CN105050310B - Electronic circuit board - Google Patents

Abstract

The present invention provides an electronic circuit board capable of suppressing unnecessary stress from being generated at soldered portions of electronic components to be wave-soldered even if the electronic circuit board is warped or warped due to temperature changes. On an electronic circuit board on which electronic components are mounted by wave soldering, the electronic components include a first connector (30) having a first plurality of terminals (34), and the first plurality of terminals (34) are connected along the ) mounted on the first area (A1, A2 and A3) of the end of the wave soldering part (W) on the electronic circuit board (10), provided with a plurality of through-holes (16) arranged and arranged The through hole penetrates the installation part.

Description

Electronic circuit substrate

technical field

The present invention relates to an electronic circuit board, and particularly to an electronic circuit board that can be favorably applied to electronic control devices for vehicles.

Background technique

For electronic circuit boards that are structural components of electronic control devices mounted on vehicles such as two-wheeled vehicles and four-wheeled vehicles, it is necessary to prevent breakage of lead wires of electronic components, peeling of circuit patterns, and Corrosion and short circuit failure due to moisture intrusion.

Therefore, the following structure has been proposed for this electronic control device: the electronic circuit board is accommodated in the housing case, and resin is filled in the gap between the accommodated electronic circuit board and the inner wall of the housing case, thereby fixing and protecting the electronic circuit substrate.

Under such circumstances, Patent Document 1 discloses the structure of the electronic control device as follows: a substrate having a first component mounted on which generates heat during operation; a case for accommodating the substrate on which the first component is mounted; The material, the housing has a recessed portion recessed toward the first component mounted on the substrate.

prior art literature

Patent Document 1: Japanese Patent Laid-Open No. 2011-35106

However, according to the study of the present inventors, in the structure of Patent Document 1, resin is filled in the gap between the electronic circuit board accommodated in the storage case and the inner wall of the storage case, thereby fixing and protecting the electronic circuit board. , however, the electronic circuit substrate will expand or contract due to changes in its ambient temperature and heat generated by its installed heat-generating components.

In particular, the electronic circuit board mounted on a vehicle such as a two-wheeled automobile or a four-wheeled automobile is exposed to high heat sources such as the outside air or an engine with drastic temperature changes, and transistors, etc. constituting a drive circuit for driving a motor, etc. are mounted Heat-generating components generate high heat.

When the electronic circuit board expands or contracts in such a thermal environment, due to the difference in the amount of resin filled on the front side and the back side of the electronic circuit board, the type and number of electronic components mounted on the front and back sides of the electronic circuit board The differences in thermal expansion coefficients between the front side and the back side of the electronic circuit board may cause warping or bending of the electronic circuit board. Due to such warping or warping of the electronic circuit board, unnecessary large stress tends to be easily generated on soldered portions of electronic components mounted by wave soldering, which may affect the quality of wave soldering.

Contents of the invention

The present invention has been accomplished through the above studies, and its object is to provide an electronic circuit board capable of suppressing soldering of electronic components subjected to wave soldering even if the electronic circuit board is warped or warped due to temperature changes. Part out creates unnecessary stress.

In order to achieve the above object, the first aspect of the present invention provides an electronic circuit substrate on which electronic components are mounted by wave soldering, wherein the electronic components include a first connector having a first plurality of terminals, along The first plurality of terminals are mounted on the first region of the end of the wave solder portion on the electronic circuit board by the wave soldering, and a plurality of first through holes are arranged and arranged to form a structure. The through hole penetrates the setting part.

In addition, a second aspect of the present invention is based on the first aspect, wherein each of the first plurality of through-holes is a flat hole.

In addition, a third aspect of the present invention is based on the second aspect, wherein the diameter of the flat hole is set to such a value that when the wave soldering is performed, the opening end of the flat hole contacts The pressure under the surface tension applied to the end of the opening by the wave solder in the molten state is lower than the pressure of the ambient atmosphere.

