CN104882426A - Plastic packaging type IPM module stacking structure - Google Patents
Plastic packaging type IPM module stacking structure Download PDFInfo
- Publication number
- CN104882426A CN104882426A CN201410069130.0A CN201410069130A CN104882426A CN 104882426 A CN104882426 A CN 104882426A CN 201410069130 A CN201410069130 A CN 201410069130A CN 104882426 A CN104882426 A CN 104882426A
- Authority
- CN
- China
- Prior art keywords
- lead frame
- pcb board
- group
- dbc plate
- ipm module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The invention discloses a plastic packaging type IPM module stacking structure. In the structure, a second lead frame group is close to one side of a first lead frame group. The distance between the two lead frame groups is shortened. One second lead frame group end with a welded PCB extends towards one side of the first lead frame group to make the PCB located above a DBC. A stacking structure is thus formed. The distance between the PCB and the DBC is effectively shortened. The volume of the whole module is reduced. The plastic packaging type IPM integrated level is improved. The risk of early-stage module failure due to the relatively large volume of the module during an injection moulding process can be reduced. The injection moulding material using amount is further reduced. The production cost is lowered.
Description
Technical field
The invention belongs to plastic sealed IPM and manufacture field, be specifically related to a kind of plastic sealed IPM module stack stacked structure.
Background technology
Plastic sealed IPM(Intelligent Power Module, Intelligent Power Module), be the Novel control module that igbt chip and drive circuit, control circuit and overcurrent, under-voltage, short circuit, the protective circuit such as overheated are integrated in one.It is a kind of complexity, advanced power model, automatically can realize overcurrent, under-voltage, short circuit and the complicated protection function such as overheated, thus have intelligent characteristic.Simultaneously it has the advantages such as low cost, miniaturization, highly reliable, easy use, and be widely used in the fields such as frequency-conversion domestic electric appliances, inverter, Industry Control, Social benefit and economic benefit is very considerable.
For plastic sealed IPM, its inside is made up of lead frame, DBC plate and pcb board usually, lead frame is used to fixing DBC plate and pcb board, complete the function of electrical connection simultaneously, DBC plate is used for carrying igbt chip and diode chip for backlight unit, and pcb board is for carrying driving chip and whole drive circuit.As a rule, electrical connection is completed by bonding line between DBC plate and pcb board.Therefore, in an IPM module, requisite three large critical components are exactly lead frame, DBC plate and pcb board, and the volume of this three determines the volume of IPM module.From now on, plastic sealed IPM development trend will be integrated and miniaturized, when ensureing that current structure is constant, how reduce the volume of IPM module, just becoming a difficult problem instantly.
There is following defect in the version of current IPM module:
(1) current IPM inside modules DBC plate and pcb board arrangement comparatively disperse, and the volume taken is comparatively large, and therefore cause the overall volume of IPM module comparatively large, material cost is higher.
(2) in plastic sealed IPM module, pcb board is Drive Protecting Circuit, and pcb board and DBC plate distant, IPM module can be made to there is destabilizing factor, there is the risk of module early failure.
Therefore, in view of above problem, be necessary the new structure proposing a kind of IPM module, effectively reduce the distance between pcb board and DBC plate, reduce the volume of whole module, improve the integrated level of plastic sealed IPM, reduce the risk of the early stage Module Fail caused because module is comparatively large in injection moulding process, save the use amount of injection molding material simultaneously, reduce production cost.
Summary of the invention
In view of this, the invention provides a kind of plastic sealed IPM module stack stacked structure, this structure is by being arranged at above DBC plate by stacking for pcb board, effectively reduce the distance between pcb board and DBC plate, reduce the volume of whole module, improve the integrated level of plastic sealed IPM, reduce the risk of the early stage Module Fail caused because module is comparatively large in injection moulding process, save the use amount of injection molding material simultaneously, reduce production cost.
The one plastic sealed IPM module stack stacked structure that object according to the present invention proposes, described IPM module comprises lead frame, DBC plate and pcb board, described DBC plate is provided with power chip, described pcb board is provided with driving chip, described lead frame is two groups that are oppositely arranged, described DBC plate is welded on first group of lead frame, and described pcb board is welded on second group of lead frame;
Described second group of lead frame is close to described first group of lead frame side, and the one end of described second group of lead frame welding pcb board extends to described first group of lead frame side, make the end of described second group of lead frame be positioned at the top of described DBC plate, described DBC plate and pcb board are stacked structures;
Connected by bonding line between described lead frame, DBC plate, power chip, pcb board and driving chip.
Preferably, described pcb board is fixedly welded on the end of described second group of lead frame, and is positioned at middle position directly over described DBC plate.
Preferably, described power chip is fixedly welded on described DBC plate.
