CN105127426A - Three-dimensional structure combined sintering processing method - Google Patents
Three-dimensional structure combined sintering processing method Download PDFInfo
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- 238000005245 sintering Methods 0.000 title claims abstract description 25
- 238000003672 processing method Methods 0.000 title claims abstract description 13
- 238000012545 processing Methods 0.000 claims abstract description 43
- 239000000843 powder Substances 0.000 claims abstract description 42
- 239000000463 material Substances 0.000 claims abstract description 36
- 238000000110 selective laser sintering Methods 0.000 claims abstract description 20
- 238000002360 preparation method Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 22
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910001092 metal group alloy Inorganic materials 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000000149 argon plasma sintering Methods 0.000 abstract description 12
- 238000007711 solidification Methods 0.000 abstract description 2
- 230000008023 solidification Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 10
- 239000007787 solid Substances 0.000 description 4
- 239000011265 semifinished product Substances 0.000 description 3
- 238000003892 spreading Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 229910001021 Ferroalloy Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
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Abstract
一种三维结构组合烧结加工方法,包括以下步骤:步骤一、根据结构件结构设计定型结构和粉末材料结构,所述粉末材料结构包含在所述定型结构形成的腔体内;步骤二、使用选择性激光烧结技术,逐层铺粉,逐层烧结,完成所述定型结构的制备以及所述粉末材料结构的成形,所述定型结构的制备是通过选择性激光烧结技术实现;步骤三、将所述定型结构连同所述粉末材料结构进一步烧结,实现所述粉末材料结构的整体固化。本发明适合各种复杂造型三维结构的加工,与传统的激光烧结技术相比较,本发明在降低工件加工量、提高加工效率上有明显优势。
A three-dimensional structure combination sintering processing method, comprising the following steps: Step 1, designing a shaped structure and a powder material structure according to the structure of the structural member, the powder material structure is contained in a cavity formed by the shaped structure; Step 2, using selectivity Laser sintering technology, laying powder layer by layer, sintering layer by layer, and completing the preparation of the shaped structure and the forming of the powder material structure, the preparation of the shaped structure is realized by selective laser sintering technology; step 3, the The shaped structure is further sintered together with the powder material structure to achieve overall solidification of the powder material structure. The invention is suitable for the processing of various complex three-dimensional structures. Compared with the traditional laser sintering technology, the invention has obvious advantages in reducing the processing amount of the workpiece and improving the processing efficiency.
Description
技术领域 technical field
本发明涉及一种三维结构加工方法,尤其涉及一种选择性激光烧结与其他烧结方法的组合加工方法。 The invention relates to a three-dimensional structure processing method, in particular to a combined processing method of selective laser sintering and other sintering methods.
背景技术 Background technique
选择性激光烧结(SLS)是快速原型制造的一种,采用激光器作能源,其工作过程为:首先在计算机中建立零件的三维实体CAD模型,用分层软件进行切片处理,得到每一加工层面的信息,并将其转换为电信号来控制激光扫描系统。在工作台上均匀铺上一层很薄的加工材料粉末,激光束在计算机控制下按照零件分层轮廓有选择性地进行烧结,被激光束照射的加工材料粉末熔化并在随后的冷却过程中粘结在一起,就完成了一个层面的加工;逐层铺粉,逐层扫描烧结,直到完成最后一层的加工,制造出三维实体模型。全部烧结完后去掉多余的加工材料粉末,再进行打磨、烘干等后续处理便获得零部件。该技术具有加工材料选择范围广泛、多余材料易于清理、应用范围广等优点,适用于原型及功能零件的制造。 Selective laser sintering (SLS) is a type of rapid prototyping. It uses lasers as energy sources. Its working process is as follows: firstly, a three-dimensional solid CAD model of the part is established in the computer, and sliced with layered software to obtain each processing level. information and convert it into electrical signals to control the laser scanning system. A thin layer of processing material powder is evenly spread on the worktable, and the laser beam is selectively sintered according to the layered contour of the part under computer control. The processing material powder irradiated by the laser beam is melted and in the subsequent cooling process Bonding together completes the processing of one layer; spreading powder layer by layer, scanning and sintering layer by layer, until the last layer of processing is completed to create a three-dimensional solid model. After all the sintering is completed, the excess processing material powder is removed, and then the parts are obtained after subsequent processing such as grinding and drying. This technology has the advantages of a wide range of processing materials, easy cleaning of excess materials, and a wide range of applications. It is suitable for the manufacture of prototypes and functional parts.
