CN104960292A - Packaging tape for carrier belt for electronic components and production method of packaging tape - Google Patents
Packaging tape for carrier belt for electronic components and production method of packaging tape Download PDFInfo
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- CN104960292A CN104960292A CN201510335854.XA CN201510335854A CN104960292A CN 104960292 A CN104960292 A CN 104960292A CN 201510335854 A CN201510335854 A CN 201510335854A CN 104960292 A CN104960292 A CN 104960292A
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- packaging belt
- stabilized zone
- intermediate layer
- adhesive layer
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 66
- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 239000010410 layer Substances 0.000 claims abstract description 125
- 239000012790 adhesive layer Substances 0.000 claims abstract description 42
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 238000003860 storage Methods 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 37
- -1 polyethylene Polymers 0.000 claims description 21
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 claims description 20
- 239000002994 raw material Substances 0.000 claims description 15
- 239000004793 Polystyrene Substances 0.000 claims description 13
- 238000001125 extrusion Methods 0.000 claims description 12
- 229920002223 polystyrene Polymers 0.000 claims description 12
- 239000004698 Polyethylene Substances 0.000 claims description 11
- 229920000573 polyethylene Polymers 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- 229920001577 copolymer Polymers 0.000 claims description 8
- 238000004026 adhesive bonding Methods 0.000 claims description 7
- 238000005984 hydrogenation reaction Methods 0.000 claims description 7
- 238000002360 preparation method Methods 0.000 claims description 6
- 239000004743 Polypropylene Substances 0.000 claims description 5
- 229920001155 polypropylene Polymers 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000000806 elastomer Substances 0.000 claims description 4
- 229920001195 polyisoprene Polymers 0.000 claims description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 3
- 239000005977 Ethylene Substances 0.000 claims description 3
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- 229920000123 polythiophene Polymers 0.000 claims description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 claims description 2
- 230000006641 stabilisation Effects 0.000 claims description 2
- 238000011105 stabilization Methods 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 17
- 230000003139 buffering effect Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 229920003023 plastic Polymers 0.000 description 7
- 239000004033 plastic Substances 0.000 description 7
- 238000007789 sealing Methods 0.000 description 7
- 230000000704 physical effect Effects 0.000 description 5
- 238000005336 cracking Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000010009 beating Methods 0.000 description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 3
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000012968 metallocene catalyst Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/05—5 or more layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/582—Tearability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2439/00—Containers; Receptacles
- B32B2439/40—Closed containers
Landscapes
- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a packaging tape for a carrier belt for electronic components and a production of the packaging tape. The packaging tape comprises a base layer, a stable layer covering the base layer, a connecting layer located between the base layer and the stable layer, a middle layer covering the stable layer and a universal adhesive layer sticking to the middle layer. The production method includes the steps of 1, co-extruding the universal adhesive layer, the middle layer and the stable layer to form a first film layer; 2, extruding the base layer to form a second film layer composed of the base layer; and 3, coating the connecting layer to the second film layer, and sticking the first film layer to the connecting layer to obtain the packaging tape. The packaging tape is suitable for carrier belts different in polarity, can be heat-sealed to the surface of the carrier belts, allows certain peeling force to be under control, is stable in service performance and rarely cracks or bursts during curling.
Description
Technical field
The present invention relates to a kind of electronic devices and components storage carrier band packaging belt with and preparation method thereof, belong to the packaging field of electronic devices and components.
Background technology
The transport of electronic devices and components and use, need to use supporting body, coordinates the shape of electronic devices and components, with housing electronic components and parts.After having received, need to cover one deck packaging belt structure at the upper surface of storage carrier band, the electronic devices and components of packaging the inside can not escape out, also protect electronic devices and components not by the interference of extraneous dust and electrostatic etc.; Packaging belt structure will both can with storage carrier band face seal, mutually can peel off with storage carrier band surface when using electronic devices and components again.The patent No. is that the Chinese invention patent of CN103153811 discloses a kind of cover layer, at least containing substrate layer (A), intermediate layer (B), peel ply (C) and the heat sealable hot sealing layer in carrier band (D), intermediate layer (B) is containing using that metallocene catalyst polymerisation obtains, that stretch modulus is below 200MPa straight-chain low density polyethylene as principal component; Peel ply (C) containing conductive material, and is that the hydrogenated resin of the aromatic vinyl-conjugated diene copolymer of 15 to 35 quality % is as principal component containing aromatic ethenyl content.The deviation of this kind of cover layer peel strength when peeling off is little, problem when can suppress to peel off in assembling procedure.
