CN105140255B - A kind of flip camera case chip and preparation method thereof - Google Patents
A kind of flip camera case chip and preparation method thereof Download PDFInfo
- Publication number
- CN105140255B CN105140255B CN201510619131.2A CN201510619131A CN105140255B CN 105140255 B CN105140255 B CN 105140255B CN 201510619131 A CN201510619131 A CN 201510619131A CN 105140255 B CN105140255 B CN 105140255B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 101
- 239000000463 material Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 5
- 238000007711 solidification Methods 0.000 claims description 5
- 230000008023 solidification Effects 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000007812 deficiency Effects 0.000 abstract description 4
- 238000012536 packaging technology Methods 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 23
- 239000010410 layer Substances 0.000 description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 229910052802 copper Inorganic materials 0.000 description 12
- 239000010949 copper Substances 0.000 description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 7
- 229910052737 gold Inorganic materials 0.000 description 7
- 239000010931 gold Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 238000010147 laser engraving Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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Abstract
A kind of flip camera case chip and preparation method thereof, it is related to camera case chip and preparation method technical field.Solve existing camera chip encapsulating structure and have that production difficulty is big, the high technical deficiency of cost, include：First substrate, second substrate, camera nude film and infrared fileter；The first substrate is double-sided PCB, and positive first pad is provided with the first conductive projection, and first substrate is provided with the chip hole to be matched with the camera nude film shape；The camera nude film is flip-chip structure, and photosensitive area periphery is provided with the 4th pad, and the 4th pad is provided with the 4th conductive projection；The second substrate is circuit board, and the second conductive projection is at least provided with its pad of reverse side second.Encapsulated using circuit board and glue-line, connected between circuit board and circuit board, between circuit board and camera nude film using conductive projection, packaging technology is simple, low manufacture cost, and production efficiency is high.
Description
Technical field
The present invention relates to camera case chip and preparation method technical field.
Background technology
Camera chip（camera sensor）It is a kind of now widely used chip.Camera nude film（bare
die）Common packaged type have CSP（Chip Scale Package refer to chip size packages, its package dimension and chip
Kernel size is essentially identical）、TSV（Represent silicon perforation Through Si via）, Neopac etc..Existing common packaged type is common
Have that production difficulty is big, the high technical deficiency of cost.
The content of the invention
In summary, it is an object of the invention to solve existing camera chip encapsulating structure, production difficulty to be present big, into
This high technical deficiency, and propose flip camera case chip and preparation method thereof.
To solve technical deficiency proposed by the invention, the technical scheme used for：Flip camera case chip, its feature exist
Include in the structure：First substrate, second substrate, camera nude film and infrared fileter；
The first substrate is double-sided PCB, and its tow sides is respectively equipped with the first pad, on positive first pad
Provided with the first conductive projection, first substrate is provided with the chip hole to be matched with the camera nude film shape；
The camera nude film is flip-chip structure, is embedded in the chip hole of the first substrate, and its positive Middle face is
Photosensitive area, photosensitive area periphery are provided with the 4th pad, and the 4th pad is provided with the 4th conductive projection；
The second substrate is circuit board, is at least provided with its reverse side corresponding with positive first pad of the first substrate
Second pad, the second pad are provided with the second conductive projection, and second substrate is provided with corresponding with the camera nude film photosensitive area
Form, second substrate reverse side is additionally provided with the 3rd pad corresponding with the 4th pad on the camera nude film, the 3rd pad
It is provided with the 3rd conductive projection；Nian Jie by the fitting of the second glue-line between second substrate reverse side and first substrate front, second is conductive
Projection electrically connects with the first conductive projection, and the 3rd conductive projection electrically connects with the 4th conductive projection；
Described infrared filtering chip size is more than the window dimension, infrared fileter located at second substrate it is positive with it is described
Form correspondence position, second substrate front are Nian Jie by the fitting of the first glue-line between infrared fileter.
