CN108962927A - The production method of camera case chip - Google Patents

Abstract

The invention discloses a kind of production methods of camera case chip, include the following steps: S1, set the first small lugs on the functional pin of camera bare chip；S2, the first substrate on camera case chip and the second substrate front and back sides make route；First substrate is equipped with the first pad and the first corresponding big protruding block；The second substrate reverse side is equipped with the second big protruding block and the second small lugs, and front is equipped with the 4th pad；S3, the second substrate are mounted on first substrate, and camera bare chip fits in the second substrate, and the second big protruding block is electrically connected with the first big protruding block, and the first small lugs are electrically connected with the second small lugs；S4, the 4th convex block is set using the point tin head of tin cream device on the 4th pad, electric elements are installed on the 4th convex block by chip mounter fitting.The present invention can make the tin cream on each pad appropriate by a point tin cream technology, when being bonded the electrical connection of corresponding electric elements will not route to surrounding or pad impact, prevent short circuit.

Description

Method for making camera package

technical field

The invention relates to the technical field of camera modules, in particular to a method for manufacturing a camera packaging sheet.

Background technique

With the development of science and technology, people have higher and higher requirements for the image quality of camera equipment. Under the condition of satisfying higher camera quality, the lightness and thinness of camera equipment has become a development trend. In the field of camera modules, the encapsulation process of the camera affects the production cost and module volume of the entire camera module.

The existing camera packaging sheet is made by laminating the bare camera chip and two substrates. Wherein, a stepped window for accommodating the bare camera chip is arranged on one substrate, and the wiring on the bare camera chip can be arranged conveniently through the two substrates. However, because the camera package is too small, the entire processing circuit is generally formed by connecting another substrate on which the required electrical components are placed, but this leads to a larger package size, and more manpower and material resources are required to install an additional substrate. In the traditional technology, pads are directly set on the two substrates to solder the required electrical components, but most of them use the method of brushing solder paste on the steel mesh to brush tin on the pads connected to the electrical components, but due to various The form of components is different, and the package of the camera is too small. The traditional planar steel mesh is not effective, and its precision is limited. It is very likely that the solder paste between two adjacent lines or pads will be connected, resulting in a short circuit. , and then the entire camera package is scrapped as a whole.

Contents of the invention

The technical problem to be solved by the present invention is to provide a method for manufacturing a camera package chip with simple structure, strong process operability, low cost and high precision.

The technical solution adopted by the present invention to solve the above problems is: a method for manufacturing a camera package sheet, comprising the following steps:

S1. Setting corresponding first small bumps on the functional pins of the camera bare chip;

S2. Both the front and back sides of the first substrate and the second substrate on the camera package sheet are fabricated with circuits; the first pad is provided on the back side of the first substrate, and the first large bump is provided on the front side of the first substrate. The first large bump is electrically connected to the first pad through a via hole; a second large bump and a second small bump are provided on the reverse side of the second substrate, and the second large bump is connected to the first pad. The two small bumps are electrically connected to the circuit on the reverse side of the second substrate, and the fourth pad is provided on the front side of the second substrate, and each pad connects the circuit to form a processing circuit;

S3. The reverse side of the second substrate is mounted on the front side of the first substrate, and the second large bump is electrically connected to the first large bump; On the reverse side of the second substrate, the first small bump is electrically connected to the second small bump;

S4. Using the solder dispensing head of the solder paste dispensing device to set a fourth bump on the fourth pad, and the electrical components are attached and mounted on the fourth bump by a placement machine;

Among them, the electrical components include capacitors, driver chips, and data storage.

Preferably, before step S4, the following steps are performed: attaching an infrared filter at the position corresponding to the light-through hole on the front of the second substrate by scribing glue, or attaching a solid adhesive, and curing by UV , so that the infrared filter and the second substrate are fastened to a stable state. In this way, for the installation steps of the infrared filter, it is set before the electrical components are mounted to prevent the solder paste device from damaging the photosensitive area of the camera bare chip; the infrared filter is mounted by scribing glue, which is convenient for assembling and fixing the infrared filter. filter.

Preferably, a stepped window is provided on the first substrate, and the camera bare chip is embedded in the stepped window. In this way, the thickness of the entire camera packaging sheet can be reduced as much as possible through the embedded arrangement.