But the raw material used of the storage carrier band on market is different, comprise papery or plastics, general papery be applicable to more miniaturized electronic devices and components; For large-scale electronic devices and components, adopt the storage carrier band of plastic material, because the kind of plastics is a lot, the raw-material selection of storage carrier band is also diversified, can be one or more mixing in PS or PC or ABS etc., the polarity on the surface of the storage carrier band obtained is also different, so also just need the packaging belt structure of opposed polarity to use to coordinate the storage carrier band of opposed polarity, at present, any packaging belt is not still had to go for any one storage carrier band, disclosed in above-mentioned patent of invention, the use of cover layer, is also very restricted; And when receiving carrier band and being curling, also there is easy cracking, occur the defect of quick-fried band in existing packaging belt.
Summary of the invention
An object of the present invention is to provide the packaging belt of a kind of electronic devices and components storage carrier band, go for the storage carrier band of dissimilar polarity, can seal with the surface of storage carrier band, certain peeling force can be controlled again, peel away packaging belt when needed, expose electronic devices and components; The serviceability of packaging belt is also stablized, and there will not be the situation of cracking, quick-fried band time curling.
Two of object of the present invention is to provide the preparation method of this packaging belt, by the most easy mode, each layer can be combined, the peeling force itself formed between intermediate layer and general adhesive layer can not be had an impact, and can complement each other between each layer, by the Function of each layer to the limit, the splendid physical property of packaging belt is controlled.
An object of the present invention is realized by following proposal: the packaging belt of electronic devices and components storage carrier band, comprising:
Packaging belt is provided to shape the substrate layer of intensity for the formation of packaging belt main body;
To cover on described substrate layer and to absorb vibrations that described substrate layer produces with the stabilized zone of stabilization package band;
The articulamentum of gluing is used between described substrate layer and described stabilized zone;
Cover the intermediate layer on described stabilized zone;
Be bonded in the general adhesive layer on described intermediate layer, described general adhesive layer can and storage carrier band seal and the attachment force sealed afterwards and between carrier band is greater than attachment force between intermediate layer;
The principal component in described intermediate layer is: the polyethylene of 50-80 weight portion, the polystyrene of 30-40 weight portion, the polypropylene of 5-15 weight portion, the SB of 10-25 weight portion;
The copolymer that the linear three embedding copolymers of described general adhesive layer to be the Ethylene/Butylene obtained with polystyrene and polybutadiene hydrogenation be middle spring block or polyisoprene and polystyrene hydrogenation obtain;
The principal component of described stabilized zone is polyethylene and polyethylene octene copolymer elastomer blends.
This technical scheme by with the storage carrier band surface obtained by different materials all can thermosealed general adhesive layer and special formulation, can with control well between general adhesive layer peeling force intermediate layer between coordinate, both can seal with the storage carrier band surface heat obtained by different materials, do not affect stripping again; Again by arranging stabilized zone, the vibrations that the material of packaging belt substrate layer own causes when peeling off can being slowed down, playing effect that is stable, buffering; Articulamentum plays connection function to substrate layer and stabilized zone, and can be arranged so that the buffering effect of stabilized zone is more remarkable by articulamentum.
The resistance to ultraviolet of raw material, resistance to oxidation that general adhesive layer adopts, when receiving carrier band and being curling, there will not be cracking, can not quick-friedly be with; The raw material adopted with stabilized zone coordinates better, crack resistence and implosion prevention band more remarkable effect.
As preferably, being also added with the Tissuemat E of 0.5-2 weight portion in described intermediate layer, can having better control to the peeling force between intermediate layer and general adhesive layer, also can be that other is applicable to the wax of plastic products, preferably polyethylene wax.
