CN104979310B - An intelligent micro-channel cooling device for chargers - Google Patents

Abstract

The present invention provides a kind of intelligent microchannel heat sink for charger, including upper plate, lower plate, cover plate, temperature sensor；Water stream channel, outlet pipe mounting groove are respectively equipped with upper plate and lower plate.The upper plate includes water inlet pipe；The water inlet tube wall is provided with seal groove；The cover plate enclosed inside circuit board is simultaneously fixed on upper plate with pin.The present invention preferably resolves the problem of centre is radiated, and reliability is high, and control is simple, and the heat abstractor directly can be fitted on the chip board of charger, plugs quick and convenient.

Description

An intelligent micro-channel cooling device for chargers

technical field

The invention belongs to the technical field of heat dissipation for integrated chips, and in particular relates to an intelligent microchannel heat dissipation device for integrated chips.

Background technique

With the continuous development of computer technology, the volume of electronic equipment is getting smaller and smaller, but the power and integration are greatly improved. The generation of high heat flux has become an irresistible trend, so the cooling problem of electronic equipment is becoming more and more serious. protrude. Statistics show that at present, 55% of electronic chip failure problems are caused by overheating, so research on effective and feasible electronic chip cooling devices has become an urgent problem.

Micro-channel liquid cooling is to directly attach the water-cooling plate to the surface of the heat dissipation module, and take away the heat through the forced convection of the liquid in the water-cooling plate to achieve the effect of cooling. This heat dissipation mode has the advantages of low thermal resistance, high heat dissipation power, and the coolant is not affected by gravity. Under the action of the water pump, it can dissipate heat to any module. Therefore, microchannel technology has been used in the field of heat dissipation for electronic equipment. However, in practical applications, the microchannels make the temperature field on the surface of the radiator extremely uneven, and it is impossible to conduct targeted cooling and heat dissipation for the concentrated heat-generating parts, and it is easy to damage the electrical characteristics of the device.

Contents of the invention

The purpose of the present invention is to provide an intelligent micro-channel heat dissipation device for a charger, which can better realize the uniform heat dissipation of the chip board of the charger during operation, has high reliability, and is fast and convenient to plug and unplug.

In order to achieve the purpose of the above invention, the intelligent micro-channel cooling device for chargers of the present invention adopts the following technical solutions:

An intelligent micro-channel cooling device for a charger, comprising a lower plate, an upper plate attached to the lower plate, and a cover plate; the side of the lower plate facing the upper plate is provided with several lower rings laid from the inside to the outside The flow channel and several lower branch flow channels connecting two adjacent lower annular flow channels; the side of the upper plate facing the lower plate is provided with several circles of upper annular flow channels laid from the inside to the outside and connecting two adjacent upper annular flow channels. A plurality of upper branch flow channels of the flow channel; the plurality of circles of upper annular flow channels and several circles of lower annular flow channels are correspondingly matched to form several circles of annular confluence flow channels; and the lower branch flow channels and the upper branch flow channels are correspondingly matched to form straight branch flow road;

The cover plate is installed on the upper plate, and the upper plate protrudes outwards with a water inlet pipe, and the cover plate is provided with a storage chamber surrounding the water inlet pipe, and a circuit board is arranged in the storage chamber; the inner wall of the water inlet pipe is provided with a There is a temperature sensor, which is connected to the circuit board; the water inlet pipe is connected to the annular confluence flow channel; the outermost annular confluence flow channel is connected to a water outlet pipe; the water inlet pipe is also connected to the water inlet pipe through the straight branch flow channel The innermost annular confluence channel is connected.

Compared with prior art, the beneficial effect of the present invention is:

1. The intelligent micro-channel heat dissipation device of the charger is used to be directly attached to the chip board (such as an integrated IGBT board), and through the layer-by-layer arrangement of several annular confluence channels, the circulation range of the cooling liquid is relatively large, which is a good solution Solved the problem of high chip board temperature and slow heat dissipation;

2. The temperature sensor can monitor the temperature of the cooling liquid in the center of the cooling device in real time, and input the temperature signal in time, so that the control of the device is simple and convenient, and has real-time performance;

3. On the basis of the structure of the annular confluence flow channel and the straight branch flow channel, the diameter and length of the annular confluence flow channel and the straight branch flow channel at all levels can be changed according to the heat dissipation characteristics of the heat source and the flow of the fluid in the configuration microchannel. Thermal characteristic design effectively improves the local convective heat transfer coefficient and heat transfer area of the cooling device;

4. The cooling device can achieve a more uniform distribution of the temperature field on the surface of the cooling device, which protects the power characteristics of the equipment and prolongs the life of the equipment;

5. The intelligent cooling device can be directly attached to the surface of the equipment, which is widely applicable and easy to disassemble.

