CN105156926A - Semiconductor lighting device - Google Patents
Semiconductor lighting device Download PDFInfo
- Publication number
- CN105156926A CN105156926A CN201510617312.1A CN201510617312A CN105156926A CN 105156926 A CN105156926 A CN 105156926A CN 201510617312 A CN201510617312 A CN 201510617312A CN 105156926 A CN105156926 A CN 105156926A
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- China
- Prior art keywords
- light source
- heat dissipation
- semiconductor light
- accommodating cavity
- power supply
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 55
- 230000017525 heat dissipation Effects 0.000 claims abstract description 36
- 238000001816 cooling Methods 0.000 claims 1
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 230000004308 accommodation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S2/00—Systems of lighting devices, not provided for in main groups F21S4/00 - F21S10/00 or F21S19/00, e.g. of modular construction
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
- F21V23/023—Power supplies in a casing
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
技术领域technical field
本发明涉及一种照明装置，尤其涉及一种半导体照明装置。The invention relates to a lighting device, in particular to a semiconductor lighting device.
背景技术Background technique
半导体照明是一种新型的照明设备，具有发光效率高、寿命长、启动速度快、安全、节能环保、抗震抗压、易控制等特点。半导体照明装置在工作中，半导体光源会产生大量的热量，如不及时排走热量，将会对半导体光源的使用寿命造成影响，这也是影响半导体照明装置使用寿命的主要因素。Semiconductor lighting is a new type of lighting equipment, which has the characteristics of high luminous efficiency, long life, fast start-up speed, safety, energy saving and environmental protection, shock resistance and pressure resistance, and easy control. During the operation of the semiconductor lighting device, the semiconductor light source will generate a large amount of heat. If the heat is not discharged in time, the service life of the semiconductor light source will be affected, which is also the main factor affecting the service life of the semiconductor lighting device.
为了解决这一问题，大多数半导体照明装置都装有散热器，在一定程度上解决了散热问题，但是，在现有半导体照明装置结构中，半导体光源容置腔与驱动电源容置腔通常直接连接，由于半导体光源产生的热量易与驱动电源产生的热量容易发生热耦合，且不容易散发，使得半导体照明装置内部长时间保持较高温度，损害半导体光源的寿命。In order to solve this problem, most semiconductor lighting devices are equipped with radiators, which solves the problem of heat dissipation to a certain extent. Connection, because the heat generated by the semiconductor light source is easy to thermally couple with the heat generated by the driving power supply, and it is not easy to dissipate, so that the inside of the semiconductor lighting device maintains a high temperature for a long time, which damages the life of the semiconductor light source.
发明内容Contents of the invention
鉴于上述存在的问题，本发明的目的在于克服现有技术的不足，提供一种工艺简单、散热效果好的半导体照明装置。In view of the above problems, the purpose of the present invention is to overcome the shortcomings of the prior art and provide a semiconductor lighting device with simple process and good heat dissipation effect.
本发明提供的技术方案是：一种半导体照明装置，包括半导体光源容置腔和电源容置腔，半导体光源容置腔内设置半导体光源，半导体光源容置腔设置散热部，散热部由多组散热鳍片组成，半导体电源容置腔内安装驱动电源，半导体光源容置腔的第一侧面为出光面，第一侧面的背面为第二侧面，第一侧面与第二侧面拥有共同的侧端面，第一侧面与第二侧面通过上侧面和下侧面相连，第二侧面、上侧面以及下侧面的形状和边界由散热鳍片的外轮廓决定，所述电源容置腔与所述光源容置腔的第二侧面通过连接结构连接。The technical solution provided by the present invention is: a semiconductor lighting device, comprising a semiconductor light source accommodating cavity and a power supply accommodating cavity, a semiconductor light source is arranged in the semiconductor light source accommodating cavity, a heat dissipation part is arranged in the semiconductor light source accommodating cavity, and the heat dissipating part is composed of multiple groups Composed of heat dissipation fins, the drive power is installed in the semiconductor power supply cavity, the first side of the semiconductor light source cavity is the light-emitting surface, the back of the first side is the second side, and the first side and the second side have a common side end surface , the first side is connected to the second side through the upper side and the lower side, the shape and boundary of the second side, the upper side and the lower side are determined by the outer contour of the heat dissipation fins, and the power supply accommodating cavity and the light source are accommodated The second side of the cavity is connected by a connecting structure.
