CN105048137B - Circuit substrate terminal for connecting - Google Patents

Abstract

The present invention relates to a terminal for connecting a circuit board. Its object is to provide a circuit board connection terminal that does not change the height of the contact portion of the leaf spring on the circuit board, does not cover the contact portion with solder flux, and can obtain reliable connection to an external conductor. Between the base plate part of the cantilever supporting the leaf spring elastically contacting the external conductor and the soldered connection part, a foot part is formed to support the base plate part in parallel above the circuit board at a set interval, so that the plate The free end side of the reed protrudes from between the base plate portion and the circuit board. The leaf spring is supported at a high position away from the soldered connection, so it will not be covered with flux.

Description

Terminals for circuit board connection

technical field

The present invention relates to a terminal for connecting a circuit board. The soldered connection part is soldered to a conductive pattern of a circuit board, and mounted on the circuit board so that the conductive pattern of the circuit board is electrically connected to an external conductor such as a surrounding shielding plate. More specifically , Relating to a circuit board connection terminal provided with a U-shaped plate spring in elastic contact with an external conductor.

Background technique

A variety of circuit board connection terminals that connect the ground pattern of the printed wiring board to the surrounding shield plate to make it short-circuit, etc., and electrically connect the conductive pattern of the circuit board mounted on the circuit board to the external conductor known to the people. Conventionally, the circuit board connection terminal mounted on the circuit board is such that a plate spring having a spring span of a predetermined length comes into elastic contact with an external conductor, and is electrically connected to the external conductor. As shown in Patent Documents 1 to 3, in order not to Reduce the mounting density of the circuit substrate, so that the plate spring is bent into a U shape, so as not to increase the projected area on the circuit substrate.

Hereinafter, the circuit board connection terminal 100 described in patent document 1 is demonstrated using FIG.11 (a), (b). The circuit board connection terminal 100 is a ground terminal for short-circuiting the ground pattern of the printed wiring board and its surrounding shield plate, and is integrally provided with a base plate portion 101 soldered to the ground pattern of the printed wiring board. , a plate spring 102 folded back into a U-shape from one side of the base plate 101 toward the top of the base plate 101, and a pair of engaging walls 103, 103 erected from both sides of the base plate 101.

The upper ends of the pair of engaging walls 103 , 103 form limiting portions 103 a , 103 a bent inwardly at right angles so that the front end 102 a of the leaf spring 102 is engaged and positioned. The base end side of the front end portion 102a is formed as a planar adsorption area 104 which is a flat surface, and its surface becomes a horizontal plane parallel to the base plate portion 101 when the front end portion 102a is engaged with the stopper portion 103a and the leaf spring 102 is positioned.

A plurality of terminals 100 for connecting circuit boards configured in this way are arranged on a tape, and the flat suction area 104 is sucked and held by the suction nozzle of an automatic device, and the base plate portion 101 is placed on a printed wiring board coated with cream solder or the like. on the grounding graph. Thereafter, the ground pattern facing the base plate portion 101 is connected by soldering through a reflow furnace, and mounted on a printed wiring board.

In the state mounted on the printed wiring board, the front end portion 102a is engaged with the stopper portion 103a, and the plate spring piece 102 is positioned in the vertical direction. The height of the printed wiring board is also positioned at a certain height, and it is contacted with the same contact pressure at the same position as the external conductor.

[Patent Document 1] Japanese Utility Model Registration No. 3064756

[Patent Document 2] Japanese Patent No. 3851526

[Patent Document 3] Japanese National Publication No. 2012-503855

In the conventional circuit board connection terminal 100 described in Patent Document 1, there is a concern that the soldering flux rises when soldering from the base plate portion 101 soldered to the ground pattern of the printed wiring board along the plate spring piece 102. The contact portion of the plate spring piece 102 is covered to cause poor connection with the external conductor.

In addition, if the height from the printed wiring board to the outer conductor is changed, the contact position and contact pressure with the leaf spring 102 will also be different, so it is necessary to redesign and manufacture the completely different length or shape of the leaf spring 102 itself. terminals for circuit boards.

