CN105109304A - Semiconductor air conditioner system of electric automobile - Google Patents

Abstract

A semiconductor air conditioning system for an electric vehicle, comprising: a blower, an air filter and a semiconductor cooling and heating device, one end of the air filter, the blower and one end of the semiconductor cooling and heating device are connected in sequence, and the other end of the air filter is connected to the system The air inlet is connected, and the other end of the semiconductor cooling and heating device is connected to the system air outlet; the semiconductor cooling and heating device includes: a semiconductor module and an air distribution housing, wherein the air distribution housing is arranged on the leeward side of the semiconductor module. The invention has a simple and compact structure, takes up little space, and is easy to install and arrange on a whole vehicle. It can be used for cooling and heating of low-speed electric vehicles, and the price is much lower than that of traditional automotive air conditioning systems.

Description

Electric Vehicle Semiconductor Air Conditioning System

technical field

The invention relates to a technology in the field of electric vehicles, in particular to a semiconductor air-conditioning system for electric vehicles based on the thermoelectric effect.

Background technique

At present, electric vehicles usually use heat pump air conditioners to realize operations such as cooling, heating, dehumidification and defogging in the car. The cost of this air-conditioning system is expensive, and it is not suitable for low-end low-speed electric vehicles.

The cooling and heating of semiconductor air conditioners rely on the Peltier effect of electrified semiconductors. P-type semiconductors and N-type semiconductors are connected in series. After connecting to direct current, temperature differences and heat transfer will occur at the joints. If the current direction at the joint is N→P, heat will be absorbed and the temperature will drop, which is the cold end. If the current direction at the joint is P→N, heat will be released and the temperature will rise, which is the hot end. Semiconductor cold and hot chips use multiple P-type semiconductors and multiple N-type semiconductors to be interleaved and connected in series. After connecting to direct current, the current absorbs heat from N to P, and the temperature drops, and vice versa, it releases heat to form a hot and cold surface.

After searching the prior art, it is found that the Chinese patent document CN104354560A, the publication date is February 18, 2015, discloses a vehicle-mounted air-conditioning device based on a semiconductor cooling and heating converter, which includes a water circulation system and a semiconductor cooling and heating conversion The water circulation system includes a sealed water tank, the sealed water tank is connected to the upper water pump, the water pump is connected to the upper water pipe, the upper water pipe is connected to the air conditioner thermostat, the upper water pipe bends and turns in the air conditioner thermostat and communicates with the return pipe, and the return pipe is connected to the sealed water tank , the return pipe passes through the semiconductor cold and heat converter, the upper substrate is connected to the top of the car, and the lower substrate is bonded to the sealed water tank. This device increases the water tank device, the structural cost is high, the installation procedure is complicated and takes up space, and the sealing of the water system and the problem of water shortage and replenishment need to be considered, so the feasibility is poor.

Chinese patent document CN203823979U, published on September 10, 2014, discloses a semiconductor air conditioner for pure electric vehicles. The circuit board, the semiconductor cooling and heating fins and the heat exchange device are all connected to the controller, the cooling surface and the heating surface of the semiconductor cooling and heating fins are provided with an air duct, and the air duct is provided with a mesh plate. However, the device does not have a reasonable air circulation system, and the cooling and heating efficiency is low.

Contents of the invention

Aiming at the above-mentioned deficiencies in the prior art, the present invention proposes a semiconductor air-conditioning system for electric vehicles.

The present invention is achieved through the following technical solutions:

The invention comprises: a blower, an air filter and a semiconductor refrigeration and heating device, wherein: one end of the air filter, the blower and one end of the semiconductor refrigeration and heating device are connected in sequence, and the other end of the air filter is connected with the system air inlet , the other end of the semiconductor cooling and heating device is connected to the system air outlet.

The air inlet of the system includes: an air inlet outside the vehicle and an air inlet inside the vehicle; the air outlet of the system includes: an air outlet for blowing the surface, an air outlet for defrosting and an air outlet for blowing feet.

The semiconductor refrigeration and heating device includes: a semiconductor module and an air distribution housing, wherein the air distribution housing is arranged on the leeward side of the semiconductor module.

