CN105101610B - Flexible circuit board and LED flexible light strip with the flexible circuit board - Google Patents

Abstract

The invention discloses a flexible circuit board and an L ED flexible lamp strip with the flexible circuit board, wherein the flexible circuit board comprises a conductor layer, an insulating layer and an insulating separation layer, the conductor layer comprises a first main conductor, a second main conductor and a packaging conductor, the first main conductor and the second main conductor are arranged side by side, the packaging conductor is positioned between the first main conductor and the second main conductor, a fracture for packaging a component is arranged on the packaging conductor, the insulating layer is arranged on the surface of one side of the conductor layer, the solder mask is arranged on the surface of the other side of the conductor layer, a window corresponding to the fracture is arranged on the solder mask, the insulating separation layer is arranged between the packaging conductor and the first main conductor and the second main conductor and is used for insulating the packaging conductor and the first main conductor and the second main conductor.

Description

Flexible circuit board and LED flexible light strip with the flexible circuit board

technical field

The invention relates to a circuit board, in particular to a flexible circuit board and an LED flexible light strip with the flexible circuit board.

Background technique

As a fourth-generation lighting source, LED has significant advantages in energy saving and longevity. With the development of society, the problem of lighting energy consumption in daily life has become increasingly prominent. Therefore, LED lamps with significant energy-saving advantages are more and more popular.

LED flexible light strips use flexible circuit boards. Because the FPC material is soft, it can be bent, folded, and wound arbitrarily, and can be moved and stretched in three-dimensional space without breaking. It is suitable for use in irregular places and places with small spaces, and because it can be bent and wound arbitrarily, it is suitable for arbitrarily combining various patterns in advertising decoration. Therefore, LED flexible circuit boards are more and more widely used in scene lighting and mood lighting.

The wires between the wire layers of the existing flexible circuit board are juxtaposed flat wires, and the direct gap between the main wires on both sides and the middle wire is generally 0.6mm. It is easy to cause the direct contact short circuit between the two main wires and the middle wire and be scrapped; at the same time, the main wires and the middle wires on both sides are not insulated and separated. During the use of the flexible light strip, especially the high-voltage flexible light strip, poor heat dissipation leads to The thermal breakdown caused the direct contact between the two main wires and the middle wire to be short-circuited and scrapped.

Contents of the invention

Aiming at the above-mentioned current state of the art, the technical problem to be solved by the present invention is to provide a flexible circuit board and an LED flexible light strip with the flexible circuit board, which can avoid the main wire and the intermediate wire due to the tiny wire wiring. Short circuit caused by displacement or thermal runaway.

In order to solve the above technical problems, a flexible circuit board provided by the present invention includes:

A wire layer, the wire layer includes a first main wire, a second main wire, and a packaging wire located between the first main wire and the second main wire arranged side by side, and the packaging wire is provided with a wire for packaging Fracture of components;

an insulating layer, the insulating layer is disposed on the surface of one side of the wire layer;

A solder resist layer, the solder resist layer is disposed on the surface of the other side of the wire layer, and a window corresponding to the fracture is disposed on the solder resist layer; it also includes:

an insulating separation layer, the insulating separation layer is arranged between the packaging wire and the first main wire and the second main wire, and is used for the packaging wire and the first main wire, the second main wire The two main conductors are insulated.

In one of the embodiments, the insulating spacer layer includes:

a first partition, the first partition is disposed between the packaging lead and the first main lead;

a second partition, the second partition is disposed between the package lead and the second main lead, and

A connection part, the connection part is connected between the first partition part and the second partition part.

In one of the embodiments, the insulating spacer layer further includes:

a connection part, the connection part is arranged between the wire layer and the insulation layer, and the two ends of the connection part are respectively connected to the first partition part and the second partition part near the side of the insulation layer A groove is formed between the connecting portion, the first partition and the second partition, and the packaging wire is accommodated in the groove.

In one of the embodiments, the insulating spacer layer further includes:

a first wing extending from an end of the first partition close to the solder mask side to the outside of the groove, and covering the first main wire;

The second wing extends from an end of the second partition near the solder mask side to the outside of the groove, and covers the second main wire.

In one of the embodiments, the solder resist layer only covers the surface of the package wire.

In one of the embodiments, the solder resist layer covers surfaces of the package lead, the first wing and the second wing.

In one of the embodiments, there are more than two packaging wires, and more than two packaging wires are connected in parallel or in series.

In one of the embodiments, the packaging wires are insulated and separated from each other.