In addition, the planar suction region 104 that is sucked by the suction nozzle of the automatic equipment is formed near the center of gravity of the entire circuit board terminal, and if the length or shape of the plate spring piece 102 is changed, the center of gravity also moves. Therefore, if the planar suction region 104 of the circuit board terminal whose shape is only changed by the leaf spring piece 102 is sucked by the suction nozzle, when it moves to the ground pattern, the balance will be broken and it will fall or cannot be placed on the board in a correct posture. Problems with the ground pattern. Therefore, not only the plate spring piece 102 but also a terminal for a circuit board which is changed up to the position of the planar suction region which is a flat surface needs to be manufactured separately.

In addition, the position where the flat suction area 104 is formed needs to be formed at a position where the suction nozzle close to the flat suction area 104 does not interfere with the plate spring piece 102. In the circuit board connection terminal 100, the top of the plate spring piece 102 is processed into a flat surface. , set as the plane adsorption area 104. However, an additional processing step is required to further process the middle portion of the bent U-shaped leaf spring 102 into a flat surface. Therefore, a part of the originally flat base plate portion 101 has conventionally been used as a planar adsorption area. However, as mentioned above, the upper part of the planar adsorption area must be set not to be covered by the leaf spring. Therefore, not only the planar adsorption area cannot be formed near the center of gravity, but also the planar adsorption area cannot be formed in the vertical direction with the leaf spring. The overlapping position increases the projected area on the circuit board, which hinders the high-density mounting of the circuit board.

In addition, in the conventional terminal 100 for connecting a circuit board, in order to set the contact portion of the leaf spring piece 102 at a constant height before being connected to an external conductor, it is necessary to provide a pair of stopper portions 103a of the engaging walls 103 .

Contents of the invention

The present invention is proposed in view of the problems existing in the prior art, and its object is to provide the contact portion of the plate spring on the circuit board without changing the height, the contact portion will not be covered by soldering flux, and the same can be obtained. Terminals for connecting circuit boards with reliability in the connection of external conductors.

Furthermore, another object of the present invention is to provide a circuit board connecting device that does not change the shape of the leaf spring, does not change the contact pressure, and does not change the position of the center of gravity even if the height of the outer conductor relative to the circuit board is changed. terminals.

Still another object of the present invention is to provide a circuit board connection terminal capable of forming a planar suction region near the center of gravity without increasing the projected area on the circuit board.

Still another object of the present invention is to provide a circuit board connection terminal capable of adjusting the height of the contact portion of the leaf spring in a free state without providing an additional stopper.

In order to achieve the above object, the terminal for connecting the circuit substrate described in the technical solution 1 of the present invention electrically connects the conductive pattern of the circuit substrate to the external conductor, which includes:

The soldering connection part is soldered to the conductive pattern of the circuit board;

a base plate portion supported on the circuit board parallel to the circuit board; and

U-shaped plate spring, the contact part on the free end side is in elastic contact with the external conductor;

The above-mentioned circuit board connection terminal is characterized in that:

Between the base plate portion and the solder connection portion, a foot portion is formed that supports the base plate portion in parallel above the circuit board at a predetermined interval, and the plate spring uses one end side of the base plate portion as a base end, Inserted through the gap between the base plate portion and the circuit board, the free end side protrudes to the other end side of the base plate portion and supported by a cantilever.

The leaf springs are supported above the circuit board with the feet at a set interval, so that the flux when soldering the solder connection to the conductive pattern of the circuit board does not reach up to the contact portion of the leaf springs. . Between the circuit board and the base plate part separated by the leg part, the plate spring is bent, so even if the leg part is provided, the height on the circuit board of the contact position where the contact part elastically contacts the external conductor does not change, Low profile without compromising the overall.

The U-shaped leaf spring has one end side of the base plate as the base end, and is inserted through the gap between the base plate and the circuit board and supported by a cantilever. The span of the spring is sufficiently long, and the overall length of the terminal for circuit board connection does not increase.

The terminal for connecting a circuit board according to claim 2 is characterized in that the base plate portion is erected between a pair of leg portions that stand parallel to each other from the pair of solder connection portions, and the pair of solder connection portions, the pair of The leg portion, the base plate portion, and the leaf spring are integrally formed by a single conductive metal plate.

The plate spring is stably supported by the base plate portion erected between a pair of leg portions erected in parallel.

The shape of the plate spring or the position of the contact part of the plate spring does not change, only the height of a pair of legs is changed, and the contact part elastically contacts with the external conductors of different heights on the circuit substrate.

The height of a pair of leg parts is changed by only changing the width of a pair of leg parts stamped and formed from a single conductive metal plate.