The semiconductor module includes: semiconductor elements, fins and thermal silica gel, wherein: the semiconductor elements are P-type semiconductors and N-type semiconductors, and the P-type semiconductors and N-type semiconductors are alternately arranged to form a plurality of cooling or heating air Both sides of the air duct are cold end or hot end, each air duct is provided with fins, and heat-conducting silica gel is provided between the semiconductor elements.

The fins are corrugated fins, louver fins or bridge fins.

The air distribution housing includes: an outer air distribution housing and an inner air distribution housing, the outer air distribution housing includes: an outer air outlet and a plurality of outer air channels, and the inner air distribution housing includes: an inner air outlet and multiple The air inlets of the inner air channel and the outer air channel are connected with the corresponding air channels, the air outlets of the inner air channel are connected with the inner air outlet, and the outer air channel air outlets are connected with the outer air outlet.

The other end of the internal air outlet is connected to the system air outlet, and the other end of the external air outlet is connected to the exhaust pipe.

When the air conditioning system is heating, both sides of the air duct connected to the inner air duct are hot ends, and the hot air enters the compartment from the inner air distribution shell through the system air outlet. When the air conditioning system is cooling, change the positive and negative poles of the power supply, and Both sides of the air duct connected by the inner air duct are cold ends, and the cold air enters the compartment from the inner air distribution housing through the system air outlet.

The cross-section of the air duct is rectangular, and the air ducts are arranged in sequence to form an array.

Both the external air passage and the internal air passage are flat hollow structures, the air inlets are in the shape of a rectangle matching the corresponding air passages, the air outlets are in the shape of a rectangle with a length shorter than the air inlet, and the distance between the external air passage and the internal air passage is arrangement.

technical effect

Compared with the prior art, the present invention has a simple and compact structure, takes up little space, and is easy to install and arrange on a whole vehicle. It can be used for cooling and heating of low-speed electric vehicles, and the price is much lower than that of traditional automotive air conditioning systems.

Description of drawings

Figure 1 is a schematic diagram of a semiconductor air-conditioning system for an electric vehicle;

Fig. 2 is a schematic diagram of the airflow of the electric vehicle semiconductor air conditioning system;

3 is a schematic diagram of a semiconductor cooling and heating device;

4 is a schematic diagram of a semiconductor module;

Fig. 5 is a schematic diagram of the external air distribution housing;

Fig. 6 is a schematic diagram of the inner air distribution housing;

Fig. 7 is the structural representation in the cabinet of embodiment 2;

In the figure: 1 air inlet inside the car, 2 air inlet outside the car, 3 air filter, 4 blower fan, 5 semiconductor module, 6 outer air distribution housing, 7 inner air distribution housing, 8 surface air outlet , 9 defrosting air outlet, 10 blowing foot air outlet, 11 exhaust pipe, 12 blowing surface ventilation door, 13 defrosting ventilation door, 14 blowing foot ventilation door, 15 exhaust pipe ventilation door, 16 temperature sensor, 17 semiconductor refrigeration Heating device, 18 air distribution shell, 19 system air inlet, 20 system air outlet, 21 box, 51 semiconductor element, 52 fin, 53 thermal silica gel, 54 first power interface, 55 second power interface, 61 Outer air channel, 62 outer air outlets, 71 inner air channels, 72 inner air outlets.

Detailed ways

The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.

Example 1

As shown in FIG. 1 , this embodiment includes: a fan 4 , a semiconductor cooling and heating device 17 and an air filter 3 , wherein the fan is arranged between the semiconductor cooling and heating device 17 and the air filter 3 . A system air intake 19 including the outside air intake 2 and the interior air intake 1 is connected to the air filter 3 , and air passes through the air filter 3 via the air intakes 1 , 2 .

As shown in Figure 3, the semiconductor cooling and heating device 17 includes a semiconductor module 5 and an air distribution housing 18, the air distribution housing 18 is arranged at the leeward end of the semiconductor module 5, and the air distribution housing 18 includes an outer air distribution housing Body 6 and inner air distribution housing 7.

