CN102198745A - Production process of polyfluortetraethylene fiber glass copper layer-cladding pressure plate - Google Patents
Production process of polyfluortetraethylene fiber glass copper layer-cladding pressure plate Download PDFInfo
- Publication number
- CN102198745A CN102198745A CN2010101312106A CN201010131210A CN102198745A CN 102198745 A CN102198745 A CN 102198745A CN 2010101312106 A CN2010101312106 A CN 2010101312106A CN 201010131210 A CN201010131210 A CN 201010131210A CN 102198745 A CN102198745 A CN 102198745A
- Authority
- CN
- China
- Prior art keywords
- ptfe
- production process
- polytetrafluoroethylene
- cladding
- copper layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 20
- 239000010949 copper Substances 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000005253 cladding Methods 0.000 title abstract 5
- 239000011152 fibreglass Substances 0.000 title abstract 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 46
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 40
- -1 Polytetrafluoroethylene Polymers 0.000 claims abstract description 19
- 239000011521 glass Substances 0.000 claims abstract description 9
- 239000003292 glue Substances 0.000 claims abstract description 9
- 239000011889 copper foil Substances 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 5
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 4
- 239000011888 foil Substances 0.000 claims abstract description 4
- 239000010959 steel Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 18
- 230000001070 adhesive effect Effects 0.000 claims description 18
- 239000003365 glass fiber Substances 0.000 claims description 13
- 238000005516 engineering process Methods 0.000 claims description 11
- 238000004026 adhesive bonding Methods 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- 239000004744 fabric Substances 0.000 claims description 8
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- 239000000839 emulsion Substances 0.000 claims description 6
- 238000007654 immersion Methods 0.000 claims description 6
- 238000005470 impregnation Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract 2
- 238000010030 laminating Methods 0.000 abstract 2
- 230000008676 import Effects 0.000 abstract 1
- 230000010365 information processing Effects 0.000 abstract 1
- 238000004513 sizing Methods 0.000 abstract 1
- 238000004891 communication Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000007598 dipping method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 108010010803 Gelatin Proteins 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention relates to the technical field of circuit boards, in particular to a production process of a polyfluortetraethylene fiber glass copper layer-cladding pressure plate. The production process comprises the following steps of: obtaining a bonding piece by glue mixing and sizing; cutting and overlapping the bonding piece; combining the bonding piece with a copper foil and a steel plate; automatically laminating by using a vacuum laminating machine at high temperature and high pressure; automatically decomposing; and cutting a copper-cladding foil plate to obtain the polyfluortetraethylene fiber glass copper layer-cladding pressure plate. By using the production process, the defects that the traditional microwave circuit substrate material is difficult to metallize hole and the production line has poor machinability, complex process and the like are overcome; the production process is extremely easy to cut, drill and mechanically process; the production process is greatly simplified; the defects in national traditional PTFE (Polytetrafluoroethylene) glass copper layer-cladding plate is changed; the situation that the present national high-frequency microwave substrate mainly depends import can be also changed; and the requirements for domestic aviation, space flight, mobile phone receiving base station and social high informationized and information processing high-speed development are met.
Description
Technical field
The present invention relates to the circuit board technology field, especially a kind of production technology of polytetrafluoroethylene (PTFE) glass fibre copper clad laminate.
Background technology
Along with the direction of electronic product to miniaturization, high frequencyization, digitlization, high reliabilityization develops, the microwave current high-frequency multi-layer circuit board adopts epoxy resin board as adhesive sheet in process, but its kind is single, solderability is low, and dielectric loss is big, the dielectric constant height, when circuit work frequency more than 300MHz even when reaching 10GHz, stability is extremely low.
Summary of the invention
The technical problem to be solved in the present invention is: a kind of production technology of polytetrafluoroethylene (PTFE) glass fibre copper clad laminate is provided, and not high to solve the substrate that original explained hereafter comes out at the wide frequency ranges internal stability, and technical problem such as dielectric loss is bigger.