In one of the embodiments, each of the packaging wires is provided with the fracture; or the fracture is formed between two adjacent packaging wires.

An LED flexible light strip provided by the present invention includes a flexible circuit board and a plurality of LED lamp beads, the flexible circuit board is the above-mentioned flexible circuit board, and a plurality of the LED lamp beads are packaged in the fracture place.

Compared with the prior art, the flexible circuit board of the present invention and the LED flexible light strip with the flexible circuit board insulate the main wires on both sides of the wire layer and the package wire in the middle through the insulating separation layer, so that the main wires Wire and package wires will not be short-circuited due to slight displacement in wire routing or thermal breakdown, so the performance is good, the circuit reliability is high, and the life is long.

The beneficial effects of the additional technical features of the present invention will be described in the specific embodiments of this specification.

Description of drawings

Fig. 1 is a structural schematic diagram of the wire layer and the insulating separation layer of the flexible circuit board in the first embodiment of the invention;

Fig. 2 is the partially enlarged schematic diagram of I place in Fig. 1;

Fig. 3 is a schematic cross-sectional structure diagram of the flexible circuit board in the first embodiment of the invention;

Fig. 4 is a schematic cross-sectional structure diagram of the flexible circuit board in the second embodiment of the invention.

In the above figures, 1. Insulation separation layer; 11. Connection portion; 12. First separation portion; 13. Second separation portion; 14. First wing portion; 15. Second wing portion; 16. Groove; 2. Insulation layer; 3, wire layer; 31, first main wire; 32, packaging wire; 321, fracture; 33, second main wire; 4, solder mask layer; 5, component packaging layer.

Detailed ways

The present invention will be described in detail below with reference to the accompanying drawings and examples. It should be noted that, in the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

As shown in Figures 1 to 3, the flexible circuit board in Embodiment 1 of the present invention includes a wire layer 3, an insulating layer 2, a solder resist layer 4, and an insulating separation layer 1, wherein the wire layer 3 includes first main conductors arranged side by side. wire 31, a second main wire 33, and a packaging wire 32 located between the first main wire 31 and the second main wire 33, the packaging wire 32 is provided with a fracture 321 for packaging components according to circuit requirements, At the position of the cutout 321 , the packaging components such as LED lamp beads and/or resistors that need to be connected to the circuit are electrically connected to form a circuit line.

The insulating separation layer 1 is arranged between the packaging wire 32 and the first main wire 31 and the second main wire 33, and is used for the packaging wire 32 and the first main wire 31, the The second main wire 33 is insulated. Like this, in the juxtaposed wiring process of wire layer 3, just can not cause the direct contact of first main wire 31, the second main wire 33 and packaging wire 32 and scrap because of the tiny displacement of wire; During use, the first main lead 31 , the second main lead 33 and the packaging lead 32 are short-circuited due to thermal breakdown due to poor heat dissipation, and the flexible circuit board is scrapped.

The insulating spacer layer 1 includes a first spacer 12, a second spacer 13 and a connection portion 11, the first spacer 12 is arranged between the package wire 32 and the first main lead 31; the The second partition 13 is arranged between the package wire 32 and the second main wire 33; the connection part 11 is arranged between the wire layer 3 and the insulating layer 2, and the connection part 11 The two ends of the first partition part 12 and the second partition part 13 are respectively connected to one end of the insulating layer 2 side, and the connection part 11, the first partition part 12 and the second partition part A groove 16 is formed between the parts 13 , and the packaging wire 32 is accommodated in the groove 16 . Further, the insulating separation layer 1 also includes a first wing 14 and a second wing 15, the first wing 14 extends from one end of the first separation 12 close to the solder resist layer 4 to the The groove 16 extends outside and covers the first main wire 31; the second wing 15 extends from the end of the second partition 13 near the side of the solder resist layer 4 to the groove 16 , and cover the second main wire 33 .

The insulating layer 2 is disposed on the surface of one side of the wire layer 3 . The solder resist layer 4 is disposed on the surface of the other side of the wire layer 3 , and a window (not shown) corresponding to the fracture 321 is disposed on the solder resist layer 4 . Preferably, the solder resist layer 4 is only covered on the package wire 32. Preferably, the package wire 32 can be used to cover the solder resist layer 4 in advance, and a window is reserved, and then the package wire 32 covered with the solder resist layer 4 is pasted. It is installed on the insulating separation layer 1 that has been insulated and separated from the first main conductor 31 and the second main conductor 33 , and then mounted together with the insulating layer 2 to form a flexible circuit board. Two sections of packaging wires 32 that do not cover the solder resist layer 4 are reserved on the reserved packaging component fracture 321 of the flexible circuit board packaging wire 32 , thereby forming the component packaging layer 5 required by the flexible circuit board.

