CN205282464U - An electronic component heat sink assembly of triangular cross-section for use in a vertical position - Google Patents

Abstract

The utility model discloses a radiator assembly for electronic components with a triangular section used in a vertical position. The radiator includes a base body and peripheral fins. fins and second fins, the second fins are a plurality of fins extending outward from the faces where the two waists of the isosceles triangle are located, the plurality of fins extending outward from the first fins, and the second fins extending in the same direction The fins are parallel to each other, and the extended ends of the first and second fins form a second isosceles triangle; the apex angle of the second isosceles triangle is a right angle, and the two radiators are butted together through the waist of the second isosceles triangle, The top corners of the second isosceles triangles of the two radiators are connected at one point, and the bottom corners of the second isosceles triangles of the two radiators are connected at one point, so that the bases of the second isosceles triangles of the two radiators are vertical , to dissipate heat for electronic components with a vertical structure, and save installation space while satisfying heat dissipation efficiency.

Description

An electronic component heat sink assembly of triangular cross-section for use in a vertical position

technical field

The utility model belongs to the field of radiators, in particular to a radiator used in a vertical position.

Background technique

With the rapid development of electronic technology, the running speed of heating electronic components such as the central processing unit is getting faster and faster, and the heat generated during operation also increases accordingly. In order to dissipate the heat to ensure the normal operation of electronic components, it is necessary to For heat dissipation, the quality of the heat dissipation is directly related to the life of the computer and the quality of the calculation. As the main frequency of electronic components is getting higher and higher, the heat generation is also increasing. If a large amount of heat generated by electronic components cannot be dissipated in time, its working performance will be seriously affected. Therefore, preventing overheating and heat dissipation has become a major problem in computer design, and heat sinks have also received significant attention as the main device for cooling electronic components.

At present, the most commonly used radiators for electronic components mainly have two types in principle. One is to use liquid cooling, including water cooling, oil cooling, etc. This method is costly, and the liquid is easy to leak, which poses a safety hazard; in addition, the installation and use are also more complicated. . Another most commonly used method is the air-cooled heat dissipation method. The air-cooled radiator is generally divided into two parts: the heat sink and the fan. The heat sink is in direct contact with the CPU. Take away from the heat. At present, in order to improve the heat dissipation efficiency of the radiator, the usual method is to increase the fan speed, and another method is to increase the heat dissipation area of the radiator. However, the heat sinks currently used have the same thickness on the entire heat dissipation surface of the electronic components, so the heat dissipation capabilities are also the same. But in fact, during the heat dissipation process of electronic components, the central point generally dissipates the most heat, while the peripheral heat dissipation is relatively small. At present, the heat sinks are all the same in thickness, which makes the heat dissipation of the whole heat sink uneven. affect the service life of the radiator. In addition, current heat sinks cannot be applied to heat dissipation in corners.

Utility model content

In order to overcome the deficiencies in the prior art, the utility model provides a radiator. The utility model has simple structure and good heat dissipation effect, and can be installed at a vertical corner position for heat dissipation. It is widely used in heat dissipation and cooling of electronic components, and has practical and reliable specialty.

The utility model is realized through the following technical solutions:

A heat sink assembly for electronic components with a triangular cross-section used in a vertical position, the heat sink assembly includes two heat sinks, the heat sinks include a base body and fins located on the periphery of the base body, the cross-section of the base body is isosceles Triangular, the fins include a first fin and a second fin, the first fin extends outward from the vertex of the isosceles triangle, and the second fin includes two waists from the isosceles triangle The plurality of fins extending outward from the first fin and the plurality of fins extending outward from the first fin, the second fins extending in the same direction are parallel to each other, the extending ends of the first fins and the second fins part forms a second isosceles triangle;

The apex of the second isosceles triangle is a right angle, and the two radiators are connected together through the waist of the second isosceles triangle, wherein the apexes of the second isosceles triangle of the two radiators are connected at one point, and the two radiators are connected at one point. A base angle of the second isosceles triangle of the radiator is connected at one point, so that the bases of the second isosceles triangles of two radiators connected at one point are vertical.

Preferably, the second fin is mirror-symmetrical with respect to the plane where the midline of the first fin is located, the distance between the adjacent second fins is L1, and the length of the base of the isosceles triangle is W, so The length of the waist of the second isosceles triangle is D, and the relationship between the above three satisfies the following formula:

L1/W=A*ln(2*D/W)+B, where ln is a logarithmic function, A and B are coefficients,

0.10<A<0.12,0.08<B<0.10,

6mm<W<8mm,

1.0mm<L1<1.45mm,

4.5mm<D<6.5mm;

0.2<L1/W<0.3,

0.6<D/W<1.0

The apex angle of the isosceles triangle is a, and the 120°<a<160°.

