside and outside of the cavity can be effectively prevented.

Furthermore, it is related with the resin sealing method and resin sealing device which simplify the structure of the resin sealing apparatus for carrying out the resin sealing method mentioned above.

Background technique

For example, in flip-chip mounting in which a substrate (semiconductor substrate) and a chip (semiconductor chip) are electrically connected via protruding terminals (bumps), usually, a liquid packaging material (underfill material) is filled into the bump The gap between the connected chip and the substrate.

In addition, in recent years, for the purpose of reducing assembly costs and the like, the development of a so-called underfill technology that uses transfer molding to fill a gap between a chip and a substrate with a liquid encapsulation material has been advanced. In order to perform this mold underfill so that the liquid encapsulation material can be efficiently and reliably filled into the gap between the chip and the substrate, it is necessary to use a highly fluid resin material (ultrafine particle size filling agent (filling material) low viscosity resin).

However, as a technical problem when performing the above-mentioned mold underfill, there is resin leakage from the vent hole. That is, since a high-fluidity resin material is used and a predetermined resin pressure is applied to the resin material injected into the cavity during resin molding, the resin material in the cavity easily flows out from the vent hole.

Furthermore, in order to prevent resin leakage from the vent hole, for example, if the depth of the vent groove is set as shallow as possible, the function of exhausting the residual air in the cavity to the outside is impaired, and as a result A more serious problem arises that it is impossible to reliably prevent voids (bubbles) and defects from being formed inside and outside the resin-molded molded body (resin package) molded in the cavity.

Therefore, the applicant of the present patent continuously arranges the vent hole pin mounting plate on which the vent hole pin is mounted at the position in the mold opening and closing direction of the mold for resin molding and overlaps with the protruding mechanism of the molded product, and the The vent hole pin is arranged at the position of the vent hole groove. Then, the step of injecting the resin material into the cavity and the step of depressurizing the cavity are performed in a state where the vent groove is opened through the vent pin. Furthermore, it has been proposed that the vent hole groove is set in a closed state by using the vent hole pin in accordance with the end timing of the resin material injection process, so that when resin encapsulation molding is performed on electronic components, the electronic components will not be damaged. The vent function also prevents resin leakage from the vent groove (refer to Patent Document 1).

According to the technical solution disclosed in Patent Document 1, even in resin molding using a high-fluidity resin material, it is possible to reliably prevent resin molding from The formation of internal voids, etc. of the body.

In addition, since a highly fluid resin material can be effectively used, the liquid encapsulating material can be efficiently and reliably filled into the gap between the chip and the substrate in flip-chip mounting. Therefore, mold underfill by transfer molding can be realized.

In addition, it is possible to effectively prevent the highly fluid molten resin material injected into the cavity from flowing out to the outside through the vent hole groove.

However, in Patent Document 1, the vent pin mounting plate on which the vent pin is mounted is continuously arranged at a position in the mold opening and closing direction of the mold for resin molding and at a position overlapping with the protruding mechanism of the molded product, and the Since the structure where the vent hole pin is arranged in the vent hole groove portion, it can be seen that the die structure and the effect based on this structure are complicated.

Patent Document 1: JP-A-2013-049253 (refer to paragraph [0030] and FIG. 4 )

Contents of the invention

The present invention further develops the already proposed invention, and aims to achieve overall cost reduction for manufacturing resin-encapsulated devices by adopting a simpler resin-encapsulation method and a simpler mold structure using a high-fluidity resin material And simplify its maintenance and repair operations.

The resin encapsulating method for electronic components according to the present invention includes: a resin encapsulating apparatus preparing step for preparing a resin encapsulating apparatus for encapsulating electronic components, the resin encapsulating apparatus for encapsulating electronic components comprising at least a fixed mold (upper mold 5) and The resin encapsulation mold of the electronic component of the movable mold (lower mold 8) opposite to the fixed mold (upper mold 5), the movable mold is provided so as to be able to move relative to the mold opening and closing mechanism 9 for mold opening and closing. The fixed mold advances and retreats, and the cavity block 16 is set to be able to move to the parting surface of the fixed mold along the mold opening and closing direction via a floating mechanism with an elastic member (floating pin 18), and the mold cavity 20 and the mold cavity 20 is provided on the parting surface of the cavity block 16, and the fitting hole 24 is provided on the cavity 20 and the vent hole slot 22 along the mold opening and closing direction. Connecting part, the vent hole block 23 is arranged on the position of the fixed mold corresponding to the fitting hole 24 (floating pin holder 17) along the mold opening and closing direction, and the vent hole block 23 can slide and tightly ground into the fitting hole 24;

pre-resin-encapsulation substrate supply process, carrying the pre-resin-encapsulation substrate W on which the electronic components are mounted between the fixed mold and the movable mold (5, 8) and supplying the pre-resin-encapsulation substrate W to the The substrate supply part 26 of the movable mold;

Resin material supply process, supplying resin material (ultra-low viscosity resin) R having high fluidity to the resin supply part (inside the barrel 10a) provided on the movable mold;