In addition, a fourth aspect of the present invention is based on the third aspect, wherein the electronic component includes a second connector, the second connector includes a second plurality of terminals that are less rigid than the first plurality of terminals, and In the second region along the end of the wave soldering part where the second plurality of terminals are mounted on the electronic circuit board by the wave soldering, a through-hole non-penetration that does not penetrate a plurality of through-holes is provided. Set up the department.

According to the above electronic circuit board of the first aspect of the present invention, it includes a first connector having a first plurality of terminals, along the end of the wave soldering portion where the first plurality of terminals are mounted on the electronic circuit board by wave soldering In the first region of the portion, a through-hole penetrating section formed by penetrating and lining up a plurality of through-holes is provided, so that even if the electronic circuit board warps or bends due to temperature changes, it can Unnecessary stress is suppressed from being generated at the soldering portion of the electronic component which is typically the first connector to be wave-soldered.

In addition, according to the electronic circuit board according to the second aspect of the present invention, each of the first plurality of through-holes is a flat hole that is a non-conductive through-hole not covered with copper foil. Therefore, during wave soldering, filling in the flat hole can be suppressed. In the case of wave soldering, therefore, heat deflection can be better absorbed through the flat holes not filled with wave soldering, and stress concentration at the wave soldering portion W can be alleviated.

Furthermore, according to the electronic circuit board of the third aspect of the present invention, the diameter of the flat hole is set to such a value that, when wave soldering is performed, the wave solder in a molten state in contact with the open end of the flat hole is applied to the open end. The pressure under the surface tension of the part is lower than the ambient atmospheric pressure. Therefore, when the electronic component as the first connector is typically installed by wave soldering, it is possible to suppress the phenomenon that the wave solder in the molten state passes through the flat hole and sprays upward. Occurrence can prevent the phenomenon that the solder sprayed up becomes a solder ball, unnecessarily contacts between terminals of other electronic components (surface mount components), etc., and causes a short circuit.

In addition, according to the electronic circuit board according to the fourth aspect of the present invention, the electronic component includes a second connector including a second plurality of terminals less rigid than the first plurality of terminals, and the second plurality of terminals is connected along the 2. In the second region of the end of the wave solder portion where a plurality of terminals are mounted on the electronic circuit board, a through-hole non-penetrating portion is provided that does not penetrate a plurality of through-holes. Therefore, even if a through-hole is provided for the first connector The strength of the electronic circuit board will not be excessively reduced even though the installation portion is penetrated.

Description of drawings

In FIG. 1 , (a) is a perspective view showing a vehicle electronic control device to which an electronic circuit board according to an embodiment of the present invention is applied, and (b) is a perspective view showing both an electronic circuit board and a connector according to this embodiment.

In FIG. 2 , (a) is a side view showing both the electronic circuit board and the connector according to the present embodiment, and (b) is a plan view showing the electronic circuit board and the connector according to the present embodiment together.

In FIG. 3 , (a) is a partially enlarged cross-sectional view showing together the electronic circuit board and the terminal of the connector according to the present embodiment, and (b) is a partly enlarged cross-sectional view showing together the electronic circuit board and the connector according to the comparative example of the present embodiment. Partial enlarged cross-sectional view of the terminal, (c) is a schematic partial enlarged cross-sectional view when the electronic circuit board of this embodiment and the terminal of the connector are thermally deflected, and (d) is a partial enlarged cross-sectional view showing this embodiment together. A schematic partially enlarged cross-sectional view of an electronic circuit board and a terminal of a connector of a comparative example during heat deflection.

In FIG. 4 , (a) is a diagram showing simulation results of heat deflection of the electronic circuit board of the present embodiment and the terminals of the connector together, and (b) is a comparative example of the present embodiment. A diagram showing the simulation results of thermal deflection of the electronic circuit board and the terminals of the connector.

