CN105097598B - A kind of wafer probe cards automatic detection device - Google Patents
A kind of wafer probe cards automatic detection device Download PDFInfo
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- CN105097598B CN105097598B CN201510502587.0A CN201510502587A CN105097598B CN 105097598 B CN105097598 B CN 105097598B CN 201510502587 A CN201510502587 A CN 201510502587A CN 105097598 B CN105097598 B CN 105097598B
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- probe card
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- 239000000523 sample Substances 0.000 title claims abstract description 49
- 238000001514 detection method Methods 0.000 title claims abstract description 18
- 238000012360 testing method Methods 0.000 claims abstract description 19
- 230000003321 amplification Effects 0.000 claims description 11
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 7
- 230000009471 action Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 6
- 238000001467 acupuncture Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The present invention relates to semi-conductive electrical detection field more particularly to a kind of probe card automatic detection devices.The present invention proposes a kind of wafer probe cards automatic detection device, pass through the combination of observation platform and mobile platform, solves the action of manual alignment probe tip, automatic detection probe quality, make wafer test full automation, because realizing full-automation, can exclude human factor during the test influences caused by test result, prevents artificial maloperation from occurring.
Description
Technical field
The present invention relates to semi-conductive electrical detection field more particularly to a kind of wafer probe cards automatic detection devices.
Background technology
One supermatic industry during IC manufacturing, cargo do not have in most of process work bench operational process
Any manually action exists, and can exclude the influence that human factor brings wafer quality in this way.But in the electricity that wafer is last
Property test this block, cargo enter board after table operative employee also need to manually to do alignment probe card needle point and manually examination prick
The action of needle.Manual alignment probe card needle point is because existing board can not be automatically found probe card tip position, is tried manually
Acupuncture treatment is to judge whether needle trace complies with standard.Only artificial to judge to think that needle trace complies with standard, board side can start to survey
Examination if artificial judge to think that needle trace is not inconsistent standardization, will exit kinds of goods, replace probe card and tested.
But current artificial judgement is so that the full-automatic target of IC FAB is difficult to realize, and for crystalline substance
In circle test process, manual activity is unfavorable for the raising of tester table production capacity, and artificial judgement needle trace quality also gives test result
Stability bring the influence of human factor into.In the evolution with integrated circuit, chip more does smaller, is used on wafer
Have an acupuncture treatment test PAD it is also less and less, from 90nm technique PAD sizes be 70um*70um to 40nm technique PAD sizes be 30um*
30um, then to 28nm below etc., PAD also more does smaller.Artificially judge that the influence that needle trace is brought is also increasing.It is unfavorable for
The stability of chip testing.
Invention content
In view of the above problems, the present invention provides a kind of wafer probe cards automatic detection device.
A kind of wafer probe cards automatic detection device, which is characterized in that applied to using probe card to the Pad on wafer into
In capable electrical testing, including：
Mobile platform；
Observation platform is fixedly installed on the mobile platform, for the position switching between camera lens；
Luminous component is set on the observation platform center, to illuminate the probe being positioned over above the observation platform
Card needle point；
If dry system lens, it is fixedly installed on the observation platform, for being amplified sight to the probe card needle point
Examine and be aligned measurement.
Above-mentioned device, wherein, the camera lens includes the first camera lens, the second camera lens and third camera lens；
Wherein, first camera lens is for positioning the probe card tip position, second camera lens for pair
The probe card needle point carries out finding alignment accurately；The third camera lens is used to measure the characterisitic parameter of the probe card needle point.
Above-mentioned device, wherein, the amplification factor of first camera lens is less than the amplification factor of second camera lens, described
The amplification factor of second camera lens is less than the amplification factor of the third camera lens.
Above-mentioned device, wherein, described device further includes：
Three-dimensional moving guide rail is connect with the mobile platform, the mobile platform to be driven to move.
Above-mentioned device, wherein, the three-dimensional moving guide rail includes X-direction guide rail, Y-direction guide rail and Z-direction guide rail, and
The X-direction guide rail, the Y-direction guide rail and the Z-direction guide rail are orthogonal between any two.
Above-mentioned device, wherein, it is both provided on the X-direction guide rail, the Y-direction guide rail and the Z-direction guide rail
Drive motor, the mobile platform to be driven to be moved in X, Y, Z-direction.
Above-mentioned device, wherein, it is both provided on the X-direction guide rail, the Y-direction guide rail and the Z-direction guide rail
Optical ruler.
Above-mentioned device, wherein, the precision of the optical ruler is 1um.