Preferably, described driving chip is pasted and is fixed on described pcb board.
Preferably, described driving chip is fixed on described pcb board by the stickup of silver slurry.
Preferably, described pcb board is fixedly welded on the below of described second group of lead frame, to shorten the difference in height between power chip and driving chip.
Compared with prior art, the advantage of plastic sealed IPM module stack stacked structure disclosed by the invention is: in this structure, second group of lead frame is close to first group of lead frame side, shorten the distance of two groups of lead frames, and the one end of second group of lead frame welding pcb board is passed through to extend to first group of lead frame side, pcb board is made to be positioned at the top of DBC plate, form stacked structures, effectively reduce the distance between pcb board and DBC plate, reduce the volume of whole module, improve the integrated level of plastic sealed IPM, reduce the risk of the early stage Module Fail caused because module is comparatively large in injection moulding process, save the use amount of injection molding material simultaneously, reduce production cost.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the front sectional view of a kind of plastic sealed IPM module stack stacked structure disclosed by the invention.
Fig. 2 is the vertical view of a kind of plastic sealed IPM module stack stacked structure disclosed by the invention.
The title of the numeral in figure or the corresponding component representated by letter:
1, first group of lead frame 2, second group of lead frame 3, DBC plate 4, pcb board 5, power chip 6, driving chip 7, bonding line
Embodiment
IPM module comprises three large critical components: lead frame, DBC plate and pcb board, the volume of this three determines the volume of IPM module.Current IPM inside modules DBC plate and pcb board arrangement comparatively disperse, and the volume taken is comparatively large, and therefore cause the overall volume of IPM module comparatively large, material cost is higher.And pcb board is Drive Protecting Circuit in plastic sealed IPM module, and pcb board and DBC plate distant, IPM module can be made to there is destabilizing factor, there is the risk of module early failure.
The present invention is directed to deficiency of the prior art, provide a kind of plastic sealed IPM module stack stacked structure, this structure is by the distance of shortening two groups of lead frames, and be arranged at above DBC plate by stacking for pcb board, effectively reduce the distance between pcb board and DBC plate, reduce the volume of whole module, improve the integrated level of plastic sealed IPM, reduce the risk of the early stage Module Fail caused because module is comparatively large in injection moulding process, save the use amount of injection molding material simultaneously, reduce production cost.
To be clearly and completely described technical scheme of the present invention by embodiment below.Obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
Please also refer to Fig. 1 and Fig. 2, as shown in the figure, a kind of plastic sealed IPM module stack stacked structure, this IPM module comprises lead frame, DBC plate 3 and pcb board 4, DBC plate 3 is provided with power chip 5, pcb board 4 is provided with driving chip 6, lead frame is two groups that are oppositely arranged, lead frame is used for fixing DBC plate 3 and pcb board 4, completes the function of electrical connection simultaneously.DBC plate 3 is welded on first group of lead frame 1, and pcb board 4 is welded on second group of lead frame 2.Connected by bonding line 7 between lead frame, DBC plate 3, power chip 5, pcb board 4 and driving chip 6.
Second group of lead frame 2 is close to first group of lead frame 1 side, the distance of effective shortening two groups of lead frames, and the one end of second group of lead frame 2 welding pcb board 4 extends to first group of lead frame 1 side, make the end of second group of lead frame 2 be positioned at the top of DBC plate 3, make DBC plate 3 and pcb board 4 in stacked structures.This structure reduces the distance between pcb board 4 and DBC plate 3 effectively, reduce the volume of whole module, improve the integrated level of plastic sealed IPM module, reduce the risk of the early stage Module Fail caused because module is comparatively large in injection moulding process, save the use amount of injection molding material simultaneously, reduce production cost.
Pcb board 4 is fixedly welded on the end of second group of lead frame 2, and is positioned at middle position directly over DBC plate 3.The weight of whole IPM module that this version is effectively balanced, ensures the stability of IPM module.
Driving chip 6 is pasted and is fixed on pcb board 4.Relative to welding procedure, barbola work better realizes, and better effects if is effectively increased work efficiency.
Driving chip 6 is fixed on pcb board 4 by the stickup of silver slurry.Silver slurry has excellent physical and mechanical properties, resistance to chemical corrosion, heat-resisting and adhesive property, uses hot setting, and have bonding force strong, good toughness, is superior to the advantage of general monomer amine curing agent significantly.
Pcb board 4 is fixedly welded on the below of second group of lead frame 2, to shorten the difference in height between power chip and driving chip, is convenient to bonding.