In the first mold clamping process, after performing the pre-resin encapsulation substrate supply process and the resin material supply process, the parting surface of the fixed mold and the movable mold are connected via the mold opening and closing mechanism 9 . Parting surface joint;

In-mold space decompression process, during the first mold clamping process, decompresses the in-mold space between the parting surface of the fixed mold and the parting surface of the movable mold;

In the molten resin material pressurized transfer step, the resin supplied to the resin supply part (inside the cylinder 10 a ) is transferred in a state where the in-mold space is decompressed by the in-mold space depressurization step. The material R is heated and melted, and the melted resin material is transferred into the cavity 20 under pressure through the resin channel (the sprue 19 and the gate 21 ) in the in-mold space;

The second mold clamping process makes the cavity block 16 of the fixed mold resist the elasticity of the elastic member (floating pin 18) in the floating mechanism and move further (move upward);

Vent block moving process, during the second mold clamping process, the vent block 23 is relatively moved (moved downward), so that the front end surface (lower surface 23a) of the vent block 23 ) is consistent with the parting surface of the cavity block 16;

In the cavity sealing step, during the vent block moving step, the surface of the wiring board ( upper surface) and the front end surface of the vent block 23 are crimped, thereby sealing the cavity 20 of the cavity block 16 .

A resin molding step (transfer molding step) of transferring the melted resin material into the cavity 20 under further pressure and filling the cavity 20 after the cavity sealing step; and

In the molded product taking out step, after the resin molding step, the fixed mold and the movable mold are opened via the mold opening and closing mechanism 9, and in this state, the mold is taken out of the cavity 20. The interior of the resin channel and the interior of the resin channel are cured and molded (substrate W1 after resin encapsulation).

In addition, in the resin sealing device for electronic components according to the present invention,

A resin encapsulation mold for electronic components comprising at least a fixed mold (upper mold 5) and a movable mold (lower mold 8) opposite to the fixed mold (upper mold 5),

The movable mold (lower mold 8) is set to be able to advance and retreat relative to the fixed mold (upper mold 5) via the mold opening and closing mechanism 9 for mold opening and closing movement,

The cavity block 16 is set to be able to move to the parting surface of the fixed mold (upper mold 5) along the mold opening and closing direction via a floating mechanism having an elastic component (floating pin 18),

The cavity 20 and the exhaust hole groove 22 connected with the cavity 20 are arranged on the parting surface of the cavity block 16,

The fitting hole 24 is provided at the connecting portion between the cavity 20 and the vent hole groove 22 along the mold opening and closing direction,

The vent block 23 is arranged at the position of the fixed mold corresponding to the fitting hole 24 (floating pin holder 17) along the mold opening and closing direction, and the vent block 23 can slide and be tightly installed to the fitting hole 24.

In addition, the resin sealing device for electronic components according to the present invention includes resin packaging of electronic components including at least a fixed mold (upper mold 5) and a movable mold (lower mold 8) facing the fixed mold (upper mold 5). mold, the movable mold (lower mold 8) is set to be able to advance and retreat relative to the fixed mold (upper mold 5) via the mold opening and closing mechanism 9 for mold opening and closing movement,

The sprue block 15 and the first cavity block 16 are configured to be able to move to the parting surface of the fixed mold along the mold opening and closing direction via a floating mechanism having an elastic member (floating pin 18),

The sprue 19 as the resin splitter is arranged on the parting surface of the sprue block 15,

The gate 21 communicated with the sprue 19 , the cavity 20 communicated with the gate 21 and the vent hole 22 communicated with the cavity 20 are arranged on the first cavity block 16 on the parting surface,

The fitting hole 24 is provided at the connecting portion between the cavity 20 and the vent hole groove 22 along the mold opening and closing direction,

The vent hole block 23 is arranged at the position of the fixed mold corresponding to the fitting hole 24 (floating pin holder 17) along the mold opening and closing direction, and the vent hole block 23 can be slid and tightly installed on the mold. said fitting hole 24,

The cylinder block 10 provided with the resin supply part (cylinder 10a) for supplying the resin material R is provided in the part of the said movable mold (lower mold 8) which opposes the said fixed mold (upper mold 5),

The side block 11 is arranged on the side of the cylinder block 10,

The second cavity block 16 is installed on the parting surface of the side block 11,

The second cavity block 12 is configured to be able to move along the mold opening and closing direction via a floating mechanism having an elastic member 14,

An in-mold decompression mechanism is provided, and the said in-mold decompression mechanism connects the parting surface of the fixed mold (upper mold 5) with the parting surface of the movable mold (lower mold 8) via the mold opening and closing mechanism 9. When closing the mold once, the space in the mold between the parting surface of the fixed mold and the parting surface of the movable mold is decompressed,

And, on the basis of the state during the first mold closing, the mold opening and closing mechanism 9 resists the elasticity of the floating mechanism to further press the parting surface of the fixed mold (upper mold 5) and the When the parting surface of the movable mold (lower mold 8) is clamped for the second time, the vent block 23 moves relatively, so that at least the front end surface (lower surface 23a) of the vent block and the parting surface The same position on the molded line P.L surface is the same.

