CN105263301B - 一种液冷散热系统及其液体散热排 - Google Patents
一种液冷散热系统及其液体散热排 Download PDFInfo
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- CN105263301B CN105263301B CN201510769643.7A CN201510769643A CN105263301B CN 105263301 B CN105263301 B CN 105263301B CN 201510769643 A CN201510769643 A CN 201510769643A CN 105263301 B CN105263301 B CN 105263301B
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- liquid
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- chamber
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- 238000001816 cooling Methods 0.000 title claims abstract description 113
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- 239000002826 coolant Substances 0.000 claims abstract description 32
- 238000009434 installation Methods 0.000 claims abstract description 17
- 238000005086 pumping Methods 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 95
- 238000003860 storage Methods 0.000 claims description 24
- 239000012530 fluid Substances 0.000 claims description 19
- 238000007789 sealing Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
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- 239000010935 stainless steel Substances 0.000 claims description 7
- 229910001220 stainless steel Inorganic materials 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 6
- 229910000976 Electrical steel Inorganic materials 0.000 claims description 4
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 3
- 241000973497 Siphonognathus argyrophanes Species 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
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- 239000010959 steel Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/04—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
- F28D1/053—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
- F28D1/0535—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight the conduits having a non-circular cross-section
- F28D1/05366—Assemblies of conduits connected to common headers, e.g. core type radiators
- F28D1/05375—Assemblies of conduits connected to common headers, e.g. core type radiators with particular pattern of flow, e.g. change of flow direction
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D2001/0253—Particular components
- F28D2001/026—Cores
- F28D2001/028—Cores with empty spaces or with additional elements integrated into the cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
- F28D2021/0031—Radiators for recooling a coolant of cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20263—Heat dissipaters releasing heat from coolant
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Human Computer Interaction (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510769643.7A CN105263301B (zh) | 2015-11-12 | 2015-11-12 | 一种液冷散热系统及其液体散热排 |
PCT/CN2017/070823 WO2017088840A1 (zh) | 2015-11-12 | 2017-01-11 | 一种液冷散热系统及其液体散热排 |
JP2018521585A JP2018533846A (ja) | 2015-11-12 | 2017-01-11 | 液冷却放熱システム及びその液体放熱列 |
US15/541,706 US10609841B2 (en) | 2015-11-12 | 2017-01-11 | Liquid cooling radiation system and liquid radiator thereof |
US16/789,892 US20200185306A1 (en) | 2015-11-12 | 2020-02-13 | Liquid cooling system |
US17/602,167 US12158307B2 (en) | 2015-11-12 | 2020-11-23 | Internal circulation water cooling heat dissipation device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510769643.7A CN105263301B (zh) | 2015-11-12 | 2015-11-12 | 一种液冷散热系统及其液体散热排 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN105263301A CN105263301A (zh) | 2016-01-20 |