Above-mentioned device, wherein, the observation platform is circle, and can rotate freely so that each camera lens it
Between position switch over, and the luminous component is set to the observation platform center.
In conclusion the present invention proposes a kind of automatic detection device, pass through the combination of observation platform and mobile platform, solution
Some the unnecessary influences brought during manual alignment of having determined probe card needle point, realize the good of automatic detection probe card probe
It is bad, make wafer test full automation, because realizing full-automation, human factor can be excluded during the test to test
As a result influence, prevents artificial maloperation from occurring caused by.
Description of the drawings
With reference to appended attached drawing, more fully to describe the embodiment of the present invention.However, appended attached drawing be merely to illustrate and
It illustrates, and is not meant to limit the scope of the invention.
Fig. 1 is the application structure diagram；
Fig. 2 is the schematic diagram that the application searches out tip position by low power lens；
Fig. 3 is that the application times mirror in searches out every probe and the schematic diagram being aligned；
Fig. 4 is the schematic diagram that the application measures every probe characteristics parameter by high power lens.
Specific embodiment
In order to which technical scheme of the present invention and advantage is made more easily to understand, make below in conjunction with the accompanying drawings further specifically
It is bright.It should be noted that the specific embodiments described herein are merely illustrative of the present invention, it is not intended to limit the present invention.
As shown in Figure 1, a kind of wafer probe cards automatic detection device, have an acupuncture treatment applied to probe card the Pad on wafer into
In row electrical testing, which includes circle observation platform 5, which can be clockwise and anticlockwise
In the case of rotate freely, 5 lower section of the observation platform is equipped with a rotation motor, which can realize the rotation of predetermined angular
Turn, for example rotate clockwise 120 ° of either 120 ° of rotations counterclockwise.In this application, the configuration design Cheng Yuan of observation platform 5
Shape, so that during rotation, being arranged on the light that the luminous component 1 at 5 center of observation platform is sent out can uniformly shine
It penetrates on probe card needle point above, the light intensity on same circumference is the same.Then it is set on observation platform 5 several
Camera lens, these camera lenses are fixedly disposed on observation platform 5, and the central point of these camera lenses is located on same circumference, should
Circumference and circle observation platform are concentric circles, are may insure in this way when observation platform rotates 120 °, multigroup camera lens after rotation
The central point of multigroup camera lens is to overlap before central point and rotation.In this application, it is provided with the mirror of 3 different multiplyings altogether
Head, is the first camera lens, the second camera lens and third camera lens respectively, and the amplification factor of the first camera lens is less than the times magnification of the second camera lens
Number, the amplification factor of the second camera lens are less than the amplification factor of third camera lens, and corresponding first camera lens is low power lens 2, the second mirror
Times camera lens 3 and third camera lens are high power camera lenses 4 during head is, the function of the camera lens of different multiplying be it is different, low power lens 2
The visual field is very big, in a wide range of interior position for finding probe tip；In times camera lens 3 be for find accurately alignment each probe
Tip position；And high power camera lens 4 is the characterisitic parameter for measuring probe card probe tip, such as the area of needle point.
In this application, which further includes a mobile platform 6, which is set
On three-dimensional moving guide rail, guide rail is X-direction guide rail, Y-direction guide rail and Z-direction guide rail respectively, and being exactly can be in the side of X, Y, Z
It moves up, so corresponding be provided with a guide rail in the X, Y, Z direction respectively, a driving horse is respectively provided on every guide rail
It reaches, then moveable platform 6 can move on this three guide rails, the mobile platform 6 is driven to move by drive motor, realized
Multi-faceted movement in space.
In this application, optical ruler is mounted on every guide rail, optical ruler is the Moire fringe and photoelectricity using grating
Switch technology, it is transparent length ruler together that 1 μ is carved in chromium plating on the attached method glass of 3mm, then it is sticked on aluminium ruler, by light
Refraction or transmission feed back in inductor and are measured.The precision of optical ruler in the application is less than 1um, is moved for measuring three-dimensional
The distance of movement of the moving platform 6 on guide rail.
It is illustrated with reference to specific embodiment
Embodiment one
The manual activity of tester table has as follows at present：
A. manual alignment probe card needle point acts.
B. examination acupuncture treatment on Pad, judges whether this card can be used for production test by the needle trace situation on Pad manually.
The application designs a kind of wafer probe cards automatic detection device, more than this wafer probe automatic detection device can solve
Two manual activities, so as to fulfill tester table full-automation.