As shown in Figure 4, the semiconductor module 5 includes a semiconductor element 51, a fin 52, a thermally conductive silica gel 53, a first power interface 54 and a second power interface 55, wherein: the semiconductor element 51 is a P-type semiconductor or an N-type semiconductor . P-type semiconductors and N-type semiconductors are alternately arranged in horizontal and vertical arrays with fins 52 between each row, thermal conductive silica gel 53 between each row of semiconductor elements 51, and power interfaces 54 and 55 at both ends. As shown in FIG. 4 , the semiconductor elements 51 are arranged in ten columns and four rows. The semiconductor elements 51 in each column and row are alternately arranged with P-type semiconductors and N-type semiconductors. Ten rows of semiconductor elements 51 form eleven air ducts. The air ducts are rectangular, and the upper and lower ends of each air duct are aligned to form an array. Air ducts with cold ends on both sides are cooling air ducts, and air ducts with hot ends on both sides are heating air ducts. The current flows in the same direction in the P-type semiconductor and N-type semiconductor on both sides of each air duct, both are P→N or N→P, P→N heating, N-P cooling. In this way, the cooling air passages are heating air passages alternately. When the current direction is changed, the original cooling air channel becomes a heating air channel, and the original heating air channel becomes a cooling air channel.

As shown in FIG. 5 , the external air distribution housing 6 includes six external air passages 61 and external air outlets 62 . As shown in FIG. 6 , the internal air distribution housing 6 includes five internal air passages 71 and internal air outlets 72 . Both the internal air passage 61 and the external air passage 71 are flat and hollow structures. Both the air inlets of the external air passage 61 and the internal air passage 72 are rectangular, and the air outlets are also rectangular, and the length of the air outlet is shorter than that of the air inlet. There is an arc structure between the air inlet and the air outlet. The external air passage 61 and the internal air passage 71 are alternately connected to the corresponding air passage in turn, the other end of the external air passage 61 is connected to the external air outlet 62 , and the other end of the internal air passage 62 is connected to the internal air outlet 62 . The external air passages 61 and the internal air passages 71 are arranged alternately in space. When the air conditioner is refrigerating or heating, all that enters the interior air passage 71 is cold wind or hot wind, and all that enters the external wind passage 61 is hot wind or cold wind.

As shown in Figure 1, the other end of the external air outlet 62 is connected to the exhaust pipe 11, and the other end of the internal air outlet 72 is connected to the system air outlet 20 including the blowing surface air outlet 8, the defrosting air outlet 9 and the foot blowing air outlet 10 . Exhaust pipe 11 is provided with exhaust pipe ventilation door 15, blowing surface air outlet 8 is provided with blowing surface ventilation door 12, defrosting ventilation door 9 is provided with defrosting ventilation door 13, blowing foot air outlet 10 is provided with Blow foot vent door14.

As shown in Figure 2, when the air-conditioning system is heating the car, the power supply is connected, and the current direction in the semiconductor elements 51 on both sides of the air duct corresponding to the inner air passage 71 is from the P-type semiconductor to the N-type semiconductor, and the air duct Both sides are hot ends, heat release at this moment, and the air after heating enters the car through the system air outlet 20 through the interior air passage 71 through the interior air outlet 72 . The current direction on both sides of the air duct corresponding to the external air channel 6 is N→P type, and both are cold ends. At this time, heat is absorbed, and the cooled air is discharged from the external air channel 61 and the external air outlet 62 through the exhaust pipe 11 outside the car.

As shown in Figure 2, when the air conditioning system is used for cooling the vehicle, the positive and negative poles of the power supply are opposite to those for heating. In this way, the current in the semiconductor elements 51 on both sides of the air duct corresponding to the inner air duct 71 is N→P, At this moment, the heat is absorbed, and the cooled air enters the car through the system air outlet 20 through the air outlet 72 through the interior air passage 71 to complete cooling. At this time, the hot air in the heat release air passage is discharged through the exhaust pipe 11 through the external air passage 61 and the external air outlet 62 . An air duct temperature sensor 16 is provided at the air inlet 1 in the car to monitor the temperature inside the car and control the positive and negative connections of the power supply, thereby realizing switching between cooling and heating modes.