众所周知,随着结构件尺寸的增大,结构件体积将会以更加显著的倍数(尺寸比的三次方)增大。目前,采用选择性激光烧结技术加工尺寸较大的大零件时,尤其是加工尺寸大的金属件时,由于总体烧结体积较大,会出现加工时间长,加工成本高等问题。 It is well known that as the size of the structural member increases, the volume of the structural member will increase by a more significant multiple (the cube of the size ratio). At present, when using selective laser sintering technology to process large parts with large sizes, especially when processing large-sized metal parts, due to the large overall sintering volume, there will be problems such as long processing time and high processing costs.
发明内容 Contents of the invention
本发明为了解决选择性激光烧结工艺中,随着加工件尺寸的增大,加工件体积显著增大,进而造成就加工时间增长,加工成本提高的问题,而提出了一种改进的三维结构组合烧结加工方法。 In order to solve the problem that in the selective laser sintering process, as the size of the workpiece increases, the volume of the workpiece increases significantly, which in turn increases the processing time and increases the processing cost, and proposes an improved three-dimensional structure combination Sintering processing method.
本发明所述三维结构组合烧结加工方法包含以下步骤: The three-dimensional structure combination sintering processing method of the present invention comprises the following steps:
步骤一、根据结构件结构设计定型结构和粉末材料结构,所述粉末材料结构包含在所述定型结构形成的腔体内。 Step 1. Design a shaped structure and a powder material structure according to the structure of the structural member, and the powder material structure is contained in a cavity formed by the shaped structure.
步骤二、使用选择性激光烧结技术,逐层铺粉,逐层烧结,完成所述定型结构的制备以及所述粉末材料结构的成形,所述定型结构的制备是通过选择性激光烧结技术实现。 Step 2. Using selective laser sintering technology, laying powder layer by layer and sintering layer by layer to complete the preparation of the shaped structure and the forming of the powder material structure. The preparation of the shaped structure is realized by selective laser sintering technology.
步骤三、将所述定型结构连同所述粉末材料结构进一步烧结,实现所述粉末材料结构的整体固化。 Step 3: further sintering the shaped structure together with the powder material structure to realize overall solidification of the powder material structure.
进一步地,在所述步骤一中,所述定型结构和所述粉末材料结构是通过CAD软件设计工具完成设计。 Further, in the first step, the shaped structure and the powder material structure are designed through a CAD software design tool.
进一步地,在所述步骤二中,所述粉末材料结构的成形是通过所述铺粉工序以及完成所述定型结构的制备后自然形成的。 Further, in the second step, the shape of the powder material structure is formed naturally after the powder spreading process and the preparation of the shaped structure are completed.
在所述步骤三中,所述进一步烧结的方法包括但不限定于高温炉烧结、放电等离子烧结等烧结方式。 In the third step, the further sintering method includes but not limited to high temperature furnace sintering, spark plasma sintering and other sintering methods.
进一步地,在所述步骤二中,用于所述铺粉的材料包括但不限定于钛合金粉末、铁基粉末等金属合金粉末。 Further, in the second step, the material used for the powder coating includes but not limited to titanium alloy powder, iron-based powder and other metal alloy powder.
本发明提供的三维结构加工方法采用了分层加工形式,理论上可以加工各种复杂造型的工件。在工件成形方法上采用激光烧结工艺,加工精度较高,加工质量较好。与现有激光烧结工艺相比,将激光烧结加工区域局限在定型结构,而非整个工件,极大地降低了加工量。以加工边长为100mm的正方体为例,传统的激光烧结加工量为1000000立方毫米,采用本发明加工工艺,设定定型结构厚度为1.5mm,可以得出本发明的激光烧结加工量约为100*100*1.5*6=90000立方毫米,两者的加工量相差11.1倍。可以看出,与传统的激光烧结技术相比较,本发明在降低工件加工量、提高加工效率上有明显优势。 The three-dimensional structure processing method provided by the present invention adopts a layered processing form, and can theoretically process workpieces of various complex shapes. The laser sintering process is adopted in the forming method of the workpiece, which has high processing precision and good processing quality. Compared with the existing laser sintering process, the laser sintering processing area is limited to the shaped structure instead of the entire workpiece, which greatly reduces the processing amount. Taking a cube with a side length of 100 mm as an example, the traditional laser sintering processing volume is 1,000,000 cubic millimeters. Using the processing technology of the present invention, the thickness of the shaped structure is set to be 1.5 mm, and the laser sintering processing volume of the present invention is about 100 mm. *100*1.5*6=90000 cubic millimeters, the difference in processing volume between the two is 11.1 times. It can be seen that compared with the traditional laser sintering technology, the present invention has obvious advantages in reducing the amount of workpiece processing and improving processing efficiency.