Label description

1: electronic control device for vehicle; 10, 10': electronic circuit substrate; 12: insulating substrate; 14: copper foil; 16: through hole; 18: through hole; 30: first connector; 32: shell; 34: Terminal; 40: second connector; 42: housing; 44: terminal; 50: housing; 52: opening; W: wave soldering portion; S: filling resin.

detailed description

Hereinafter, the electronic circuit board according to the embodiment of the present invention will be described in detail with appropriate reference to the drawings. In addition, in the drawing, the x-axis, y-axis, and z-axis constitute a three-axis orthogonal coordinate system, and the direction of the z-axis corresponds to the up-down direction.

〔Structure of electronic circuit board〕

First, the structure of the electronic circuit board of this embodiment will be described in detail with reference to FIG. 1( a ) to FIG. 3( a ).

1( a ) is a perspective view showing a vehicle electronic control device to which an electronic circuit board according to an embodiment of the present invention is applied, and FIG. 1( b ) is a perspective view showing both the electronic circuit board and a connector according to this embodiment. 2( a ) is a side view showing the electronic circuit board and the connector according to the present embodiment together, and FIG. 2( b ) is a plan view showing the electronic circuit board and the connector according to the present embodiment together. In addition, (a) of FIG. 3 is a partial enlarged cross-sectional view showing together the electronic circuit board and the terminal of the connector of this embodiment. In addition, in (b) of FIG. 2, the shape of a connector is shown simplified.

As shown in (a) of FIG. 1 to (a) of FIG. 3 , the electronic circuit board 10 of this embodiment is typically applied to a vehicle electronic control device such as an engine control device mounted on a vehicle such as a motorcycle. 1.

The electronic circuit board 10 is typically a printed board, and includes: an insulating substrate 12 such as a rectangular plate-like epoxy glass substrate parallel to the x-y plane; and a copper foil 14 formed on the insulating substrate 12 in a predetermined pattern. Electrical conduction part.

The electronic circuit board 10 is provided with a plurality of through holes 16 and 18 , and the plurality of through holes 16 and 18 are provided to penetrate through the upper and lower surfaces of the electronic circuit board 10 up and down, respectively. Typically, the through-hole 16 is provided with no copper foil 14 on the hole wall surface, around the upper opening, or around the lower opening, and the through-hole 16 is formed as a so-called flat hole. In the through hole 18, typically, copper foil 14 is provided on the wall surface of the hole, around the upper opening, and around the lower opening. The terminals and the like of the insulating substrate 12 are electrically connected to the upper and lower surfaces of the insulating substrate 12 . In addition, in the through-hole 18 , the copper foil 14 may be omitted from either the periphery of the upper opening or the periphery of the lower opening of the through-hole 18 .

On the electronic circuit board 10 , in addition to components such as transistors, a first connector 30 and a second connector 40 are mounted. The first connector 30 has an insulating housing 32 made of resin or the like, and a plurality of terminals 34 protruding from the housing 32 in the positive direction of the x-axis so as to be aligned in the y-axis direction and the z-axis direction. The second connector 40 has an insulating case 42 made of resin or the like, and a plurality of terminals 44 protruding from the case 42 in the positive direction of the x-axis so as to be aligned in the y-axis direction and the z-axis direction.

The first connector 30 is inserted into the electronic circuit board 10 in such a way that the terminal 34 extending horizontally from the vertical wall portion of the housing 32 on the positive side of the x-axis to the positive side of the x-axis faces the upper surface of the electronic circuit board 10 . On the portion on the negative side of the y-axis of the peripheral portion on the negative side of the x-axis of the upper surface of the circuit board 10 . The terminal 34 is made of metal such as iron, and has a curved shape that extends horizontally from the vertical wall portion of the housing 32 on the side in the positive direction of the x-axis, and its central portion is bent downward at a right angle, and its end side extends downward. . The terminal portion of the terminal 34 is attached to the copper foil 14 of the through hole 18 via the wave solder portion W by wave soldering so as to be inserted into the through hole 18 . Furthermore, in order to protect the terminals 34 , the first connector 30 has a pair of protective vertical walls 36 and 36 extending from the housing 32 in the positive direction of the x-axis on both sides in the positive and negative directions of the y-axis. In addition, in (b) of FIG. 2, illustration of the protection vertical wall 36 is abbreviate|omitted.