According to the present invention, even in the resin encapsulation molding of electronic components using the highly fluid resin material R, residual air and the like inside the cavity 20 can be efficiently discharged to the outside.

Therefore, it is possible to effectively prevent voids, chipped parts, and the like from being formed inside and outside the resin package 29 integrally molded with the resin-packaged substrate W1 .

In addition, the vent block 23 is formed by being fixed on the upper mold plate 4 side, and the vent block 23 doubles as a sealing member for sealing the cavity 20 and the cavity when the upper and lower molds 5 and 8 are clamped. part of 20. Furthermore, the cavity sealing process is performed during the mold clamping process of the upper and lower molds 5 and 8 , so that the highly fluid molten resin material injected into the cavity 20 can be effectively prevented from flowing out through the vent hole groove 22 .

Therefore, there is no need for a complicated die structure, such as opening and closing the vent hole groove by moving the vent hole groove 23 up and down through a special drive mechanism.

Therefore, in a structure using a high fluidity resin material, a simpler resin encapsulation method and an easier mold structure can be employed, and overall cost reduction and simplification of maintenance and inspection operations for manufacturing the resin encapsulation device can be achieved. .

Description of drawings

1 is a schematic front view of a resin encapsulating device according to the present invention using a transfer molding unit, showing the mold-opening state of its upper mold and lower mold.

Fig. 2 is a schematic front view of the resin encapsulation device corresponding to Fig. 1, (1) of Fig. 2 is a longitudinal sectional view showing the mold opening state of the semiconductor encapsulation mold, and (2) of Fig. 2 is a view showing its mold clamping state for the first time. (3) of Fig. 2 is a longitudinal sectional view showing its second clamping state.

Fig. 3 is an enlarged longitudinal sectional view of main parts of the semiconductor package mold corresponding to (1) of Fig. 2 .

(1) of FIG. 4 is an enlarged longitudinal sectional view of main parts of the semiconductor package mold corresponding to (2) of FIG. 2 , and (2) of FIG. 4 is a further enlarged longitudinal sectional view of main parts thereof.

(1) of FIG. 5 is an enlarged longitudinal sectional view of main parts of the semiconductor package mold corresponding to (3) of FIG. 2 , and (2) of FIG. 5 is a further enlarged longitudinal sectional view of main parts thereof.

(1) of FIG. 6 and (2) of FIG. 6 are action explanatory views of the floating pin.

7 is a longitudinal sectional view of the semiconductor package mold corresponding to FIG. 3 , showing a state in which the molded product is projected between the upper mold and the lower mold.

Detailed ways

Next, the present invention will be described based on the embodiment shown in FIG. 1 .

FIG. 1 schematically shows the overall structure of an embodiment of a resin sealing device according to the present invention using a so-called transfer molding unit.

The resin encapsulation device has: a base 1 of the device; a tie rod 2, which is installed on the base 1 in an upright state; a fixing plate 3, which is installed on the upper end of the tie rod 2; an upper template 4, which is installed on the lower part of the fixing plate 3; The upper mold 5 (fixed mold) used for molding is installed on the bottom of the upper template 4; the movable plate 6 is embedded and installed in the pull rod 2 below the upper mold 5; the lower template 7 is installed on the bottom of the movable plate 6. The upper part; the lower mold 8 (movable mold) for resin molding is installed on the upper part of the lower template 7; The relative parting surfaces of the molds 5 and 8 engage or deviate from the servo motor, etc.

This resin encapsulating device includes a resin encapsulating mold for electronic components including at least an upper mold 5 (fixed mold) and a lower mold 8 (movable mold) disposed opposite to the upper mold 5 . The resin encapsulation mold can perform mold opening and closing movement in which the lower mold 8 advances and retreats relative to the upper mold 5 via the mold opening and closing mechanism 9 .

A cylinder block 10 is disposed at the center of the lower mold 8 , and a plunger 13 for pressurizing the resin is fitted into the cylinder block 10 .

In addition, a lower cavity block 12 (second cavity block) is fitted in a vertically movable state on parting surfaces of side blocks 11 provided at the left and right sides of the cylinder block 10 .

Furthermore, the lower cavity block 12 is provided with a floating mechanism (floating structure) for generating an upward elastic pushing force by utilizing the elasticity of the elastic member 14 . Accordingly, the lower cavity block 12 can move in the mold opening and closing direction via the floating mechanism. And, as will be described later, the upper space of the lower cavity block 12 is set as a substrate supply unit 26 .

On the parting surface (lower surface) of the upper mold 5 opposite to the position of the barrel block 10 in the lower mold 8, a sprue block 15 is arranged. In addition, each lower mold cavity block 12 in the lower mold 8 is opposite The position of the parting surface of the upper mold 5 is provided with an upper mold cavity block 16 (first cavity block).

