CN105278712A - Covering plate and manufacturing method thereof - Google Patents

Abstract

The invention provides a covering plate and a manufacturing method thereof. A plurality of concave holes are formed on a mother substrate. The surface of the concave hole is subjected to first strengthening treatment, so that an ion strengthening layer is formed on the surface of the concave hole. And cutting the mother substrate into a plurality of unit substrates corresponding to the unit regions, wherein each concave hole is positioned in one of the unit substrates, and the concentration of the strengthening ions of the ion strengthening layer on the surface of each concave hole is greater than that of the strengthening ions of one side wall of each unit substrate.

Description

Overlay plate and its manufacturing method

technical field

The present invention relates to a cover plate and its manufacturing method, and in particular to a cover plate made from a motherboard and its manufacturing method.

Background technique

With the continuous development of technology, electronic devices are getting thinner. Therefore, the outermost glass substrate of the electronic device is usually a strengthening substrate, such as a cover plate. Covering plates are sometimes required to have specific structural designs, such as recessed holes, such as perforated holes or blind holes. However, when such concave holes are formed on the reinforced substrate, the mechanical strength of the cover plate of the electronic device is likely to be weakened.

Contents of the invention

The invention provides a cover board and a manufacturing method thereof. The cover board has ideal mechanical strength and can effectively strengthen the mechanical strength of a glass substrate.

The manufacturing method of the cover board of this invention comprises the following steps. A plurality of concave holes and corresponding concave hole surfaces are formed on a mother substrate. A first strengthening treatment is performed on the surface of the concave hole, so that an ion strengthening layer is formed on the surface of the concave hole. The mother substrate is cut into a plurality of unit substrates corresponding to the unit regions. An element unit is formed on each unit substrate, and each concave hole is located in one of the unit substrates, wherein a first strengthened ion concentration of the ion strengthened layer is greater than a second strengthened ion concentration of a side wall of each unit substrate.

In the manufacturing method of the covering plate of the present invention, the first strengthening treatment may optionally include the following steps. In an ion strengthening step, a chemical ion exchange process is performed on the surface of the mother substrate or the surface of the concave hole to form an ion strengthening layer. An etching step is carried out with an etching solution before forming the ion-enhanced layer, so that an etching surface is formed on the surface of the concave hole. A grinding and polishing step is performed before or after the etching step to reduce the surface roughness of the concave hole surface or to reduce the surface roughness of the etched surface. The same etching step makes the surface of the mother substrate form another etched surface, and the grinding and polishing step may further include grinding and polishing the surface of the mother substrate to reduce the surface roughness of the etched surface of the mother substrate.

The manufacturing method of the cover board of this invention comprises the following steps. After the mother substrate is cut into a plurality of unit substrates, a second strengthening treatment is performed on each unit substrate. The second strengthening treatment includes performing an etching step with an etching solution, so that an etching surface is formed on the sidewall of each unit substrate. The second strengthening treatment may also include performing a polishing step to reduce the surface roughness of the sidewall.

The manufacturing method of the cover board of this invention comprises the following steps. Forming a plurality of element units on a plurality of unit regions of the mother substrate, the method includes a coating step, a deposition step, a printing step, a lithographic etching step or a combination thereof, wherein the element unit can be a touch element, a display element or both integration components. And optionally after the etching step, a solid glue is formed on the sidewall of each unit substrate, and the solid glue is grinded and shaped to make the outline of the solid glue meet the design requirements.

The manufacturing method of the cover board of this invention comprises the following steps. After the mother substrate is cut into a plurality of unit substrates, a chamfering step is further included so that the profile of the sidewall of each unit substrate has a C-shaped chamfer or an R-angle.

The manufacturing method of the cover board of this invention comprises the following steps. A decorative element is selectively formed on each unit substrate, and if each unit substrate is provided with element units, the decorative element is formed on each element unit. The decorative element can be a patterned decorative layer, which is arranged on the unit substrate or the periphery of the element unit to shield part of the circuit traces.

The manufacturing method of the cover board of the present invention further includes forming an outer decoration layer around each unit substrate, and the outer decoration layer covers part of the side wall.

In an embodiment of the present invention, before the mother substrate is cut into unit substrates, at least one corresponding concave hole is made for each unit substrate, and a first strengthening treatment is performed on the mother substrate. The first strengthening treatment also includes performing an etching step, so that an etching solution (such as a solution containing hydrofluoric acid) contacts the surface of the mother substrate and the surface of the concave hole, and then performing an ion strengthening step, so that the surface of the mother substrate or the surface of the concave hole An ion-enhanced layer is formed on the surface of the hole. After the mother substrate is cut into unit substrates, a second strengthening treatment is performed on each unit substrate. The second strengthening treatment includes an etching step, so that an etchant (such as a solution containing hydrofluoric acid) contacts the sidewall of the unit substrate. The second strengthening treatment includes optionally performing a grinding and polishing step before or after the etching step to reduce the surface roughness of the sidewall. The first strengthening treatment further includes optionally performing a polishing step on the concave hole surface before or after the etching step.

In an embodiment of the present invention, a solid glue is further disposed on the side wall to cover at least part of the side wall.

In an embodiment of the present invention, the above-mentioned method for forming a device unit includes a coating step, a deposition step, a printing step, a lithographic etching step or a combination thereof.

In an embodiment of the present invention, after the above-mentioned cutting of the mother substrate into unit substrates, a beveling step is further included so that the profile of the side wall has a C-shaped bevel or an R-angle.