The second connector 40 differs from the first connector 30 in that its arrangement position is set to the positive y-axis side of the peripheral portion on the negative x-axis side of the upper surface of the electronic circuit board 10 . The other parts are the same as the first connector 30, so that the terminal 44 horizontally extending from the vertical wall portion of the housing 42 on the positive side of the x-axis to the positive side of the x-axis faces the upper surface of the electronic circuit board 10. In the form of the surface, it is inserted and mounted at the above-mentioned disposition position of the electronic circuit board 10 . The terminal 44 is made of metal such as iron, and has a curved shape that extends horizontally from the vertical wall portion of the housing 42 on the side in the positive direction of the x-axis, and its central portion is bent downward at a right angle, and its end side extends downward. . The terminal portion of the terminal 34 is attached to the copper foil 14 of the through hole 18 via the wave solder portion W by wave soldering so as to be inserted into the through hole 18 . Furthermore, in order to protect the terminal 34, the second connector 40 has a pair of protective vertical walls 46 and 46 extending from the housing 42 in the positive direction of the x-axis on both sides in the positive and negative directions of the y-axis. In addition, in (b) of FIG. 2, illustration of the protection vertical wall 46 is abbreviate|omitted.

Here, the rigidity of the terminal 34 of the first connector 30 is set higher than the rigidity of the terminal 44 of the second connector 40 . As the main reason why the rigidity of the terminals 34 of the first connector 30 is higher than the rigidity of the terminals 44 of the second connector 40, the following cases can be cited: the second connector 40 is formed from the upper surface of the electronic circuit board 10 The height of the high-back connector is higher, and the first connector 30 is a low-back connector with a lower height from the upper surface of the electronic circuit substrate 10, so the terminal 34 of the first connector 30 is from the x of the housing 32 The height of the portion of the terminal 34 that extends horizontally toward the positive side of the x-axis from the wall portion on the positive side of the axis is lower than the height of the same portion of the terminal 44 of the second connector 40, and the portion that is bent downward and hangs down The length is short. Furthermore, as another factor, the first connector 30 has to be made of a high-strength metal member because the number of terminals 34 is large and the cross-sectional area has to be small.

In addition, the through hole 16 provided on the electronic circuit board 10 is provided at a predetermined distance from the end of the wave soldering portion W that is close to but not in contact with the end of the wave soldering portion W that connects the first The terminals 34 of the connector 30 are fixed in a state of being inserted into the electronic circuit board 10 through the through holes 18 . In addition, when viewed from the through hole 16 as a whole, the plurality of through holes 16 are close to but not in contact with the end of the wave solder portion W that mounts the corresponding terminal 34 of the first connector 30 on the electronic circuit board 10 . part and spaced a predetermined distance from the end part, and are arranged in a row in the areas A1, A2 and A3 set along the arrangement of the wave solder part W. Here, the area A1 is an area surrounding the terminals 34, and is set to correspond to the terminals 34 arrayed in the y-axis direction on the farthest side in the positive direction of the x-axis of the first connector 30 along the y-axis direction. The end of the wave soldering portion W on the positive side of the x-axis extends in the y-axis direction. In addition, the areas A2 and A3 are areas surrounding the terminals 34, respectively, and are set to correspond to the terminals 34 arrayed in the x-axis direction of the first connector 30 so as to be arranged along the farthest side in the positive direction of the y-axis and the negative terminal 34. The ends of the wave solder portion W on the farthest side in the positive direction and the negative direction of the y-axis extend in the direction of the x-axis, and the area A2 is set on the positive side of the y-axis with respect to the first connector 30 . A3 is set on the negative side of the y-axis with respect to the first connector 30 . Furthermore, from the viewpoint of improving the mounting efficiency on the electronic circuit board 10 , it is preferable that the terminals 34 provided in the areas A2 and A3 are arranged below the pair of protective vertical walls 36 and 36 . In addition, terminals 34 may be arranged in multiple columns. In addition, regarding these areas A1, A2, and A3, any one of them may be omitted as necessary.

