CN105246292B - A kind of electronic component radiator of triangular-section - Google Patents

Abstract

The invention provides a kind of electronic-device radiator of triangular-section electricity, the radiator includes matrix and the fin positioned at matrix periphery, the cross section of described matrix is isosceles triangle, the fin includes the first fin and the second fin stretched out from isosceles triangle drift angle, second fin includes the multiple fins extended outwardly and the multiple fins stretched out from the first fin where two waists from isosceles triangle, the second fin extended to same direction is parallel to each other, first fin, the end of second fin extension forms the second isosceles triangle；Face where the base of the isosceles triangle is thermally contacted with the radiator of electronic component.The present invention optimizes the structure of radiator, and heat spreader structures are set according to the heat regularity of distribution, reaches radiating efficiency maximization.

Description

A heat sink for electronic components with a triangular cross-section

technical field

The invention belongs to the field of radiators, in particular to a radiator used for heat dissipation of electronic components, and belongs to the field of F28F.

Background technique

With the rapid development of electronic technology, the running speed of heating electronic components such as the central processing unit is getting faster and faster, and the heat generated during operation also increases accordingly. In order to dissipate the heat to ensure the normal operation of electronic components, it is necessary to For heat dissipation, the quality of the heat dissipation is directly related to the life of the computer and the quality of the calculation. As the main frequency of electronic components is getting higher and higher, the heat generation is also increasing. If the large amount of heat generated by electronic components cannot be dissipated in time, its working performance will be seriously affected. Therefore, preventing overheating and heat dissipation has become a major problem in computer design, and heat sinks have also received significant attention as the main device for cooling electronic components.

At present, the most commonly used radiators for electronic components mainly have two types in principle. One is to use liquid cooling, including water cooling, oil cooling, etc. This method is costly, and the liquid is easy to leak, which poses a safety hazard; in addition, the installation and use are also more complicated. . Another most commonly used method is the air-cooled heat dissipation method. The air-cooled radiator is generally divided into two parts: the heat sink and the fan. The heat sink is in direct contact with the CPU. Take away from the heat. At present, in order to improve the heat dissipation efficiency of the radiator, the usual way is to increase the fan speed, and the other is to increase the heat dissipation area of the radiator. However, the heat sinks currently used have the same thickness on the entire heat dissipation surface of the electronic components, so the heat dissipation capabilities are also the same. But in fact, during the heat dissipation process of electronic components, the central point generally dissipates the most heat, while the peripheral heat dissipation is relatively small. At present, the heat sinks are all the same in thickness, which makes the heat dissipation of the whole heat sink uneven. affect the service life of the radiator.

Contents of the invention

In order to overcome the deficiencies in the prior art, the present invention provides a heat sink for electronic components, which has a simple structure and good heat dissipation effect, is widely used in heat dissipation and cooling of electronic components, and has the characteristics of practicality and reliability.

The present invention is realized through the following technical solutions:

A heat sink for electronic components, the heat sink includes a base and fins located on the periphery of the base, characterized in that the cross-section of the base is an isosceles triangle, and the fins extend outward from the corners of the isosceles triangle The first fin and the second fin, the second fin includes a plurality of fins extending outward from the face where the two waists of the isosceles triangle are located and a plurality of fins extending outward from the first fin , the second fins extending in the same direction are parallel to each other, and the extended ends of the first fins and the second fins form a second isosceles triangle; The heat sink makes thermal contact.

Preferably, the second fin is mirror-symmetrical with respect to the plane where the midline of the first fin is located, the distance between the adjacent second fins is L1, and the length of the base of the isosceles triangle is W, so The length of the waist of the second isosceles triangle is D, and the relationship between the above three satisfies the following formula:

L1/W=A*ln(2*D/W)+B, where ln is a logarithmic function, A and B are coefficients,

0.10<A<0.12,0.08<B<0.10,

6mm<W<8mm,

1.0mm<L1<1.45mm,

4.5mm<D<6.5mm;

0.2<L1/W<0.3,

0.6<D/W<1.0

The apex angle of the isosceles triangle is a, and the 120°<a<160°.

Preferably, the base body and the fins have the same length, L, 0.04<L1/L<0.27, 5mm<L<15mm.

As preferred, A=0.11, B=0.09

Compared with the prior art, the radiator of the present invention has the following advantages:

1) The present invention provides a new radiator. The cross section of the radiator is triangular, so that the heat dissipation area and volume of the radiator are the largest in the middle, and the smallest on both sides, so that the heat dissipation in the middle is the largest, which is in line with the heat dissipation requirements of electronic components. The regular distribution makes the heat dissipation of the radiator uniform on the whole.

2) Avoid excessive local heat distribution of the radiator, resulting in excessive local temperature of the radiator, and ensure the life of the radiator.