As preferably, the thickness in described intermediate layer is 18 μm-25 μm, the thickness in intermediate layer is very crucial to the peeling force controlled between intermediate layer and general adhesive layer, too thin or too thick large on peeling force impact, peeling force is unstable, and the vibrations of storage carrier band can also be slowed down in intermediate layer when peeling off, too thick shock-absorbing is good, but interlaminar strength can be poor; Too thin interlaminar strength is good, but does not have damping effect;
Described articulamentum and substrate layer and stabilized zone bond, and ensure to connect effect, too thick, not only increase cost, also can affect the buffering effect of stabilized zone, and can not rapid curing, do not reach bonding strength; Too thinly can not provide enough intensity again.When providing sufficient intensity, can ensure again the stablizing effect of stabilized zone, consider to select most thinning from its financial cost, preferred thickness is 1 μm-2 μm;
The thickness of described stabilized zone is 8 μm-15 μm, and stabilized zone is excessively thin does not have cushioning effect, blocked up, not only increases cost, and affects the sizing intensity of packaging belt.
As preferably, described packaging belt also comprises the first antistatic backing covering described substrate layer upper surface, and covers the second antistatic backing on described general adhesive layer lower surface; The principal component of described first antistatic backing is quaternary ammonium salt surface active agent; The principal component polythiophene conductive polymer of described second antistatic backing.
Second antistatic backing in use can under the effect of general adhesive layer with storage carrier band surface, be enclosed between general adhesive layer and storage carrier band, be Electrostatic Absorption when protection components and parts are not broken down by high-voltage or peel off, selected electrostatic agent wants ageing longer, polythiophene conductive polymer, under the process of heat-sealing, still can keep its anti-static effect; And study through many experiments, multiple antistatic agent all has a significant impact the peeling force between intermediate layer and general adhesive layer, in the program, the principal component of the second antistatic backing can not affect the peeling force of packaging belt only, first antistatic backing is because be exposed to outside, produce in order to the electrostatic reduced in technical process, the principal component that this technical scheme provides can reach on this basis required, controls cost again.
In order to realize the second object, the present invention adopts following technical scheme: a kind of preparation method of packaging belt of electronic devices and components storage carrier band, comprises step (1) and each to general adhesive layer, intermediate layer and stabilized zone layer raw material is formed the first tunic by three-layer co-extruded mode; (2) substrate layer is extruded, form the second tunic be made up of substrate layer; (3) on the second tunic, coating obtains articulamentum, by the stabilized zone of the first tunic that obtains and articulamentum gluing, obtains packaging belt.
Preferred as such scheme, extrusion temperature when step (1) is three-layer co-extruded is 160 ~ 220 DEG C, and pressure is 0.2 ~ 0.6MPa.
By implementing technique scheme, tool of the present invention has the following advantages:
The packaging belt obtained goes for the storage carrier band of dissimilar polarity, can seal, can control certain peeling force again, peel away packaging belt when needed, expose electronic devices and components with the surface of storage carrier band; The serviceability of packaging belt is also stablized, and there will not be the situation of cracking, quick-fried band time curling.The technique adopted not only can production control cost, and by the Function of each layer to maximization, can ensure the physical property of packaging belt.
Accompanying drawing explanation
Accompanying drawing 1 is the profile of one embodiment of the invention;
Accompanying drawing 2 is that in one embodiment of the invention, packaging belt uses schematic diagram;
Accompanying drawing 3 is the top view receiving carrier band after peeling off packaging belt.