In an embodiment of the present invention, an outer decoration layer is formed around each unit substrate, and the outer decoration layer covers part of the sidewall. For example, when the solid glue is provided on the side wall of the unit substrate, the solid glue is regarded as an extension of the side wall, and at this time, the outer decorative layer covers part of the solid glue. For another example, when there is an etched surface on the side wall of the unit substrate but no solid glue is provided, the outer decoration layer covers part of the etched surface. Even when there is an etched surface on the side wall of the unit substrate and the etched surface is partially covered by the solid glue, the outer decorative layer covers the part of the solid glue.

In one embodiment of the present invention, a functional film is also formed on each unit substrate, and the functional film and the element units are located on opposite sides of the unit substrate. one of them. The functional film may be a single-layer optical film layer or a stack of multiple optical film layers, without limitation.

In the method for manufacturing a touch panel according to an embodiment of the present invention, after the mother substrate is cut into unit substrates, a thinning step is performed to thin each unit substrate. For example, an etching step and a grinding and polishing step are performed on the surface of the unit substrate.

A covering plate of the present invention includes a unit substrate. The unit substrate includes a side wall, a first surface, a second surface and at least one concave hole. The side wall is connected between the first surface and the second surface, and the side wall surrounds the first surface and the second surface. The concave hole has a surface of the concave hole, wherein an ion strengthening layer is formed on the surface of the concave hole. The enhanced ion concentration of the ion-enhanced layer is greater than that of the sidewall.

A cover board of the present invention includes a component unit configured on the first surface, wherein the component unit can provide at least one of touch or display functions, that is, the component unit can be a touch component or a display component One or an integrated component of both. In addition, a decorative element can also be selectively disposed on the unit substrate or the element unit. To further illustrate, when the decorative element is disposed on the unit substrate, the decorative element can be disposed between the element unit and the unit substrate; or the element unit can be disposed on another substrate, and this substrate is bonded to the unit substrate. The decorative element can be a patterned decorative layer, which is disposed on the unit substrate or at least part of the periphery of the element unit to shield part of the circuit traces. The patterned decoration layer can be photosensitive material (such as photoresist) or ink material. The patterned decorative layer can be formed by stacking a single layer of the aforementioned materials or multiple layers of the aforementioned materials, and the color is not limited, and can be any single-color material or multiple colors of the aforementioned materials stacked or mixed.

In an embodiment of the present invention, at least one of the sidewall of the unit substrate or the surface of the concave hole has a plurality of continuous adjacent micro-concaves. Preferably, in a predetermined unit area of the side wall of the unit substrate or the surface of the concave hole, at least 70% of the number of micro-concaves, the size of each micro-concave is between 2 micrometers (μm) to 150 micrometers (μm) ). For example, for an irregularly shaped micro-concave surface, the maximum or approximate maximum value of a diagonal line taken from one side of the micro-concave contour to the other side under the microscope, as long as it meets the requirements of 2 microns (μm) to 150 microns (μm) ) can be included in the range. More preferably, the size of the micro-concaves is between 10 μm and 40 μm. When the size of the micro-concave falls within the above range, it means that the etching depth of the etching solution on the glass just removes most or all of the depth of the small cracks caused by cutting, without excessive etching, for example, the etching depth is controlled at 5 μm It is a good choice between to 50μm.

In an embodiment of the present invention, the cover plate further includes a solid glue disposed on the sidewall of the unit substrate. At this time, the sidewall can further have an etched surface or a polished surface as mentioned above.

In an embodiment of the present invention, the profile of the sidewall of the unit substrate has a C-shaped chamfer or an R-angle. Likewise, the sidewall may further have an etched surface or a polished surface at this time.

In an embodiment of the present invention, the above-mentioned cover board further includes an outer decoration layer disposed around the unit substrate, and the outer decoration layer covers a part of the side wall. For example, the profile of the side wall of the unit substrate has a C-shaped chamfer or R angle, and a solid glue is provided on the side wall. At this time, the solid glue is regarded as an extension of the side wall, so the outer decorative layer will cover the solid Part of the glue. For another example, when the profile of the sidewall of the unit substrate has a C-shaped chamfer or an R-angle, and there is an etched surface on the sidewall, the outer decoration layer covers part of the etched surface. Furthermore, the sidewall of the unit substrate may also have an etched surface and a portion of the etched surface covered by the solid glue. At this time, the outer decoration layer covers the part of the solid glue.

In an embodiment of the present invention, the above-mentioned cover board further includes a functional film disposed on the second surface. The functional film may, for example, have at least one of anti-reflection, anti-fouling, anti-glare, and waterproof functions. The functional film can be a single-layer optical film layer or a stack of multi-layer optical film layers, without limitation, for example, a functional film with anti-reflection function can be formed by stacking multiple optical film layers with different refractive indices .

Based on the above, in the cover plate and its manufacturing method according to the embodiment of the present invention, the surface of the concave hole of the cover plate is strengthened by forming an ion-enhanced layer, and even before forming an ion-enhanced layer, the concave hole can be treated with an etching solution. The surface is strengthened. Therefore, the cover plate or the cover plate with touch/display function manufactured by the manufacturing method of the embodiment of the present invention will have ideal mechanical strength.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail with reference to the accompanying drawings.