The 3rd glue-line is provided with first substrate and camera nude film reverse side, and the 3rd glue-line is provided with and first substrate reverse side the
Pad hole corresponding to one pad.
Described the first conductive projection, the second conductive projection, the 3rd conductive projection and the 4th conductive projection is by copper facing bottom
Layer, plating Ni interlayer and tin plating outer layer composition, are either made up of or by plating plating copper substrate, plating Ni interlayer and gold-plated outer layer
Copper substrate and gold-plated outer layer composition, or be made up of plating copper substrate and tin plating outer layer.
Described the first conductive projection, the second conductive projection, the 3rd conductive projection and the 4th conductive projection is each to be placed in
Gold goal in respective pad, or plating layer gold.
Its preparation method of described flip camera case chip, it is characterised in that methods described comprises the following steps：
1）, on the 4th pad of camera nude film make the 4th conductive projection；First substrate and second substrate are made, the
One substrate and second substrate form chip hole and form respectively, and are made respectively on first substrate and second substrate and form institute
Need circuit；The first conductive projection, second substrate reverse side and described first are made on the first pad on first substrate front-side circuit
Corresponding to the pad of substrate front side first the second conductive projection is made on second pad；Second substrate reverse side and the camera nude film
The 4th pad corresponding to the 3rd conductive projection is made on the 3rd pad；
2）, second substrate front rubberizing material, the first three-back-shaped glue-line is formed after exposed development；Second substrate reverse side pastes
Glue material, the second glue-line for including through hole corresponding with the form, the second pad and the 3rd pad is formed after exposed development；
3）, from supporting joint tool, joint tool is fitted on pallet, the base as successive process；
4）, infrared fileter is positioned in joint tool, second substrate is then bonded on infrared fileter, second
First substrate and camera nude film are bonded on substrate；
5）, carry out full plate pressing, while pressure, by being heated to the first conductive projection, the second conductive projection, the 3rd
Conductive projection and the 4th conductive projection fusing point so that fused together between each corresponding conductive projection, formation electrically conducts；
6）, the solidification of full plate, pass through baking or UV irradiations so that the first glue-line and the second glue-line, which fully solidify, reaches stable
State.
Also include step 7）, in first substrate and camera nude film reverse side rubberizing material, afterwards exposed development and solidification
The 3rd glue-line is formed afterwards；
Described joint tool is provided with more than two positioning holes, flip camera case chip described in batch making, most
After carry out cutting and form the independent single flip camera case chip.
Described joint tool is provided with identification anchor point.
Cutting, which is carried out, with laser, cutter or punch press forms the independent single flip camera case chip.
Described makes the first glue-line, the second glue-line or the 3rd glue-line by the way of membranaceous glue exposure imaging.
Beneficial effects of the present invention are：The present invention is encapsulated using circuit board and glue-line, between circuit board and circuit board, circuit
Connected between plate and camera nude film using conductive projection, packaging technology is simple, low manufacture cost, and production efficiency is high.
The preparation method of the present invention is encapsulated relative to tradition based on COB（Chip on Board, exactly by bare chip with leading
Electricity or non-conductive adhesive are adhered on interconnection substrates, are then carried out wire bonding and are realized its electrical connection）, due to eliminating routing
（Wire bond）Link, greatly promoted in efficiency.In addition, the inventive method carries out batch encapsulation using mode in flakes, imitating
Rate can be lifted further；The substrate of use is similar with the production method of general wiring board, can effectively reduce equipment cost with
Material cost.
Brief description of the drawings
Fig. 1 is the dimensional structure diagram of the present invention；
Fig. 2 is the cross section structure schematic diagram of the present invention；
Fig. 3 is the decomposition texture schematic diagram one of the present invention；
Fig. 4 is the decomposition texture schematic diagram two of the present invention；
Fig. 5 is the structural representation when present invention uses batch making.