The invention discloses a kind of plastic sealed IPM module stack stacked structure, in this structure, second group of lead frame is close to first group of lead frame side, shorten the distance of two groups of lead frames, and the one end of second group of lead frame welding pcb board is passed through to extend to first group of lead frame side, pcb board is made to be positioned at the top of described DBC plate, form stacked structures, effectively reduce the distance between pcb board and DBC plate, reduce the volume of whole module, improve the integrated level of plastic sealed IPM, reduce the risk of the early stage Module Fail caused because module is comparatively large in injection moulding process, save the use amount of injection molding material simultaneously, reduce production cost.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (6)
1. a plastic sealed IPM module stack stacked structure, it is characterized in that, described IPM module comprises lead frame, DBC plate and pcb board, described DBC plate is provided with power chip, described pcb board is provided with driving chip, described lead frame is two groups that are oppositely arranged, and described DBC plate is welded on first group of lead frame, and described pcb board is welded on second group of lead frame;
Described second group of lead frame is close to described first group of lead frame side, and the one end of described second group of lead frame welding pcb board extends to described first group of lead frame side, make the end of described second group of lead frame be positioned at the top of described DBC plate, described DBC plate and pcb board are stacked structures;
Connected by bonding line between described lead frame, DBC plate, power chip, pcb board and driving chip.
2. plastic sealed IPM module stack stacked structure as claimed in claim 1, it is characterized in that, described pcb board is fixedly welded on the end of described second group of lead frame, and is positioned at middle position directly over described DBC plate.
3. plastic sealed IPM module stack stacked structure as claimed in claim 1, it is characterized in that, described power chip is fixedly welded on described DBC plate.
4. plastic sealed IPM module stack stacked structure as claimed in claim 1, is characterized in that, described driving chip is pasted and is fixed on described pcb board.
5. plastic sealed IPM module stack stacked structure as claimed in claim 4, is characterized in that, described driving chip is fixed on described pcb board by the stickup of silver slurry.
6. plastic sealed IPM module stack stacked structure as claimed in claim 1, it is characterized in that, described pcb board is fixedly welded on the below of described second group of lead frame, to shorten the difference in height between power chip and driving chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410069130.0A CN104882426A (en) | 2014-02-27 | 2014-02-27 | Plastic packaging type IPM module stacking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410069130.0A CN104882426A (en) | 2014-02-27 | 2014-02-27 | Plastic packaging type IPM module stacking structure |
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| Publication Number | Publication Date |
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| CN104882426A true CN104882426A (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410069130.0A Pending CN104882426A (en) | 2014-02-27 | 2014-02-27 | Plastic packaging type IPM module stacking structure |
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| CN (1) | CN104882426A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655317A (en) * | 2015-12-24 | 2016-06-08 | 合肥祖安投资合伙企业(有限合伙) | Double-frame packaging structure and manufacturing method thereof |
| CN114666974A (en) * | 2022-03-15 | 2022-06-24 | 广东汇芯半导体有限公司 | Semiconductor circuit and manufacturing method thereof |
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| CN103236422A (en) * | 2013-03-29 | 2013-08-07 | 广东美的制冷设备有限公司 | Intelligent power module and manufacturing method thereof |
| US20130207253A1 (en) * | 2008-03-31 | 2013-08-15 | Fairchild Korea Semiconductor, Ltd. | Complex Semiconductor Packages and Methods of Fabricating the Same |
| CN203457035U (en) * | 2013-08-27 | 2014-02-26 | 陕西中科天地航空模块有限公司 | Module power supply |
-
2014
- 2014-02-27 CN CN201410069130.0A patent/CN104882426A/en active Pending
Patent Citations (5)
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|---|---|---|---|---|
| US20130207253A1 (en) * | 2008-03-31 | 2013-08-15 | Fairchild Korea Semiconductor, Ltd. | Complex Semiconductor Packages and Methods of Fabricating the Same |
| CN102468292A (en) * | 2010-10-29 | 2012-05-23 | 万国半导体股份有限公司 | Packaging body structure for direct current-direct current convertor |
| CN202042483U (en) * | 2011-02-25 | 2011-11-16 | 比亚迪股份有限公司 | Package structure of power semiconductor device |
| CN103236422A (en) * | 2013-03-29 | 2013-08-07 | 广东美的制冷设备有限公司 | Intelligent power module and manufacturing method thereof |
| CN203457035U (en) * | 2013-08-27 | 2014-02-26 | 陕西中科天地航空模块有限公司 | Module power supply |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655317A (en) * | 2015-12-24 | 2016-06-08 | 合肥祖安投资合伙企业(有限合伙) | Double-frame packaging structure and manufacturing method thereof |
| CN114666974A (en) * | 2022-03-15 | 2022-06-24 | 广东汇芯半导体有限公司 | Semiconductor circuit and manufacturing method thereof |
| CN114666974B (en) * | 2022-03-15 | 2024-10-15 | 广东汇芯半导体有限公司 | Semiconductor circuit and manufacturing method thereof |
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