On the other hand, it is not necessary to set the areas A1 , A2 , and A3 in which the through-holes 16 are arranged for the second connector 40 . That is, the positive direction side of the x-axis along the outermost end portion of the wave solder portion W mounted with the terminal 44 of the second connector 40 inserted into the electronic circuit board 10 through the through-hole 18 The region of , the region on the positive side of the y-axis, and the region on the negative side of the y-axis are portions of the electronic circuit board 10 where the through-hole 16 is not formed.

In addition, when performing wave soldering with the terminals 34 of the first connector 30 inserted into the electronic circuit board 10 through the through holes 18 , if the molten wave solder liquid is placed on the lower surface side of the electronic circuit board 10 , the molten wave solder will come into contact with the lower openings of the through-holes 16 provided on the electronic circuit board 10 . At this time, if the molten wave solder in contact with the lower opening of the through-hole 16 passes through the through-hole 16 above and reaches and adheres to the upper surface of the electronic circuit board 10, an unnecessary wave will be formed. solder part. Therefore, first, if the through-hole 16 is formed as a flat hole without the copper foil 14, the wettability of the molten wave solder to the through-hole 16 can be reduced, so that the molten wave solder can be prevented from passing through the through-hole 16 above. However, the case where it reaches the upper surface of the electronic circuit board 10 is therefore preferable. In addition, from the viewpoint of suppressing the wave soldering in the molten state from passing through the through hole 16 above and reaching the upper surface of the electronic circuit board 10, it is preferable to set the diameter of the through hole 16 to such a value that when wave soldering is performed in this way, The pressure under the surface tension applied to the lower opening of the through hole 16 by the molten wave solder in contact with the lower opening of the through hole 16 is equal to or lower than the atmospheric pressure on the upper surface side of the electronic circuit board 10 , for example, atmospheric pressure. the following.

After the electronic circuit board 10 having the above-mentioned structure is fixed and installed in such a manner as to be accommodated in the internal space from the opening 52 of the casing 50 made of resin, etc., it is sealed in the casing 50 by the filling resin S, thereby becoming a vehicle-use substrate. Structural components of the electronic control unit 1 . Typically, the electronic circuit board 10 mounted and enclosed in the housing 50 is substantially fixed at its end X on the positive side of the x-axis and its ends Y1 and Y2 on both positive and negative sides of the y-axis.

Here, when the vehicle electronic control device 1 is mounted on a vehicle (not shown) and operated, the electronic circuit board 10 is exposed to heat generated by heat-generating components such as transistors mounted on the electronic circuit board 10 and heat transmitted from the vehicle. middle. If heat is applied to the electronic circuit substrate 10 as above, thermal deflection will occur on the electronic circuit substrate 10, so further referring to FIG. 3 (b) to FIG. The state of the electronic circuit board 10 at the time of heat application will be described.

[The state of the electronic circuit board when heat is applied]

(b) of FIG. 3 is a partially enlarged cross-sectional view showing together an electronic circuit board and a terminal of a connector according to a comparative example of this embodiment, and (c) of FIG. Fig. 3(d) is a schematic partial schematic partial view of an electronic circuit board and a connector terminal of a comparative example of this embodiment when thermally deflected. Zoom in on the section view. In addition, FIG. 4( a ) is a diagram showing the simulation results of thermal deflection of the electronic circuit board of this embodiment and the terminals of the connector together, and FIG. 4( b ) is a diagram showing the simulation results of this embodiment together. The figure which shows the simulation result at the time of thermal deflection of the electronic circuit board of the comparative example and the terminal of a connector. In addition, the positions in (b) of FIG. 3 to (b) of FIG. 4 correspond to (a) of FIG. 3 . In addition, illustration of the copper foil 14 is abbreviate|omitted in FIG.4(a) and FIG.4(b).

As shown in FIG. 3( b ), the electronic circuit board 10 ′ of the comparative example of this embodiment differs from the electronic circuit board 10 of this embodiment only in that it has The structure omits the structure of the through hole 16, and the rest of the structure is the same.