Also, even if the height of the pair of legs is changed, the overall center of gravity position does not substantially change.

The terminal for connecting a circuit board according to claim 3 is characterized in that a planar suction region is formed on the plane of the base plate portion so that the suction nozzle of the mounting device is attracted to the base plate portion.

Since the center of gravity of the whole is located on the plane of the base plate, when the plane suction area formed near the center of gravity is sucked and moved by the suction nozzle, it will not fall due to a loss of balance, and will not be placed on the circuit board in an oblique posture.

The base end of the plate spring is inserted through the gap between the base plate and the circuit board, and the free end side protrudes to the other end side of the base plate, so it does not interfere with approaching the base plate from above. interference with the suction nozzles on the side.

The terminal for connecting a circuit board according to claim 4 is characterized in that the assembly stress of the plate spring piece when it is bent into a U-shape abuts against the other end of the base plate portion, and the contact portion before elastically contacting the external conductor is positioned. .

The base plate portion of the cantilever supporting leaf spring functions as a stopper for positioning the height of the contact portion of the leaf spring.

The terminal for connecting a circuit board according to claim 5 is characterized in that a plurality of leaf springs are cantilevered and supported on one end side of the base plate part parallel to each other.

The contact portions of the plurality of plate springs are in elastic contact with the external conductor, so even if a contact portion of a certain plate spring has poor contact with the external conductor, the external conductor and the terminal for connecting the circuit board can be reliably electrically connected.

The effect of the present invention is described below:

According to the invention of claim 1, as the height above the circuit board of the contact part of the plate spring does not change, and the solder flux does not reach the contact part when mounting on the circuit board, the contact part and the external conductor can be reliably electrically connected.

In addition, the spring span of the plate spring can be made sufficiently long without enlarging the projected area on the circuit board.

According to the invention of technical solution 2, the plate spring is stably supported on the base plate portion erected between a pair of legs erected in parallel, and even if the contact portion is elastically contacted to the external conductor, the base plate portion or the leg portion will not be affected. No torsional stress occurs.

In addition, even if the height of the outer conductor on the circuit board with which the contact portion is elastically contacted is changed to a different height, only the height of the pair of legs is correspondingly changed without changing the shape of other parts such as the leaf spring, so that the contact portion can be adjusted to a different height. Contacts of external conductors of different heights. The shape of the plate spring does not change, so the position of the contact part does not change, the contact pressure with the elastic contact with the external conductor does not change, and the connection characteristics do not change.

Even if the height of the pair of legs is changed, the overall center of gravity does not move greatly. Therefore, there is no need to form the planar adsorption area on the flat surface for adsorption by the adsorption nozzle of the automatic equipment at another position.

In addition, only by changing the width of a pair of legs stamped and formed by a conductive metal plate, the height of the legs can be changed, and the height on the circuit board of the contact portion elastically contacting the external conductor can be adjusted.

According to the invention of claim 3, regardless of the interference with the suction nozzle, a plane suction area can be formed on the plane of the base plate portion that overlaps the plate spring in the vertical direction, so that the circuit board can be realized without enlarging the mounting area on the circuit board. High-density mounting of substrates.

According to the invention of claim 4, the height of the contact portion of the leaf spring can be positioned without forming a stopper.

According to the invention of claim 5, high connection reliability between the conductive pattern of the circuit board and the external conductor can be obtained.

Description of drawings

FIG. 1 is a perspective view viewed obliquely from above on the front side of a circuit board connection terminal 1 according to an embodiment of the present invention.

FIG. 2 is a perspective view seen obliquely from below on the rear side of the circuit board connection terminal 1 .

FIG. 3 is a side view of the circuit board connection terminal 1 .

FIG. 4 is a vertical cross-sectional view of the circuit board connection terminal 1 cut along the leaf spring piece 2 .

FIG. 5 is an explanatory view showing a state of use of the circuit board connection terminal 1 .

FIG. 6 is a perspective view seen obliquely from above on the front side of the circuit board connection terminal 20 according to the second embodiment.

FIG. 7 is a vertical cross-sectional view of the circuit board connection terminal 20 cut along the leaf spring piece 2 .

8 shows a coil formed by stamping a conductive metal plate, (a) is a plan view of main parts of a coil 3 forming a circuit board connection terminal 1, and (b) is a plan view of a coil 21 forming a circuit board connection terminal 20. Main part floor plan.