FIG. 4 is a schematic structural diagram of a flexible circuit board according to Embodiment 2 of the present invention. The rest is the same as the first embodiment, except that the solder resist layer 4 covers the surface of the packaging wire 32 , the first wing 14 and the second wing 15 .

It should be noted that, for the sake of simplicity and as an example, the packaging wire 32 is one, but it does not mean that there is only one packaging wire 32 . As a modification or improvement, the packaged wires 32 can be two or more, and the circuit connection between the packaged wires 32 can be in parallel and/or in series. For example, the packaged wires 32 are two wires that are also insulated and separated. A packaging wire 32 can be shown in the above-mentioned embodiment fracture 321, each packaging wire 32 has its own series current, and another packaging wire 32 is connected in series and/or in parallel to form a circuit; The packaging wires 32 do not need to reserve a fracture 321 , and the fracture 321 is formed between two adjacent packaging wires 32 .

In summary, since the main wire of the wire layer 3 and the packaging wire 32 have been insulated and separated, this can avoid short circuits caused by the slight displacement of the wire layer 3 during the wiring process, and can also prevent poor heat dissipation during use. Short circuit caused by thermal breakdown, so the reliability of the flexible circuit board is improved and the service life is long.

The present invention also provides a LED flexible light strip, including a flexible circuit board and a plurality of LED lamp beads, the flexible circuit board is the flexible circuit board of the above-mentioned embodiment, and a plurality of the LED lamp beads are packaged in the at the fracture.

The above-mentioned embodiments only express several implementation modes of the present invention, and the description thereof is relatively specific and detailed, but should not be construed as limiting the patent scope of the present invention. It should be pointed out that those skilled in the art can make several modifications and improvements without departing from the concept of the present invention, and these all belong to the protection scope of the present invention.

Claims (8)

1. a kind of flexible circuit board, including：

Conductor layer, the conductor layer include the first main traverse line being arranged side by side, the second main traverse line and be located at first main traverse line With the packaging conductive wire between second main traverse line, the fracture for potted element is provided on the packaging conductive wire；

Insulating layer, the insulating layer are set on the surface of the conductor layer side；

Solder mask, the solder mask are set on the surface of the conductor layer other side, and be provided on the solder mask with The corresponding window of fracture；

It is characterized in that, further including：

Isolating separator layer, the isolating separator layer are set to the packaging conductive wire and are dominated with first main traverse line and described second Between line, the isolating separator layer includes：First lattice, first lattice are set to the packaging conductive wire and described the Between one main traverse line；Second lattice, second lattice are set between the packaging conductive wire and second main traverse line And interconnecting piece, the interconnecting piece are connected between first lattice and second lattice, the interconnecting piece setting Between the conductor layer and the insulating layer, and the both ends of the interconnecting piece respectively with first lattice and described second Lattice close to the insulating layer side one end connect, the interconnecting piece, first lattice and second lattice it Between form groove, the packaging conductive wire is placed in the groove.

2. flexible circuit board according to claim 1, which is characterized in that the isolating separator layer further includes：

First alar part, first alar part from first lattice close to the solder mask side one end to the groove extension It stretches, and covers first main traverse line；

Second alar part, second alar part from second lattice close to the solder mask side one end to the groove extension It stretches, and covers second main traverse line.

3. flexible circuit board according to claim 2, which is characterized in that the solder mask only covers the packaging conductive wire Surface.

4. flexible circuit board according to claim 2, which is characterized in that the solder mask covers the packaging conductive wire, institute State the surface of the first alar part and second alar part.

5. flexible circuit board as claimed in any of claims 1 to 4, which is characterized in that the packaging conductive wire is two More than root, two or more the packaging conductive wires are parallel with one another or connect.

6. flexible circuit board according to claim 5, which is characterized in that mutually insulated point between each packaging conductive wire Every.

7. flexible circuit board according to claim 5, which is characterized in that be provided on each packaging conductive wire described disconnected Mouthful；Or form the fracture between two adjacent packaging conductive wires.

8. a kind of flexible LED lamp band, including flexible circuit board and multiple LED lamp beads, which is characterized in that the flexible circuit board is such as Flexible circuit board described in any one of claim 1 to 7, multiple LED lamp beads are encapsulated in the incision position.