作为本发明的进一步改进，所述散热部的散热鳍片在上侧面形成阶梯状结构，这种结构能进一步提高散热效率。As a further improvement of the present invention, the heat dissipation fins of the heat dissipation part form a stepped structure on the upper side, and this structure can further improve heat dissipation efficiency.
作为本发明的进一步改进，所述散热部的散热鳍片在下侧面形成阶梯状结构，这种结构能进一步提高散热效率。As a further improvement of the present invention, the heat dissipation fins of the heat dissipation part form a stepped structure on the lower side, and this structure can further improve heat dissipation efficiency.
作为本发明的进一步改进，所述散热部的散热鳍片在上侧面和下侧面均形成阶梯状结构，这种结构能进一步提高散热效率。As a further improvement of the present invention, the heat dissipation fins of the heat dissipation part form a stepped structure on both the upper side and the lower side, and this structure can further improve the heat dissipation efficiency.
作为本发明的进一步改进，所述半导体光源容置腔与电源容置腔之间形成供空气流动的通道，这种结构能进一步提高散热效率。As a further improvement of the present invention, a channel for air flow is formed between the semiconductor light source accommodating cavity and the power supply accommodating cavity, and this structure can further improve heat dissipation efficiency.
与现有技术相比，采用此种技术方案的半导体照明装置，能够快速的将半导体光源产生的热量传递至散热部，进而提高散热效率，且能够避免半导体光源产生的热量与驱动电源产生的热量发生热耦合，大大提高了半导体照明装置的寿命。Compared with the prior art, the semiconductor lighting device using this technical solution can quickly transfer the heat generated by the semiconductor light source to the heat dissipation part, thereby improving the heat dissipation efficiency, and can avoid the heat generated by the semiconductor light source and the heat generated by the driving power supply. Thermal coupling occurs, greatly improving the life of the semiconductor lighting device.
附图说明Description of drawings
图1为具体实施例的整体结构示意图；Fig. 1 is the overall structure schematic diagram of specific embodiment;
图2为具体实施例的发光面的示意图；Fig. 2 is a schematic diagram of a light-emitting surface of a specific embodiment;
图3为具体实施例光源容置腔的立体结构示意图；Fig. 3 is a schematic diagram of a three-dimensional structure of a light source containing cavity of a specific embodiment;
图4为具体实施例光源容置腔的侧视图。Fig. 4 is a side view of the light source accommodating cavity of the specific embodiment.
图1～图4中，有关附图标记为：In Fig. 1～Fig. 4, relevant reference signs are:
1、半导体光源容置腔；2、电源容置腔；3、半导体光源；4、散热鳍片；5、阶梯状结构；6、上侧面；7、第二侧面；8、下侧面；9、第一侧面；10侧端面。1. Semiconductor light source accommodation chamber; 2. Power supply accommodation chamber; 3. Semiconductor light source; 4. Heat dissipation fins; 5. Ladder-like structure; 6. Upper side; 7. Second side; 8. Lower side; 9. first side; 10 side end face.
具体实施方式Detailed ways
为了使本领域的技术人员更好地理解本发明的技术方案，下面结合附图和具体实施例对本发明作进一步的详细说明。In order to enable those skilled in the art to better understand the technical solutions of the present invention, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
如图1至图4所示的半导体照明装置，包括半导体光源容置腔1和电源容置腔2，半导体光源容置腔1内设置半导体光源3，半导体光源容置腔1设置散热部，散热部由多组散热鳍片4组成，电源容置腔2内安装驱动电源，半导体光源容置腔1的第一侧面9为出光面，第一侧面9的背面为第二侧面7，第一侧面9与第二侧面7拥有共同的侧端面10，第一侧面9与第二侧面7通过上侧面6和下侧面8相连，第二侧面7、上侧面6以及下侧面8的形状和边界由散热鳍片4的外轮廓决定，所述电源容置腔2与所述半导体光源容置腔1的第二侧面7通过连接结构连接。The semiconductor lighting device shown in Figures 1 to 4 includes a semiconductor light source accommodating chamber 1 and a power supply accommodating chamber 2, a semiconductor light source 3 is arranged in the semiconductor light source accommodating chamber 1, and a heat dissipation part is arranged in the semiconductor light source accommodating chamber 1 to dissipate heat. The first side 9 of the semiconductor light source housing cavity 1 is the light-emitting surface, the back of the first side 9 is the second side 7, and the first side 9 and the second side 7 have a common side end surface 10, the first side 9 and the second side 7 are connected by the upper side 6 and the lower side 8, the shape and boundary of the second side 7, the upper side 6 and the lower side 8 are determined by heat dissipation The outer contour of the fin 4 determines that the power supply accommodating cavity 2 is connected to the second side 7 of the semiconductor light source accommodating cavity 1 through a connection structure.