In figure, 101-substrate layer; 102-articulamentum; 103-stabilized zone; 104-intermediate layer; The general adhesive layer of 105-; 106-first antistatic backing; 107-second antistatic backing; 20-receives carrier band; 30-seals print.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Embodiment 1:
For the packaging belt of the storage carrier band of electronic devices and components, its structure as shown in Figure 1, comprise set gradually from attaching simultaneously with storage carrier band surface the second antistatic backing 107, general adhesive layer 105, intermediate layer 104, stabilized zone 103, articulamentum 102, substrate layer 101 and the first antistatic backing 106.The Ethylene/Butylene that general adhesive layer 105 adopts polystyrene and polybutadiene hydrogenation to obtain is the linear three embedding copolymers of middle spring block is raw material, can be heat-sealed in storage carrier band 20 surface of most of plastic material.Intermediate layer 104 adopts the pulp furnish of following weight portion: polyethylene 55 parts, polystyrene 30 parts, polypropylene 10 parts, SB 10 parts, and the peeling force between general adhesive layer 105 is controlled, the attachment force ensureing between general adhesive layer 105 and carrier band is greater than the attachment force between intermediate layer 104, can realize the stripping between intermediate layer 104 and general adhesive layer 105.The raw material of substrate layer 101 is PETG, for whole packaging belt provides intensity, and can also seal time timely heat conduction, ensure heat-sealing effect.The composition of articulamentum 102 is adhesive for polyurethane, stabilized zone 103 adopts polyethylene and polyethylene octene copolymer elastomer by weight the mixture for 1:1, be to slow down beating of substrate layer 101, during stable stripping, the vibrations of packaging belt, also can provide certain support force for packaging belt; The setting of articulamentum 102, can be more firm by two-layer connection, and more unified between two-layer, the stable buffering effect of stabilized zone 102 is more remarkable.
In order to ensure physical property and the peeling effect of packaging belt, the thickness in intermediate layer 104 is with 18 μm of-25 μm of the bests, and be preferably 20 μm-25 μm, the present embodiment is 25 μm; The thickness of articulamentum 102 is 1 μm-2 μm, ensures to connect effect, and too thick, not only increase cost, also can affect the buffering effect of stabilized zone 103, the present embodiment is 1. 5 μm; The thickness of stabilized zone 103 is 8 μm-15 μm, and the present embodiment adopts 10 μm, and substrate layer 101 thickness is with 13 μm of-25 μm of the bests, and the present embodiment is 15 μm.
Above-mentioned packaging belt obtains by the following method, (1) general adhesive layer 105, intermediate layer 104 and stabilized zone 103 each layers of raw material are formed the first tunic by three-layer co-extruded mode, extrusion temperature during co-extrusion is for being preferably 160 ~ 220 DEG C, pressure is 0.2 ~ 0.6MPa, and the present embodiment temperature is 200 DEG C, pressure is 0.4MPa; (2) by extruded for substrate layer 101, form the second tunic be made up of substrate layer 101, extrusion temperature is 150-200 DEG C, and pressure is 18 ~ 36MPa, and the present embodiment is extrusion temperature 150 degree, pressure 20MPa; (3) on the second tunic, coating obtains articulamentum 102, by stabilized zone 103 and articulamentum 102 gluing of the first tunic of obtaining, obtains packaging belt.
Embodiment 2:
For the packaging belt of the storage carrier band of electronic devices and components, its structure as shown in Figure 1, comprise set gradually from attaching simultaneously with storage carrier band surface the second antistatic backing 107, general adhesive layer 105, intermediate layer 104, stabilized zone 103, articulamentum 102, substrate layer 101 and the first antistatic backing 106.The copolymer that general adhesive layer 105 adopts polyisoprene and polystyrene hydrogenation to obtain is raw material, can be heat-sealed in storage carrier band 20 surface of most of plastic material.Intermediate layer 104 adopts the pulp furnish of following weight portion: polyethylene 80 parts, polystyrene 40 parts, polypropylene 5 parts, SB 25 parts, Tissuemat E 1 part, and the peeling force between general adhesive layer 105 is controlled, the attachment force ensureing between general adhesive layer 105 and carrier band is greater than the attachment force between intermediate layer 104, can realize the stripping between intermediate layer 104 and general adhesive layer 105.The raw material of substrate layer 101 is PETG, for whole packaging belt provides intensity, and can also seal time timely heat conduction, ensure heat-sealing effect.The composition of articulamentum 102 is adhesive for polyurethane, stabilized zone 103 adopts polyethylene and the elastomeric mixture of polyethylene octene copolymer, both mixed weights are than being 1:2, the present embodiment is 1:1, to slow down beating of substrate layer 101, during stable stripping, the vibrations of packaging belt, also can provide certain support force for packaging belt; The setting of articulamentum 102, can be more firm by two-layer connection, and more unified between two-layer, the stable buffering effect of stabilized zone 102 is more remarkable.