Preferably, the base body and the fins have the same length, L, 0.04<L1/L<0.27, 5mm<L<15mm.

As a preference, A=0.11, B=0.09

Compared with the prior art, the radiator of the present invention has the following advantages:

1) The utility model is equipped with a radiator assembly that can be installed at a vertical corner, which can dissipate heat for electronic components with a vertical structure, and greatly saves the installation space while satisfying the heat dissipation efficiency.

2) The utility model provides a new radiator. The cross-section of the radiator is triangular, so that the heat dissipation area and volume of the radiator are the largest in the middle, and the smallest on both sides, so that the heat dissipation in the middle is the largest, which is in line with the heat dissipation of electronic components. The distribution law of the radiator makes the overall heat dissipation of the radiator even.

3) Avoid excessive local heat distribution of the radiator, resulting in excessive local temperature of the radiator, and ensure the life of the radiator.

4) The utility model obtained an optimal radiator optimization result through multiple tests, and verified it through tests, thus proving the accuracy of the results.

5) Heat dissipation fins are arranged outside the radiator, and multiple heat dissipation fins cooperate with each other to form a triangle shape, which improves the heat dissipation efficiency of the radiator.

Description of drawings

Fig. 1 is the front view structure schematic diagram of an embodiment of radiator;

Fig. 2 is the front view structure schematic diagram of an embodiment of radiator;

Fig. 3 is the schematic diagram that the right side of Fig. 1 is observed;

Fig. 4 is a sectional view of a heat sink provided with holes;

Fig. 5 is the front view of the cooling fin provided with holes;

Fig. 6 is a schematic diagram of the front view of the radiator assembly.

The reference signs are as follows:

1. Substrate, 2. Radiator, 3. First fin, 4 Second fin, 5 Second fin, 6 Hole, 7 Bottom.

Below in conjunction with accompanying drawing, specific embodiment of the present utility model is described in detail.

In this article, if there is no special explanation, when it comes to formulas, "/" means division, and "×" and "*" mean multiplication.

As shown in Figures 1 and 2, a heat sink for electronic components, the heat sink includes a base 1 and fins 3-5 positioned on the periphery of the base, as shown in Figures 1 and 2, the cross section of the base is isosceles Triangular, the fins include first fins 3 and second fins 4, 5, the first fins 3 extend outward from the corners of the isosceles triangle, and the second fins 4, 5 include A plurality of fins 4 extending outward from the two sides of the isosceles triangle and a plurality of fins 5 extending outward from the first fin, and second fins 4 and 5 extending in the same direction are parallel to each other, For example, as shown in the figure, the second fins 4 and 5 extending outward from the left waist of the isosceles triangle are parallel to each other, and the second fins 4 and 5 extending outward from the right waist of the isosceles triangle are parallel to each other, so The extended ends of the first fin 3 and the second fin 4 and 5 form a second isosceles triangle, as shown in Figure 1, the length of the waist of the second isosceles triangle is D; the bottom of the isosceles triangle The side of the edge is in thermal contact with the heat sink 2 of the electronic component.

Because it is found through experiments that the electronic components dissipate the most heat in the middle, and the heat dissipation gradually decreases from the middle to the surroundings. Therefore, the cross-section of the radiator is set to be triangular, so that the heat dissipation area and volume of the radiator are the largest in the middle and the smallest on both sides. , so that the heat dissipation capacity of the middle part is the largest, which conforms to the heat distribution law of electronic components, so that the overall heat dissipation of the radiator is uniform, and the local temperature of the radiator is prevented from overheating, so as to avoid the local temperature of the radiator from overheating, resulting in poor heat dissipation effect and shortening the life of electronic components. shorten.

Preferably, the second fins 4 and 5 are mirror-symmetrical to the plane where the midline of the first fin 3 is located, that is, mirror-symmetrical to the plane where the line connecting the midpoint of the apex and the base of the isosceles triangle is located.

Preferably, the second fins extend perpendicular to the two legs of the second isosceles triangle.

When the length of the side of the isosceles triangle is constant, the longer the first fin 3 and the second fin 4, 5, the better the heat exchange effect is in theory. During the test, it was found that when the first fin and the second fin When the second fin reaches a certain length, the heat transfer effect will not increase significantly, mainly because as the length of the first fin and the second fin increases, the temperature at the end of the fin becomes lower and lower. If it is reduced to a certain extent, the heat transfer effect will not be obvious, on the contrary, the cost of materials will be increased and the space occupied by the radiator will be greatly increased. At the same time, during the heat transfer process, if the distance between the second fins is too small , it is also easy to cause the deterioration of the heat transfer effect, because as the length of the radiator increases, the boundary layer becomes thicker, causing the boundary layers between adjacent fins to overlap each other, which deteriorates heat transfer, and the radiator constant is too low or the second fin If the distance between the sheets is too large, the heat exchange area will be reduced, which will affect the heat transfer. Therefore, the distance between the adjacent second fins, the side length of the isosceles triangle, the length of the first fin and the second fin, and An optimal dimensional relationship is satisfied between the lengths of the heat sink substrates.

