CN102864333A - Copper rare earth alloy material - Google Patents
Copper rare earth alloy material Download PDFInfo
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- CN102864333A CN102864333A CN2012103342393A CN201210334239A CN102864333A CN 102864333 A CN102864333 A CN 102864333A CN 2012103342393 A CN2012103342393 A CN 2012103342393A CN 201210334239 A CN201210334239 A CN 201210334239A CN 102864333 A CN102864333 A CN 102864333A
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- copper
- silicon
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- alloy material
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- 239000000956 alloy Substances 0.000 title claims abstract description 17
- 239000010949 copper Substances 0.000 title claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 13
- 229910052761 rare earth metal Inorganic materials 0.000 title abstract description 4
- -1 Copper rare earth Chemical class 0.000 title abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 28
- 229910052747 lanthanoid Inorganic materials 0.000 claims abstract description 18
- 150000002602 lanthanoids Chemical class 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 18
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 18
- 239000010703 silicon Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000012535 impurity Substances 0.000 claims abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 20
- 239000002245 particle Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 11
- 239000011574 phosphorus Substances 0.000 claims description 11
- 229910052698 phosphorus Inorganic materials 0.000 claims description 11
- 229910052718 tin Inorganic materials 0.000 claims description 11
- 229910017052 cobalt Inorganic materials 0.000 claims description 10
- 239000010941 cobalt Substances 0.000 claims description 10
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 10
- 229910052742 iron Inorganic materials 0.000 claims description 10
- 229910000691 Re alloy Inorganic materials 0.000 claims description 9
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 7
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 7
- 239000011777 magnesium Substances 0.000 claims description 7
- 229910052748 manganese Inorganic materials 0.000 claims description 7
- 239000011572 manganese Substances 0.000 claims description 7
- 239000011135 tin Substances 0.000 claims description 4
- 238000005452 bending Methods 0.000 abstract description 2
- 230000008901 benefit Effects 0.000 abstract description 2
- 150000002910 rare earth metals Chemical class 0.000 abstract description 2
- 239000004615 ingredient Substances 0.000 abstract 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 13
- 239000004020 conductor Substances 0.000 description 5
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000001192 hot extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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Abstract
The invention relates to a copper rare earth alloy material, which comprises the following ingredients in percentage by weight: 1.5-3.5% of nickel, 0.4-0.6% of silicon, 0.001-0.05% of lanthanide series rare earth metal and the balance of copper and inevitable impurities. The copper alloy material has the advantages of high tensile strength, good anti-bending performance and similar electrical conductivity with the metal copper.
Description
Technical field
The invention belongs to field of alloy material, refer to especially a kind of Cu-RE alloys material.
Background technology
The wire that now uses, in particular for wire that mobile or vibrations place are arranged and cable etc., main what use is the twisting thread as conductor of annealed copper wire or the stranded formation of copper cash that is coated with tin etc. on it, is coated with the electric wire of the isolators such as the vinylchlorid of concentric circles or glue connection vinylchlorid on this conductor.
Recently also more and more higher to the requirement of weather resistance, folding resistance and the conductivity of wire.From saving the angle of the energy, reduce the diameter of wire conductor with weight reduction and saving material, but the powered-on capacity of wire conductor in the past is certain, reduces the diameter of wire and has also just reduced reducing by capacity.And the reducing of wire conductor diameter causes folding quality to descend, and therefore existing electric wire can't satisfy these requirements.
Summary of the invention
The purpose of this invention is to provide the improvement of a Cu alloy material, can improve intensity and the specific conductivity of copper alloy by this technical scheme, when guaranteeing powered-on capacity, also guarantee or improve folding quality.
The present invention is achieved by the following technical solutions:
A kind of Cu alloy material, the composition composition of described Cu alloy material includes by weight percentage: the nickel of 1.5-3.5%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
Described nickel, it is 0.1-0.5 μ m particle that silicon and lanthanide rare metal consist of diameter, with 185-205/mm
2Density exists.
The composition composition of described Cu alloy material further includes by weight percentage: the tin of 0.1-0.6%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
Described nickel, it is 0.1-0.5 μ m particle that silicon and lanthanide rare metal consist of diameter, constituting diameter with in described tin, cobalt, phosphorus or the iron one or more is 0.1-0.5 μ m particle, with 185-205/mm
2Density exists.