Description of drawings

FIG. 1 is a flow chart of manufacturing a panel device according to an embodiment of the present invention;

FIG. 2A shows a schematic top view of step 10 according to an embodiment of the present invention;

Fig. 2B is the schematic cross-sectional view of section line I-I' in Fig. 2A;

3A and 3B are schematic diagrams of step 20 of another embodiment of the present invention;

3C is a schematic cross-sectional view of a mother substrate that is directly subjected to an ion strengthening step after the processing of the concave hole;

4A is a schematic top view of the mother substrate after step 30 according to an embodiment of the present invention;

Fig. 4B is a schematic cross-sectional view of the section line II-II" in Fig. 4A;

Figure 4C is a schematic cross-sectional view of section line III-III' in Figure 4A;

5A is a schematic top view of the unit substrate after step 40 in the manufacturing method according to an embodiment of the present invention;

Figure 5B is a schematic cross-sectional view of the section line IV-IV' of Figure 5A;

6 is a schematic partial cross-sectional view of a unit substrate after performing step 50 in a manufacturing method according to an embodiment of the present invention;

7 is a partial cross-sectional schematic diagram of a panel device according to an embodiment of the present invention;

8 and 9 are schematic diagrams of various touch elements;

10 is a partial cross-sectional schematic diagram of a panel device according to another embodiment of the present invention;

11 to 13 are schematic partial cross-sectional views of panel devices according to other embodiments of the present invention;

FIG. 14 is a flow chart of manufacturing a panel device according to another embodiment of the present invention.

Explanation of reference signs:

1～5: panel device;

10-90: steps;

100: mother substrate;

102, 102': first surface;

102A, 104A, 112A: ion strengthening layer;

104, 104': second surface;

110: concave hole;

112, 112': Concave hole surface;

120: unit substrate;

122, 122', 122A, 122B: side walls;

124: blank area;

302: opening;

310: decorative element;

320, 320A, 320B: element unit;

322, 324: conductive series;

400: outer decorative layer;

410: functional film;

600: solid glue;

d: distance;

D1: first direction;

D2: second direction;

F: area;

G: slightly concave surface;

I-I', II-II', III-III', IV-IV': broken line;

M: alignment mark;

S3: Strip electrode;

S4: rectangular electrode;

S5: comb electrode;

W1, W2: Dimensions.

detailed description

FIG. 1 is a flow chart of manufacturing a panel device according to an embodiment of the present invention. The manufacturing method of this embodiment includes steps 10 to 50 shown in FIG. 1 . Step 10 is to form a plurality of concave holes on the mother substrate, wherein the mother substrate may be a hard substrate such as a glass substrate. For example, the material of the mother substrate may be soda-lime glass, boro-silicate glass, alumo-silicate glass, and the like. In addition, the formation of the concave hole is mainly realized by mechanical processing.

After the concave holes are completed on the mother substrate, the present embodiment further proceeds to step 20 to perform a first strengthening treatment on the mother substrate. This step can not only strengthen the original surface of the mother substrate, but also strengthen the surface of the concave hole. In this way, the device fabricated from the mother substrate can have ideal mechanical strength. The first strengthening treatment may be at least one of an etching step, a grinding and polishing step, and an ion strengthening step, and the sequence of the etching step and the grinding and polishing step may be interchanged. For example, the grinding and polishing step is followed by the etching step, and usually the ion strengthening step is placed last. Next, in step 30 , required element units can be selectively fabricated on the strengthened mother substrate, and then step 40 is performed to cut the mother substrate corresponding to the element units into a plurality of independent unit substrates. At this point, the prototype of the panel device has been roughly completed. Afterwards, in order to further improve the mechanical strength of the panel device, step 50 may be further performed to perform a second strengthening treatment on the independent unit substrate. FIG. 2A shows a schematic top view of step 10 according to an embodiment of the present invention. Please refer to FIG. 2A. Step 10 is to form a plurality of concave holes 110 on the mother substrate 100, wherein the concave holes 110 can be perforations, grooves, etc. structure, and this paper uses perforation to illustrate. At this time, in order to provide a reference point for alignment in the subsequent process, at least one alignment mark M can be formed on the mother substrate 100, wherein the number, outline, size and position of the concave hole 110 and the alignment mark N are only for illustration. used, not to limit the present invention. 2B is a schematic cross-sectional view of the section line II' in FIG. 2A. It can be seen from FIG. 2B that the mother substrate 100 has a first surface 102, a second surface 104, and a concave hole defining the concave hole 110 after the concave hole 110 is formed. Surface 112. Since the concave hole 110 is a structure manufactured by machining, the surface of the concave hole 112 is quite rough. Such a rough surface often leads to the phenomenon of stress concentration, so damage or cracking of the mother substrate 100 may occur from the concave surface 112 .

In order to improve the stress concentration phenomenon that may occur on the surface 112 of the concave hole, the step 20 disclosed in FIG. 1 can be performed. According to the steps in FIG. 2 , after the concave hole 110 is processed, the first strengthening treatment may be at least one of etching, grinding and polishing, and ion strengthening. For example, only the ion strengthening step is performed, or the etching step is performed first and then the ion strengthening step is performed, or the grinding and polishing step is performed first and then the ion strengthening step is performed, or the etching step, grinding and polishing step, and ion strengthening step are performed sequentially. The choice and combination of steps is not limited in the present invention.