Embodiment
The structure of the present invention is further described below in conjunction with accompanying drawing and currently preferred specific embodiment.
Shown in Fig. 4, the present invention includes：First substrate 1, second substrate 2, camera nude film 3 and infrared
Optical filter 4.
The first substrate 1 is double-sided PCB, and the circuit of tow sides is turned on by plated through-hole, its tow sides point
Not She You the first pad 11, positive first pad 11 is provided with the first conductive projection 12, and first substrate 1 is provided with and taken the photograph with described
The chip hole 13 to be matched as head nude film shape.
The camera nude film 3 is flip-chip structure, is embedded in the chip hole 13 of the first substrate 1, in its front
Portion is photosensitive area 31, and photosensitive area 31 is used to sense the light in the external world and change into electronic signal to be handled；The periphery of photosensitive area 31
Provided with the 4th pad 32, the 4th pad 32 is provided with the 4th conductive projection 33.
For the second substrate 2 to be also circuit board, second substrate 2 can be double with the identical of first substrate 1 as needed
Face circuit board or single sided board, circuit only is provided with reverse side, its reverse side circuit is provided with and the front of first substrate 1
Second pad 21 corresponding to first pad 11, the second pad 21 are provided with the second conductive projection 22, and second substrate 2 is provided with and institute
Form 23 corresponding to camera nude film photosensitive area 31 is stated, form 23 is so that light is by reaching on camera nude film photosensitive area 31；
The reverse side of second substrate 2 is additionally provided with and 32 corresponding 3rd pad 24 of the 4th pad on the camera nude film 3, the 3rd pad 24
It is provided with the 3rd conductive projection 25；It is Nian Jie by the second fitting of glue-line 5 between the reverse side of second substrate 2 and the front of first substrate 1, second
Glue-line 5 is provided with and 24 corresponding through hole of form 23, the second pad 21 and the 3rd pad；Second conductive projection 22 and the first conductive stud
Block 12 electrically connects, and the 3rd conductive projection 25 electrically connects with the 4th conductive projection 33.
The described size of infrared fileter 4 is more than the size of form 23, and infrared fileter 4 is located at the front of second substrate 2
With the correspondence position of form 23, the front of second substrate 2 is bonded viscous with the first glue-line 6 between infrared fileter 4 by Back Word type
Connect.
In order to strengthen the package strength of camera nude film 3, the 3rd glue-line is provided with first substrate 1 and the reverse side of camera nude film 3
7, the 3rd glue-line 7 is provided with and 1 the first pad of reverse side of first substrate, 11 corresponding pad hole 71.
Described the first conductive projection 12, the second conductive projection 22, the 3rd conductive projection 25 and the 4th conductive projection 33 are equal
It is made up of plating copper substrate, plating Ni interlayer and tin plating outer layer, or is made up of plating copper substrate, plating Ni interlayer and gold-plated outer layer,
Either it is made up of plating copper substrate and gold-plated outer layer or is made up of plating copper substrate and tin plating outer layer；It is or each corresponding to be placed in
Gold goal on pad, or plating layer gold；In bonding processes of the present invention, fusing point is reached by each conductive projection of high temperature, from
And each corresponding conductive projection is fused together, form more stable electric conductivity.