The composition composition of described Cu alloy material further includes by weight percentage: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
It is 0.1-0.5 μ m particle that described nickel, one or more in silicon and the same tin of lanthanide rare metal, cobalt, phosphorus or the iron constitute diameter, and constituting diameter with in described manganese or the magnesium one or both is 0.1-0.5 μ m particle, with 185-205/mm
2Density exists.
The invention has the beneficial effects as follows;
By in technical scheme of the present invention, adding the lanthanide rare metal, specific conductivity that can the Effective Raise copper alloy, because the perveance of nickel and silicon etc. is lower than the perveance of copper in alloy, powered-on capacity after adding the materials such as nickel and silicon reduces, but after adding the lanthanide rare metal, the specific conductivity of copper alloy improves even surpasses the specific conductivity of copper on the contrary.
Embodiment
Below come by specific embodiment that the present invention is described in detail.
Each composition is all measured by weight percentage in the present invention.
The adding of nickel and silicon is for the element of the intensity that improves copper alloy, in copper alloy, form the intensity that the tantnickel precipitate improves copper alloy by nickel and silicon, the weight percent content of nickel is 1.5-3.5%, the weight percentage of silicon is 0.4-0.6%, described nickel, it is 0.1-0.5 μ m particle that silicon and lanthanide rare metal consist of diameter, with 185-205/mm
2Density exists.Although these two kinds of elements can strengthen the intensity of copper alloy, the specific conductivity that the specific conductivity of these two kinds of elements is lower than copper is a lot, and the amount of adding too much can affect the specific conductivity of copper alloy, increases the resistance of copper alloy, and powered-on capacity descends.
In the technical program, add the lanthanide rare metal, this rare earth metal can change the crystal arrangement of copper alloy inside, the percent of pass that improves electronics can improve the powered-on capacity of copper alloy, and the consumption of the lanthanide rare metal that is suitable among the present invention is 0.001-0.05%.Certainly can increase the consumption of lanthanide rare metal, but increase the cost that too much improves on the contrary copper alloy according to the purposes of wire, and when usage quantity surpasses 1.0%, can not increase again on the contrary the electric conductivity of copper alloy.
For Cu alloy material of the present invention, can also contain at least a in tin, iron, cobalt, the phosphorus, phosphorus can increase the intensity of Cu alloy material in these elements, but consumption too much can affect the toughness of Cu alloy material.Improve the bending endurance quality when other several elements can increase Cu alloy material intensity, concrete consumption is the tin of 0.1-0.6%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, the iron of 0.05-0.1%; Described nickel, it is 0.1-0.5 μ m particle that silicon and lanthanide rare metal consist of diameter, constituting diameter with in described tin, cobalt, phosphorus or the iron one or more is 0.1-0.5 μ m particle, with 185-205/mm
2Density exists.When the consumption of these elements is too much, can affect the specific conductivity of Cu alloy material.
Can also select at least a in two kinds of elements of magnesium and manganese among the present invention, these two kinds of elements can preventing adding thermal embrittlement and improve very large advantage is arranged aspect the hot workability, be conducive to reduce diameter of wire.But can obviously affect the conductivity of copper alloy when the consumption of these two kinds of elements surpasses 0.5%, the consumption of these two kinds of elements is the manganese of 0.02-0.1% and/or the magnesium of 0.08-0.2% in the present invention.It is 0.1-0.5 μ m particle that described nickel, one or more in silicon and the same tin of lanthanide rare metal, cobalt, phosphorus or the iron constitute diameter, and constituting diameter with in described manganese or the magnesium one or both is 0.1-0.5 μ m particle, with 185-205/mm
2Density exists.
Use the high-frequency melting stove that each component is melted casting copper base among the embodiments of the invention 1-6, with the copper base after carrying out hot extrusion under 900 ℃ immediately quench process and obtain pole, then cold drawnly obtain expecting material.
Composition and performance in each specific embodiment are shown in Table 1
Table 1
By above embodiment, only include nickel, the highest electric conductivity near copper of electric conductivity of the copper alloy of silicon and lanthanide rare metal, but intensity is not high.The preferred embodiment of the present invention is 3 and 4.