3A and 3B are schematic diagrams of step 20 of another embodiment of the present invention, and FIG. 3A is a schematic cross-sectional view of the mother substrate 100 after the etching step of the first strengthening treatment, wherein the first surface 102', the second surface 104 A part of the 'surface 112' of the concave hole is etched (removed) after contact with the etchant, and the etching method such as dry etching or wet etching can be used. For example, the dry etching medium can be fluorine-containing gas or plasma, and the wet etching medium can be a solution containing hydrofluoric acid (HF) or a fluorine-containing solution, wherein the fluorine-containing solution can include sulfamic acid, peroxide, etc. ammonium persulfate, nonionic surfactant, hydrochloric acid, acetic acid, surfactant, deionized water (DIwater), nitric acid, fluorine salt, fluorine compound, hydrofluoric acid, sulfuric acid, phosphoric acid, etc One or more of the above ingredients are combined with each other. Therefore, the surface structures of the first surface 102', the second surface 104' and the concave hole surface 112' have many micro-concaves G to form an etched surface. The purpose of etching the surface 112' of the concave hole is to remove the small cracks caused by the cutting to achieve the function of strengthening the glass surface and improving the bending resistance of the glass. The etching of the first surface 102' and the second surface 104' can achieve the function of reducing the thickness of the glass by the way. Preferably, in a predetermined unit area (for example, 0.09mm2) of the side wall of the unit substrate or the surface of the concave hole, the size of the micro-concave G that accounts for at least 70% of the number is between 2 micrometers (μm) and 150 micrometers (μm ), more preferably, the size of the dimples is between 10 μm and 40 μm.

Next, the first surface 102' and the second surface 104' of the etched mother substrate 100 can be ground and polished, so as to grind and polish the first surface 102' and the second surface 104' to be flat, while the concave hole surface 112' is Grinding and polishing can be optionally performed as required, but not limited thereto. In other embodiments, the first strengthening treatment can also be directly ground and polished on the concave hole surface 112' without etching, and the small cracks (crack) caused by cutting can also be removed or reduced to achieve the function of strengthening the glass surface. It can improve the ability of glass to resist bending.

Next, the mother substrate 100 after grinding, polishing or etching can be subjected to an ion strengthening step to form a cross section as shown in FIG. The surface diffuses into the interior of the mother substrate 100 . At this time, the ions diffused into the mother substrate 100 increase the compressive stress of the concave hole surface 112 ′, and thus increase the strength of the concave hole surface 112 ′.

3A and 3B illustrate an embodiment in which the first strengthening treatment includes at least two of etching, abrasive polishing, and ion strengthening. However, in other embodiments, the ion strengthening step can also be performed directly after finishing the processing of the concave hole 110 in FIG. 2A and FIG. 2B . That is to say, the etching step or the grinding and polishing step of FIG. 3A can be optionally omitted. 3C is a schematic cross-sectional view of a mother substrate that undergoes an ion strengthening step directly after the processing of the concave holes. In FIG. 3C , the mother substrate 100 is subjected to an ion strengthening step after the concave hole 110 is processed, so the first surface 102 , the second surface 104 and the concave hole surface 112 are respectively formed with ion strengthening layers 102A, 104A and 112A. Here, the surface 112' of the concave hole is rougher than the surface 112' of the concave hole shown in FIG. .

The so-called ion strengthening step of the mother substrate in the embodiment of the present invention is to immerse the mother substrate 100 formed with the concave hole 110 in an ion strengthening tank containing an ion strengthening liquid. For example, when the material of the mother substrate 100 is the above-mentioned soda-lime glass, the ion strengthening liquid is, for example, potassium nitrate solution. Potassium ions with a larger ionic radius can diffuse from the surface of the mother substrate 100 to the interior to replace part of the sodium ions in the mother substrate 100 . Therefore, the ion-enhanced layers 102A, 104A, and 112A are denser than the original material of the mother substrate 100 , can provide higher compressive stress on the glass surface, and effectively strengthen the mechanical strength of the glass surface.

In this paper, the depth of the ion-strengthened layer refers to the average depth of potassium ions diffused from the glass surface into the interior of the glass, and a better definition refers to the maximum concentration of potassium ions in these regions when the entire surface of the glass is divided into multiple regions. Mean value of diffusion depth. The depth of the ion-enhanced layer can generally be known by detecting the presence or absence of potassium ions with an instrument. Since the ion diffusion depth may vary even under the same process, the average value of the diffusion depth is used as the criterion for judging the depth of the ion-enhanced layer in this paper.

That is to say, in one embodiment, the depth of the ion-enhanced layer can be defined as the depth at which the concentration of potassium ions (K+) is measured from the glass surface toward the interior at multiple measurement points to obtain the corresponding concentration, and these The value obtained by calculating the average value of the measured depth. Usually, the distribution of potassium ions is the highest at the surface, and then gradually decreases to zero or the background value in the glass. Therefore, the depth measured at each measurement point is essentially the distance from the glass surface to the position where the distribution of potassium ions decreases to zero or to the background value, where the background value refers to the concentration of potassium ions in the raw materials contained in the glass during manufacture. concentration.

For example, when the original composition of glass contains potassium ions, the concentration of potassium ions in the raw material can be defined as the background value. In other words, the ion-enhanced layer is defined by the depth at which exchange ions (such as potassium ions) enter the glass through exchange/diffusion mechanisms. The concentration distribution of the exchanged ions will gradually decrease from the surface of the glass substrate to the center to zero or the background value, so whether the ion-enhanced layer exists can be known by detecting the existence of the exchanged ions by the instrument. In addition, the so-called average depth here may be the average value of the depths of the ion-enhanced layer at multiple measurement points. Preferably, the average depth is defined by the average value of the maximum diffusion depth of the exchanged ions in each measurement area in the glass.

