CN105275179A - Heat-conducting wood composite floor - Google Patents

Abstract

The invention relates to a heat-conducting wooden composite floor, which is composed of a surface layer (1), a base layer (2) and a bottom layer (3), and the layers are closely joined together. The base layer (2) is a density board, which is made of wood composite material composed of wood fiber (4) and heat-conducting material (5), so that the floor can obtain good heat-conducting performance while maintaining the strength of the floor. The heat-conducting wooden composite floor of the invention has the advantages of simple structure, easy processing and production, good strength, high thermal conductivity, improved energy utilization rate, and can achieve good heat transfer effect as floor heating equipment.

Description

A thermally conductive wooden composite floor

technical field

The invention relates to the technical field of wooden floors for floor heating, in particular to a heat-conducting wooden composite floor.

Background technique

At present, there are few studies on the thermal conductivity of wood composite materials. Yang Guiguang, a technician in the field, obtained their thermal conductivity values by analyzing the thermal conductivity of density boards, composite floors, solid wood boards, and plywood. The thermal conductivity of the four boards is very good. Small, indicating that ordinary wooden boards are poor conductors of heat, and their thermal conductivity from large to small is: density board, composite floor, solid wood board, plywood.

In the prior art, there is a kind of heat-conducting wooden floor. By pasting a honeycomb heat-conducting middle layer between the upper and lower panels of the wood floor, a plurality of heat-conducting holes are opened on the honeycomb heat-conducting middle layer, and heat-conducting materials are filled in the heat-conducting holes, so that The floor acquires thermal conductivity properties. Although this method can solve the heat conduction problem of the wooden floor, its honeycomb intermediate layer structure reduces the strength of the heat conductive wooden floor. Another technology solves the heat conduction problem of the wooden floor by arranging multiple heat conduction holes on the wooden floor, which also reduces the mechanical properties of the wooden floor and destroys the natural characteristics of the wood.

Contents of the invention

(1) Technical problems to be solved

The technical problem to be solved by the present invention is how to provide a new type of floor that improves the thermal conductivity without destroying the strength of the floor.

(2) Technical solution

In order to solve the above technical problems, the present invention provides a heat-conducting wooden composite floor, which is composed of a surface layer, a base layer, and a bottom layer. The base layer is a density board, and the composite material is made of wood fiber and heat-conducting filler.

Preferably, the thermally conductive filler is a micro-nano thermally conductive filler, which ensures that the structure and performance of the wood composite material will not be affected when it is combined with wood fiber, and when the wood composite material made of wood fiber and thermally conductive filler is used to make the base layer, it will not Affect the appearance quality and physical and mechanical properties of the base layer.

Preferably, the micro-nano thermally conductive filler is carbon black, carbon fiber, carbon nanotube, or nano-alumina.

Preferably, the thermally conductive filler forms a thermally conductive network in the composite material, thereby enhancing the thermally conductive performance of the wood floor.

Preferably, the wood fiber and thermally conductive filler are made into a wood composite material through a wood-based panel process.

(3) Beneficial effects

The heat-conducting wooden composite floor of the present invention is composed of a surface layer, a base layer and a bottom layer, and the layers are closely joined together. Among them, the base layer is made of wood composite material composed of wood fiber and heat-conducting material, which enables the floor to obtain good heat-conducting performance while maintaining the strength of the floor. On this basis, the heat-conducting material makes the wood floor dissipate heat more evenly, reducing the cracking and deformation caused by the anisotropy of the wood floor. The heat-conducting wooden composite floor of the invention has the advantages of simple structure, easy processing and production, good strength, high thermal conductivity, improved energy utilization rate, and can achieve good heat transfer effect as floor heating equipment.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

Fig. 1: A structural schematic diagram of a heat-conducting wooden composite floor provided by the present invention.

In the figure: 1. Surface layer; 2. Base layer; 3. Base layer; 4. Wood fiber; 5. Thermally conductive filler.

detailed description

Embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but should not be used to limit the scope of the present invention.

This embodiment provides a heat-conducting wooden composite floor, as shown in Figure 1, which is composed of a surface layer 1, a base layer 2, and a bottom layer 3, and the layers are closely joined together. The base layer 2 is a density board made of composite materials. The composite material is composed of wood fibers 4 and micro-nano thermally conductive fillers 5.

In this embodiment, the micro-nano thermally conductive filler is carbon black, carbon fiber, carbon nanotube, or nano-alumina. Of course, it is not limited to the above-mentioned fillers. Other micro-nano thermally conductive fillers should also be included in the present invention as long as they meet the requirements of structure and appearance. among.

It can be seen from Figure 1 that the wood fibers 4 interweave in a cross shape, and the micro-nano thermally conductive fillers 5 are granular and filled between the structures of the wood fibers 4, so that the micro-nano thermally conductive fillers 5 form a network of heat in the base layer 2. The transfer path, that is, the thermal network, thereby enhancing the thermal conductivity of the floor.

The choice of thermally conductive filler is limited by the structure of wood fiber 4. In this embodiment, micro-nano thermally conductive filler is used to ensure that the original mechanism of wood fiber is not affected when composited with wood fiber, and the wood composite material made of wood fiber and thermally conductive filler When used to make the base layer, it does not affect the appearance of the base layer. Of course, other thermally conductive fillers, even if they are not micro-nano thermally conductive fillers, should also be included in the present invention as long as they meet the requirements of structure and appearance.

In this embodiment, the wood fiber 4 and the micro-nano thermally conductive filler 5 are made into a wood-based composite material through a wood-based panel process.

The above embodiments are only used to illustrate the present invention, but not to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications or equivalent replacements of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention, and all should cover Within the scope of the claims of the present invention.

Claims (5)

1. a heat conduction wooden composite floor, be made up of surface layer (1), basic unit (2), bottom (3), closely be bonded together between each layer, it is characterized in that, combination process is adopted to make composite material, obtain basic unit (2) by composite material, described basic unit (2) is density board, and described composite material is composited by wood fiber (4) and heat filling (5).

2. heat conduction wooden composite floor according to claim 1, is characterized in that, described heat filling (5) is micro-nano heat filling.

3. heat conduction wooden composite floor according to claim 2, is characterized in that, described micro-nano heat filling is carbon black, carbon fiber, CNT or nano aluminium oxide.

4. heat conduction wooden composite floor according to claim 1, is characterized in that, described heat filling (5) forms heat conduction network in the composite.

5. heat conduction wooden composite floor as claimed in any of claims 1 to 4, is characterized in that, described wood fiber (4) and heat filling (5) make composite wooden material by artificial panel technology.