The sprue block 15 and the upper mold cavity block 16 are supported on the upper mold plate 4 via a plurality of floating pins 18 . A floating pin holder 17 is fitted into the floating pin 18 . Thus, the floating pin holder 17 is arranged between the upper surface of the sprue block 15 and the upper surface of the upper cavity block 16 and the upper die plate 4 . In this embodiment, a floating mechanism is constituted by the floating pin 18 as an elastic member, and the sprue block 15 and the upper mold cavity block 16 are provided so as to be able to move to the upper mold 5 (fixed) in the mold opening and closing direction via the floating mechanism. mold) parting surface.

A sprue 19 is formed on the lower surface (parting surface) of the sprue block 15 as a resin branching portion for branching the molten resin material.

A cavity 20 for resin molding is formed on the parting surface of the upper cavity block 16 .

A gate 21 formed narrowly toward the cavity 20 side is provided at a connection portion with the sprue 19 in the upper cavity block 16 . The gate 21 is an inlet for injecting molten resin material into the cavity 20 .

For the upper mold cavity block 16, on the parting surface of the upper mold cavity block 16 on the side opposite to the gate 21, a vent hole groove formed to be connected to the cavity 20 is provided at a required depth. twenty two.

As described above, the gate 21 communicating with the sprue 19 , the cavity 20 communicating with the gate 21 , and the vent groove communicating with the cavity 20 are formed on the parting surface of the cavity block 16 . twenty two.

In addition, a fitting hole 24 is formed at a connection portion between the cavity 20 and the vent hole groove 22 in the upper cavity block 16 . The fitting hole 24 is used for fitting and installing the air vent block 23 . The connecting portion referred to here is a position where the molten resin material flowing from the gate 21 into the cavity 20 finally reaches. The fitting hole 24 is formed along the mold opening and closing direction, and the vent block 23 is fitted and mounted in the fitting hole 24 so as to be slidable and tightly (that is, closely connected). The air vent block 23 is fixedly provided on the lower surface of the floating pin holder 17 at a portion on the upper mold 5 (fixed mold) side along the mold opening and closing direction. The air vent block 23 is fixedly arranged on the side of the upper mold plate 4 via the floating pin holder 17, and is set to push the upper mold 5 upward against the elasticity of the floating pin 18 when the upper and lower molds 5 and 8 described later are closed. , with respect to the upper mold cavity block 16 of the upper mold 5 and relatively moves downward.

Although the exhaust hole block 23 is set to move relatively downward relative to the upper mold cavity block 16, when the upper and lower molds 5 and 8 are closed, when the upper surface of the sprue block 15 and the upper mold cavity block 16 When the surface is engaged with the lower surface of the floating pin holder 17, the movement of each part is set so that the lower surface 23a of the vent block 23 is at the same height position as the parting line P.L surface (see FIG. 5 ).

In addition, each figure shows the structure which has the resin filling part 23b which comprises a part of the cavity 20 on the cavity joint surface of the vent block 23. As shown in FIG. The resin filled portion 23b is formed as a concave portion having a rectangular cross section. When the height position of the lower surface 23a of the vent block is at the same height position as the parting line P.L surface, each part is set so that the top surface of the resin filling part 23b is at the same height position as the top surface of the cavity 20. movement (see Figure 5).

In addition, an appropriate draft (not shown) may be given to the cavity 20 including the resin filled portion 23 b of the vent block 23 for easy demolding after molding.

In addition, a configuration in which the above-mentioned resin filled portion 23 b is not provided in the vent block 23 may also be employed. That is, a cavity 20 of a predetermined capacity is formed in the upper mold cavity block 16, and a part of the cavity 20 is not formed in the vent block 23, and only the function of the vent hole described later and the function of the vent hole from the cavity are provided. The resin leakage prevention function within 20 suffices.

In addition, the exhaust hole groove 22 is connected to a vacuum pump (not shown) via an appropriate suction path 25 . This resin sealing device has an in-mold decompression mechanism constituted by including the vacuum pump. The in-mold decompression mechanism makes the vacuum pump work when the upper and lower molds 5 and 8 are closed, so that the inside of the cavity 20 is decompressed through the suction path 25 and the exhaust hole groove 22 .

The lower mold 8 has the structure shown below. That is, a cylinder block 10 having a resin supply cylinder 10a (resin supply part) is disposed at a portion of the lower mold 8 facing the sprue block 15 of the upper mold 5, and the resin cylinder 10a is fitted into the cylinder 10a. Plunger 13 for pressurization.

On the parting surface of the lower mold 8 opposite to the cavity 20 provided on the parting surface of the upper mold 5, a substrate supply part 26 for supplying and placing the substrate W before resin encapsulation is provided. That is, the lower mold cavity block 12 is fitted and attached to the position of the lower mold 8 opposite to the position of the upper mold cavity 20 so as to be movable up and down. The lower mold cavity block 12 is embedded and installed between the cylinder block 10 and the side block 11 . The lower cavity block 12 has a floating mechanism. The floating mechanism has an elastic member 14 such as a compression spring or a disc spring that exists between the lower surface of the lower mold cavity block 12 and the lower template 7, and the floating mechanism generates an upward elastic pushing force through the elastic bias of the elastic member 14 . The upper space formed by the upper surface of the lower cavity block 12, the side faces of the cylinder block 10, and the side blocks 11 is a substrate supply part 26 (see FIG. 3).