Here, as shown in FIG. 3(c) and FIG. 3(d), for the electronic circuit board 10 of the present embodiment and the electronic circuit board 10' of the comparative example, the use of the electronic circuit boards 10 and 10' are considered respectively. Warping occurs when heat is applied under the same conditions. In addition, in FIG. 3(c) and FIG. 3(d), electronic circuit boards 10 and 10' warp downwardly in a convex shape due to the thermal deflection. In addition, FIG. 3(c) and FIG. 3(d) show the warped state of the electronic circuit boards 10 and 10' on the end X on the positive side of the x-axis as an example, and the electronic circuit The state of warping at the ends Y1 and Y2 on the positive and negative sides of the y-axis of the substrates 10 and 10 ′ is also the same.

Specifically, as shown in (c) of FIG. 3 , in the electronic circuit substrate 10 of this embodiment, with the through-hole 16 (as an example, included in the region A1 ) as the boundary, on the electronic circuit substrate 10 , the first The part on the side of the terminal 34 of the connector 30 is hardly warped, and is maintained in a substantially flat state, while the part on the electronic circuit board 10 farther away from the terminal 34 of the first connector 30 is warped. song. That is, this means that less bending stress due to less heat deflection occurs at the wave solder portion W corresponding to the terminal 34 of the first connector 30 . The reason why the electronic circuit board 10 bends into this shape is considered to be that the local rigidity of the electronic circuit board 10 formed with the through-holes 16 arranged in a row is lowered, and the row of the through-holes 16 functions as a kind of broken line. The deflection mainly occurs in the portion between the positive x-direction end portion of the electronic circuit board 10 that is the fixed end side of the electronic circuit board 10 and the through hole 16, and the deflection is hardly transmitted to the through hole 16. The portion on the side of the terminal 34 of the first connector 30 of the electronic circuit board 10 . That is, it is preferable that such a plurality of through-holes 16 are arranged close to each other with a predetermined distance apart so as to function as the above-mentioned fold lines, and are configured in a linear row.

On the other hand, as shown in (d) of FIG. 3 , no through hole 16 is provided on the electronic circuit board 10 ′ of the comparative example, so the electronic circuit including the wave solder portion W of the terminal 34 of the first connector 30 The entire substrate 10' is warped. That is, this indicates that a large bending stress due to large thermal deflection is generated at the wave solder portion W corresponding to the terminal 34 of the first connector 30 .

Specifically, as shown in FIG. 4(a) and FIG. 4(b), when heat is applied under the same conditions to the electronic circuit board 10 of the present embodiment and the electronic circuit board 10' of the comparative example, warping occurs. stress. Here, the bending stress is greater on the upper surface side of the electronic circuit boards 10 and 10'.

Specifically, as shown in (b) of FIG. 4 , on the wave solder portion W of the electronic circuit board 10' of the comparative example, the region M having a moderate bending stress has a larger area, and the region L having a lower bending stress has a large area. The area is about the same size as the area of the region M, and the size of the area of the region H where the bending stress is the highest is also considerable.

On the other hand, as shown in FIG. 4( a ), on the wave solder portion W of the electronic circuit board 10 according to this embodiment, compared with FIG. 4( b ), the bending stress of the region M is moderate. The area is greatly reduced, and the area of the region L with the lower bending stress is much larger than the area of the region M, and the area of the region H with the highest bending stress is also reduced to about half. Thus, in the electronic circuit board 10 of the present embodiment, it can be understood that the bending stress is significantly reduced as an effect of providing the through-hole 16 .

As can be seen from the above description, the electronic circuit substrate 10 of this embodiment is an electronic circuit substrate 10 on which electronic components are mounted by wave soldering. The electronic components include a first connector 30 having a first plurality of terminals 34, In the first regions A1, A2, and A3 where the first plurality of terminals 34 are mounted on the ends of the wave solder portion W on the electronic circuit board 10, a plurality of through holes 16 are arranged to penetrate and form through holes. Even if the electronic circuit board 10 warps or bends due to temperature changes, unnecessary stress can be suppressed from being generated at the soldering portion W of the first connector 30 that is wave-soldered.