附图说明 Description of drawings
图1为本发明的加工工艺流程图。 Fig. 1 is the processing flow chart of the present invention.
图2为本发明实施例1中的加工件的外形结构示意图。 Fig. 2 is a schematic diagram of the shape and structure of the workpiece in Embodiment 1 of the present invention.
图3为本发明实施例1中采用选择性激光烧结的加工示意图。 FIG. 3 is a schematic diagram of processing using selective laser sintering in Example 1 of the present invention.
图4为本发明实施例1中采用选择性激光烧结加工过程中在某一时点加工件的三维结构图。 Fig. 4 is a three-dimensional structure diagram of a workpiece at a certain point in the selective laser sintering process in Embodiment 1 of the present invention.
图5为本发明实施例2中的加工件的外形结构示意图。 Fig. 5 is a schematic diagram of the external structure of the workpiece in embodiment 2 of the present invention.
图6为本发明实施例2中采用选择性激光烧结的加工示意图。 FIG. 6 is a schematic diagram of processing using selective laser sintering in Example 2 of the present invention.
图7为本发明实施例2中采用选择性激光烧结加工过程中在某一时点加工件的三维结构图。 Fig. 7 is a three-dimensional structure diagram of a workpiece at a certain point in the selective laser sintering process in Embodiment 2 of the present invention.
具体实施方式 Detailed ways
下面结合附图对本发明具体实施例做进一步的说明。 The specific embodiments of the present invention will be further described below in conjunction with the accompanying drawings.
实施例1: Example 1:
根据参照图2,本实例中加工件形状为一长方体,其主要尺寸如下:长25mm,宽25mm,高50mm。 According to Fig. 2, the shape of the workpiece in this example is a cuboid, and its main dimensions are as follows: length 25mm, width 25mm, height 50mm.
首先,在计算机中建立加工件的三维实体CAD模型,设定定型结构和粉末材料结构,其中定型结构的厚度设定为0.2mm,即定型结构为一0.2mm厚的壳体,其外表面与加工件的外表面相一致,粉末材料结构为加工件中除去定型结构的部分(定型结构见图3(d)中标号1所示,粉末材料结构见图3(d)中标号2所示)。用分层软件进行切片处理,得到每一加工层面的信息,并转换为电信号控制激光烧结系统。 First, establish a three-dimensional solid CAD model of the workpiece in the computer, and set the shaped structure and powder material structure. The thickness of the shaped structure is set to 0.2mm, that is, the shaped structure is a shell with a thickness of 0.2mm. The outer surface of the workpiece is consistent, and the powder material structure is the part of the workpiece except the shaped structure (the shaped structure is shown in the number 1 in Figure 3 (d), and the powder material structure is shown in the number 2 in Figure 3 (d)). Use layered software for slicing processing to obtain information on each processing level and convert it into electrical signals to control the laser sintering system.
然后,在工作台上均匀铺一层0.2mm厚的钛合金粉末,使用选择性激光烧结加工形成该层的定型结构,完成一个层面的加工。 Then, evenly spread a layer of 0.2mm thick titanium alloy powder on the workbench, and use selective laser sintering to form the fixed structure of this layer, and complete the processing of one layer.