In addition, in this embodiment, a substrate W including a wiring board 27 a and a semiconductor chip 27 c mounted on the wiring board 27 a via solder bumps 27 b is exemplified as a substrate before resin encapsulation.

In addition, the sprue 19 of the sprue block 15 and the gate 21 of the upper mold cavity block 16 constitute (2) of FIG. The molten resin material heated and melted in 10 a is transferred to the resin passage in the cavity 20 . Furthermore, when the mold is clamped for the first time, each part of the barrel 10a, the sprue 19, the gate 21, the cavity 20, the fitting hole 24 and the suction path 25 constitutes the parting surface of the upper and lower molds 5, 8 The air-permeable in-mold space formed between them.

Next, the positional relationship between the upper mold 5 and the vent block 23 when the upper and lower molds 5 and 8 shown in FIG. 1 are opened will be described in detail. The mold opening of the upper and lower molds 5 and 8 is performed by moving the lower mold 8 downward via the mold opening and closing mechanism 9 . At the time of this mold opening, it is in the state shown below. That is, since the parting surfaces of the upper and lower molds 5 and 8 are separated, as shown in Figure 1, the upper mold 5, i.e. the sprue block 15 and the upper mold cavity block 16, are pushed into the lower mold 8 by the elastic bias of the floating pin 18. The side moves downward and stops at the specified height position (refer to Figure 3). On the other hand, since the vent block 23 is fixed to the upper die plate 4 via the floating pin holder 17, the vent block 23 itself does not move downward. However, as a result of the downward movement of the sprue block 15 and the upper cavity block 16 toward the lower mold 8 side, the vent block 23 relatively moves upward.

Next, a method of resin-encapsulating an electronic component using the resin-encapsulating apparatus described above will be described. When the upper and lower molds 5 and 8 shown in (1) of FIG. between them and to the substrate supply part 26 of the lower mold 8, and supply the highly fluid resin material (ultra-low viscosity resin) R into the cylinder 10a of the lower mold 8 (see FIG. 3 ).

Then, after performing the pre-resin-encapsulating substrate supply process and resin material supply process described above, mold clamping is performed to move the lower platen 7 and the lower mold 8 upward via the mold opening and closing mechanism 9 (see FIG. 1 ).

In this mold clamping, the lower mold 8 is first moved upward, thereby performing the first mold clamping process in which the parting surface (upper surface) of the lower mold 8 is joined to the parting surface (lower surface) of the upper mold 5 (see (2) of Figure 2). Through the mold clamping process for the first time, the parting surface (upper surface) of the barrel block 10 of the lower mold 8 and the parting surface (upper surface) of the side block 11 and the parting surface (upper surface) of the main channel block 15 of the upper mold 5 lower surface) and the parting surface (lower surface) of the upper mold cavity block 16 (refer to (2) in FIG. 2 ). However, at this time, the floating pin 18 is not elastically deformed as shown in the enlarged view of FIG. 4 , and therefore, the clearance S for the upward movement of the sprue block 15 and the upper mold cavity block 16 is maintained. Therefore, the height position of the vent block 23 fixed to the upper die plate 4 side via the floating pin holder 17 does not change. Therefore, the ventilation state between the lower surface 23a of the vent block 23 and the parting surface (ie, the parting line P.L surface) of the upper cavity block 16 can be ensured. In addition, at this time, the wiring substrate 27 a of the resin-encapsulated front substrate W supplied to the substrate supply part 26 is pushed upward via the lower cavity block 12 applying the elastic urging force of the elastic member 14 . Therefore, by pressing the upper surface side of the wiring board 27a, it is mounted in a state of being closely connected to the parting surface of the cavity 20 of the upper cavity block 16 .

In addition, when the mold is closed for the first time, the in-mold space formed between the parting surfaces of the upper and lower molds 5 and 8, that is, the barrel 10a, the sprue 19, the gate 21, the cavity 20, and the fitting hole 24 and each part of the inhalation path 25 are in a breathable state. Therefore, in this state, by operating a vacuum pump (not shown) in the in-mold decompression mechanism, an in-mold space depressurization step of decompressing the in-mold space is performed.

In addition, the resin material R supplied into the barrel 10a of the lower mold 8 is heated and melted by the heaters (not shown) for heating the resin provided on the upper and lower molds 5, 8, and is heated and melted by the plunger 13. The pressure is injected into the cavity 20 through the gate 21 while pressurizing the upper sprue 19 . This step is a step of pressurizing and transferring the molten resin material by the plunger 13 . This step may be performed after the in-mold space portion decompression step, or may be performed in parallel with the decompression step. That is, by performing the pressurized transfer process of the molten resin material in a state where the in-mold space is decompressed, the air remaining in the in-mold space and the combustion gas generated when the resin material R is heated and melted can be similarly The in-mold space is positively exhausted outside.