9( a ) is a perspective view viewed obliquely from above on the front side of the circuit board connection terminal 30 according to the third embodiment, and (b) is a side view of the circuit board connection terminal 30 according to the third embodiment. Longitudinal sectional view of reed 2 cut off.

FIG. 10 is a perspective view seen obliquely from above on the front side of the circuit board connection terminal 40 according to the fourth embodiment.

11 shows a circuit board connection terminal 100, (a) is a vertical cross-sectional view cut along the plate spring 102, (b) is a plan view.

The meanings of the symbols in the figure are as follows:

1, 20, 30, 40 - Terminals for connecting circuit boards

2 - leaf spring

4, 22, 31, 41 - feet

5,33,42 - Brazed connections

6,32 - base plate

7 - contact part

8 - Plane adsorption area

10 - shielded shell

11 - Printed wiring board (circuit board)

12 - carrier

detailed description

Next, a circuit board connection terminal 1 according to an embodiment of the present invention will be described using FIGS. 1 to 5 and FIG. 8( a ). As shown in FIG. 5 , this circuit board connection terminal 1 is installed on the printed wiring board for the purpose of electrically connecting the shielding case 10 of the electronic device to a ground pattern not shown in the printed wiring board 11 to make it grounded. The terminals on the substrate 11 are therefore simply referred to as ground terminals 1 hereinafter. In addition, in the following description, the left side of FIG. 3 is taken as the front, the right side is taken as the rear, and the up-down direction is taken as the up-down direction as it is, and the position of each part will be described.

As shown in Figures 1 to 4, the terminal 1 for connecting the circuit board is integrally formed by an elastic conductive metal plate such as phosphor bronze or titanium copper: a pair of rectangular plate-shaped legs 4 and 4 standing vertically , a pair of brazing connection parts 5, 5 arranged continuously in the horizontal direction from the bottom surface of each leg part 4 to the outside, erected on the base plate part 6 close to the rear of the pair of leg parts 4, 4, and supported by a cantilever U-shaped leaf spring piece 2 at the rear end of base plate portion 6 .

The soldering connection part 5 is parallel to the surface of the printed wiring board 11, arranged on the grounding pattern with cream solder formed on the corresponding part of the printed wiring board 11, and brazed with the grounding pattern through a reflow furnace, Electrically connected to the ground pattern. A pair of brazing connection parts 5, 5 are separated from each other by parallel widths of the base plate part 6, and respectively form elongated strips along the front and rear directions. The whole is mounted on the surface in a state of being firmly fixed to the printed wiring board 11 .

The width in the front-back direction of the rectangular leg portion 4 can be set to any width as long as the ground terminal 1 has a sufficient length not to rotate in the front-back direction. Here, the width is adjusted so that the center of gravity of the whole ground terminal 1 becomes the base plate portion 6. the central. Also, the width in the vertical direction, that is, the height of the leg portion 4 is determined by the distance between the printed wiring board 11 and the shield case 10 serving as an external conductor. The contact portion 7 of the leaf spring piece 2 has a height at which it elastically contacts the shield case 10 .

The base plate portion 6 is horizontally supported near the rear of the pair of leg portions 4, 4, and by making the whole into a flat surface, a planar adsorption area 8 indicated by a dotted line in the figure that is adsorbed by the general-purpose nozzle of the installation device is formed on the surface. . The size of the plane suction area 8 is formed by a flat surface with a size of at least φ0.6 cm, so that the ground terminal 1 can be sucked and transported by a suction nozzle of a general-purpose automatic equipment. The base plate part 6 is erected on the rear side close to the pair of leg parts 4, 4, and the gap near the front between the pair of leg parts 4, 4 is opened above.

The plate spring 2 is formed as an elongated strip-shaped plate that is continuously integrated with the rear end of the base plate portion 6, and is folded back into a U-shape from the base end connected to the rear end toward the lower front, and the folded middle connecting portion 2a faces toward the bottom. The front is inserted through the gap between the base plate portion 6 and the printed wiring board 11 separated by the leg portion 4, and its free end side protruding forward passes through the opening near the front between the pair of leg portions 4, 4, It protrudes obliquely upwards in front of the base plate portion 6 and is supported by a cantilever on the rear end of the base plate portion 6 . The front end of the free end protruding obliquely upward in front of the base plate portion 6 is further folded back downward into a U-shape, and the uppermost end of the front end becomes the contact portion 7 elastically contacting the shield case 10 .