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, in this device there are one fixed light source 1, the camera lens of three groups of different multiplyings is (low
Times camera lens 2, in times camera lens 3, high power camera lens 4) be fixed on observation platform 5, observation platform 5 embedded in can three-dimensional mobile platform 6, move
The power moved on X, Y, Z guide rail of moving platform 6 is provided respectively by three motors, and is mounted with light respectively on X, Y, Z guide rail
Ruler (precision is less than 1um) is learned to measure the distance that mobile platform 6 moves on guide rail.
Fixed light source 1 is radiated at probe card needle region and provides brightness for camera lens, and then low power lens 2 is sought interior on a large scale
Look for tip position 7；In times camera lens 3 make uniform tip position 7；High power camera lens 4 measures needle point parameter.
Fixed light source 1 lights work, and low power lens 2 is rotated to camera lens operating position by observation platform 5, and low power lens 2 exists
It confirms tip position 7 within sweep of the eye, and mobile platform 6 is automatically moved is moved to tip position 7 by the central point of low power lens 2
Underface, (such as：Tip position 7 appears in the upper right side X1 at 2 circular field of view center of low power lens, at Y1, mobile platform 6X
X1 distances are moved in direction, and Y-direction movement Y1 distances make tip position 7 be located at the central point in 2 visual field of low power lens after mobile), it sees
Survey platform 5 counterclockwise rotation 120 ° by times camera lens 3 rotate to camera lens operating position, after rotation in 3 central point of times camera lens position
Put be exactly rotation before 2 central point of low power lens position, in times camera lens 3 from left to right find each needle and be aligned, needle point pair
High power camera lens 4 is rotated to camera lens operating position to observation platform 5 by 120 ° of rotation counterclockwise again after neat, high power camera lens 4 after rotation
The position of central point be exactly before rotation in 3 central point of times camera lens position, high power camera lens 4 measures the characterisitic parameter of every probe
(such as the horizontal position value X, Y of every probe；Height value Z；Needle point area S)
Horizontal position value X, Y accurately react the position for pricking the needle trace on Pad, and the power of the needle trace on Pad is pricked in height value Z reactions
Degree, needle point area response prick the size of the needle trace on Pad.These practical characterisitic parameters measured are understood and are set on board
Parameter specification be compared, any one parameter exceeds specification, and board prompts this probe to fall short of specifications, be not allowed for surveying
Examination.All parameters are up to specification, and board automatically begins to test.
The present invention proposes a kind of wafer probe cards automatic detection device, by the combination of observation platform and mobile platform,
It solves some the unnecessary influences brought during manual alignment probe card needle point, realizes the good of automatic detection probe card probe
It is bad, make wafer test full automation, because realizing full-automation, human factor can be excluded during the test to test
As a result influence, prevents artificial maloperation from occurring caused by.
By explanation and attached drawing, the exemplary embodiments of the specific structure of specific embodiment are given, based on essence of the invention
God can also make other conversions.Although foregoing invention proposes existing preferred embodiment, however, these contents are not intended as
Limitation.
For a person skilled in the art, after reading above description, various changes and modifications undoubtedly will be evident.
Therefore, appended claims should regard the whole variations and modifications of true intention and range for covering the present invention as.It is weighing
The range and content of any and all equivalence, are all considered as still belonging to the intent and scope of the invention in the range of sharp claim.
Claims (9)
1. a kind of wafer probe cards automatic detection device, which is characterized in that carried out applied to using probe card to the Pad on wafer
Electrical testing in, including：
Mobile platform；
Observation platform is fixedly installed on the mobile platform, for the position switching between camera lens；
Luminous component is set on the observation platform center, to illuminate the probe card needle being positioned over above the observation platform
Point；
If dry system lens, be fixedly installed on the observation platform, for the probe card needle point be amplified observation and
Alignment measures.
2. the apparatus according to claim 1, which is characterized in that the camera lens includes the first camera lens, the second camera lens and
Three-lens；
Wherein, for being positioned to the probe card tip position, second camera lens is used for described first camera lens
Probe card needle point carries out finding alignment accurately；The third camera lens is used to measure the characterisitic parameter of the probe card needle point.
3. the apparatus of claim 2, which is characterized in that the amplification factor of first camera lens is less than second mirror
The amplification factor of head, the amplification factor of second camera lens are less than the amplification factor of the third camera lens.
4. the apparatus according to claim 1, which is characterized in that described device further includes：
Three-dimensional moving guide rail is connect with the mobile platform, the mobile platform to be driven to move.