Description of drawings

Fig. 1 is a perspective view of an intelligent microchannel cooling device for a charger according to the present invention;

Fig. 2 is a partially cut-away perspective view of the smart micro-channel cooling device used in the charger according to the present invention;

Fig. 3 is a bottom view of the upper plate, showing the side of the upper plate facing the lower plate;

Figure 4 is a top view of the lower plate, showing the side of the lower plate facing the upper plate.

detailed description

Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

As shown in FIGS. 1 to 4 , the present invention discloses an intelligent microchannel cooling device for a charger, which includes a lower plate 1 , an upper plate 2 bonded to the lower plate 1 , and a cover plate 3 . The upper plate 2 and the lower plate 1 are connected by four pins. . The side of the lower plate 1 facing the upper plate 2 is provided with several circles of lower annular flow channels laid from the inside to the outside and several lower branch flow channels connecting two adjacent lower annular flow channels; the upper plate 2 faces downward One side of the plate 1 is provided with several circles of upper annular flow channels laid from the inside to the outside and several upper branch flow channels connecting two adjacent upper annular flow channels. The several circles of upper annular flow channels and the several circles of lower annular flow channels are correspondingly matched to form several circles of annular confluence flow channels; the lower branch flow channels and the upper branch flow channels are correspondingly matched to form straight branch flow channels. Wherein, the diameter and length of the annular confluence flow channel and the straight branch flow channel are designed according to the heat dissipation characteristics of the heat source and the flow heat transfer characteristics of the fluid in the configuration microchannel. For example, in this embodiment, the annular confluence flow channel includes self- The first-level annular confluence flow channel 4, the second-level annular confluence flow channel 5, and the third-level annular confluence flow channel 6 are arranged inside and outside; the straight branch flow channel includes the first-level straight branch flow channel 7, the second-level straight branch flow channel 8, the third Level straight branch runner 9. The cover plate 3 is installed on the upper plate 2, and the upper plate 2 is provided with a water inlet pipe 21 protruding outward. The cover plate 3 is provided with a receiving chamber 31 surrounding the water inlet pipe 21 , and a circuit board 32 is arranged in the receiving chamber. The inner wall of the water inlet pipe 21 is provided with a temperature sensor 33. The temperature sensor 33 is connected to the circuit board 32 . The water inlet pipe 21 communicates with the annular confluence flow channel so as to inject cooling liquid into the annular confluence flow channel through the water inlet pipe 21 and fill the entire cooling device. At the same time, the outermost circular confluence channel is connected with a water outlet pipe 22 , and the cooling liquid passes through the water outlet pipe 22 after circulating in the cooling device. Wherein, the water inlet pipe 21 also communicates with the innermost annular confluence flow channel through a straight branch flow channel. The outlet pipe 22 is installed in the outlet pipe installation groove formed between the upper plate 2 and the lower plate 1, and is connected with the three-stage annular confluence channel 6, and the outlet pipe is connected to the upper plate 2 and the lower plate 1 through an O-shaped gasket. seal. The cover plate 3 is fixed on the outside of the water inlet pipe 21 of the upper plate 2 by four pins.

The signal output end of the temperature sensor 33 is sealed with the inner wall of the water inlet pipe 21 with a sealing ring.

The first-level annular confluence channel 4 is located in the second-level annular confluence channel 5, and the second-level annular confluence channel 5 is located in the third-level annular confluence channel 6; the primary annular confluence channel 4 and the water inlet pipe 21 pass through 8 first-level straight branch flow channels 7 are connected; the first-level annular confluence flow channel 4 is connected with the second-level annular confluence flow channel 5 through 16 second-level straight branch flow channels 8; the second-level annular confluence flow channel 5 is connected with the third-level annular confluence flow channel The flow channel 6 communicates with 32 three-stage straight branch flow channels 9 . In this embodiment, the first-stage, second-stage, and third-stage annular confluence channels are concentric circular channels, forming symmetrical and orderly coolant flow channels in the heat dissipation device to achieve uniform heat dissipation. The upper plate 2 is provided with a positioning boss 23 on the outside of the outermost circular confluence flow channel, and the lower plate 1 is provided with a groove (not labeled) that cooperates with the positioning boss 23 for the alignment and alignment of the upper and lower plates. Tight fit to prevent water leakage.