In addition, the in-mold space portion decompression process may be continued from the time of the first mold clamping process to immediately before the second mold clamping process. The second mold clamping process will be described later.

Next, on the basis of the mold clamping state for the first time, via the mold opening and closing mechanism 9, the lower mold 8 is further moved upward against the elasticity of the floating pin 18, thus as shown in (3) of FIG. The second mold clamping process in which the upper surface of the sprue block 15 and the upper surface of the upper mold cavity block 16 are joined to the lower surface of the floating pin holder 17 . By performing the second mold clamping process, the gap S practically disappears.

Therefore, the relative height position of the vent block 23 fixed on the upper die plate 4 side via the floating pin holder 17 will change, so that the height position of the lower surface 23a (front end surface) of the vent block 23 is the same as that of the upper face. The height position of the parting surface (P.L surface) of the mold cavity block 16 is aligned, and the height position of the top surface of the resin filling part 23b of the vent block 23 is matched with the height position of the top surface of the cavity 20. Block moving process (refer to FIG. 5 ).

And by performing this vent block moving process, the fitting process of the vent block 23 and the upper cavity block 16 is performed. In this fitting step, when the height position of the lower surface 23a of the vent block is at least at the same height position as the parting line P.L surface, the top surface of the resin filling part 23b and the top surface of the cavity 20 are aligned. Fitting processing is performed by means of the same height position. Furthermore, at this time, since the lower surface 23a of the vent block 23 and the upper surface of the wiring board 27a bonded to the lower surface 23a are subjected to a force for maintaining the relative downward movement of the vent block 23, and are also subjected to elasticity. Due to the elastic driving force of the component 14, the two surfaces are in a state of being pressed against each other. The cavity sealing step is performed by crimping the both surfaces. By performing this step, the space between the cavity 20 and the vent hole groove 22 is actually and reliably blocked.

In addition, as shown schematically in FIG. 6 , the floating pin 18 is deformed by elasticity during the second mold clamping process. Thus, as shown in (1) of Figure 6, a gap S is formed between the floating pin holder 17 and the sprue block 15, so that when the upper and lower molds 5, 8 are opened and when they are closed for the first time During the molding process, the sprue block 15 and the upper mold cavity block 16 can move upwards. However, as shown in (2) of FIG. 6 , during the second clamping process, the upper surface of the sprue block 15 and the upper surface of the upper mold cavity block 16 are engaged with the lower surface of the floating pin holder 7 , then by The floating pin 18 is deformed and the gap S practically disappears.

In addition, the floating pin 18 is elastically deformed so as to shrink in the vertical direction due to the mold clamping pressure caused by the upper and lower molds 5 and 8 during the second mold clamping process, and is accommodated in the floating pin holder 17. Pin holder hole 17a.

Further, when the floating pin 18 becomes the state in the first mold clamping process or when the upper and lower molds 5, 8 are opened by releasing the mold clamping pressure caused by the upper and lower molds 5, 8, the shape returns to the original state. . Thereby, the sprue block 15 and the upper cavity block 16 can be moved downward to the original downward position shown in (1) of FIG. 6 .

In addition, the figure shows a floating mechanism with a floating pin 18 having the required elasticity, but it is also possible to use a floating mechanism with an elastic member such as a compression spring or a disc spring instead of this, and it is obvious that even such a structure can get the same effect.

After the cavity sealing step, a resin molding step (transfer molding step) is performed in which the molten resin material in the cylinder 10 a is further pressurized and transferred into the cavity 20 by the plunger 13 to fill the cavity 20 .

In addition, in the resin molding process, the resin material R in a molten state (hereinafter referred to as molten resin material) is injected into the cavity 20 through the resin channel (sprue 19, gate 21) by the pressure of the plunger 13. . Furthermore, the molten resin material is injected and filled into the resin filling part 23b of the vent hole block 23 at the time when the molten resin material reaches the final stage. At this time, since the lower surface 23a of the vent block 23 and the upper surface of the wiring board 27a are sealed by the cavity sealing process, it is possible to effectively prevent the cavity 20 and the resin filled portion 23b of the vent block 23 from being filled. Part of the molten resin material flows out from the sealing portion through the vent hole groove 22 .

In addition, since the portion where the molten resin material reaches the resin filling portion 23b at the final stage is kept in a depressurized state as described above, troubles such as residual air mixed into the molten resin material filled in this portion can be prevented.

Also, for example, even if a small amount of air remains in this portion, formation of voids can be effectively prevented by receiving a predetermined resin pressing force by the plunger 13 .

In addition, the molded product taking-out step of taking out the resin-encapsulated substrate (molded product) W1 cured and molded in the cavity 20 and the resin channel is performed, for example, as follows. That is, by moving the lower mold 8 side downward via the mold opening and closing mechanism 9, at first, the first mold opening process corresponding to the state of performing the first mold clamping process in (2) of FIG. 2 is performed, and then, After performing the second mold opening step corresponding to the original mold opening state shown in (1) of FIG. 2 , the molded product taking-out step is performed in this mold opening state. The molded product taking-out step can be carried out by carrying out the resin-sealed substrate W1 to the outside of the apparatus via a carry-out loader (not shown) in the mold-open state.