The leaf spring 2 is bent into the above-mentioned shape by stamping and forming. In the bending process, the intermediate connecting portion 2a comes into elastic contact with the front end of the base plate portion 6 from below, and the contact portion 7 is fixed at a distance from the printed wiring board 11. The height is positioned.

As mentioned above, the base plate portion 6 is erected near the rear of the pair of leg portions 4, 4, and the leaf spring 2 protrudes to the front of the base plate portion 6, so the center of gravity of the whole is located in the plane adsorption area in the center of the base plate portion 6 within 8. Therefore, when the flat suction area 8 is sucked by the suction nozzle of the automatic equipment and transported to the printed wiring board 11, the ground terminal 1 can be sucked in a well-balanced manner, and the solder connection part 5 can be reliably held in a state where the solder connection part 5 is kept horizontal. It is arranged on the corresponding ground pattern of the printed wiring board 11 .

The ground terminal 1 having the above configuration is formed by bending a press-formed product 1A that is connected to a carrier 12 as shown in FIG. 8( a ) and becomes one ground terminal 1 . On the carrier 12, a plurality of stamped products 1A are continuously connected at a certain pitch P to form a coil 3 suitable for coil forming.

The stamped product 1A is provided with a pair of leg portions 4, 4 in the up-and-down direction around the base plate portion 6 in FIG. There are leaf springs 2, which are continuously arranged on the same plane respectively. That is, the vertical width in FIG. 8(a) of the press-formed product 1A is the width w1 in the left-right direction of the base plate portion 6 plus the width 2w2 of the pair of leg portions 4,4 and the width of the pair of soldered connection portions 5,5. For the width (w1+2w2+2w3) of the width 2w3, the pitch P between adjacent press-formed products 1A is at least longer than the width. The stamping machine moves the carrier 12 along its long direction with the pitch P, bends the dotted line part of the stamped product 1A into a right angle, and bends the leaf spring 2 to become a ground terminal of the shape shown in FIG. 1 After 1, cut off from the carrier.

The process of mounting the ground terminal 1 cut off from the carrier on the printed wiring board 11 is to suck the plane suction area 8 of the ground terminal 1 with the suction nozzle of the automatic equipment, and then place the solder connection part 5, 5 is placed on the ground pattern of the printed wiring board 11, and the two are soldered and connected by a reflow furnace. Thereafter, as shown in FIG. 5 , if the printed wiring board 11 on which the ground terminal 1 is mounted and the shield case 10 of the device are fixed at positions close to each other at a distance H, the contact portion 7 of the ground terminal 1 and the shield case The body 10 is elastically contacted, and the shielding shell 10 is grounded.

When the printed wiring board 11 and the shield case 10 of the equipment are fixed to each other with a distance shorter than the interval H, as shown in FIGS. The circuit board connection terminal (ground terminal) 20 connects the shield case 10 to the ground pattern of the printed wiring board 11 .

The circuit board connection terminal 20 according to the second embodiment of the present invention differs only in the vertical width of the leg portion 22, and therefore, the other structures are given the same reference numerals as the ground terminal 1, and descriptions thereof are omitted. Comparing FIGS. 1 and 6, it is clear that even if the height H from the printed wiring board 11 to the contact position with the shield case 10 as the outer conductor changes, the shape of the base plate portion 6 or the leaf spring 2 does not change. Therefore, , the contact pressure of the elastic contact or the horizontal position of the contact portion 7 does not change, and there is no need to redesign the shape of the leaf spring 2. In addition, only the height of the leg portion 22 is changed, so the overall center of gravity hardly moves, and the position of the planar adsorption region 8 of the base plate portion 6 which is a flat surface is not changed, and the ground terminal 20 can be adsorbed in a well-balanced manner.

The ground terminal 20 is formed by bending a stamped product 20A as shown in FIG.

Compared with the stamped product 1A shown in FIG. 8( a ), the vertical width of the leg portion 22 of the stamped product 20A shown in the figure is w2', which is shorter than w2. To form the press-formed product 20A, the feeding pitch P of the coil 21 can be set to the same pitch as that of the coil 3 . Therefore, even if the height from the mounted printed wiring board 11 to the contact position with the shield case 10 as the outer conductor is changed, the ground terminal 20 can be manufactured with the same press processing equipment, and only the width of the leg portion 22 is changed. , Other stamping shapes can be obtained without changing the stamped product 20A to be the ground terminal 20 .