Furthermore, in the electronic circuit board 10 of the present embodiment, more specifically, each of the plurality of through-holes 16 is a flat hole as a non-conductive through-hole not covered with copper foil. Since the flat hole 16 is filled with wave solder, thermal deflection can be better absorbed by the flat hole 16 not filled with wave solder, and the concentration of stress at the wave soldering portion W can be eased.

In addition, with regard to the electronic circuit board 10 of the present embodiment, more specifically, the diameter of the flat hole 16 is set to such a value that when wave soldering is performed, the diameter of the molten state in contact with the opening end of the flat hole 16 is set. The pressure under the surface tension applied by the wave solder to the opening end is below the ambient atmospheric pressure, so when the first connector 30 is installed by wave soldering, it is possible to suppress the phenomenon that the molten wave solder passes through the flat hole 16 and sprays upwards. , It can suppress the phenomenon that the solder sprayed on the top becomes a solder ball, unnecessarily contacts between terminals of other electronic components (surface mount components), etc., and causes a short circuit.

In addition, regarding the electronic circuit board 10 of the present embodiment, more specifically, the electronic component includes a second connector 40 including a second plurality of terminals 44 that are lower in rigidity than the first plurality of terminals. In the second area along the end of the wave soldering portion where the second plurality of terminals 44 are mounted on the electronic circuit board 10 by wave soldering, there is provided a through-hole non-penetration portion that does not penetrate through the plurality of through-holes. Even if the first connector 30 is provided with the through-hole penetrating portion, the strength of the electronic circuit board 10 will not be excessively reduced.

In addition, the type, shape, arrangement, number, etc. of the components described in the present invention are not limited to the above-mentioned embodiments, and the structural elements can be appropriately replaced with elements that can obtain equivalent effects, and of course, within the scope of not departing from the gist of the invention Make appropriate changes within.

Industrial Utilization Possibility

As above, the present invention provides an electronic circuit board capable of suppressing unnecessary stress on soldered portions of electronic components to be wave-soldered even if the electronic circuit board is warped or warped due to temperature changes, based on Its universal applicability is expected to be widely used in electronic control devices for vehicles such as motorcycles.

Claims (4)

1. An electronic circuit substrate, which is mounted with electronic components by wave soldering, and is parallel to a plane formed by a first direction and a second direction perpendicular to the first direction, the electronic circuit substrate is characterized in that, The electronic component includes a first connector having a first plurality of terminals extending in an extending direction parallel to the first direction and arranged in an arrangement direction parallel to the second direction , Surrounding the end portion on one side of the extending direction and the end portion on one side of the arrangement direction in the wave soldering portion where the first plurality of terminals are mounted on the electronic circuit board by the wave soldering In the first region, there is provided a through-hole penetrating part formed by penetrating and arranging a plurality of first through-holes on the electronic circuit board, wherein the first through-holes are close to but not in contact with all the electronic circuit boards. The way of the end portion on one side of the extending direction and the end portion on one side of the arrangement direction of the wave solder portion is the same as the end portion on one side of the extending direction and the arrangement direction The ends on one side are spaced apart. 2. The electronic circuit substrate according to claim 1, wherein The first plurality of through holes are respectively flat holes. 3. The electronic circuit substrate according to claim 2, wherein: The diameter of the flat hole is set to such a value that when the wave soldering is performed, the wave solder in a molten state in contact with the opening end of the flat hole is applied to the opening end under the surface tension. The pressure is below the ambient atmospheric pressure. 4. The electronic circuit substrate according to claim 3, wherein said electronic component includes a second connector including a second plurality of terminals less rigid than said first plurality of terminals, In the second region along the end portion of the wave soldering portion where the second plurality of terminals are mounted on the electronic circuit board by the wave soldering, a through-hole not penetrating through the plurality of through-holes is provided. Through the setup section.