Making the preparation method of above-mentioned flip camera case chip includes having the following steps：
1）, preliminary preparation includes：The 4th conductive projection 33 is made on the 4th pad 32 of camera nude film 3；
Specifically projection or gold goal can be either generated by way of plating on the 4th pad 32 being worth ball.Make the He of first substrate 1
Second substrate 2, it is included in first substrate 1 and second substrate 2 and forms chip hole 13 and form 23 respectively, and in first substrate 1
The required circuit for including pad is formed with being made respectively on second substrate 2；Required circuit uses traditional circuit-board manufacturing process
The technique of the middle plating used, etching or laser engraving makes；The first pad 11 on the front-side circuit of first substrate 1 afterwards
The first conductive projection 12 of upper making, the reverse side of second substrate 2 and 11 corresponding second pad of positive first pad of first substrate 2
The second conductive projection 22 is made on 21；The reverse side of second substrate 2 welds with the 4th pad 32 the corresponding 3rd of the camera nude film 3
The 3rd conductive projection 25 is made on disk 24.Each conductive projection 12,22,25,33 can be by electroplating, etching or laser engraving
Technique makes；Such as：Copper substrate is first plated, then plates Ni interlayer, finally tin plating outer layer again；Or copper substrate is first plated, then in nickel plating
Interbed, finally gold-plated outer layer again；Or copper substrate is first plated, then gold-plated outer layer；Or copper substrate is first plated, then tin plating outer layer；Or
Gold goal, or plating layer gold are directly disposed in each respective pad.
2）, the positive rubberizing material of second substrate 2, the first three-back-shaped glue-line 6 is formed after exposed development；Second substrate 2 is anti-
Face rubberizing material, formed and included and 24 corresponding through hole of the form, 23 second pads 21 and the 3rd pad after exposed development
Second glue-line 5；First glue-line 6 and the second glue-line 5 make acquisition by the way of membranaceous glue exposure imaging.
3）, from supporting joint tool 8, joint tool 8 is fitted on pallet 9, as the base of successive process, played
Positioning and the effect of support；For the ease of batch making flip camera case chip, it is more than two fixed that joint tool 8 is provided with
Position hole 81, each positioning hole 81 carry out positioning support, positioning hole 81 and infrared fileter 4 to a flip camera case chip
It coincide.8 four jiaos of joint tool is provided with identification anchor point 82, manually or with board to place second substrate 2, first substrate
1 and position and direction are determined during camera nude film 3；It can be any desired profile and pattern to recognize anchor point 82.In Fig. 5
Shown, joint tool 8 is provided with four positioning holes 81, namely is covered in a joint tool 8 can subsequently make shape four simultaneously
The four of brilliant camera case chip composition are in flakes.
4）, infrared fileter 4 is positioned in joint tool 8, be specifically placed in positioning hole 81, then in infrared filtering
Second substrate 2 is bonded on piece, is bonded first substrate 1 and camera nude film 3 on second substrate 2；First substrate 1 and camera are naked
The placement order of piece 3 can exchange.
5）, carry out full plate pressing, if namely just while first substrate 1 and the reverse side of camera nude film 3 apply pressure,
By being heated to the first conductive projection 12, the second conductive projection 22, the 3rd conductive projection 25 and the fusing point of the 4th conductive projection 33,
So that being fused together between each corresponding conductive projection, formation electrically conducts.
6）, the solidification of full plate, pass through baking or UV irradiations so that the first glue-line and the second glue-line, which fully solidify, reaches stable
State.
7）, as needed, can be in first substrate 1 and the reverse side rubberizing material of camera nude film 3, exposed development afterwards and solid
The 3rd glue-line 7 is formed after change；The one side of 3rd glue-line 7 plays a part of fixing camera nude film 3, on the other hand plays solder mask
Effect.
8）, when batch making of the present invention, with laser, cutter or punch press carry out cutting form the independent single flip
Camera case chip；Namely the joint tool 8 shown in Fig. 5 makes four formed and four flips can be divided into image in flakes
Head case chip.
