CN105112719A - Copper alloy - Google Patents
Copper alloy Download PDFInfo
- Publication number
- CN105112719A CN105112719A CN201510566975.5A CN201510566975A CN105112719A CN 105112719 A CN105112719 A CN 105112719A CN 201510566975 A CN201510566975 A CN 201510566975A CN 105112719 A CN105112719 A CN 105112719A
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- Prior art keywords
- copper alloy
- copper
- alloy material
- composition
- alloy
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- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000956 alloy Substances 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 11
- 239000010949 copper Substances 0.000 claims abstract description 11
- 229910052747 lanthanoid Inorganic materials 0.000 claims abstract description 9
- 150000002602 lanthanoids Chemical class 0.000 claims abstract description 9
- 229910052751 metal Inorganic materials 0.000 claims abstract description 9
- 239000002184 metal Substances 0.000 claims abstract description 9
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 239000010703 silicon Substances 0.000 claims abstract description 9
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 8
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000012535 impurity Substances 0.000 claims abstract description 3
- 229910052707 ruthenium Inorganic materials 0.000 claims abstract description 3
- 229910052706 scandium Inorganic materials 0.000 claims abstract description 3
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052709 silver Inorganic materials 0.000 claims abstract description 3
- 239000004332 silver Substances 0.000 claims abstract description 3
- 239000000203 mixture Substances 0.000 claims description 14
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 239000011574 phosphorus Substances 0.000 claims description 5
- 229910052698 phosphorus Inorganic materials 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- 239000011777 magnesium Substances 0.000 claims description 4
- 229910052748 manganese Inorganic materials 0.000 claims description 4
- 239000011572 manganese Substances 0.000 claims description 4
- 229910052761 rare earth metal Inorganic materials 0.000 abstract description 2
- 150000002910 rare earth metals Chemical class 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 239000004020 conductor Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001192 hot extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Abstract
The invention relates to a copper alloy material. The copper alloy material is prepared from, by weight, 1.5%-3.5% of nickel, 0.01%-0.03% of silver, 0.01%-0.05% of ruthenium, 0.03%-0.05% of scandium, 0.4%-0.6% of silicon, 0.003%-0.03% of lanthanide series rare earth metal, and the balance copper and inevitable impurities. The copper alloy material is high in tensile strength and good in fracture resistance, and the electric conductivity of the copper alloy is similar to that of metal copper.
Description
Technical field
The invention belongs to field of alloy material, refer to a kind of copper alloy especially.
Background technology
The wire now used, in particular for having the wire of mobile or vibrations place and cable etc., mainly use annealed copper wire or it is coated with tin etc. the stranded formation of copper cash twist thread as conductor, this conductor is coated with the electric wire of the isolator such as the vinylchlorid of concentric circles or glue connection vinylchlorid.
The requirement of the recent weather resistance to wire, folding resistance and conductivity is also more and more higher.From saving the angle of the energy, the diameter reducing wire conductor is with weight reduction and save material, but the powered-on capacity of wire conductor is in the past certain, reduces the diameter of wire and it also reduces reduction by capacity.And the reduction of wire conductor diameter causes folding quality to decline, therefore existing electric wire cannot meet these requirements.
Summary of the invention
The object of this invention is to provide the improvement of a Cu alloy material, intensity and the specific conductivity of copper alloy can be improved by this technical scheme, also ensure while guarantee powered-on capacity or improve folding quality.
The present invention is achieved by the following technical solutions:
One Albatra metal-, the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-3.5%, the silver of 0.01-0.03%, the ruthenium of 0.01-0.05%, the scandium of 0.03-0.05%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.003-0.03%, all the other are copper and inevitable impurity.
The composition composition of described copper alloy includes by weight percentage further: the tin of 0.1-0.6%, the cobalt of 0.06-0.8%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
The composition composition of described copper alloy includes by weight percentage further: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
The invention has the beneficial effects as follows;
By adding lanthanide rare metal in the inventive solutions, effectively can improve the specific conductivity of copper alloy, because the perveance of nickel and silicon etc. is lower than the perveance of copper in the alloy, powered-on capacity after adding the material such as nickel and silicon reduces, but after adding lanthanide rare metal, the specific conductivity of copper alloy improves the specific conductivity even exceeding copper on the contrary.