The intelligent micro-channel heat dissipation device used in the charging machine of the present invention is attached to the surface of the equipment (such as a chip board) that needs heat dissipation in the charging machine during use, and injects cooling liquid through the water inlet pipe 21 at all levels of the annular confluence flow channel and at all levels. While circulating in the straight branch flow channel, it absorbs the heat of the equipment and flows out from the water outlet pipe 22 to take away the heat to realize heat dissipation. A number of annular confluence flow channels are arranged layer by layer to make the circulation range of the cooling liquid larger, which solves the problem of high temperature of the chip board and slow heat dissipation. At the same time, the temperature sensor can monitor the temperature of the coolant in the central part of the cooling device in real time, and input the temperature signal there in time, so that the control of the device is simple, convenient and real-time.

Claims (8)

1. An intelligent micro-channel heat dissipation device for a charger, characterized in that: it comprises a lower plate, an upper plate and a cover plate that are bonded to the lower plate; the side of the lower plate facing the upper plate is provided with a Several circles of lower annular flow passages laid and several lower branch passages connecting two adjacent lower annular passages; the side of the upper plate facing the lower plate is provided with several circles of upper annular flow passages laid from inside to outside and connecting A plurality of upper branch flow passages of two adjacent upper annular flow passages; said several circles of upper annular flow passages and several circles of lower annular flow passages are correspondingly matched to form several circles of annular confluence flow passages; and the lower branch flow passages and the upper branch flow passages Correspondingly cooperate to form a straight branch flow channel; The cover plate is installed on the upper plate, and the upper plate protrudes outwards with a water inlet pipe, and the cover plate is provided with a storage chamber surrounding the water inlet pipe, and a circuit board is arranged in the storage chamber; the inner wall of the water inlet pipe is provided with a There is a temperature sensor, the temperature sensor is connected to the circuit board; the water inlet pipe is connected to the annular confluence flow channel; among the plurality of ring confluence flow channels, the outermost ring confluence flow channel is connected to a water outlet pipe; the water inlet pipe is also The straight branch flow channel communicates with the innermost annular confluence flow channel. 2. The intelligent micro-channel cooling device for chargers according to claim 1, characterized in that: the signal output end of the temperature sensor is sealed with the inner wall of the water inlet pipe with a sealing ring. 3. The intelligent microchannel cooling device for charger according to claim 1, characterized in that: said annular confluence flow channel comprises primary, secondary and tertiary annular confluence channels arranged from inside to outside; The branch flow channels include primary, secondary, and tertiary straight branch channels; the primary annular confluence flow channel is located in the secondary annular confluence flow channel, and the secondary annular confluence flow channel is located in the third-stage annular confluence flow channel; The confluence flow channel and the water inlet pipe are connected through 8 first-level straight branch channels, the first-level annular confluence flow channel is connected with the second-level annular confluence flow channel through 16 second-level straight branch channels, and the second-level annular confluence flow channel is connected with the second-level annular confluence flow channel. The three-stage annular confluence flow channel is connected through 32 three-stage straight branch flow channels. 4. The intelligent micro-channel cooling device for chargers according to claim 3, characterized in that: the primary, secondary, and tertiary annular confluence channels are circular channels with concentric centers. 5. The intelligent micro-channel cooling device for chargers according to claim 1, characterized in that: the upper board and the lower board are connected by four pins. 6. The intelligent micro-channel cooling device for chargers according to claim 3, characterized in that: the outlet pipe is installed in the outlet pipe installation groove formed between the upper plate and the lower plate, and confluence with the three-stage ring The flow channel is connected, and the outlet pipe is sealed with the upper plate and the lower plate through the O-ring. 7. The intelligent micro-channel heat dissipation device for chargers according to claim 1, wherein the cover plate is fixed on the outer side of the water inlet pipe of the upper plate by four pins. 8. The intelligent micro-channel cooling device for chargers according to claim 7, characterized in that: the upper plate is provided with a positioning boss on the outside of the outermost circular confluence channel, and the lower plate is provided with a positioning boss. Groove for boss fit.