Preferably, in step S3, specifically, the following steps are included:

S31. Paste the reverse side of the second substrate on the front side of the first substrate by scribing glue or pasting solid adhesive, and attach the front side of the camera bare chip to the second substrate by gold-clad bonding On the opposite side, the gap between the step window and the side of the camera bare chip is filled by scribing glue;

S32. Carry out full-board lamination, and fuse the first small bump and the second small bump, the first big bump and the second big bump together by heating to form an electrical connection;

S33, curing by baking, so that the fastening of the first substrate and the second substrate reaches a stable state.

In this way, the connection between the bumps can be better and firmer.

Preferably, the camera packaging sheet connected to the board is cut by a laser, a knife or a punch to form a single camera packaging sheet. In this way, during batch operation, each package sheet is cut into a single piece and installed on each camera circuit board.

Preferably, the size of the infrared filter is larger than the size of the light hole. In this way, the infrared filter can completely cover the entire light hole, which is convenient for fixing the infrared filter on the second substrate.

Compared with the prior art, the present invention has the advantages that: the present invention spots tin on the front pad of the second substrate by spotting solder paste, and then connects the electrical components to the front side of the second substrate through a mounter, The method of spotting solder paste can make the amount of solder paste on each pad on the front of the second substrate, and then attach the corresponding electrical components to electrically connect without affecting the surrounding lines or pads to prevent short circuits. At the same time, using spot tin Paste technology is more convenient in batch operation.

Description of drawings

Fig. 1 is the top view of the front structure of the bare chip of the camera of the present invention;

FIG. 2 is a top view of the front structure of the first substrate of the present invention;

Fig. 3 is the bottom view of the back structure of the first substrate of the present invention;

4 is a top view of the front structure of the second substrate of the present invention;

Fig. 5 is a bottom view of the reverse structure of the second substrate of the present invention;

FIG. 6 is a schematic cross-sectional structure diagram of a camera package sheet of the present invention.

Explanation of symbols in the figure: 1. Camera bare chip, 11. Function pin, 12. First small bump, 13. Photosensitive area, 2. First substrate, 21. First pad, 22. First large bump , 23, step window, 3, the second substrate, 32, the second largest bump, 34, the second small bump, 35, the fourth pad, 36, the fourth bump, 37, the light hole, 4, Infrared filter, 5, electrical components.

Detailed ways

Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

As shown in FIGS. 1-6 , the camera packaging sheet of this embodiment mainly includes a camera bare chip 1 , a first substrate 2 , a second substrate 3 , an infrared filter 4 and electrical components 5 .

This embodiment relates to a method for processing a camera packaging sheet, comprising the following steps:

S1 , setting corresponding first small bumps 12 on the functional pins 11 of the bare camera chip 1 .

Wherein, the camera bare chip 1 placed on the packaging sheet is a flip-chip structure, and the middle part of the front side is a photosensitive area 13 .

S2. The front and back sides of the first substrate 2 and the second substrate 3 on the camera package sheet are fabricated to form required lines; the first pad 21 is provided on the back side of the first substrate 2, and the first large bump is provided on the front side of the first substrate 2. Block 22, the first large bump 22 is electrically connected to the first pad 21 through a via hole; the reverse side of the second substrate 3 is provided with a second large bump 32 corresponding to the first large bump 22 on the front side of the first substrate 2 The reverse side of the second substrate 3 is also provided with a second small bump 34 corresponding to the first small bump 12 on the camera bare chip 1, and the second large bump 32 and the second small bump 34 are all connected to the second substrate. 3. The lines on the reverse side are electrically connected. The front side of the second substrate 3 is provided with a fourth pad 35, and each pad connects the lines to form a processing circuit. The second substrate 3 is provided with a light-through hole corresponding to the photosensitive area 13 of the bare chip 1 of the camera. 37.

Specifically, two substrates made of BT resin are first selected, one of which is used as the first substrate 2, and the other is used as the second substrate 3; the two substrates are respectively cleaned and then sputtered with titanium and copper to form on the surface of the substrates. Metal thin film layer; the corresponding circuit layers are made on the two substrates through photoresist, photoresist exposure, photoresist development and electroplating copper on the two substrates respectively; then the photoresist on the two substrates is removed agent, re-applied photoresist, photoresist exposure, and photoresist development. Then place the two substrates in the copper, nickel, tin, and gold electrolytic baths for electroplating, and electroplate the corresponding first large bump 22, the second large bump 32 and the first large bump 32 on each surface circuit layer of the two substrates. Two small bumps 34. Wherein, the first large bump 22, the second large bump 32 and the second small bump 34 are all composed of a copper-plated bottom layer, a nickel-plated middle layer and a tin-plated outer layer, or are composed of a copper-plated bottom layer, a nickel-plated middle layer and a tin-plated outer layer. A gold-plated outer layer, or a copper-plated base layer and a gold-plated outer layer, or a copper-plated base layer and a tin-plated outer layer.

