CN104902693A - Teflon adhesive sheet - Google Patents
Teflon adhesive sheet Download PDFInfo
- Publication number
- CN104902693A CN104902693A CN201510265710.1A CN201510265710A CN104902693A CN 104902693 A CN104902693 A CN 104902693A CN 201510265710 A CN201510265710 A CN 201510265710A CN 104902693 A CN104902693 A CN 104902693A
- Authority
- CN
- China
- Prior art keywords
- adhesive sheet
- teflon
- dielectric constant
- teflon adhesive
- polytetrafluoroethyladhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the technical field of circuit boards, and particularly relates to a teflon adhesive sheet. The adhesive sheet comprises 35-90% mass percent of teflon emulsion, 8-60% glass fiber cloth and 0.5-2% auxiliary agent, and the remaining is solvent. The teflon adhesive sheet has extremely low dielectric constant and loss factor, and the dielectric constant of teflon is quite stable within a quite wide frequency range so that the teflon adhesive sheet is quite wide in range of application.
Description
Technical field
The present invention relates to circuit board technology field, especially a kind of polytetrafluoroethyladhesive adhesive sheet.
Background technology
Along with electronic product is to the future development of miniaturization, high frequency, digitlization, high reliability, the epoxy resin board that adopts as adhesive sheet more in the course of processing for available circuit plate, and this description of materials is single, non-refractory, and loss is larger.
Summary of the invention
The technical problem to be solved in the present invention is: provide a kind of polytetrafluoroethyladhesive adhesive sheet, to solve original adhesive sheet non-refractory and the technical problem such as loss is larger.
The technical solution adopted for the present invention to solve the technical problems is: a kind of polytetrafluoroethyladhesive adhesive sheet, and this adhesive sheet contains ptfe emulsion, the glass fabric of 8-60%, the auxiliary agent of 0.5-2% that mass percent is 35-90%, and surplus is solvent.
The invention has the beneficial effects as follows, the present invention has extremely low dielectric constant and fissipation factor, and polytetrafluoroethylene dielectric constant also quite stable in very wide frequency range, therefore the scope of application is very vast.
Embodiment
A kind of polytetrafluoroethyladhesive adhesive sheet, this adhesive sheet contains ptfe emulsion, the glass fabric of 8-60%, the auxiliary agent of 0.5-2% that mass percent is 35-90%, and surplus is solvent.
The present invention is innovated by Processes and apparatus, improve the impregnating effect of polytetrafluoroethyladhesive adhesive sheet, overcome in the PTFE adhesive sheet occurred in impregnation processability and contain the problems such as micro-bubble, resin glue impregnability is poor, leakage is soaked, glue content is uneven, thus make high-frequency microwave pdm substrate performance more stable, there is high accuracy dielectric constant (tolerance+0.02) and lower dielectric loss.
The present invention makes polytetrafluoroethyladhesive adhesive sheet improve immersion to glass-fiber-fabric of PTFE glue in the course of processing by vacuum-latexed mode, makes glue stable content even.
The present invention is by controlling the high accuracy of dip resin viscosity thus improve the effect of impregnation and the uniformity of glue content, and the target that high accuracy controls to reach is: gelatin viscosity deviation is less, and viscosimetric analysis is fed back and adjusted in time.
Main Feature of the present invention has:
1, the corrosion of resistance to strong acid, highly basic, chloroazotic acid and various organic solvent.
2, drug resistance, nontoxicity, almost can resistance to all medicament article.
3, light transmittance reaches 6-13%.
4, coefficient of friction low (0.05-0.1), is the optimal selection of oil-free self lubrication.
5, good temp characteristic, has weather, anti-ageing property, and can use under 260 DEG C of high-temperature conditions for a long time, its properties of product are constant; Original flexibility can be kept in-60 DEG C of ultra-low temperature surroundings.