再次,逐层铺钛合金粉末,逐层扫描烧结(每层厚度0.2mm),直到完成最后一层的加工,得到选择性激光烧结半成品。图3为加工过程示意图,图4为加工过程中某一时点形成的加工件三维示意图,可以看到选择性激光烧结完成后形成了定型结构和粉末材料结构组成。 Again, titanium alloy powder is laid layer by layer, and the sintering is scanned layer by layer (each layer thickness is 0.2mm), until the processing of the last layer is completed, and the selective laser sintering semi-finished product is obtained. Figure 3 is a schematic diagram of the processing process, and Figure 4 is a three-dimensional schematic diagram of the workpiece formed at a certain point in the processing process. It can be seen that after the selective laser sintering is completed, a shaped structure and a powder material structure are formed.
最后,对激光烧结后形成的定型结构及其包含的粉末材料结构进行进一步烧结,得到加工件成品。 Finally, the finalized structure formed after laser sintering and the powder material structure it contains are further sintered to obtain the finished workpiece.
实施例2: Example 2:
根据参照图5,本实例中加工件形状为“回”形拉伸体,其主要尺寸如下:高1000mm,“回”形的外正方形边长700mm,内正方形边长300mm。 According to Fig. 5, the shape of the workpiece in this example is a "back"-shaped stretched body, and its main dimensions are as follows: the height is 1000mm, the side length of the outer square of the "back" shape is 700mm, and the side length of the inner square is 300mm.
首先,在计算机中建立加工件的三维实体CAD模型,设定定型结构和粉末材料结构,其中定型结构的厚度设定为50mm,即定型结构为一50mm厚的壳体,其外表面与加工件的外表面相一致,粉末材料结构为加工件中除去定型结构的部分(定型结构见图6(d)中标号1所示,粉末材料结构见图6(d)中标号2所示)。用分层软件进行切片处理,得到每一加工层面的信息,并转换为电信号控制激光烧结系统。 Firstly, establish the three-dimensional solid CAD model of the workpiece in the computer, set the shaped structure and the powder material structure, wherein the thickness of the shaped structure is set to 50mm, that is, the shaped structure is a shell with a thickness of 50mm, and its outer surface and the processed part The outer surface is consistent, and the powder material structure is the part of the workpiece except the shaped structure (the shaped structure is shown in the number 1 in Figure 6 (d), and the powder material structure is shown in the number 2 in Figure 6 (d)). Use layered software for slicing processing to obtain information on each processing level and convert it into electrical signals to control the laser sintering system.
然后,在工作台上均匀铺一层10mm厚的铁合金粉末,使用选择性激光烧结加工形成该层的定型结构,完成一个层面的加工。 Then, evenly spread a layer of 10mm thick ferroalloy powder on the workbench, and use selective laser sintering to form the fixed structure of this layer, and complete the processing of one layer.
再次,逐层铺钛合金粉末,逐层扫描烧结(每层厚度10mm),直到完成最后一层的加工,得到选择性激光烧结半成品。图6为加工过程示意图,图7为加工过程中某一时点形成的加工件三维示意图,可以看到选择性激光烧结半成品由定型结构和粉末材料结构组成。 Again, the titanium alloy powder is laid layer by layer, and the sintering is scanned layer by layer (each layer thickness is 10mm), until the processing of the last layer is completed, and the selective laser sintering semi-finished product is obtained. Figure 6 is a schematic diagram of the processing process, and Figure 7 is a three-dimensional schematic diagram of the workpiece formed at a certain point in the processing process. It can be seen that the selective laser sintering semi-finished product is composed of a shaped structure and a powder material structure.
最后,对激光烧结后形成的定型结构及其包含的粉末材料结构进行进一步烧结,得到加工件成品。 Finally, the finalized structure formed after laser sintering and the powder material structure it contains are further sintered to obtain the finished workpiece.
以上显示和描述本发明的基本原理和主要特征。本行业的技术人员应该了解本发明不受上述使用方法的限制,上述使用方法和说明书中描述的只是说本发明的原理,在不脱离本发明精神和范围的前提下本发明还会有各种变化和改进,这些变化和改进都落入要求保护本发明范围内本发明要求保护范围由所附的权利要求书及其等效物界定。 The basic principles and main features of the present invention have been shown and described above. Those skilled in the industry should understand that the present invention is not limited by the above-mentioned method of use. What is described in the above-mentioned method of use and the description is only the principle of the present invention. The present invention will also have various functions without departing from the spirit and scope of the present invention. Changes and improvements, which fall within the scope of the claimed invention, are defined by the appended claims and their equivalents.
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