In fact, the same ion-strengthening process may form ion-strengthened layers with slightly different depths. Therefore, the depths of ion-strengthened layers at several different positions can be detected here, and then the average value can be taken. For example, select 5 different positions on the strengthened glass substrate, use an instrument to detect the diffusion depth of potassium ions, and then average the five measured values, and use this average value to represent the average value of the entire ion-enhanced layer. Depth T or d. In addition, the aforementioned ion exchange behavior of replacing sodium ions with potassium ions is only illustrative and not intended to limit the present invention. Other ion exchange behaviors that can produce strength-enhancing effects can be applied to various embodiments of the present invention. Furthermore, the above-mentioned glass material is not particularly limited, and it may include, for example, soda lime silicate glass, aluminosilicate glass and the like.

After the mother substrate 100 completes the above-mentioned first strengthening treatment, step 30 may be optionally performed to form element units on the mother substrate 100 . The following steps will be described by taking the mother substrate 100 of FIG. 3B as an example. 4A is a schematic top view of the mother substrate after step 30 according to an embodiment of the present invention, and FIG. 4B is a schematic cross-sectional view of the section line II-II" in FIG. 4A. It can be seen from FIGS. 4A and 4B that there are multiple Unit regions R independent of each other, and a plurality of decorative elements 310 and a plurality of element units 320 are formed in these unit regions R. The decorative elements 310 and the element units 320 are, for example, disposed on the first surface 102', and each decorative element 310 has Frame pattern. The method for decorating the element 310 and the element unit 320 includes a coating step, a deposition step, a printing step, a lithographic etching step or a combination of the above. The element unit 320 can provide at least one of touch or display functions, That is, the component unit 320 can be one of a touch component or a display component, or an integrated component combining both. Specifically, the component unit 320 of this embodiment is described using a capacitive touch component as an example , but the present invention is not limited thereto. In another embodiment, the element unit 320 can be arranged on a substrate (not shown), and this substrate is bonded on the cover plate made by the method of the present invention. For example, the element The unit 320 (capacitive touch element) is arranged on the color filter substrate of a liquid crystal display panel, and then attached to the cover plate made by the method of the present invention; the element unit 320 (capacitive touch element) can also be arranged On a packaging substrate with a light-emitting diode display panel, and then attached to the cover plate made by the method of the present invention; it is also possible that the element unit 320 (capacitive touch element) is arranged on a thin plastic/glass substrate (thickness less than 0.25mm), and then pasted on the cover plate made by the method of the present invention. The above is only an example, and the present invention is not limited thereto.

The decorative element 310 can be a patterned decorative layer made of at least one layer of ink, resin or other opaque or light-absorbing materials, for example, it is arranged around each capacitive touch element to shield the wiring, and the central part has a transparent layer. The light opening area, as shown in Figure 4A. Therefore, although FIG. 4B only schematically depicts one layer of the decorative element 310, in a specific embodiment, the decorative element 310 may be a multi-layer structure. The patterned decoration layer can be photosensitive material (such as photoresist) or ink material. The patterned decorative layer can be formed by stacking a single layer of the aforementioned materials or multiple layers of the aforementioned materials, and the color is not limited, and can be any single-color material or multiple colors of the aforementioned materials stacked or mixed.

In addition, FIG. 4C is a schematic cross-sectional view of line III-III' in FIG. 4A. When making the element unit 320 on the mother substrate 100, since the mother substrate 100 has already formed the concave hole 110, the decorative element 310 can be provided with a corresponding concave hole 110 through the patterning process or with the assistance of a printing jig. The opening 302. Furthermore, considering that the maximum manufacturing tolerance is 350 μm, the dimension W1 of the concave hole 110 is smaller than the dimension W2 of the opening 302 , wherein the distance d between the edge of the opening 302 and the concave hole 110 can be 0 μm to 700 μm. For example, when the decorative element is a photoresist layer and a photolithography process is used, the distance from the edge of the opening 302 to the concave hole 110 is 0 μm to 250 μm. For example, when the decoration element is an ink stack structure with at least one layer and adopts a printing or coating process, the distance from the edge of the opening 302 to the concave hole 110 is 200 μm to 700 μm.

After the device units 320 are fabricated, step 40 may be performed, in which the mother substrate 100 is cut into a plurality of independent unit substrates 120 corresponding to the unit regions R. 5A is a schematic top view of the unit substrate after step 40 in the manufacturing method of an embodiment of the present invention, and FIG. 5B is a schematic cross-sectional view of the section line IV-IV' in FIG. 5A . It can be seen from FIGS. 5A and 5B that the unit substrate A component unit 320 and a decoration component 310 are disposed on the first surface 102 , and the unit substrate 120 has a concave hole 110 . At the same time, since the mother substrate 100 is cut into the unit substrate 120 after the element unit 320 and the decorative element 310 are manufactured, after the sidewall 122 of the unit substrate 120 is cut, most of the sidewall 122 has a rather rough surface and does not exist. There is an ion-enhanced layer. In this embodiment, referring to FIG. 5B , there is no ion-enhanced layer in the central area of the surface of the sidewall 122 , and there may still be a slight ion-enhanced layer on the surface of the sidewall 122 close to the upper and lower surfaces of the unit substrate 120 .

Therefore, in this embodiment, the second strengthening process of step 50 can be performed next. In this way, as shown in FIG. 6 , which is a schematic partial cross-sectional view of the unit substrate after performing step 50 in the manufacturing method according to an embodiment of the present invention, the sidewall 122 ′ of the unit substrate 120 will become relatively smooth and less prone to stress. concentrated phenomenon. Wherein, in this embodiment, the second strengthening treatment includes an etching step, a grinding and polishing step, or both.