The technical solution adopted for the present invention to solve the technical problems is: a kind of production technology of polytetrafluoroethylene (PTFE) glass fibre copper clad laminate may further comprise the steps:
A, from the basin district solvent, additive, ptfe emulsion pumped into according to certain proportioning and to join the glue agitator tank, open and stir, mix the back set aside for use;
B, the adhesive for preparing is dropped into containing in the immersion trough of vertical gluing machine, the solvent that drops into proportional quantity as required is to adjust the viscosity of adhesive;
C, with glass fabric by vertical gluing machine conveying mechanism impregnation and baking railway carriage or compartment oven dry of entering vertical gluing machine in containing immersion trough, obtain adhesive sheet;
D, adhesive sheet full-automatic return wire through cut, stacked after, with Copper Foil, steel plate Automatic Combined,, disassemble automatically then by vacuum press auto-stitching under high temperature, condition of high voltage, copper coated foil plate promptly gets polytetrafluoroethylene (PTFE) glass fibre copper clad laminate after cutting.
Further, the mass percentage content of described each component of adhesive is, the ptfe emulsion of 35-90%, and the glass fabric of 10-65%, the additive of 0.5-2%, surplus is a solvent.
The invention has the beneficial effects as follows, the polytetrafluoroethylene (PTFE) glass fibre copper clad laminate that the present invention produces has extremely low dielectric constant and fissipation factor, lower thermal coefficient of expansion, machinery, electric property homogeneity and dimensional stability are good, and polytetrafluoroethylene (PTFE) is also quite stable of dielectric constant in very wide frequency range, so the scope of application is very vast.
The specific embodiment
A kind of production technology of polytetrafluoroethylene (PTFE) glass fibre copper clad laminate may further comprise the steps:
A, from the basin district solvent, additive, ptfe emulsion pumped into according to certain proportioning and to join the glue agitator tank, open and stir, mix the back set aside for use;
B, the adhesive for preparing is dropped into containing in the immersion trough of vertical gluing machine, the solvent that drops into proportional quantity as required is to adjust the viscosity of adhesive;
C, with glass fabric by vertical gluing machine conveying mechanism impregnation and baking railway carriage or compartment oven dry of entering vertical gluing machine in containing immersion trough, obtain adhesive sheet;
D, adhesive sheet full-automatic return wire through cut, stacked after, with Copper Foil, steel plate Automatic Combined,, disassemble automatically then by vacuum press auto-stitching under high temperature, condition of high voltage, copper coated foil plate promptly gets polytetrafluoroethylene (PTFE) glass fibre copper clad laminate after cutting.
Further, the mass percentage content of described each component of adhesive is, the ptfe emulsion of 35-90%, and the glass fabric of 10-65%, the additive of 0.5-2%, surplus is a solvent.
The polytetrafluoroethylene (PTFE) glass fibre copper clad laminate that the present invention produces is a kind of High Frequency Of Recombination microwave base plate that designs for printed substrate specially, this kind material is in conjunction with the outstanding physics of polytetrafluoroethylene (PTFE), the characteristic of chemistry and electric property and low dielectric loss, be processed to form polytetrafluoroethylene (PTFE) glass fibre copper clad laminate with glass fabric and Copper Foil through advanced production technology and equipment, this material has good X/Y CET and Copper Foil CET matching, lower thermal coefficient of expansion, machinery, electric property homogeneity and dimensional stability are good, have extremely low dielectric constant and fissipation factor, polytetrafluoroethylene (PTFE) is also quite stable of dielectric constant in very wide frequency range, this makes this material be applicable to the wideband application, is high frequency printed wiring board ideal application base material.
When circuit work frequency when 300MHz is above, the selectable material ranges of design engineer has just reduced greatly, and the sheet material that the present invention produced can allow Radio Frequency Engineer design circuit easily, for example to the design iterations of wave filter, the network coupling, Impedance Matching on Transmission Line etc.Because the characteristic of its low dielectric loss, in frequency applications, this sheet material has more the unmatchable advantage of circuit common material, and its temperature coefficient of permittivity almost is minimum in the same type of material, and in wide frequency range, its dielectric constant is quite stable also.