In order to ensure physical property and the peeling effect of packaging belt, the thickness in intermediate layer 104 is 18 μm; The thickness of articulamentum 102 ensures to connect effect, and too thick, not only increase cost, also can affect the buffering effect of stabilized zone 103, the present embodiment is 1 μm; The thickness of stabilized zone 103 is that the present embodiment adopts 15 μm, and substrate layer 101 is 13 μm.
Above-mentioned packaging belt obtains by the following method, and general adhesive layer 105, intermediate layer 104 and stabilized zone 103 each layers of raw material are formed the first tunic by three-layer co-extruded mode by (1), and extrusion temperature during co-extrusion is 220 DEG C, and pressure is 0.6MPa; (2) by extruded for substrate layer 101, form the second tunic be made up of substrate layer 101, extrusion temperature is 200 DEG C, and pressure is 36MPa; (3) on the second tunic, coating obtains articulamentum 102, by stabilized zone 103 and articulamentum 102 gluing of the first tunic of obtaining, obtains packaging belt.
Embodiment 3:
For the packaging belt of the storage carrier band of electronic devices and components, its structure as shown in Figure 1, comprise set gradually from attaching simultaneously with storage carrier band surface the second antistatic backing 107, general adhesive layer 105, intermediate layer 104, stabilized zone 103, articulamentum 102, substrate layer 101 and the first antistatic backing 106.The copolymer that general adhesive layer 105 adopts polyisoprene and polystyrene hydrogenation to obtain is raw material, can be heat-sealed in storage carrier band 20 surface of most of plastic material.Intermediate layer 104 adopts the pulp furnish of following weight portion: polyethylene 50 parts, polystyrene 35 parts, polypropylene 15 parts, SB 20 parts, Tissuemat E 2 parts, Tissuemat E appropriate amount is 0.5-2 weight portion, the present embodiment is preferred 2 parts, by adding and subtracting the amount of Tissuemat E, and the peeling force between general adhesive layer 105 is controlled, the attachment force ensureing between general adhesive layer 105 and carrier band is greater than the attachment force between intermediate layer 104, can realize the stripping between intermediate layer 104 and general adhesive layer 105.The raw material of substrate layer 101 is PETG, for whole packaging belt provides intensity, and can also seal time timely heat conduction, ensure heat-sealing effect.The composition of articulamentum 102 is adhesive for polyurethane, stabilized zone 103 adopts polyethylene and polyethylene octene copolymer elastomer by weight the mixture for 1:3, be to slow down beating of substrate layer 101, during stable stripping, the vibrations of packaging belt, also can provide certain support force for packaging belt; The setting of articulamentum 102, can be more firm by two-layer connection, and more unified between two-layer, the stable buffering effect of stabilized zone 102 is more remarkable.
In order to ensure physical property and the peeling effect of packaging belt, the thickness in intermediate layer 104 is 20 μm; The thickness of articulamentum 102 ensures to connect effect, and too thick, not only increase cost, also can affect the buffering effect of stabilized zone 103, the present embodiment is 2 μm; The thickness of stabilized zone 103 is that the present embodiment adopts 8 μm, and substrate layer 101 is 25 μm.
Above-mentioned packaging belt obtains by the following method, and general adhesive layer 105, intermediate layer 104 and stabilized zone 103 each layers of raw material are formed the first tunic by three-layer co-extruded mode by (1), and extrusion temperature during co-extrusion is 160 DEG C, and pressure is 0.2MPa; (2) by extruded for substrate layer 101, form the second tunic be made up of substrate layer 101, extrusion temperature is 180 DEG C, and pressure is 18MPa; (3) on the second tunic, coating obtains articulamentum 102, by stabilized zone 103 and articulamentum 102 gluing of the first tunic of obtaining, obtains packaging belt.
During use, by heat-sealing, general adhesive layer 105 is sealed in the upper surface of storage carrier band 20, the both sides of storage pocket, when peeling off, intermediate layer 104 is separated with general adhesive layer 105, as shown in accompanying drawing 2,3, and can form two heat-sealing prints 30 in the both sides of storage pocket.