CN105263301B true CN105263301B (zh) | 2017-12-19 |
Family
ID=55102754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510769643.7A Active CN105263301B (zh) | 2015-11-12 | 2015-11-12 | 一种液冷散热系统及其液体散热排 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10609841B2 (zh) |
JP (1) | JP2018533846A (zh) |
CN (1) | CN105263301B (zh) |
WO (1) | WO2017088840A1 (zh) |
Families Citing this family (57)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104754924B (zh) * | 2015-03-31 | 2016-02-03 | 广东申菱环境系统股份有限公司 | 液冷装置和辅助散热装置结合的服务器散热系统 |
CN105263301B (zh) * | 2015-11-12 | 2017-12-19 | 深圳市研派科技有限公司 | 一种液冷散热系统及其液体散热排 |
US12158307B2 (en) | 2015-11-12 | 2024-12-03 | Shenzhen APALTEK Co., Ltd. | Internal circulation water cooling heat dissipation device |
CN107148194B (zh) * | 2016-03-01 | 2019-12-27 | 双鸿科技股份有限公司 | 水冷散热装置 |
CN106455420B (zh) * | 2016-09-11 | 2018-10-12 | 奇鋐科技股份有限公司 | 水冷排单元及其水冷模组 |
CN106852096B (zh) * | 2017-04-20 | 2023-10-03 | 石家庄盈博智能科技有限公司 | 一种水冷散热装置 |
CN107084376A (zh) * | 2017-06-29 | 2017-08-22 | 湖南明和光电设备有限公司 | 一种液冷风冷组合散热系统 |
TWD191875S (zh) * | 2017-11-10 | 2018-07-21 | 雙鴻科技股份有限公司 | 水冷散熱裝置 |
CN108088301A (zh) * | 2017-12-25 | 2018-05-29 | 江西鑫田车业有限公司 | 一种通用型散热器 |
CN108287602B (zh) * | 2018-01-29 | 2021-04-30 | 温州职业技术学院 | 一种计算机电源散热装置 |
US10694640B2 (en) | 2018-01-30 | 2020-06-23 | Quanta Computer Inc. | Server water cooling modules prevent water leakage device |
CN108323113B (zh) * | 2018-02-12 | 2024-03-29 | 广东昂湃液冷技术有限公司 | 一种双向施压的液冷散热结构 |
JP7031373B2 (ja) * | 2018-03-01 | 2022-03-08 | セイコーエプソン株式会社 | プロジェクター |
CN108681192A (zh) * | 2018-03-13 | 2018-10-19 | 苏州科勒迪电子有限公司 | 可应用于dmd芯片散热的液冷型散热器 |
JP7238401B2 (ja) * | 2018-03-30 | 2023-03-14 | 日本電産株式会社 | 冷却装置 |
JP2019179832A (ja) * | 2018-03-30 | 2019-10-17 | 日本電産株式会社 | 冷却装置 |
US10768677B2 (en) * | 2018-04-13 | 2020-09-08 | Cooler Master Technology Inc. | Heat dissipating device having colored lighting and persistence effect |
CN108566768B (zh) * | 2018-06-01 | 2021-03-23 | 深圳市研派科技有限公司 | 一种无管液冷散热系统 |
CN109164931B (zh) * | 2018-07-26 | 2021-07-27 | 合肥金新允电子技术有限公司 | 一种elo工业触摸显示器的散热装置 |
US10681841B2 (en) * | 2018-08-08 | 2020-06-09 | Evga Corporation | Water-cooling heat dissipation device suitable for computer |
CN108845654B (zh) * | 2018-09-15 | 2023-10-31 | 东莞市领胜泵业科技有限公司 | 一种水冷散热器 |
CN109944806B (zh) * | 2019-04-23 | 2024-08-13 | 迎新科技(中国)有限公司 | 并联双泵导液装置及其液冷散热系统 |
CN109247000B (zh) * | 2018-11-12 | 2024-08-27 | 青岛天乾科技有限公司 | 一种电子产品一体化水冷散热器及其应用的方法 |
WO2020123557A1 (en) * | 2018-12-12 | 2020-06-18 | Edwards George Anthony | Computer component cooling device and method |
CN109491471A (zh) * | 2018-12-28 | 2019-03-19 | 浙江晟昱散热器制造有限公司 | 一种石墨烯涂层散热器 |
CN111623648A (zh) * | 2019-02-28 | 2020-09-04 | 浙江吉利汽车研究院有限公司 | 散热装置、散热系统及汽车 |
CN109817106B (zh) * | 2019-03-19 | 2024-05-14 | 京东方科技集团股份有限公司 | 显示装置 |
CN110337227B (zh) | 2019-08-13 | 2020-10-13 | 深圳市研派科技有限公司 | 液冷散热装置 |
TWI725590B (zh) * | 2019-10-25 | 2021-04-21 | 雙鴻科技股份有限公司 | 水冷頭 |
CN110750149A (zh) * | 2019-11-20 | 2020-02-04 | 北京市鑫全盛科技有限公司 | 双层散热的水冷散热器的水冷头 |
CN111194155B (zh) * | 2019-12-18 | 2021-10-12 | 深圳市迅凌科技有限公司 | 水冷头、水冷散热器以及电子设备 |
CN111121494A (zh) * | 2020-01-17 | 2020-05-08 | 南宁八菱科技股份有限公司 | 一种多功能散热器主片 |
CN111552363B (zh) * | 2020-05-15 | 2024-08-02 | 深圳市万景华科技有限公司 | 液冷散热装置 |
TWI726776B (zh) * | 2020-07-24 | 2021-05-01 | 訊凱國際股份有限公司 | 水冷散熱裝置與水冷系統 |
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JP2018533846A (ja) | 2018-11-15 |
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