Compared with the prior art, the air-conditioning system of the present invention has a simple and compact structure, and is easy to install and arrange on a whole vehicle. It can be used for cooling and heating of low-speed electric vehicles, and the price is much lower than that of traditional automotive air conditioning systems.

Example 2

Compared with Embodiment 1, this embodiment differs in that:

As shown in FIG. 7 , the fan 4 , the air filter 6 and the semiconductor cooling and heating device 17 are packaged in a box 21 . The air filter 6 is arranged at one end of the box body 21 , the fan 4 is arranged at a corner of the box body 21 , and the semiconductor cooling and heating device 17 is arranged at the other end of the box body. When the electric vehicle semiconductor air conditioning system is running, the wind flows through the air filter 6 and is transported by the fan 4 to the semiconductor cooling and heating device 17 to realize heating or cooling of the airflow.

Compared with embodiment 1, the further effect of this embodiment is:

This makes the structure of the air conditioner more compact, occupies less space, and is easier to install.

Claims (9)

1. an electronlmobil semiconductor air-conditioning system, it is characterized in that, comprise: blowing engine, airfilter and Semi-conductor, wherein: one end, the blowing engine of airfilter are connected successively with one end of Semi-conductor, the airfilter other end is connected with system admission port, and the Semi-conductor other end is connected with system air extractor duct;

Described Semi-conductor comprises: semiconductor module and point crust of weathering body, wherein: point crust of weathering body is arranged at the leeward side of semiconductor module.

2. electronlmobil semiconductor air-conditioning system according to claim 1, it is characterized in that, described semiconductor module comprises: semiconductor element, fin and heat conductive silica gel, wherein: described semiconductor element is P-type semiconductor and N-type semiconductor, described P-type semiconductor and N-type semiconductor are alternately arranged and form multiple refrigeration or heating air duct, the both sides in air channel are all cold junction or hot junction, be provided with fin, be provided with heat conductive silica gel between semiconductor element in each air channel.

3. electronlmobil semiconductor air-conditioning system according to claim 2, is characterized in that, described fin is corrugated fin, louvered fin or bridge sheet fin.

4. according to described electronlmobil semiconductor air-conditioning system arbitrary in claims 1 to 3, it is characterized in that, a described point crust of weathering body comprises: outer point crust of weathering body and interior point of crust of weathering body, an outer point crust of weathering body comprises: exogenous wind outlet and multiple exogenous wind passage, an interior point crust of weathering body comprises: interior wind outlet and multiple interior wind passage, interior wind passage is connected with corresponding air channel with the ventilation inlet of exogenous wind passage, and interior wind passage air outlet exports with interior wind and is connected, and exogenous wind passage air outlet exports with exogenous wind and is connected.

5. electronlmobil semiconductor air-conditioning system according to claim 4, is characterized in that, the described interior wind outlet other end is connected with system air extractor duct, and the exogenous wind outlet other end is connected with freeing pipe.

6. electronlmobil semiconductor air-conditioning system according to claim 5, it is characterized in that, when described a/c system heats, the both sides, air channel be connected with interior wind passage are all hot junction, hot blast enters compartment by interior point of crust of weathering body through system air extractor duct, during a/c system refrigeration, changes power positive cathode, the both sides, air channel be connected with interior wind passage are all cold junction, and cold wind enters compartment by interior point of crust of weathering body through system air extractor duct.

7. electronlmobil semiconductor air-conditioning system according to claim 6, is characterized in that, described duct cross-section is rectangle, and air channel is arranged in order composition array.

8. electronlmobil semiconductor air-conditioning system according to claim 7, it is characterized in that, described exogenous wind passage and interior wind passage are all flattened tubular configuration, its ventilation inlet shape is all the rectangle matched with corresponding air channel, air outlet shape is the rectangle that length is less than ventilation inlet, exogenous wind passage and the arrangement of interior wind channel spacing.

9. electronlmobil semiconductor air-conditioning system according to claim 1, is characterized in that, described system admission port comprises: car outer air admission port and Che Nei air inlet; Described system air extractor duct comprises: blow face air extractor duct, defrost air extractor duct and blow pin air extractor duct.