Claims (6)
1. the packaging belt of electronic devices and components storage carrier band, is characterized in that, comprising: provide packaging belt to shape the substrate layer (101) of intensity for the formation of packaging belt main body; To cover on described substrate layer (101) and to absorb vibrations that described substrate layer (101) produces with the stabilized zone of stabilization package band (103); Be positioned at and between described substrate layer (101) and described stabilized zone (103), be used for the articulamentum (102) of gluing; Cover the intermediate layer (104) on described stabilized zone (103); Be bonded in the general adhesive layer (105) on described intermediate layer (104), described general adhesive layer (105) can and storage carrier band seal and the attachment force sealed afterwards and between carrier band is greater than attachment force between intermediate layer (104); The principal component in described intermediate layer (104) is: the polyethylene of 50-80 weight portion, the polystyrene of 30-40 weight portion, the polypropylene of 5-15 weight portion, the SB of 10-25 weight portion; The copolymer that the linear three embedding copolymers of described general adhesive layer (105) to be the Ethylene/Butylene obtained with polystyrene and polybutadiene hydrogenation be middle spring block or polyisoprene and polystyrene hydrogenation obtain; The principal component of described stabilized zone (103) is polyethylene and polyethylene octene copolymer elastomer blends.
2. packaging belt according to claim 1, is characterized in that, is also added with the Tissuemat E of 0.5-2 weight portion in the composition of described intermediate layer (104).
3. packaging belt according to claim 1, is characterized in that, the thickness of described intermediate layer (104) is 18 μm-25 μm; The thickness of described articulamentum (102) is 1 μm-2 μm; The thickness of described stabilized zone (103) 8 μm-15 μm.
4. packaging belt according to claim 1, is characterized in that, also comprises the first antistatic backing (106) covering described substrate layer (101) upper surface, and covers the second antistatic backing (107) on described general adhesive layer (105) lower surface; The principal component of described first antistatic backing (106) is quaternary ammonium salt surface active agent; The principal component polythiophene conductive polymer of described second antistatic backing (107).
5. the preparation method of packaging belt as claimed in claim 1, is characterized in that, comprise step (1) and general adhesive layer (105), intermediate layer (104) and stabilized zone (103) each layer raw material are formed the first tunic by three-layer co-extruded mode; (2) by extruded for substrate layer (101), the second tunic be made up of substrate layer (101) is formed; (3) on the second tunic, coating obtains articulamentum (102), by the stabilized zone (103) of the first tunic and articulamentum (102) gluing that obtain, obtains packaging belt.
6. the preparation method of packaging belt according to claim 5, it is characterized in that, extrusion temperature when step (1) is three-layer co-extruded is 160 ~ 220 DEG C, and pressure is 0.2 ~ 0.6MPa.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510335854.XA CN104960292B (en) | 2015-06-17 | 2015-06-17 | Packaging tape for carrier belt for electronic components and production method of packaging tape |
| TW104129258A TWI545012B (en) | 2015-06-17 | 2015-09-04 | Electronic component storage and carrying tape and its preparation method |
| KR1020150133586A KR101804558B1 (en) | 2015-06-17 | 2015-09-22 | Packaging strips of storing strips for carrying of electronic component and preparation method thereof |
| JP2015188203A JP6148705B2 (en) | 2015-06-17 | 2015-09-25 | Cover tape for carrier tape for storing electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510335854.XA CN104960292B (en) | 2015-06-17 | 2015-06-17 | Packaging tape for carrier belt for electronic components and production method of packaging tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104960292A true CN104960292A (en) | 2015-10-07 |
| CN104960292B CN104960292B (en) | 2017-01-25 |