S3. The reverse side of the second substrate 3 is mounted on the front side of the first substrate 2, and the second large bump 32 is electrically connected to the first large bump 22; the front side of the camera bare chip 1 is bonded to the second substrate 3 by gold-clad bonding. On the opposite side, the first small bump 12 is electrically connected to the second small bump 34 .

Wherein, a stepped window 23 is provided on the first substrate 2 , and the camera bare chip 1 is embedded in the stepped window 23 . In this way, the thickness of the entire camera packaging sheet can be reduced as much as possible through the embedded arrangement.

In this embodiment, the specific step S3 includes the following steps:

S31. Mount the reverse side of the second substrate 3 on the front side of the first substrate 2 by scribing glue, or attaching solid adhesive, and then heat to make the glue initially melt and have a certain viscosity. The first substrate 2 and the second substrate 3 are bonded; then the front of the camera bare chip 1 is bonded to the back of the second substrate 3 by gold-clad bonding, and the gap between the step window 23 and the side of the camera bare chip 1 is glued Filling in a way to make the connection of the camera bare chip 1 better and tighter;

S32, then carry out full-board pressing, and at the same time fuse the first large bump 22 and the second large bump 32, the first small bump 12 and the second small bump 34 by heating to form an electrical connection;

S33, then bake and solidify, so that the glue reaches a molten state, completely solidifies and connects the first substrate 2 and the second substrate 3, the camera bare chip 1 and the second substrate 3, so that the first substrate 2 and the second substrate 3 can be tightly connected reached a steady state. In this way, the connection between the bumps can be better and firmer.

Wherein, the gold-clad bonding method refers to: the first small bump 12 is obtained by planting gold balls on the functional pin 11 of the bare camera chip 1, and then bonded and connected with the corresponding second small bump 34; Alternatively, a thin layer of gold is formed on the surface of the second small bump 34 by means of electroplating, and then bonded and connected to the corresponding first small bump 12 .

S4. Using the tin dispensing head of the solder paste dispensing device to set the fourth bump 36 on the fourth pad 35, and the electrical component 5 is attached and mounted on the fourth bump 36 by the placement machine.

Wherein, the electrical component 5 includes a capacitor, a driver chip, and a data memory.

In this embodiment, the first substrate 2 and the second substrate 3 that have been pressed together are first fixed under the soldering head of the solder paste dispensing device. Height; then on the fourth pad 35 on the second substrate 3, distribute flux through the tin head to form the fourth bump 36; then perform glue dispensing inspection; finally, the suction nozzle on the placement machine sucks the corresponding components Passive components 5 such as capacitors, driver chips, and data storage are mounted.

In the actual production process, the solder paste dispensing device also includes a hot air reflow soldering machine. In this way, it can be ensured that the solder paste process can be used to mount electrical components 5 such as capacitors, drive chips, and data storage devices, and the solder paste on the fourth pad 35 will be melted by a hot air reflow machine to ensure that the electrical components 5 are electrically connected to each other. on the fourth pad 35 .

The solder paste dispensing device can use the existing solder paste dispensing device, such as the dispenser-05 model automatic dispensing solder paste from MARTIN of Germany, which is suitable for dispensing solder paste on high-density device pads. The placement machine can use the JUKI placement machine KE2070, which can mount various devices. In actual production, a solder paste dispensing device, placement machine and hot air reflow soldering machine will be combined to form a production line. Mount the required electrical components 5 on the first substrate 2 and the second substrate 3 to form a processing circuit.

Preferably, before step S4, the following steps are carried out: the position corresponding to the light hole on the front of the second substrate 3 is pasted on the infrared filter 4 by scribing glue, or by attaching a solid adhesive, and then cured by UV , so that the infrared filter 4 and the second substrate 3 are fastened to a stable state. In this way, it is convenient to assemble and fix the infrared filter 4 . The reason why the infrared filter 4 is mounted before step S4 is that it can protect the photosensitive area 13 of the bare camera chip 1 and avoid damage to the bare camera chip 1 . If the mounting step is arranged after, then when carrying out solder paste, although the solder paste device can avoid damage to the infrared filter 4, it will damage the photosensitive area 13 on the camera bare chip 1, and then make the whole The image collected by the camera is not clear, and the price of the chip is much higher than the price of the infrared filter 4 , so considering comprehensively, the infrared filter 4 should be mounted before step S4 . Mounting the infrared filter 4 by scribing glue is convenient for assembling and fixing the infrared filter 4 .