Embodiment
Below by way of specific embodiment, the present invention is described in detail.
Each composition is measured all by weight percentage in the present invention.
The element adding the intensity in order to improve copper alloy of nickel and silicon, forms by nickel and silicon the intensity that tantnickel precipitate improves copper alloy in copper alloy, and the weight percent content of nickel is 1.5-3.5%, and the weight percentage of silicon is 0.4-0.6%.Although these two kinds of elements can strengthen the intensity of copper alloy, the specific conductivity of these two kinds of elements is a lot of lower than the specific conductivity of copper, and the amount added too much can affect the specific conductivity of copper alloy, increases the resistance of copper alloy, and powered-on capacity declines.
Lanthanide rare metal is added in the technical program, this rare earth metal can change the crystal arrangement of copper alloy inside, the percent of pass improving electronics can improve the powered-on capacity of copper alloy, and the consumption the lanthanide rare metal be suitable in the present invention is 0.003-0.03%.Certainly can increase the consumption of lanthanide rare metal, but increase according to the purposes of wire the cost too much improving copper alloy on the contrary, and the electric conductivity of copper alloy can not be increased when usage quantity is more than 1.0% on the contrary again.
For Cu alloy material of the present invention, can also contain at least one in tin, iron, cobalt, phosphorus, in these elements, phosphorus can increase the intensity of Cu alloy material, but consumption too much can affect the toughness of Cu alloy material.Improve bending endurance quality while other several elements can increase Cu alloy material intensity, concrete consumption is the iron of the phosphorus of the cobalt of the tin of 0.1-0.6%, 0.06-0.8%, 0.01-0.05%, 0.05-0.1%.The specific conductivity of Cu alloy material can be affected when the consumption of these elements is too much.
Can also select at least one in magnesium and manganese two kinds of elements in the present invention, these two kinds of elements can prevent from adding thermal embrittlement and improving in hot workability have very large advantage, are conducive to reducing diameter of wire.But obviously can affect the conductivity of copper alloy when the consumption of these two kinds of elements is more than 0.5%, the consumption of these two kinds of elements is the manganese of 0.02-0.1% and/or the magnesium of 0.08-0.2% in the present invention.
Use high-frequency melting stove each component to be melted casting copper base in embodiments of the invention 1-6, after copper base is carried out hot extrusion at 900 DEG C, quench process immediately obtains pole, and then cold drawn obtaining expects material.
Composition in each specific embodiment and performance are shown in Table 1
Table 1
By above embodiment, only include nickel, the highest electric conductivity close to copper of electric conductivity of the copper alloy of silicon and lanthanide rare metal, but intensity is not high.The preferred embodiment of the present invention is 3 and 4.
Claims (3)
1. an Albatra metal-, it is characterized in that: the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-3.5%, the silver of 0.01-0.03%, the ruthenium of 0.01-0.05%, the scandium of 0.03-0.05%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.003-0.03%, all the other are copper and inevitable impurity.