Therefore, the utility model is the best size optimization relationship of the radiator summarized through thousands of test data of radiators of different sizes.

The distance between the adjacent second fins is L1, the length of the base of the isosceles triangle is W, and the length of the waist of the second isosceles triangle is D. The relationship between the above three satisfies the following formula:

L1/W=A*ln(2*D/W)+B, where ln is a logarithmic function, A and B are coefficients,

0.10<A<0.12,0.08<B<0.10,

6mm<W<8mm,

1.0mm<L1<1.45mm,

4.5mm<D<6.5mm;

0.2<L1/W<0.3,

0.6<D/W<1.0

The apex angle of the isosceles triangle is a, and the 120°<a<160°.

Preferably, the base body and the fins have the same length, L, 0.04<L1/L<0.27, 5mm<L<15mm.

As a preference, A=0.11, B=0.09

It should be noted that the distance L1 between adjacent secondary fins is the distance calculated from the center of the secondary fins, as shown in FIG. 1 .

After calculating the results, the test is carried out. By calculating the boundary and intermediate values, the obtained results are basically consistent with the formula. The error is basically within 3.2%, the largest relative error is not more than 4.3%, and the average error is 1.63%.

Preferably, the distances between the adjacent second fins are the same.

Preferably, the width of the first fin is larger than the width of the second fin.

Preferably, the width of the first fin is b1, and the width of the second fin is b2, wherein 1.5*b2<b4<2.4*b2;

The widths b1 and b2 here refer to the average width of the fins.

Preferably, the distance between the second fins is changed according to a certain rule, the specific rule is from the bottom angle of the isosceles triangle to the top angle, between the second fins 4 extending from the two waists of the isosceles triangle The distance is getting smaller and smaller, and the distance between the second fins 5 extending from the first fins 3 is getting bigger and bigger from the vertex of the isosceles triangle to the end of the first fins 3 . The main reason is that the second fins set at the waist, the heat dissipation gradually increases from the bottom corner to the top corner, so the number of fins needs to be increased, so the number of fins is increased by reducing the spacing of the fins. Similarly, along the first fin 3 , from the bottom to the end, the amount of heat dissipation becomes less and less, so the number of fins is correspondingly reduced. By setting in this way, the heat dissipation efficiency can be greatly improved, and at the same time, the material can be greatly saved.

As preferably, from the bottom corner of the isosceles triangle to the top corner, the distance between the second fins 4 extending from the two waists of the isosceles triangle decreases gradually, from the top corner of the isosceles triangle to the first fin 4. At the ends of the fins 3, the distance between the second fins 5 extending from the first fin 3 increases more and more. Through experiments, it is found that the heat dissipation effect can be increased by about 15% compared with the same increase or decrease by the above setting. Therefore, it has a good heat dissipation effect.

Preferably, the width b2 between the second fins is changed according to a certain rule, the specific rule is from the base angle to the top angle of the isosceles triangle, and the width of the second fin 4 extending from the two waists of the isosceles triangle The width becomes larger and larger, and the width of the second fin 5 extending from the first fin 3 becomes smaller and smaller from the vertex of the isosceles triangle to the end of the first fin 3 . The main reason is that the heat dissipation of the second fins on the waist gradually increases from the bottom corner to the top corner, so the heat dissipation area needs to be increased, so the heat dissipation area of the fins is increased by increasing the width of the fins. Similarly, along the first fin 3 , from the bottom to the end, the amount of heat dissipation becomes less and less, so the area of the fin is correspondingly reduced. By setting in this way, the heat dissipation efficiency can be greatly improved, and at the same time, the material can be greatly saved.

Preferably, from the base angle of the isosceles triangle to the top angle, the width of the second fin 4 extending from the two waists of the isosceles triangle increases more and more, and from the top angle of the isosceles triangle to the first fin 3 The width of the second fins 5 extending from the first fins 3 decreases gradually. It is found through experiments that the above setting can increase the heat dissipation effect by about 16% compared with the same increase or decrease. Therefore, it has a good heat dissipation effect.

Preferably, although the width or distance of the second fins changes, it is preferred that they still meet the requirements of the above optimum formula.

Preferably, as shown in Fig. 4-5, holes 6 are provided on the first and/or second cooling fins for destroying the bottom layer of laminar flow. The main reason is that the second heat sink mainly exchanges heat through air convection, and the air flows upwards from the bottom of the second heat sink by natural convection. During the upward flow of air, the thickness of the boundary layer continues to increase, and even finally As a result, the boundary layers between adjacent second heat sinks overlap, which will lead to deterioration of heat exchange. Therefore, the boundary layer can be destroyed by setting the hole 6, thereby enhancing heat transfer.