3) The present invention obtains an optimal radiator optimization result through multiple tests, and verifies it through tests, thereby proving the accuracy of the result.

4) Heat dissipation fins are arranged outside the radiator, and multiple heat dissipation fins cooperate with each other, and the heat dissipation fins form a triangle, which improves the heat dissipation efficiency of the heat sink.

Description of drawings

Fig. 1 is a front view structural schematic diagram of an embodiment;

Fig. 2 is a front view structural schematic diagram of an embodiment;

FIG. 3 is a schematic diagram viewed from the right side of FIG. 1 .

The reference signs are as follows:

1. Substrate, 2. Radiator, 3. First fin, 4 Second fin, 5 Second fin.

detailed description

The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

In this article, if there is no special explanation, when it comes to formulas, "/" means division, and "×" and "*" mean multiplication.

As shown in Figures 1 and 2, a heat sink for electronic components, the heat sink includes a base 1 and fins 3-5 positioned on the periphery of the base, as shown in Figures 1 and 2, the cross section of the base is isosceles Triangular, the fins include first fins 3 and second fins 4, 5, the first fins 3 extend outward from the corners of the isosceles triangle, and the second fins 4, 5 include A plurality of fins 4 extending outward from the two sides of the isosceles triangle and a plurality of fins 5 extending outward from the first fin, and second fins 4 and 5 extending in the same direction are parallel to each other, For example, as shown in the figure, the second fins 4 and 5 extending outward from the left waist of the isosceles triangle are parallel to each other, and the second fins 4 and 5 extending outward from the right waist of the isosceles triangle are parallel to each other, so The extended ends of the first fin 3 and the second fin 4 and 5 form a second isosceles triangle, as shown in Figure 1, the length of the waist of the second isosceles triangle is D; the second isosceles triangle vertex angle It is b; the surface where the base of the isosceles triangle is in thermal contact with the radiator 2 of the electronic component.

Because it is found through experiments that the electronic components dissipate the most heat in the middle, and the heat dissipation gradually decreases from the middle to the surroundings. Therefore, the cross-section of the radiator is set to be triangular, so that the heat dissipation area and volume of the radiator are the largest in the middle and the smallest on both sides. , so that the heat dissipation capacity of the middle part is the largest, which conforms to the heat distribution law of electronic components, so that the overall heat dissipation of the radiator is uniform, and the local temperature of the radiator is prevented from overheating, so as to avoid the local temperature of the radiator from overheating, resulting in poor heat dissipation effect and shortening the life of electronic components. shorten.

Preferably, the second fins 4 and 5 are mirror-symmetrical to the plane where the midline of the first fin 3 is located, that is, mirror-symmetrical to the plane where the line connecting the midpoint of the apex and the base of the isosceles triangle is located.

Preferably, the second fins extend perpendicular to the two legs of the second isosceles triangle.

When the length of the side of the isosceles triangle is constant, the longer the first fin 3 and the second fin 4, 5, the better the heat exchange effect is in theory. During the test, it was found that when the first fin and the second fin When the second fin reaches a certain length, the heat transfer effect will not increase significantly, mainly because as the length of the first fin and the second fin increases, the temperature at the end of the fin becomes lower and lower. If it is reduced to a certain extent, the heat transfer effect will not be obvious, on the contrary, the cost of materials will be increased and the space occupied by the radiator will be greatly increased. At the same time, during the heat transfer process, if the distance between the second fins is too small , It is also easy to cause the deterioration of the heat exchange effect, because as the length of the radiator increases, the boundary layer becomes thicker, causing the boundary layers between adjacent fins to overlap each other, which deteriorates heat transfer, the length of the radiator is too low or the second fin If the distance between them is too large, the heat exchange area will be reduced, which will affect the heat transfer. An optimal dimensional relationship is satisfied between the base body lengths of the device.

Therefore, the present invention summarizes the best size optimization relationship of the radiator through thousands of test data of radiators of different sizes.

The distance between the adjacent second fins is L1, the length of the base of the isosceles triangle is W, and the length of the waist of the second isosceles triangle is D. The relationship between the above three satisfies the following formula:

L1/W=A*ln(2*D/W)+B, where ln is a logarithmic function, A and B are coefficients,

0.10<A<0.12,0.08<B<0.10,

6mm<W<8mm,

1.0mm<L1<1.45mm,

4.5mm<D<6.5mm;

0.2<L1/W<0.3,

0.6<D/W<1.0

The apex angle of the isosceles triangle is a, and the 120°<a<160°.

Preferably, the base body and the fins have the same length, L, 0.04<L1/L<0.27, 5mm<L<15mm.