In each of the above-mentioned embodiments, the base plate 6 is horizontally supported by a pair of legs 4, 22 at a certain distance from the circuit board 11, but the positions and numbers of the legs are not limited to the above-mentioned embodiments. FIG. 9 shows a ground terminal 30 according to a third embodiment in which one leg portion 31 is arranged on the front side, and FIG. 10 shows a ground terminal 40 according to a fourth embodiment in which one leg portion 41 is arranged on a side surface. The ground terminal 1 involved in the form is the same or has the same function, and its structure is marked with the same symbol, and its description is omitted.

The grounding terminal 30 shown in Fig. 9 (a), (b) connects the base plate portion 32 and the solder connection portion 33 of the cantilever support leaf spring 2 into a cross-sectional "U" shape with the leg portion 31 disposed on the front. , so that the free end side of the plate spring 2 is inserted through the opening 32A provided in front of the base plate portion 32 .

In addition, the ground terminal 40 shown in FIG. With approximately the same width, the base plate portion 6 is horizontally supported against the surface of the circuit board 11 .

In the above embodiment, one plate spring 2 is cantilever supported on the base plate portion 6, but the plate spring can also be divided by a slit penetrating along its longitudinal direction, and multiple plate springs cantilevered on the base plate portion.

In addition, in the above-mentioned embodiment, the description is given by using the ground terminal that connects the terminal for circuit board connection to the ground pattern of the circuit board by soldering. Be applicable.

In addition, the terminal for circuit board connection has been described as an example of being mounted on the surface of the circuit board, but it is also possible to insert the solder connection part to the back side of the circuit board and insert the solder connection to the pattern on the back side and mount it on the circuit board. .

The industrial applicability of the present invention will be described below.

The present invention is applicable to a circuit board connection terminal for electrically connecting a pattern on a circuit board and an external conductor disposed near the circuit board.

Claims (7)

1. A terminal for connecting a circuit substrate, electrically connecting the conductive pattern of the circuit substrate to an external conductor, comprising: The soldering connection part is soldered to the conductive pattern of the circuit board; a base plate portion supported on the circuit board parallel to the circuit board; and U-shaped plate spring, the contact part on the free end side is in elastic contact with the external conductor; The above-mentioned circuit board connection terminal is characterized in that: Between the base plate portion and the solder connection portion, a foot portion is formed that supports the base plate portion in parallel above the above-mentioned circuit substrate at a predetermined interval; The leaf spring takes one end side of the base plate part as a base end, is inserted through the gap between the base plate part and the above-mentioned circuit board, and is supported by a cantilever in a state where the free end side protrudes to the other end side of the base plate part; The above-mentioned base plate part is erected near the rear of the above-mentioned foot part, the gap close to the front is opened above, and the above-mentioned plate spring protrudes to the front of the base plate part. 2. The terminal for connecting a circuit board according to claim 1, characterized in that: The base plate portion is erected between a pair of legs that stand parallel to each other from the pair of soldered connection portions; The pair of soldered connection parts, the pair of leg parts, the base plate part, and the plate spring are integrally formed by a single conductive metal plate. 3. The terminal for connecting a circuit board according to claim 1, characterized in that: On the plane of the base plate portion, there is formed a planar suction area such that the suction nozzle of the mounting device is adsorbed on the base plate portion. 4. The terminal for connecting a circuit board according to claim 2, characterized in that: On the plane of the base plate portion, there is formed a planar suction area such that the suction nozzle of the mounting device is adsorbed on the base plate portion. 5. The terminal for connecting a circuit board according to any one of claims 1 to 4, characterized in that: The plate spring abuts against the other end of the base plate portion due to assembly stress when it is bent into a U-shape, and the contact portion before elastically contacting the external conductor is positioned. 6. The terminal for connecting a circuit board according to any one of claims 1 to 4, characterized in that: A plurality of plate springs are cantilevered and supported on one end side of the base plate part parallel to each other. 7. The terminal for connecting a circuit board according to claim 5, characterized in that: A plurality of plate springs are cantilevered and supported on one end side of the base plate part parallel to each other.