如图4所示，散热部的散热鳍片4在上侧面6形成阶梯状结构5。As shown in FIG. 4 , the heat dissipation fins 4 of the heat dissipation part form a stepped structure 5 on the upper side 6 .
以上仅是本发明的优选实施方式，应当指出的是，上述优选实施方式不应视为对本发明的限制，本发明的保护范围应当以权利要求所限定的范围为准。对于本技术领域的普通技术人员来说，在不脱离本发明的精神和范围内，还可以做出若干改进和润饰，这些改进和润饰也应视为本发明的保护范围。The above are only preferred implementations of the present invention, and it should be noted that the above preferred implementations should not be regarded as limiting the present invention, and the scope of protection of the present invention should be based on the scope defined in the claims. For those skilled in the art, without departing from the spirit and scope of the present invention, some improvements and modifications can also be made, and these improvements and modifications should also be regarded as the protection scope of the present invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510617312.1A CN105156926A (en) | 2015-09-24 | 2015-09-24 | Semiconductor lighting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510617312.1A CN105156926A (en) | 2015-09-24 | 2015-09-24 | Semiconductor lighting device |
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| Publication Number | Publication Date |
|---|---|
| CN105156926A true CN105156926A (en) | 2015-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510617312.1A Pending CN105156926A (en) | 2015-09-24 | 2015-09-24 | Semiconductor lighting device |
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| Country | Link |
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| CN (1) | CN105156926A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10539314B2 (en) | 2011-09-12 | 2020-01-21 | RAB Lighting Inc. | Light fixture with airflow passage separating driver and emitter |
Citations (7)
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| CN201599769U (en) * | 2009-12-09 | 2010-10-06 | 苏州中泽光电科技有限公司 | LED street lamp with over-current heat-dissipating function |
| CN203231278U (en) * | 2013-05-16 | 2013-10-09 | 深圳市博为光电有限公司 | Heat-dissipating light emitting diode (LED) lamp |
| CN203585944U (en) * | 2013-10-30 | 2014-05-07 | 东莞勤上光电股份有限公司 | A MR16-LED Spotlight with High Heat Dissipation Performance |
| CN203771214U (en) * | 2014-04-11 | 2014-08-13 | 唐粤湘 | A floodlight structure combining heat dissipation columns and heat dissipation holes |
| CN203771146U (en) * | 2014-04-04 | 2014-08-13 | 烟台奥星电器设备有限公司 | LED mining lamp |
| CN204026359U (en) * | 2014-08-06 | 2014-12-17 | 江苏奥雷光电有限公司 | A kind of LED light supplement lamp |
| CN205014113U (en) * | 2015-09-24 | 2016-02-03 | 家联宝（上海）光电新能源科技有限公司 | Semiconductor lighting device |
-
2015
- 2015-09-24 CN CN201510617312.1A patent/CN105156926A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201599769U (en) * | 2009-12-09 | 2010-10-06 | 苏州中泽光电科技有限公司 | LED street lamp with over-current heat-dissipating function |
| CN203231278U (en) * | 2013-05-16 | 2013-10-09 | 深圳市博为光电有限公司 | Heat-dissipating light emitting diode (LED) lamp |
| CN203585944U (en) * | 2013-10-30 | 2014-05-07 | 东莞勤上光电股份有限公司 | A MR16-LED Spotlight with High Heat Dissipation Performance |
| CN203771146U (en) * | 2014-04-04 | 2014-08-13 | 烟台奥星电器设备有限公司 | LED mining lamp |
| CN203771214U (en) * | 2014-04-11 | 2014-08-13 | 唐粤湘 | A floodlight structure combining heat dissipation columns and heat dissipation holes |
| CN204026359U (en) * | 2014-08-06 | 2014-12-17 | 江苏奥雷光电有限公司 | A kind of LED light supplement lamp |
| CN205014113U (en) * | 2015-09-24 | 2016-02-03 | 家联宝（上海）光电新能源科技有限公司 | Semiconductor lighting device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10539314B2 (en) | 2011-09-12 | 2020-01-21 | RAB Lighting Inc. | Light fixture with airflow passage separating driver and emitter |
| US11181261B2 (en) | 2011-09-12 | 2021-11-23 | RAB Lighting Inc. | Light fixture with airflow passage separating driver and emitter |
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Application publication date: 20151216 |
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