When performing the etching step of the sidewall 122, an acid-resistant film (not shown) may be pasted on the unit substrate 120 to protect the element unit 320 and the second surface 104'. When the element unit 320 is wrapped between the unit substrate 120 and the acid-resistant film, an etching step is performed, wherein the etching method can be performed by dry etching or wet etching as in the first strengthening treatment. At this time, the surface of the sidewall 122' forms an etched surface, and the etched surface has many micro-concaves like the enlarged region F shown in FIG. 3A. In a preset unit area (for example, 0.09mm 2 ) of the side wall 122' of the unit substrate 120, the size of the micro-concave G that accounts for at least 70% of the number is between 2 micrometers (μm) and 150 micrometers (μm), more preferably Generally, the size of the dimples is between 10 μm and 40 μm, and the depth is about 6 μm to 12 μm. In addition, the average surface roughness of the sidewall 122 before sidewall etching is about 1.0 μm to 3 μm, while the average surface roughness of the sidewall 122′ after etching is about 0.03 μm to 0.8 μm.

In this step, the second surface 104' of the unit substrate 120 can optionally be coated with an acid-resistant film or not coated with an acid-resistant film. When the second surface 104' is not coated with an acid-resistant film, the second surface 104' will also be exposed to the etchant to reduce the thickness of the unit substrate 120. The unit substrate 120 can be thinned from a first thickness to a second thickness, and the second thickness is not greater than 0.3 mm. In addition, step 50 may also be a grinding and polishing step to reduce the surface roughness of the sidewall 122 . In other embodiments, step 50 may firstly perform a grinding and polishing step on the sidewall 122 and then perform an etching step. Alternatively, step 50 may be performed on the sidewall 122 firstly by etching and then by grinding and polishing.

Since the mother substrate 100 is cut after the decorative element 310 and the element unit 320 are manufactured, the boundary of the decoration element 310 and the element unit 320 is separated from the boundary of the unit substrate 120 to form a blank area 124 . Therefore, as shown in FIG. 7, FIG. 7 is a partial cross-sectional schematic diagram of a panel device according to an embodiment of the present invention. In this embodiment, an outer decorative layer 400 can be further formed around the unit substrate 120 to complete the panel device 1, and the outer The decoration layer 400 covers part of the sidewall 122'. In this way, the peripherals of the panel device 1 can be provided with the desired decorative effect by these decorative elements (the decorative element 310 and the outer decorative layer 400 ).

Here, the top view of the panel device 1 is shown in FIG. 5A and the cross-sectional view is shown in FIG. 7 . A functional film 410 can be formed on the second surface 104 ′, wherein the functional film 410 can be formed by coating or bonding. and other methods to set. A functional film 410 can be an anti-reflection layer, anti-fouling layer, waterproof layer or anti-glare layer, etc., and can be a single functional film layer or a stack of multiple functional film layers, which can provide anti-reflection, anti-moisture, anti-glare, etc. Dirt, anti-glare and other functions. For example, the anti-reflection layer can be formed by stacking multiple layers with different refractive indices, or a composite layer stacked by anti-fouling and anti-glare layers, but it is not limited thereto. In addition, although the unit substrate 120 is only provided with one concave hole 110 , the present invention is not limited thereto. In other embodiments, a single unit substrate 120 may be provided with multiple concave holes 110 . When the panel device 1 is applied to electronic products, the concave hole 110 can be used as an ear hole, a speaker hole, a button hole, a component accommodating groove or other structures. In this embodiment, the panel device 1 can be used as a cover plate of the electronic device due to the decoration element 310 , and the decoration element 310 can be used to cover components that users do not want to see or to form a specific pattern.

The descriptions of the above steps are only for illustration purposes, and in other embodiments, the steps in FIG. 1 may have other implementation manners.

For example, referring to the formation of the element unit in step 30, please refer to FIG. The plurality of conductive series 324 in the second direction D2. In this embodiment, the conductive series 322 and the conductive series 324 are interlaced and insulated from each other. In other embodiments, the conductive series 322 and the conductive series 324 can be replaced by strip-shaped conductive patterns. Alternatively, the element unit 320 can be made of a single conductive layer. For example, FIGS. 8 and 9 are schematic diagrams of various touch elements. The element unit 320A may be composed of a plurality of strip electrodes S3 as shown in FIG. 8 , wherein the width of each strip electrode S3 gradually decreases from one end to the other end. Of course, the element unit 320B can also be composed of a plurality of rectangular electrodes S4 and comb-shaped electrodes S5 shown in FIG. 9 . It is worth mentioning that the designs of the above-mentioned various element units 320 , 320A, 320B are just examples, and are not intended to limit the implementation of the touch elements 320 , 320A, 320B described in the present invention.

In addition, the element units 320, 320A, and 320B may also include many wires not directly shown, or sensing patterns and pad structures arranged on the decoration element 310, so as to realize signal transmission and touch sensing. Features. In this embodiment, the decoration element 310 and the element unit 320 are sequentially fabricated on the mother substrate 100 for illustration, but the present invention is not limited thereto. In other embodiments, the decorative element 310 may be disposed on the element unit 320 after the element unit 320 (such as a capacitive touch element) is fabricated on the mother substrate 100 . Even, in an embodiment, the decorative element 310 can be disposed on the element unit 320 after the element unit 320 (such as a capacitive touch element) is fabricated on the mother substrate 100 and the mother substrate 100 is cut into a plurality of unit substrates. In such an embodiment, the decorative element 310 can be fabricated on a film first, and then the film formed with the decorative element 310 can be pasted on the element unit 320 through an adhesive layer. In other words, in such a modified embodiment, the mother substrate 100 can be cut into a plurality of unit substrates 120 to form a panel device as shown in FIG. 10 (FIG. 10 is a partial cross-sectional view of a panel device according to another embodiment of the present invention). 2, and the panel device 2 is essentially a touch panel. In addition, the panel device 2 may be formed by directly disposing the element unit 320 on the unit substrate 120 without any decorative element.