The sheet material that the present invention produces is mainly used in Aero-Space, base antenna, microwave transmission, global positioning system, satellite communication, communication apparatus adapter, receiver, signal oscillator, high-speed cruising computer, oscillograph, IC tester or the like, communication and computer realms such as high-frequency communication, high-speed transfer, high security, high transfer quality, high memory capacity processing.
The present invention innovates by Processes and apparatus, improve the impregnating effect of polytetrafluoroethylene (PTFE) adhesive sheet, overcome in the PTFE adhesive sheet that in dipping processing, occurs and contain problems such as micro-bubble, the resin glue impregnability is poor, leakage is soaked, glue content is inhomogeneous, thereby make high-frequency microwave pdm substrate performance more stable, have high accuracy dielectric constant (tolerance+0.02) and lower dielectric loss.
The present invention makes the polytetrafluoroethylene (PTFE) adhesive sheet improve the dipping of PTFE glue to glass cloth in process by the vacuum-latexed mode, makes the glue stable content even.
Thereby the present invention improves the effect of impregnation and the uniformity of glue content by dipping is controlled with the high accuracy of resin viscosity, and the target that high accuracy control will reach is: the gelatin viscosity deviation is littler, and viscosimetric analysis is fed back and adjusted in time.
Claims (2)
1. the production technology of a polytetrafluoroethylene (PTFE) glass fibre copper clad laminate, it is characterized in that: described production technology may further comprise the steps:
A, from the basin district solvent, additive, ptfe emulsion pumped into according to certain proportioning and to join the glue agitator tank, open and stir, mix the back set aside for use;
B, the adhesive for preparing is dropped into containing in the immersion trough of vertical gluing machine, the solvent that drops into proportional quantity as required is to adjust the viscosity of adhesive;
C, with glass fabric by vertical gluing machine conveying mechanism impregnation and baking railway carriage or compartment oven dry of entering vertical gluing machine in containing immersion trough, obtain adhesive sheet;
D, adhesive sheet full-automatic return wire through cut, stacked after, with Copper Foil, steel plate Automatic Combined,, disassemble automatically then by vacuum press auto-stitching under high temperature, condition of high voltage, copper coated foil plate promptly gets polytetrafluoroethylene (PTFE) glass fibre copper clad laminate after cutting.
2. the production technology of polytetrafluoroethylene (PTFE) glass fibre copper clad laminate according to claim 1, it is characterized in that: the mass percent of described ptfe emulsion is 35-90%, glass fabric is 10-65%, and additive is 0.5-2%, and surplus is a solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101312106A CN102198745A (en) | 2010-03-24 | 2010-03-24 | Production process of polyfluortetraethylene fiber glass copper layer-cladding pressure plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101312106A CN102198745A (en) | 2010-03-24 | 2010-03-24 | Production process of polyfluortetraethylene fiber glass copper layer-cladding pressure plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102198745A true CN102198745A (en) | 2011-09-28 |
Family
ID=44659855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101312106A Pending CN102198745A (en) | 2010-03-24 | 2010-03-24 | Production process of polyfluortetraethylene fiber glass copper layer-cladding pressure plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102198745A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922864A (en) * | 2012-11-07 | 2013-02-13 | 广东生益科技股份有限公司 | Prepreg production method and device |