6, Abherent: superior self-cleaning property, its smooth surface has extremely strong antistick characteristic and being not stained with property, is easy to clean the various oil stains on its surface of attachment, stain or other attachment.
7, there is high insulating property, lower dielectric constant, dielectric loss, reach UL-94 flammability.
Claims (1)
1. a polytetrafluoroethyladhesive adhesive sheet, is characterized in that: described adhesive sheet contains ptfe emulsion, the glass fabric of 8-60%, the auxiliary agent of 0.5-2% that mass percent is 35-90%, and surplus is solvent.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510265710.1A CN104902693A (en) | 2015-05-24 | 2015-05-24 | Teflon adhesive sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510265710.1A CN104902693A (en) | 2015-05-24 | 2015-05-24 | Teflon adhesive sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104902693A true CN104902693A (en) | 2015-09-09 |
Family
ID=54034995
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510265710.1A Pending CN104902693A (en) | 2015-05-24 | 2015-05-24 | Teflon adhesive sheet |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104902693A (en) |
-
2015
- 2015-05-24 CN CN201510265710.1A patent/CN104902693A/en active Pending
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2913354B1 (en) | Circuit substrate and preparation method thereof | |
JP6514335B2 (en) | Silicone resin composition and prepreg using the same, laminate, copper clad laminate, and aluminum substrate | |
BRPI0822649B8 (en) | APPLIANCE, METHOD FOR ESTABLISHING A CONDUCTIVE STANDARD ON A FLAT INSULATING SUBSTRATE, THE FLAT INSULATING SUBSTRATE AND THE SAME CHIPSET | |
CN103756472B (en) | One can laser activation LDS antenna coating | |
CN104419120A (en) | Insulating resin composition for printed circuit board and products manufactured by using the same | |
CN102198745A (en) | Production process of polyfluortetraethylene fiber glass copper layer-cladding pressure plate | |
CN101856900A (en) | Preparation method of low-loss high-frequency copper-clad plate | |
CN104902693A (en) | Teflon adhesive sheet | |
CN204994073U (en) | PCB circuit board is thoughtlessly pressed to PTFE high frequency | |
CN112477359A (en) | Preparation process of polytetrafluoroethylene glass fiber copper-clad plate with high gluing amount | |
CN104910821A (en) | Polytetrafluoroethylene bonding sheet | |
CN102320168A (en) | Poly (phthalazinone ether) high performance thermoplastic resin base copper-clad plate and preparation method thereof | |
CN103031085A (en) | Polytetrafluoroethylene bonding sheet | |
CN104893612A (en) | Ceramic filling polytetrafluoroethylene adhesion piece | |
CN105153961A (en) | Production technology of polytetrafluoroethylene varnished cloth micro-porous adhesive tape | |
JP2011140614A (en) | Composition for forming substrate, and prepreg and substrate using the same | |
CN103031086A (en) | Ceramic filled polytetrafluoroethylene bonding sheet | |
CN104448826A (en) | Preparation method of polyphenylene sulfide, polytetrafluoroethylene and glass fiber cloth film-shaped ternary composite material | |
US20140127483A1 (en) | Copper-clad laminate. method for manufacturing the same, and printed circuit board including the same | |
CN104924721A (en) | Production process of polytetrafluoroethylene glass fiber copper-coated laminated board | |
TW202321031A (en) | Metal-clad laminated plate | |
CN109629243A (en) | A kind of preparation method of copper-clad plate dielectric cloth | |
CN113290978A (en) | CEM-1 copper-clad plate with high CTI (comparative tracking index) and high peel strength and preparation method thereof | |
ATE449144T1 (en) | SILICON COATING WITH LOW DILECTRIC CONSTANT, PRODUCTION PROCESS THEREOF AND ITS APPLICATION FOR INTEGRATED CIRCUITS | |
Feng | Copper clad laminate for high frequency printed-circuit board in 5G era |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
WD01 | Invention patent application deemed withdrawn after publication | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150909 |