In addition, as shown in FIG. 7 , the resin-encapsulated substrate W1 taken out between the upper and lower molds 5 and 8 is a cured molded body 28 formed in a shape corresponding to the resin channel (sprue 19, gate 21) and formed as A substrate in which a resin package 29 having a shape corresponding to the cavity 20 and the resin filling portion 23b of the vent block is integrated. Since the resin package 29 is molded from the highly fluid resin material R, underfilling is performed to smoothly fill the connection portion 30 between the wiring board 27a and the semiconductor chip 27c with the molten resin material. Therefore, when flip-chip connection is performed via the solder bumps 27b, the connection portion 30 is protected by filling the gap between the chip and the substrate with resin, thereby improving the reliability of the molded product.

According to this embodiment, even in the resin encapsulation molding of the electronic component using the resin material R with high fluidity, the residual air and the like inside the cavity 20 can be effectively discharged to the outside, so it is possible to effectively prevent the The resin package 29 integrally molded with the rear substrate W1 forms gaps and defects on the inside and outside, and can effectively prevent the highly fluid molten resin material injected into the cavity 20 from flowing out through the vent hole groove 22 .

In addition, the air vent block 23 is fixed on the upper mold plate 4 . Furthermore, the vent block 23 is configured to also function as a part of the cavity 20 and a sealing member for sealing the cavity 20 when the upper and lower molds 5 and 8 are clamped. Moreover, the cavity sealing process is performed during the first/second mold clamping process of the upper and lower molds 5, 8, thereby effectively preventing the highly fluid molten resin material from being injected into the cavity 20. It flows out to the outside through the vent hole groove 22 . Therefore, for example, there is no need for a complicated mold structure, that is, opening and closing the vent hole groove 22 by moving the vent hole groove 23 up and down via a special drive mechanism, and the like. Therefore, the following excellent practical effects are achieved: for the structure using a resin material having high fluidity, a simpler resin encapsulation method and a simpler mold structure can be adopted than before, and the resin for manufacturing can be realized. The overall cost of the packaged device is reduced and its maintenance and repair operations are simplified.

In addition, instead of the mold structure consisting of the upper mold 5 and the lower mold 8 shown in the drawing of the embodiment, an apparatus structure in which the upper mold and the lower mold are arranged upside down can also be adopted.

The present invention is not limited to the above-mentioned embodiments, and can be arbitrarily and suitably changed and selectively adopted as needed without departing from the gist of the present invention.

As the resin material used in the present invention, thermosetting resin materials and thermoplastic resin materials can be used. In addition, the resin material used in the present invention has a liquid form, a powder form, a granular form, and a block form.

In addition, for example, as the resin material having a high fluidity function used in the present invention, an ultra-low-viscosity resin is exemplified. Such ultra-low-viscosity resins are liquid or solid at normal temperature. When these resins are heated, they become molten due to their high fluidity, and the molten resins are ultra-low-viscosity.

Explanation of reference signs

1 base

2 tie rods

3 Fixing plate

4 upper template

5 upper mold

6 Movable panels

7 next template

8 die

9 Opening and closing mechanism

10 Barrel Blocks

10a Barrel

11 side blocks

12 Lower mold cavity block (second cavity block)

13 plunger

14 Elastic parts

15 sprue block

16 Upper cavity block (first cavity block)

17 Floating pin cage

18 floating pin

19 main channel

20 cavities

21 gate

22 Vent slot

23 Vent block

23a Lower face of vent block

23b Resin filled part

24 fitting holes

25 suction path

26 Substrate supply part

27a Wiring board

27b Solder bumps

27c semiconductor chip

28 cured molded body

29 Resin package

30 connection part

R resin material

S gap

W Resin-encapsulated front substrate

W1 Resin-encapsulated rear substrate

P.L parting line

Claims (3)