As preferred, A=0.11, B=0.09

It should be noted that the distance L1 between adjacent second fins is the distance calculated from the center of the second fins, as shown in FIG. 1 .

After calculating the results, the test is carried out. By calculating the boundary and intermediate values, the obtained results are basically consistent with the formula. The error is basically within 3.2%, the largest relative error is not more than 4.3%, and the average error is 1.63%.

Preferably, the distances between the adjacent second fins are the same.

Preferably, the width of the first fin is larger than the width of the second fin.

Preferably, the width of the first fin is b1, and the width of the second fin is b2, wherein 1.5*b2<b1<2.4*b2;

The widths b1 and b2 here refer to the average width of the fins.

Preferably, the distance between the second fins is changed according to a certain rule, the specific rule is from the bottom angle of the isosceles triangle to the top angle, between the second fins 4 extending from the two waists of the isosceles triangle The distance is getting smaller and smaller, and the distance between the second fins 5 extending from the first fins 3 is getting bigger and bigger from the vertex of the isosceles triangle to the end of the first fins 3 . The main reason is that the second fins set at the waist, the heat dissipation gradually increases from the bottom corner to the top corner, so the number of fins needs to be increased, so the number of fins is increased by reducing the spacing of the fins. Similarly, along the first fin 3 , from the bottom to the end, the amount of heat dissipation becomes less and less, so the number of fins is correspondingly reduced. By setting in this way, the heat dissipation efficiency can be greatly improved, and at the same time, the material can be greatly saved.

As preferably, from the bottom corner of the isosceles triangle to the top corner, the distance between the second fins 4 extending from the two waists of the isosceles triangle decreases gradually, from the top corner of the isosceles triangle to the first fin 4. At the ends of the fins 3, the distance between the second fins 5 extending from the first fin 3 increases more and more. Through experiments, it is found that the heat dissipation effect can be increased by about 15% compared with the same increase or decrease by the above setting. Therefore, it has a good heat dissipation effect.

Preferably, the width b2 between the second fins is changed according to a certain rule, the specific rule is from the base angle to the top angle of the isosceles triangle, and the width of the second fin 4 extending from the two waists of the isosceles triangle The width becomes larger and larger, and the width of the second fin 5 extending from the first fin 3 becomes smaller and smaller from the vertex of the isosceles triangle to the end of the first fin 3 . The main reason is that the heat dissipation of the second fins on the waist gradually increases from the bottom corner to the top corner, so the heat dissipation area needs to be increased, so the heat dissipation area of the fins is increased by increasing the width of the fins. Similarly, along the first fin 3 , from the bottom to the end, the amount of heat dissipation becomes less and less, so the area of the fin is correspondingly reduced. By setting in this way, the heat dissipation efficiency can be greatly improved, and at the same time, the material can be greatly saved.

Preferably, from the base angle of the isosceles triangle to the top angle, the width of the second fin 4 extending from the two waists of the isosceles triangle increases more and more, and from the top angle of the isosceles triangle to the first fin 3 The width of the second fins 5 extending from the first fins 3 decreases gradually. It is found through experiments that the above setting can increase the heat dissipation effect by about 16% compared with the same increase or decrease. Therefore, it has a good heat dissipation effect.

Preferably, although the width or distance of the second fins changes, it is preferred that they still meet the requirements of the above optimum formula.

Although the present invention has been disclosed above with preferred embodiments, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention should be based on the scope defined in the claims.

Claims (2)

1. A heat sink for electronic devices with a triangular cross-section, the heat sink includes a base and fins positioned on the periphery of the base, wherein the cross-section of the base is an isosceles triangle, and the fins include a first fin and the second fins, the first fins extend outward from the vertex of the isosceles triangle, and the second fins include a plurality of fins extending outward from the face where the two waists of the isosceles triangle are located and extending from the A plurality of fins extending outward from the first fins, and second fins extending in the same direction are parallel to each other, and the extending ends of the first fins and the second fins form a second isosceles triangle; the etc. The surface where the base of the waist triangle is in thermal contact with the radiator of the electronic component; The second fin is mirror-symmetrical to the plane where the centerline of the first fin is located, the distance between the centerlines of adjacent second fins is L1, and the length of the base of the isosceles triangle is W , the length of the waist of the second isosceles triangle is D, satisfying the following formula: L1/W=A*ln(2*D/W)+B, where ln is a logarithmic function, A and B are coefficients, 0.10<A<0.12,0.08<B<0.10, 6mm<W<8mm, 1.0mm<L1<1.45mm, 4.5mm<D<6.5mm; 0.2<L1/W<0.3, 0.6<D/W<1.0, The apex angle of an isosceles triangle is a, 120°<a<160°. 2. The electronic device heat sink with triangular cross-section as claimed in claim 1, characterized in that A=0.11, B=0.09.