Preferably, the shape of the hole 6 is semicircular or circular.

Preferably, the hole 6 runs through the entire heat sink.

As a preference, on the same second heat sink, from the root of the heat sink (that is, the connection portion with the base 1 ) to the top of the heat sink, the area of each hole 6 is continuously reduced. The main reason is that from the root of the heat sink to the top of the heat sink, the temperature of the heat sink continues to drop, so the thickness of the boundary layer is constantly reduced. By setting the area of the changed hole 6, the thickness of different positions that destroy the boundary layer can be realized, thereby Save material.

Preferably, the change of the area of the hole 6 is directly proportional to the absolute temperature on the heat sink.

As a preference, on the same second heat sink, the density of the holes 6 decreases continuously from the root of the heat sink (ie, the connection portion with the base 1 ) to the top of the heat sink. The main reason is that from the root of the heat sink to the top of the heat sink, the temperature of the heat sink continues to drop, so the thickness of the boundary layer is continuously reduced. By setting the density of the changed holes 6, the thickness of different positions that destroy the boundary layer can be realized, thereby Save material.

Preferably, the change of the density of the holes 6 is directly proportional to the absolute temperature on the heat sink.

Of course, most preferably, it may also be a combination of at least two of the above multiple forms.

As a preference, the utility model provides a radiator group composed of the above two radiators, as shown in FIG. 6 .

The radiator group shown in FIG. 6 includes two radiators as described above, and the apex angle of the second isosceles triangle of the radiator is a right angle, so its base angle must be 45°. The two radiators are butted together through the waists of the second isosceles triangles, as shown in Figure 6, wherein the vertices of the second isosceles triangles of the two radiators are connected at one point, and the second isosceles triangles of the two radiators are connected at one point. One base angle of the triangle is connected at one point, so that the base angles of the second isosceles triangle of the two radiators connected at one point combine to form a right angle. That is, the angle formed by the two bases 7 is 90°.

Because the bottom edge 7 is a plane, and because the bottom corners are combined into a right angle, it can be installed at a vertical corner to ensure that it is close to the heating element during installation, thereby saving installation space.

Because the first and second fins are placed outside instead of close to the heating element, the external air can be fully convected, and the closed space formed between the first fin and the arc forms a chimney effect of airflow suction , enhanced heat transfer.

Although the utility model has been disclosed above with preferred embodiments, the utility model is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present utility model, so the protection scope of the present utility model should be based on the scope defined in the claims.

Claims (4)

1. the electronic component radiator assembly of the triangular-section used in upright position, described heat sink assembly includes two radiators, described radiator includes matrix and is positioned at the fin that matrix is peripheral, the cross section of described matrix is isosceles triangle, described fin includes the first fin and the second fin, described first fin is to stretch out from isosceles triangle drift angle, described second fin includes the multiple fins facing out extension from the two of isosceles triangle waist places and from the first outward extending multiple fins of fin, the second fin extended to same direction is parallel to each other, described first fin, the end that second fin extends forms the second isosceles triangle,

It is characterized in that, the drift angle of described second isosceles triangle is right angle, said two radiator is docking together by the waist of the second isosceles triangle, second isosceles triangle drift angle of two of which radiator is connected to a bit, one base angle of the second isosceles triangle of two radiators is connected to a bit, so that be connected to the base vertical of the second isosceles triangle of two radiators of a bit;

Providing holes on the first and/or second fin, the through whole fin in hole.

2. the electronic component radiator assembly of triangular-section as claimed in claim 1, it is characterized in that, described second fin is relative to the face specular at the first fin center line place, the distance of described the second adjacent fin is L1, the base length of described isosceles triangle is W, the length of the waist of described second isosceles triangle is D, and the relation of above-mentioned three meets equation below:

L1/W=A*ln (2*D/W)+B, wherein ln is logarithmic function, and A, B are coefficient,

0.10 < A < 0.12,0.08 < B < 0.10,

6mm<W<8mm,

1.0mm<L1<1.45mm,

4.5mm<D<6.5mm;

0.2<L1/W<0.3,

0.6<D/W<1.0

The drift angle of isosceles triangle is a, 120 �� < a < 160 ��.

3. the electronic component radiator assembly of triangular-section as claimed in claim 2, it is characterised in that matrix is identical with the length of fin, for L, 0.04 < L1/L < 0.27,5mm < L < 15mm.

4. the electronic component radiator assembly of triangular-section as claimed in claim 3, it is characterised in that A=0.11, B=0.09.