11 to 13 are schematic partial cross-sectional views of panel devices according to other embodiments of the present invention. Please refer to FIG. However, the panel device 3 also includes a solid glue 600 . That is to say, when manufacturing the panel device 3, after performing steps 10 to 50 described in FIG. 1, an adhesive layer is coated on the side wall 122' and cured into a solid adhesive 600 to provide the side wall 122' An extra layer of protection against external forces such as impact forces. The solid glue 600 can be made of photocurable resin, thermosetting resin or other materials that can be made on the sidewall 122'. In this embodiment, for example, a photo-curable resin that is cured after being irradiated with UV light is used. In addition, the outer decoration layer 400 can be fabricated on the unit substrate 120 after the solid glue 600 is fabricated. Therefore, the outer decoration layer 400 may partially cover the solid glue 600, further increasing the adhesion between the solid glue 600 and the side wall 122'. Finally, the solid glue 600 can be edged and shaped so that the outline of the solid glue meets the design requirements, as shown in FIG. 12 or FIG. 13 .

In FIG. 12 , the components of the panel device 4 are substantially the same as those of the panel device 3, but during the cutting step 40, the panel device 4 further performs a beveling step on the side wall 122 so that the profile of the side wall 122A has a C-shaped guide. horn. In addition, in FIG. 13 , the components of the panel device 5 are substantially the same as those of the panel device 3, but when performing the cutting in step 40, the panel device 3 further performs a chamfering step on the side wall 122 so that the profile of the side wall 122B has an R horn.

In another embodiment, the manufacturing method of the panel device may have the following steps. FIG. 14 is a flow chart of manufacturing a panel device according to another embodiment of the present invention. Please refer to FIG. 14, step 60, forming a plurality of concave holes on the mother substrate; step 70, cutting the mother substrate into multiple unit substrates; step 80 , performing strengthening treatment; and step 90, forming element units on the unit substrate. In this embodiment, the element unit is formed after the strengthening treatment, so the strengthening treatment may include an ion strengthening step so that an ion strengthening layer may be formed on the surface of the concave hole. The implementation of the ion strengthening step and the description of the ion strengthening layer can refer to the foregoing content, without further description. In this embodiment, between step 60 and step 70, that is, after the concave hole is formed and before the mother substrate is cut, a pre-strengthening treatment may be additionally performed, wherein the pre-strengthening treatment may include an etching step to remove the surface of the concave hole Reduced roughness. In addition, in this embodiment, the element unit is produced after the unit substrate has been cut into shape, so the boundary of the element unit can be aligned with the boundary of the unit substrate, and there is no blank area 124 shown in FIG. 6 .

To sum up, in the manufacturing method of the cover plate according to the embodiment of the present invention, the strengthening of the substrate and the steps of manufacturing other components are performed after the concave holes are formed. Therefore, although the cover board or the touch panel is formed with concave holes, the surface of the concave holes has been strengthened and has an ion-enhanced layer so that stress concentration is not easy to occur. That is, the cover plate or touch panel can have ideal mechanical strength.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the various embodiments of the present invention. scope.

Claims (33)