| CN105898984A (en) * | 2016-05-04 | 2016-08-24 | 江苏富仕德科技发展有限公司 | Production technology for baseplate made of polytetrafluoroethylene glass fiber composite |
| CN106854330A (en) * | 2016-11-25 | 2017-06-16 | 常州中英科技股份有限公司 | A kind of fluorine resin mixture and its prepreg and the copper-clad plate of preparation |
| WO2018032795A1 (en) * | 2016-08-18 | 2018-02-22 | 江苏泰氟隆科技有限公司 | Laminated cloth for 4g or 5g network circuit board substrate and manufacturing process of same |
| TWI636885B (en) * | 2017-05-24 | 2018-10-01 | 台燿科技股份有限公司 | Method of manufacturing metal-clad laminate and uses of the same |
| CN108790327A (en) * | 2018-05-21 | 2018-11-13 | 江苏泰氟隆科技有限公司 | Polytetrafluoroethylene (PTFE) fills the high performance copper clad laminate and its manufacturing process of Film laminated glass cloth |
| WO2020124436A1 (en) * | 2018-12-19 | 2020-06-25 | 华为技术有限公司 | Packaged antenna substrate, manufacturing method therefor, packaged antenna, and terminal |
| CN117193178A (en) * | 2023-07-06 | 2023-12-08 | 苏州市华研富士新材料有限公司 | Production process optimization control method and system for glass fiber composite board |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1868735A (en) * | 2006-04-13 | 2006-11-29 | 上海南亚覆铜箔板有限公司 | Non-halogen epoxide glass cloth base copper coated foil plate and its preparation method |
-
2010
- 2010-03-24 CN CN2010101312106A patent/CN102198745A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1868735A (en) * | 2006-04-13 | 2006-11-29 | 上海南亚覆铜箔板有限公司 | Non-halogen epoxide glass cloth base copper coated foil plate and its preparation method |
Non-Patent Citations (1)
| Title |
|---|
| 辜信实: "《印制电路用覆铜箔层压板》", 28 February 2002, 化学工业出版社 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102922864A (en) * | 2012-11-07 | 2013-02-13 | 广东生益科技股份有限公司 | Prepreg production method and device |
| CN105898984A (en) * | 2016-05-04 | 2016-08-24 | 江苏富仕德科技发展有限公司 | Production technology for baseplate made of polytetrafluoroethylene glass fiber composite |
| WO2018032795A1 (en) * | 2016-08-18 | 2018-02-22 | 江苏泰氟隆科技有限公司 | Laminated cloth for 4g or 5g network circuit board substrate and manufacturing process of same |
| CN106854330A (en) * | 2016-11-25 | 2017-06-16 | 常州中英科技股份有限公司 | A kind of fluorine resin mixture and its prepreg and the copper-clad plate of preparation |
| CN106854330B (en) * | 2016-11-25 | 2018-03-23 | 常州中英科技股份有限公司 | A kind of fluorine resin mixture and its prepreg and the copper-clad plate of preparation |
| TWI636885B (en) * | 2017-05-24 | 2018-10-01 | 台燿科技股份有限公司 | Method of manufacturing metal-clad laminate and uses of the same |
| CN108790327A (en) * | 2018-05-21 | 2018-11-13 | 江苏泰氟隆科技有限公司 | Polytetrafluoroethylene (PTFE) fills the high performance copper clad laminate and its manufacturing process of Film laminated glass cloth |
| CN108790327B (en) * | 2018-05-21 | 2020-12-04 | 江苏泰氟隆科技有限公司 | High-performance copper-clad plate with polytetrafluoroethylene filled film and composite glass cloth and manufacturing process thereof |
| WO2020124436A1 (en) * | 2018-12-19 | 2020-06-25 | 华为技术有限公司 | Packaged antenna substrate, manufacturing method therefor, packaged antenna, and terminal |
| US11637376B2 (en) | 2018-12-19 | 2023-04-25 | Huawei Technologies Co., Ltd. | Antenna packaged substrate and manufacturing method thereof, packaged antenna, and terminal |
| CN117193178A (en) * | 2023-07-06 | 2023-12-08 | 苏州市华研富士新材料有限公司 | Production process optimization control method and system for glass fiber composite board |
| CN117193178B (en) * | 2023-07-06 | 2024-01-26 | 苏州市华研富士新材料有限公司 | Production process optimization control method and system for glass fiber composite board |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110928 |
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| WD01 | Invention patent application deemed withdrawn after publication |