In the actual production process, the size of the infrared filter 4 is larger than that of the light through hole 37 . In this way, the infrared filter 4 can completely cover the entire light hole 37 , which is convenient for fixing the infrared filter 4 on the second substrate 3 .

If the camera packaging sheet is a connecting board, the camera packaging sheet connecting the boards needs to be cut by laser, cutter or punching machine at the end to form a single camera packaging sheet. In this way, during batch operation, each package sheet is cut into a single piece and installed on each camera circuit board.

The beneficial effects of the present invention are: the present invention applies glue between the first substrate and the second substrate, glues the step window and the side of the bare chip of the camera, and then bakes and solidifies the first substrate, the second substrate and the bare chip of the camera. The chip is closely connected; spot tin on the front pad of the second substrate by spotting solder paste, and then connect the electrical components to the front side of the second substrate through the placement machine, and the second substrate can be made The amount of solder paste on each pad on the front side will not affect the surrounding lines or pads when the corresponding electrical components are electrically connected to prevent short circuits. At the same time, the use of solder paste technology is more convenient in batch operation.

The above description shows and describes several preferred embodiments of the present invention, but as mentioned above, it should be understood that the present invention is not limited to the forms disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various Various other combinations, modifications, and environments can be made within the scope of the inventive concept described herein, by the above teachings or by skill or knowledge in the relevant field. However, changes and changes made by those skilled in the art do not depart from the spirit and scope of the present invention, and should all be within the protection scope of the appended claims of the present invention.

Claims (6)

1. a kind of manufacturing method of camera case chip, characterized by the following steps:

S1, corresponding first small lugs are set on the functional pin of the camera bare chip；

S2, the first substrate on the camera case chip and the second substrate tow sides make route；The first substrate Reverse side is equipped with the first pad, and the first substrate front is equipped with the first big protruding block, and first big protruding block passes through via hole mode It is electrically connected with the first pad；The second substrate reverse side be equipped with the second big protruding block and the second small lugs, second big protruding block with Second small lugs are electrically connected with the route of the second substrate reverse side, and the second substrate front is equipped with the 4th pad, each to weld Disk contacts route to form processing circuit；

S3, the first substrate front are mounted on the second substrate reverse side, and first big protruding block is electrically connected with the second big protruding block It connects；Camera bare chip front is fitted in the second substrate reverse side, first small lugs by covering golden laminating type It is electrically connected with the second small lugs；

S4, the 4th convex block is set on the 4th pad using the point tin head of tin cream device, the electric elements pass through patch The fitting of piece machine is installed on the 4th convex block；

Wherein, electric elements include capacitor, driving chip, data storage.

2. the manufacturing method of camera case chip according to claim 1, it is characterised in that: before step S4, execute such as Lower step: in the positive light hole corresponding position of the second substrate by way of drawing glue, or by attaching solid-state viscose Mode mounts infrared fileter, is solidified by UV, so that infrared fileter and the second substrate fastening reach stable state.

3. the manufacturing method of camera case chip according to claim 1, it is characterised in that: the first substrate is equipped with One step window, the camera bare chip are embedded in the step window.

4. the manufacturing method of camera case chip according to claim 3, it is characterised in that: in step s3, specifically Include the following steps:

S31, the second substrate reverse side is mounted on the first base by way of drawing glue, or by way of attaching solid-state viscose Plate front, camera bare chip front are fitted in the second substrate reverse side by covering golden laminating type, the step window with Gap between camera bare chip side is filled by way of drawing glue；

S32, full plate pressing is carried out, the first small lugs and the second small lugs, the first big protruding block and the second big protruding block is made by heating It is fused together, forms electrical connection；

S33, pass through baking-curing, so that first substrate and the second substrate fastening reach stable state.

5. the production method of camera case chip according to claim 2, it is characterised in that: encapsulate the camera of connecting plate Piece carries out the camera case chip that cutting forms single by laser, cutter or punching machine.

6. the production method of camera case chip according to claim 2, it is characterised in that: the ruler of the infrared fileter It is very little to be greater than the light passing pore size.