1. A resin encapsulation method for electronic parts, comprising: A resin encapsulating apparatus preparation process of preparing a resin encapsulating apparatus for encapsulating electronic components, the resin encapsulating apparatus for encapsulating electronic components having a resin encapsulating mold for electronic components including at least a fixed mold and a movable mold opposed to the fixed mold, The movable mold is set to be able to advance and retreat relative to the fixed mold through a mold opening and closing mechanism for mold opening and closing movement, and the cavity block is set to be able to move to the mold opening and closing direction via a floating mechanism with elastic components. The parting surface of the fixed mold, the cavity and the vent hole connected to the cavity are arranged on the parting surface of the cavity block, and the fitting holes are arranged on the parting surface of the mold along the mold opening and closing direction. The connecting part of the cavity and the vent hole slot, the vent block is arranged at the position of the fixed mold corresponding to the fitting hole along the mold opening and closing direction, and the vent block can slide and tightly mounted to the fitting hole; A pre-resin-encapsulation substrate supply process of carrying the pre-resin-encapsulation substrate on which the electronic components are mounted between the fixed mold and the movable mold, and supplying the resin-encapsulated substrate to the movable mold. department; a resin material supply process of supplying a resin material having high fluidity to a resin supply part provided on the movable mold; In the first mold clamping process, after performing the pre-resin encapsulation substrate supply process and the resin material supply process, the parting surface of the fixed mold is separated from the movable mold via the mold opening and closing mechanism. Surface joint; In-mold space decompression process, during the first mold clamping process, decompresses the in-mold space between the parting surface of the fixed mold and the parting surface of the movable mold; a molten resin material pressure transfer process of heating and melting the resin material supplied to the resin supply part in a state where the in-mold space is decompressed by the in-mold space decompression process, and transferring the melted resin material into the cavity under pressure through a resin channel in the in-mold space; The second mold clamping process is to further move the cavity block of the fixed mold against the elasticity of the elastic member in the floating mechanism; The step of moving the vent block is to relatively move the vent block during the second mold clamping process so that the front end surface of the vent block is in contact with the parting surface of the cavity block. consistent; In the cavity sealing step, during the moving step of the vent block, the surface of the wiring board and the front-end surface of the vent block are encapsulated by the resin supplied to the substrate supply unit and bonded to the front end surface of the vent block. The front end face of the vent block is crimped, thereby sealing the cavity of the cavity block; a resin molding step of, after the cavity sealing step, transferring the melted resin material into the cavity under further pressure and filling the cavity; and In the molded product extraction process, after the resin molding process, the fixed mold and the movable mold are opened via the mold opening and closing mechanism, and in this state, the molded product is taken out inside the cavity. and the internal curing molded product of the resin channel, The vent block has a resin filling portion configuring a part of the cavity on a joint surface with the cavity, The movement of each part is set so that when the height position of the lower surface of the vent block is aligned with the height position of the parting line at the same height position, the top surface of the resin filling part and the cavity tops at the same height. 2. A resin encapsulation device for electronic components, characterized in that, A resin encapsulation mold having an electronic component including at least a fixed mold and a movable mold opposed to the fixed mold, The movable mold is configured to be able to move forward and backward relative to the fixed mold via a mold opening and closing mechanism for mold opening and closing movement, The cavity block is configured to be able to move to the parting surface of the fixed mold along the direction of mold opening and closing via a floating mechanism with elastic components, The cavity and the vent hole connected to the cavity are arranged on the parting surface of the cavity block, The fitting hole is provided along the mold opening and closing direction at the connecting portion between the cavity and the vent hole groove, The vent hole block is arranged at the position of the fixed mold corresponding to the fitting hole along the mold opening and closing direction, and the vent hole block can be slidably and tightly installed to the fitting hole, The vent block has a resin filling portion configuring a part of the cavity on a joint surface with the cavity, The movement of each part is set so that when the height position of the lower surface of the vent block is aligned with the height position of the parting line at the same height position, the top surface of the resin filling part and the cavity tops at the same height. 3. A resin sealing device for electronic components, comprising a resin sealing mold for electronic components including at least a fixed mold and a movable mold opposed to the fixed mold, the movable mold being configured to be movable through mold opening and closing The mold opening and closing mechanism advances and retreats relative to the fixed mold, The resin encapsulation device of the electronic component is characterized in that, The sprue block and the first cavity block are configured to be able to move to the parting surface of the fixed mold along the mold opening and closing direction via a floating mechanism with elastic components, The sprue as the resin flow part is arranged on the parting surface of the sprue block, A gate connected to the sprue, a cavity connected to the gate, and a vent groove connected to the cavity are arranged on the parting surface of the first cavity block, The fitting hole is provided along the mold opening and closing direction at the connecting portion between the cavity and the vent hole groove, The vent hole block is arranged at the position of the fixed mold corresponding to the fitting hole along the mold opening and closing direction, and the vent hole block can slide and be tightly installed to the fitting hole, A cylinder block provided with a resin supply portion for supplying a resin material is provided at a portion of the movable mold opposite to the fixed mold, The side block is arranged at the side position of the barrel block, The second cavity block is embedded and installed on the parting surface of the side block, The second cavity block is configured to be able to move along the mold opening and closing direction via a floating mechanism having elastic components, An in-mold decompression mechanism is provided for the first mold closing in which the parting surface of the fixed mold is joined to the parting surface of the movable mold via the mold opening and closing mechanism , decompressing the space in the mold between the parting surface of the fixed mold and the parting surface of the movable mold, And, on the basis of the state at the time of the first mold clamping, the mold opening and closing mechanism resists the elasticity of the floating mechanism to further press the parting surface of the fixed mold and the parting surface of the movable mold. When the mold is clamped for the second time, the vent block moves relatively, so that at least the front end face of the vent block coincides with the same position as the parting line surface, The vent block has a resin filling portion configuring a part of the cavity on a joint surface with the cavity, The movement of each part is set so that when the height position of the lower surface of the vent block is aligned with the height position of the parting line at the same height position, the top surface of the resin filling part and the cavity tops at the same height.