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| CN201510335854.XA Active CN104960292B (en) | 2015-06-17 | 2015-06-17 | Packaging tape for carrier belt for electronic components and production method of packaging tape |
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| Country | Link |
|---|---|
| JP (1) | JP6148705B2 (en) |
| KR (1) | KR101804558B1 (en) |
| CN (1) | CN104960292B (en) |
| TW (1) | TWI545012B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109628008A (en) * | 2018-12-29 | 2019-04-16 | 浙江洁美电子科技股份有限公司 | A kind of transparency cover band |
| CN110791179A (en) * | 2018-08-02 | 2020-02-14 | 电子科技大学中山学院 | Special antistatic coating for cover tape |
| CN110844324A (en) * | 2019-11-15 | 2020-02-28 | 东莞市航达电子有限公司 | FPC carrier band |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG11201903634WA (en) * | 2016-11-01 | 2019-05-30 | Denka Company Ltd | Surface-conductive laminated sheet and electronic component packaging container |
| KR20210141645A (en) * | 2019-03-27 | 2021-11-23 | 미츠이·다우 폴리케미칼 가부시키가이샤 | Cover tape for paper carrier tape, electronic component conveyance package and electronic component package |
| JP7164485B2 (en) * | 2019-04-26 | 2022-11-01 | デンカ株式会社 | Cover film and electronic component package using the same |
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| US20040188027A1 (en) * | 2001-02-08 | 2004-09-30 | American Made, Llc | Method of partially embedding non-woven fiber mat to reinforcing fibers impregnated with a thermoplastic resin |
| CN102348609A (en) * | 2009-03-13 | 2012-02-08 | 电气化学工业株式会社 | cover film |
| CN103450146A (en) * | 2013-08-27 | 2013-12-18 | 合肥工业大学 | Method for catalyzed synthesis of high-purity 4-chloromethyl-5-methyl-1,3-dioxol-2-one |
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| JP4453789B2 (en) * | 2000-04-27 | 2010-04-21 | アキレス株式会社 | Conductive cover tape |
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| JP2007276799A (en) * | 2006-04-04 | 2007-10-25 | Oji Paper Co Ltd | Cover tape for carrier tape |
| EP2311749B1 (en) * | 2008-08-12 | 2013-04-17 | Sumitomo Bakelite Co., Ltd. | Cover tape for electronic component packing body and electronic component packing body |
| JP4826858B2 (en) * | 2009-07-22 | 2011-11-30 | 住友ベークライト株式会社 | Cover tape for electronic component packaging and electronic component package |
| EP2628690B1 (en) | 2010-10-13 | 2018-03-21 | Denka Company Limited | Cover film |
| KR101935978B1 (en) * | 2011-06-08 | 2019-01-07 | 덴카 주식회사 | Cover film |
| CN202953309U (en) * | 2011-10-14 | 2013-05-29 | 电气化学工业株式会社 | Cover tape |
| JP2013180792A (en) * | 2012-03-01 | 2013-09-12 | Line Plast:Kk | Cover tape for packaging chip type electronic part |
| JP2014227216A (en) * | 2013-05-24 | 2014-12-08 | 三徳商事株式会社 | Conductive carrier tape |
| JP2015020750A (en) * | 2013-07-16 | 2015-02-02 | 旭化成ケミカルズ株式会社 | Cover tape and electronic parts package |
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2015
- 2015-06-17 CN CN201510335854.XA patent/CN104960292B/en active Active
- 2015-09-04 TW TW104129258A patent/TWI545012B/en active
- 2015-09-22 KR KR1020150133586A patent/KR101804558B1/en active Active
- 2015-09-25 JP JP2015188203A patent/JP6148705B2/en active Active
Patent Citations (3)
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| US20040188027A1 (en) * | 2001-02-08 | 2004-09-30 | American Made, Llc | Method of partially embedding non-woven fiber mat to reinforcing fibers impregnated with a thermoplastic resin |
| CN102348609A (en) * | 2009-03-13 | 2012-02-08 | 电气化学工业株式会社 | cover film |
| CN103450146A (en) * | 2013-08-27 | 2013-12-18 | 合肥工业大学 | Method for catalyzed synthesis of high-purity 4-chloromethyl-5-methyl-1,3-dioxol-2-one |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110791179A (en) * | 2018-08-02 | 2020-02-14 | 电子科技大学中山学院 | Special antistatic coating for cover tape |
| CN109628008A (en) * | 2018-12-29 | 2019-04-16 | 浙江洁美电子科技股份有限公司 | A kind of transparency cover band |
| CN110844324A (en) * | 2019-11-15 | 2020-02-28 | 东莞市航达电子有限公司 | FPC carrier band |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101804558B1 (en) | 2017-12-08 |
| CN104960292B (en) | 2017-01-25 |
| JP2017007739A (en) | 2017-01-12 |
| KR20160149126A (en) | 2016-12-27 |
| JP6148705B2 (en) | 2017-06-14 |
| TWI545012B (en) | 2016-08-11 |
| TW201700298A (en) | 2017-01-01 |
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