2. an Albatra metal-according to claim 1, it is characterized in that: the composition composition of described Cu alloy material includes by weight percentage further: the tin of 0.1-0.6%, the cobalt of 0.06-0.8%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
3. a kind of copper alloy for wire according to claim 1 and 2, is characterized in that: the composition composition of described Cu alloy material includes by weight percentage further: the manganese of 0.02-0.1% and 0.08-0, one or both combinations in the magnesium of 2%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510566975.5A CN105112719A (en) | 2015-09-08 | 2015-09-08 | Copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510566975.5A CN105112719A (en) | 2015-09-08 | 2015-09-08 | Copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105112719A true CN105112719A (en) | 2015-12-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510566975.5A Pending CN105112719A (en) | 2015-09-08 | 2015-09-08 | Copper alloy |
Country Status (1)
| Country | Link |
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| CN (1) | CN105112719A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105624460A (en) * | 2015-12-29 | 2016-06-01 | 刘雷 | High-conductivity and high-tenacity copper alloy cable conductor and preparation method thereof |
| CN105913900A (en) * | 2016-05-11 | 2016-08-31 | 江苏华威铜业有限公司 | Hard copper busbar and preparation method thereof |
| CN106350701A (en) * | 2016-08-22 | 2017-01-25 | 吴雅萍 | Copper alloy |
| CN106702203A (en) * | 2016-11-16 | 2017-05-24 | 俞虹 | High conductive copper alloy |
| CN106756201A (en) * | 2016-11-16 | 2017-05-31 | 严静儿 | A kind of High-conduction copper alloy material |
| CN106834786A (en) * | 2015-12-03 | 2017-06-13 | 黄波 | A kind of Gu-La-Au-B alloy lead wires and preparation method thereof |
| CN106834784A (en) * | 2015-12-03 | 2017-06-13 | 黄波 | A kind of high-conductivity copper alloy wire of element containing praseodymium and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102864332A (en) * | 2012-09-10 | 2013-01-09 | 任静儿 | Copper rare earth alloy |
| CN103282525A (en) * | 2011-01-13 | 2013-09-04 | 三菱综合材料株式会社 | Copper alloy for electronic/electric devices, copper alloy thin plate, and conductive member |
| CN103502487A (en) * | 2011-06-06 | 2014-01-08 | 三菱综合材料株式会社 | Copper alloy for electronic devices, method for producing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| CN103842531A (en) * | 2011-11-07 | 2014-06-04 | 三菱综合材料株式会社 | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| CN103842551A (en) * | 2011-10-28 | 2014-06-04 | 三菱综合材料株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
| CN103890205A (en) * | 2011-11-14 | 2014-06-25 | 三菱综合材料株式会社 | Copper alloy and copper alloy forming material |
-
2015
- 2015-09-08 CN CN201510566975.5A patent/CN105112719A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103282525A (en) * | 2011-01-13 | 2013-09-04 | 三菱综合材料株式会社 | Copper alloy for electronic/electric devices, copper alloy thin plate, and conductive member |
| CN103502487A (en) * | 2011-06-06 | 2014-01-08 | 三菱综合材料株式会社 | Copper alloy for electronic devices, method for producing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| CN103842551A (en) * | 2011-10-28 | 2014-06-04 | 三菱综合材料株式会社 | Copper alloy for electronic equipment, method for producing copper alloy for electronic equipment, rolled copper alloy material for electronic equipment, and part for electronic equipment |
| CN103842531A (en) * | 2011-11-07 | 2014-06-04 | 三菱综合材料株式会社 | Copper alloy for electronic devices, method of manufacturing copper alloy for electronic devices, copper alloy plastic working material for electronic devices, and component for electronic devices |
| CN103890205A (en) * | 2011-11-14 | 2014-06-25 | 三菱综合材料株式会社 | Copper alloy and copper alloy forming material |
| CN102864332A (en) * | 2012-09-10 | 2013-01-09 | 任静儿 | Copper rare earth alloy |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106834786A (en) * | 2015-12-03 | 2017-06-13 | 黄波 | A kind of Gu-La-Au-B alloy lead wires and preparation method thereof |
| CN106834784A (en) * | 2015-12-03 | 2017-06-13 | 黄波 | A kind of high-conductivity copper alloy wire of element containing praseodymium and preparation method thereof |
| CN105624460A (en) * | 2015-12-29 | 2016-06-01 | 刘雷 | High-conductivity and high-tenacity copper alloy cable conductor and preparation method thereof |
| CN105624460B (en) * | 2015-12-29 | 2017-10-31 | 陕西通达电缆制造有限公司 | A kind of copper alloy cable wire of high conductivity high tenacity and preparation method thereof |
| CN105913900A (en) * | 2016-05-11 | 2016-08-31 | 江苏华威铜业有限公司 | Hard copper busbar and preparation method thereof |
| CN106350701A (en) * | 2016-08-22 | 2017-01-25 | 吴雅萍 | Copper alloy |
| CN106702203A (en) * | 2016-11-16 | 2017-05-24 | 俞虹 | High conductive copper alloy |
| CN106756201A (en) * | 2016-11-16 | 2017-05-31 | 严静儿 | A kind of High-conduction copper alloy material |
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Application publication date: 20151202 |