Claims (6)
1. a kind of its preparation method of flip camera case chip, it is characterised in that methods described comprises the following steps：
1）, on the 4th pad of camera nude film make the 4th conductive projection；Make first substrate and second substrate, the first base
Plate and second substrate form chip hole and form respectively, and make electricity needed for formation respectively on first substrate and second substrate
Road；The first conductive projection, second substrate reverse side and the first substrate are made on the first pad on first substrate front-side circuit
Corresponding to positive first pad the second conductive projection is made on the second pad；The of second substrate reverse side and the camera nude film
The 3rd conductive projection is made corresponding to four pads on 3rd pad；
2）, second substrate front rubberizing material, the first three-back-shaped glue-line is formed after exposed development；Second substrate reverse side rubberizing
Material, the second glue-line for including through hole corresponding with the form, the second pad and the 3rd pad is formed after exposed development；
3）, from supporting joint tool, joint tool is fitted on pallet, the base as successive process；
4）, infrared fileter is positioned in joint tool, second substrate is then bonded on infrared fileter, in second substrate
Upper fitting first substrate and camera nude film；
5）, carry out full plate pressing, while pressure, by being heated to the first conductive projection, the second conductive projection, the 3rd conductive
Projection and the 4th conductive projection fusing point so that fused together between each corresponding conductive projection, formation electrically conducts；
6）, the solidification of full plate, pass through baking or UV irradiations so that the first glue-line and the second glue-line, which fully solidify, reaches stable shape
State.
2. its preparation method of flip camera case chip according to claim 1, it is characterised in that：Also include step
7）, in first substrate and camera nude film reverse side rubberizing material, form the 3rd glue-line after exposed development and solidification afterwards.
3. its preparation method of flip camera case chip according to claim 1 or 2, it is characterised in that：Described patch
Close tool and be provided with more than two positioning holes, flip camera case chip described in batch making, finally carry out cutting and formed solely
Found the single flip camera case chip.
4. its preparation method of flip camera case chip according to claim 1, it is characterised in that：Described fitting is controlled
Tool is provided with identification anchor point.
5. its preparation method of flip camera case chip according to claim 3, it is characterised in that：With laser, cutter
Or punch press carries out cutting and forms the independent single flip camera case chip.
6. its preparation method of flip camera case chip according to claim 1 or 2, it is characterised in that：Using membranaceous
The mode of glue exposure imaging makes the first glue-line, the second glue-line or the 3rd glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510619131.2A CN105140255B (en) | 2015-09-25 | 2015-09-25 | A kind of flip camera case chip and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510619131.2A CN105140255B (en) | 2015-09-25 | 2015-09-25 | A kind of flip camera case chip and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN105140255A CN105140255A (en) | 2015-12-09 |
| CN105140255B true CN105140255B (en) | 2017-11-17 |
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| CN201510619131.2A Expired - Fee Related CN105140255B (en) | 2015-09-25 | 2015-09-25 | A kind of flip camera case chip and preparation method thereof |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108573877B (en) * | 2017-03-14 | 2021-08-27 | 兴讯科技股份有限公司 | Method for forming attached electronic chip module with double-sided carrying parts |
| CN108962927A (en) * | 2018-06-28 | 2018-12-07 | 江西芯创光电有限公司 | The production method of camera case chip |
| CN113745202A (en) * | 2021-06-04 | 2021-12-03 | 荣耀终端有限公司 | Packaging module, manufacturing method thereof and electronic equipment |
| CN113823608A (en) * | 2021-09-14 | 2021-12-21 | 深圳市汇顶科技股份有限公司 | Chip module and manufacturing method thereof |
| CN114025476B (en) * | 2021-11-03 | 2024-03-12 | 深圳市溢鑫科技研发有限公司 | Integrated circuit board structure of electrochemical detection electrode and manufacturing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286520A (en) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Image sensing chip packaging structure and packaging method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM264651U (en) * | 2004-10-21 | 2005-05-11 | Chipmos Technologies Inc | Package structure of image sensor device |
| KR101209306B1 (en) * | 2010-06-23 | 2012-12-06 | 엘지이노텍 주식회사 | Ceramic board, method manufacturing thereof, image censor package and method of manufacturing the same |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101286520A (en) * | 2007-04-10 | 2008-10-15 | 鸿富锦精密工业（深圳）有限公司 | Image sensing chip packaging structure and packaging method thereof |
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