1. A method for manufacturing a covering plate, characterized in that, comprising: forming a plurality of concave holes and corresponding surfaces of the plurality of concave holes on a mother substrate; performing a first strengthening treatment on the surface of the concave holes, so that an ion strengthening layer is formed on the surface of the concave holes; forming a plurality of element units on a plurality of unit regions of the mother substrate; and Corresponding to the unit areas, the mother substrate is cut into a plurality of unit substrates, each of the unit substrates is configured with an element unit and has a side wall, and each of the concave holes is located in one of the unit substrates, wherein the concave holes A first strengthening ion concentration of the ion strengthening layer on the surface is greater than a second strengthening ion concentration of the sidewall. 2. The manufacturing method of the cover plate according to claim 1, characterized in that, the first strengthening treatment further comprises performing an etching step with an etching solution before forming the ion-enhanced layer, so that the surface of each concave hole is formed Has an etched surface. 3. The manufacturing method of the cover plate according to claim 2, characterized in that, the first strengthening treatment also includes performing a grinding and polishing step after the etching step, so that the surface roughness of the etched surface of each of the concave holes decrease. 4. The manufacturing method of the cover plate according to claim 3, wherein the etching step forms another etched surface on the surface of the mother substrate, and the grinding and polishing step comprises performing an etching process on the other etched surface of the mother substrate. Grinding and polishing to reduce the surface roughness of the other etched surface of the mother substrate. 5. The manufacturing method of the covering plate according to claim 1, characterized in that, the first strengthening treatment further comprises a grinding and polishing step on the surfaces of the concave holes before forming the ion strengthening layer, so that each of the concave holes The surface roughness of the hole surface is reduced. 6 . The manufacturing method of a cover plate according to claim 1 , further comprising performing a second strengthening treatment on each of the unit substrates after cutting the mother substrate into the unit substrates. 7 . The manufacturing method of the cover plate according to claim 6 , wherein the second strengthening treatment comprises performing an etching step with an etching solution, so that the sidewalls of each of the unit substrates form an etched surface. 8 . 8 . The method for manufacturing a cover plate according to claim 7 , wherein the second strengthening treatment further comprises forming a solid glue on the sidewalls of each of the unit substrates after the etching step. 9 . The manufacturing method of the cover plate according to claim 8 , wherein the second strengthening treatment further comprises edging and shaping the solid glue. 10 . 10 . The manufacturing method of the cover board according to claim 6 , wherein the second strengthening treatment comprises a grinding and polishing step to reduce the surface roughness of the sidewall. 11 . 11 . The manufacturing method of the cover plate according to claim 1 , wherein the method of forming the element units comprises a coating step, a deposition step, a printing step, a lithographic etching step or a combination thereof. 12. The manufacturing method of the cover plate according to claim 1, characterized in that, after cutting the mother substrate into the unit substrates, it further comprises a chamfering step, so that the profile of the side wall has a C-shaped chamfer Or R angle. 13 . The manufacturing method of the cover plate according to claim 12 , further comprising forming an outer decoration layer around each of the unit substrates, and the outer decoration layer covers a part of the side wall. 14 . 14 . The manufacturing method of a cover plate according to claim 1 , further comprising forming a functional film on each of the unit substrates, and the functional film and the element unit are located on opposite sides of the unit substrate. 15. The method of manufacturing a cover plate according to claim 1, further comprising forming a decorative element on each element unit. 16. A method for manufacturing a cover plate, comprising: forming a plurality of concave holes and corresponding surfaces of the plurality of concave holes on a mother substrate; performing an etching step with an etching solution, so that an etching surface is formed on each surface of the concave hole; performing a strengthening treatment on the surface of the mother substrate and the etched surface, so that an ion-enhanced layer is formed on the surface of the mother substrate and the etched surface; cutting the mother substrate into a plurality of unit substrates, each of the unit substrates has a side wall, and each of the concave holes is located in each of the unit substrates; and A chamfering step is performed to make the profile of the sidewall have a C-shaped chamfer or an R-angle, wherein the enhanced ion concentration of the sidewall is smaller than that of the surfaces of the concave holes. 17. The manufacturing method of the cover plate according to claim 16, further comprising another etching step with another etching solution, so that the sidewalls of each of the unit substrates are formed with another etched surface, wherein The enhanced ion concentration of the other etched surface is smaller than the enhanced ion concentration of the concave hole surfaces. 18. The method for manufacturing a cover plate according to claim 17, further comprising forming a solid glue on the other etched surface of each of the unit substrates after the another etching step, and selectively The solid glue is edged and shaped. 19. The method for manufacturing a cover plate according to claim 17 or 18, further comprising: forming a decorative element on each of the unit substrates; and An outer decorative layer is partially covered on each of the decorative elements, and the outer decorative layer covers the etched surface or part of the surface of the solid glue. 20. A covering board, characterized in that it comprises: A unit substrate, including a side wall, a first surface, a second surface and at least one concave hole, the side wall is connected between the first surface and the second surface, and the side wall surrounds the first surface With the second surface, the concave hole has a concave hole surface, wherein an ion strengthening layer is formed on the concave hole surface, and a strengthening ion concentration of the ion strengthening layer is greater than that of the sidewall. 21. The cover plate according to claim 20, wherein at least one of the side wall and the surface of the concave hole has a plurality of micro-concavities, and a predetermined unit area of the side wall or the surface of the concave hole wherein at least 70% of the micro-concavities have a size between 2 microns and 150 microns. 22 . The cover plate according to claim 21 , wherein the size of each of the dimples is between 10 microns and 40 microns. 23. The cover plate according to claim 22, further comprising a solid glue disposed on the side wall. 24. The cover plate of claim 20, wherein at least one of the sidewall and the surface of the recess has a polished surface. 25. The cover plate according to claim 24, further comprising a solid glue disposed on the side wall. 26. The cover board according to claim 20, wherein the profile of the side wall has a C-shaped chamfer or an R-angle. 27. The cover plate according to claim 20, further comprising a decorative element and an outer decorative layer arranged on the decorative element, the decorative element and the outer decorative layer are arranged on the unit substrate around, and the outer decorative layer covers at least part of the decorative element and the side wall. 28. The cladding panel of claim 27, comprising: A component unit is configured on the first surface to provide at least one of touch control or display functions. 29. The cover panel of claim 27, further comprising: A solid glue is disposed on the side wall, the profile of the side wall has a C-shaped chamfer or an R angle, and the outer decorative layer covers at least part of the solid glue. 30. The cover plate according to claim 20, further comprising a functional film disposed on the second surface, the functional film having at least one of anti-reflection, anti-fouling, anti-glare, and waterproof functions . 31. The cover plate according to claim 27, wherein the decorative element is provided with an opening corresponding to the concave hole, and the size of the concave hole is smaller than or equal to the size of the opening, wherein the edge of the opening reaches the concave hole The distance is from 0 μm to 700 μm. 32 . The cover plate according to claim 31 , wherein the decorative element is a photoresist layer, and the distance from the edge of the opening to the concave hole is 0 μm to 250 μm. 33. The cover plate according to claim 31, wherein the decorative element is at least one layer of ink stacking structure, and the distance from the edge of the opening to the concave hole is 200 microns to 700 microns.