5. device according to claim 4, which is characterized in that the three-dimensional moving guide rail includes X-direction guide rail, Y-direction
Guide rail and Z-direction guide rail, and the X-direction guide rail, the Y-direction guide rail and the Z-direction guide rail hang down mutually between any two
Directly.
6. device according to claim 5, which is characterized in that the X-direction guide rail, the Y-direction guide rail and the Z side
Drive motor is both provided on direction guiding rail, the mobile platform to be driven to be moved in X, Y, Z-direction.
7. device according to claim 5, which is characterized in that the X-direction guide rail, the Y-direction guide rail and the Z side
Optical ruler is both provided on direction guiding rail.
8. device according to claim 7, which is characterized in that the precision of the optical ruler is 1um.
9. the apparatus according to claim 1, which is characterized in that the observation platform for circle, and can rotate freely with
So that the position between each camera lens switches over, and the luminous component is set to the observation platform center.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510502587.0A CN105097598B (en) | 2015-08-14 | 2015-08-14 | A kind of wafer probe cards automatic detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510502587.0A CN105097598B (en) | 2015-08-14 | 2015-08-14 | A kind of wafer probe cards automatic detection device |
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| Publication Number | Publication Date |
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| CN105097598A CN105097598A (en) | 2015-11-25 |
| CN105097598B true CN105097598B (en) | 2018-06-26 |
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| CN201510502587.0A Active CN105097598B (en) | 2015-08-14 | 2015-08-14 | A kind of wafer probe cards automatic detection device |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109212282B (en) * | 2018-08-22 | 2021-04-16 | 矽电半导体设备(深圳)股份有限公司 | A fully automatic probe detection table and its probe positioning module |
| KR102767035B1 (en) * | 2020-01-03 | 2025-02-13 | 에스케이하이닉스 주식회사 | Probe card and test apparatus having probe card |
| US20220402146A1 (en) * | 2021-06-18 | 2022-12-22 | Win Semiconductors Corp. | Testing system and method of testing and transferring light-emitting element |
| CN115166476A (en) * | 2022-06-22 | 2022-10-11 | 上海华力集成电路制造有限公司 | Method for predicting test stability of probe card according to needle marks |
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| US5404111A (en) * | 1991-08-03 | 1995-04-04 | Tokyo Electron Limited | Probe apparatus with a swinging holder for an object of examination |
| CN2684374Y (en) * | 2004-02-16 | 2005-03-09 | 经测科技股份有限公司 | Needle adjusting machine with two-way needle adjusting function |
| CN101285865A (en) * | 2007-03-23 | 2008-10-15 | 东京毅力科创株式会社 | Probe tip position detection method and apparatus, alignment method, and probe apparatus |
| CN101458972A (en) * | 2007-12-11 | 2009-06-17 | 京元电子股份有限公司 | Probe card correction apparatus |
| CN104332433A (en) * | 2014-10-29 | 2015-02-04 | 武汉新芯集成电路制造有限公司 | Probe card cleaning piece and probe card cleaning method |
| CN104748658A (en) * | 2013-12-31 | 2015-07-01 | 上海华虹宏力半导体制造有限公司 | Method and instrument for automatically measuring loss amount of pin tip of probe card |
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2015
- 2015-08-14 CN CN201510502587.0A patent/CN105097598B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5404111A (en) * | 1991-08-03 | 1995-04-04 | Tokyo Electron Limited | Probe apparatus with a swinging holder for an object of examination |
| CN2684374Y (en) * | 2004-02-16 | 2005-03-09 | 经测科技股份有限公司 | Needle adjusting machine with two-way needle adjusting function |
| CN101285865A (en) * | 2007-03-23 | 2008-10-15 | 东京毅力科创株式会社 | Probe tip position detection method and apparatus, alignment method, and probe apparatus |
| CN101458972A (en) * | 2007-12-11 | 2009-06-17 | 京元电子股份有限公司 | Probe card correction apparatus |
| CN104748658A (en) * | 2013-12-31 | 2015-07-01 | 上海华虹宏力半导体制造有限公司 | Method and instrument for automatically measuring loss amount of pin tip of probe card |
| CN104332433A (en) * | 2014-10-29 | 2015-02-04 | 武汉新芯集成电路制造有限公司 | Probe card cleaning piece and probe card cleaning method |
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Address after: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee after: Wuhan Xinxin Integrated Circuit Co.,Ltd. Country or region after: China Address before: 430205 No.18, Gaoxin 4th Road, Donghu Development Zone, Wuhan City, Hubei Province Patentee before: Wuhan Xinxin Semiconductor Manufacturing Co.,Ltd. Country or region before: China |