Claims (6)
1. Cu-RE alloys material, it is characterized in that: the composition composition of described Cu-RE alloys material includes by weight percentage: the nickel of 1.5-3.5%, the silicon of 0.4-0.6%, the lanthanide rare metal of 0.001-0.05%, all the other are copper and inevitable impurity.
2. a kind of Cu-RE alloys material according to claim 1 is characterized in that: described nickel, it is 0.1-0.5 μ m particle that silicon and lanthanide rare metal consist of diameter, with 185-205/mm
2Density exists.
3. a kind of Cu-RE alloys material according to claim 1, it is characterized in that: the composition composition of described Cu alloy material further includes by weight percentage: the tin of 0.1-0.6%, the cobalt of 0.05-1.0%, the phosphorus of 0.01-0.05%, one or more combinations in the iron of 0.05-0.1%.
4. a kind of Cu-RE alloys material according to claim 3, it is characterized in that: described nickel, it is 0.1-0.5 μ m particle that silicon and lanthanide rare metal consist of diameter, and constituting diameter with in described tin, cobalt, phosphorus or the iron one or more is 0.1-0.5 μ m particle, with 185-205/mm
2Density exists.
5. a kind of Cu-RE alloys material according to claim 1 and 2 is characterized in that: the composition of described Cu alloy material forms and further includes by weight percentage: one or both combinations in the manganese of 0.02-0.1% and the magnesium of 0.08-0.2%.
6. a kind of Cu-RE alloys material according to claim 5, it is characterized in that: described nickel, it is 0.1-0.5 μ m particle that in silicon and the same tin of lanthanide rare metal, cobalt, phosphorus or the iron one or more constitute diameter, constituting diameter with in described manganese or the magnesium one or both is 0.1-0.5 μ m particle, with 185-205/mm
2Density exists.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103342393A CN102864333A (en) | 2012-09-10 | 2012-09-10 | Copper rare earth alloy material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012103342393A CN102864333A (en) | 2012-09-10 | 2012-09-10 | Copper rare earth alloy material |
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| Publication Number | Publication Date |
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| CN102864333A true CN102864333A (en) | 2013-01-09 |
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| CN2012103342393A Pending CN102864333A (en) | 2012-09-10 | 2012-09-10 | Copper rare earth alloy material |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105112718A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper-rare earth alloy |
| CN105118542A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper alloy material used for wires |
| CN105112721A (en) * | 2015-09-08 | 2015-12-02 | 周欢 | Copper-rare earth alloy material |
| CN106756225A (en) * | 2016-11-16 | 2017-05-31 | 严静儿 | A kind of Copper rare earth alloy material |
| CN106756226A (en) * | 2016-11-16 | 2017-05-31 | 俞虹 | A kind of Cu-RE alloys |
| CN106834798A (en) * | 2016-11-23 | 2017-06-13 | 虞海盈 | A kind of high conductivity copper alloy |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101981212A (en) * | 2008-03-31 | 2011-02-23 | Jx日矿日石金属株式会社 | Cu-Ni-Si Alloys for Conductive Elastic Materials |
| CN102140594A (en) * | 2011-03-11 | 2011-08-03 | 无锡日月合金材料有限公司 | High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof |
-
2012
- 2012-09-10 CN CN2012103342393A patent/CN102864333A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101981212A (en) * | 2008-03-31 | 2011-02-23 | Jx日矿日石金属株式会社 | Cu-Ni-Si Alloys for Conductive Elastic Materials |
| CN102140594A (en) * | 2011-03-11 | 2011-08-03 | 无锡日月合金材料有限公司 | High-strength, high-conductivity and high-toughness copper alloy and preparation method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105112718A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper-rare earth alloy |
| CN105118542A (en) * | 2015-09-08 | 2015-12-02 | 张超 | Copper alloy material used for wires |
| CN105112721A (en) * | 2015-09-08 | 2015-12-02 | 周欢 | Copper-rare earth alloy material |
| CN106756225A (en) * | 2016-11-16 | 2017-05-31 | 严静儿 | A kind of Copper rare earth alloy material |
| CN106756226A (en) * | 2016-11-16 | 2017-05-31 | 俞虹 | A kind of Cu-RE alloys |
| CN106834798A (en) * | 2016-11-23 | 2017-06-13 | 虞海盈 | A kind of high conductivity copper alloy |
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Application publication date: 20130109 |