CN104867918A - Plastic packaging type IPM module and fixing structure for DBC board thereof - Google Patents
Plastic packaging type IPM module and fixing structure for DBC board thereof Download PDFInfo
- Publication number
- CN104867918A CN104867918A CN201410066722.7A CN201410066722A CN104867918A CN 104867918 A CN104867918 A CN 104867918A CN 201410066722 A CN201410066722 A CN 201410066722A CN 104867918 A CN104867918 A CN 104867918A
- Authority
- CN
- China
- Prior art keywords
- ipm module
- fixing structure
- dbc plate
- dbc
- plastic sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention discloses a fixing structure for a DBC board of a plastic packaging type IPM module. The fixing structure is characterized in that the fixing structure completes electrical connection through an ultrasonic welding method. By utilizing the ultrasonic welding method, a lead wire framework is welded with the DBC board, the reliability is greatly improved, and the risk of early module failure caused by surfacing or pseudo welding on the DBC board is reduced.
Description
Technical field
The present invention relates to electronic circuit technology field, particularly relate to the fixed structure of a kind of plastic sealed IPM module and DBC plate thereof.
Background technology
Plastic sealed IPM(IntelligentPowerModule; Intelligent Power Module) be by IGBT(InsulatedGateBipolarTransistor, insulated gate bipolar transistor) Novel control module that is integrated in one of chip and drive circuit, control circuit and overcurrent, under-voltage, short circuit, the protective circuit such as overheated.
Plastic sealed IPM module is a kind of complexity, advanced power model, automatically can realize overcurrent, under-voltage, short circuit and the complicated protection function such as overheated, thus have intelligent characteristic.Simultaneously it has the advantages such as low cost, miniaturization, highly reliable, easy use, and be widely used in the fields such as frequency-conversion domestic electric appliances, inverter, Industry Control, Social benefit and economic benefit is very considerable.
For plastic sealed IPM module, its inside is made up of lead frame, DCB plate and pcb board usually, lead frame is used to fixing DBC plate and pcb board, complete the function of electrical connection simultaneously, DBC plate is used for carrying igbt chip and diode chip for backlight unit, pcb board for carrying driving chip and whole drive circuit, as a rule, DBC plate be that mode by welding completes fixing and is electrically connected between lead frame.
At present in the mass production of plastic sealed IPM module, first by the mode of silk screen printing by scolding tin brush on DBC plate, then complete welding of DBC plate and lead frame by brazier.As shown in Figure 1, first needed by the technique of silk screen printing the position 103 fixed brushes scolding tin on DCB plate 102, then in frock, both are fitted together and put into brazier and weld.
As can be seen from Figure 1, fixedly being welded by a lot of pin between DBC plate 102 and lead frame 101, the pin of therefore these welding must be highly consistent, so just can not cause pin rosin joint, very high to the technological requirement of lead frame 101;
In general, on DBC plate 102, the region of welding lead framework 101 pin is less, if do not control the number of scolding tin in welding process well, welding position built-up welding or rosin joint can be made, and in the process that DBC plate 102 and lead frame 101 are assembled, as long as there is displacement a little, lead frame 101 will be caused cannot to contact with solder joint, cause product to become waste product.
Therefore, for above-mentioned technical problem, be necessary to provide a kind of fixed structure with structure improved plastic sealed IPM module DBC plate, to solve problems of the prior art.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of fixed structure of plastic sealed IPM module DBC plate, the difficulty that pcb board and lead frame are assembled can be reduced.
For achieving the above object, the invention provides following technical scheme:
A fixed structure for plastic sealed IPM module DBC plate, described fixed structure completes electrical connection by the mode of ultrasonic bonding.
A kind of plastic sealed IPM module, it comprises lead frame, DBC plate and pcb board, and described plastic sealed IPM module has the fixed structure of above-mentioned plastic sealed IPM module DBC plate.
As can be seen from technique scheme, the fixed structure of the plastic sealed IPM module DBC plate of the embodiment of the present invention utilizes the mode of ultrasonic bonding lead frame and DBC plate to be welded together, reliability greatly improves, and to reduce on DBC plate built-up welding or rosin joint and the risk of the early stage Module Fail caused simultaneously.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing for the present invention in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is lead frame and pcb board fixed structure schematic diagram in prior art, and fixed structure adopts the mode of common scolding tin;
Fig. 2 is IPM module DBC plate of the present invention electrical connection schematic diagram, and electrical connection adopts the mode of ultrasonic bonding to realize;
Fig. 3 is lead frame of the present invention and pcb board fixed structure schematic diagram, and fixed structure adopts the mode of ultrasonic bonding.
Embodiment
The invention discloses the fixed structure of a kind of plastic sealed IPM module and DBC plate thereof, the difficulty that pcb board and lead frame are assembled can be reduced.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be described in detail the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of protection of the invention.
As shown in Figure 2, the fixed structure of plastic sealed IPM module DBC plate disclosed by the invention completes electrical connection by the mode of ultrasonic bonding.
As shown in Figure 3, this plastic sealed IPM module disclosed by the invention, it comprises lead frame 201, DBC plate 202 and pcb board 203, and described plastic sealed IPM module has the fixed structure of above-mentioned plastic sealed IPM module DBC plate.
DBC board fixing structure of the present invention can reduce multiple pin and weld and the risk of the rosin joint that causes or welding dislocation simultaneously, and when the leg of lead frame is not in same level, ultrasonic bonding can one by one by the pin of lead frame tightly be pressed in the layers of copper of DBC, carry out ultrasonic bonding, therefore its welding effect will be better than the welding effect of common scolding tin far away, technological operation difficulty greatly reduces, and improves the reliability of product simultaneously.
The fixed structure of the plastic sealed IPM module DBC plate of the embodiment of the present invention utilizes the mode of ultrasonic bonding lead frame and DBC plate to be welded together, reliability greatly improves, and to reduce on DBC plate built-up welding or rosin joint and the risk of the early stage Module Fail caused simultaneously.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this specification is described according to execution mode, but not each execution mode only comprises an independently technical scheme, this narrating mode of specification is only for clarity sake, those skilled in the art should by specification integrally, and the technical scheme in each embodiment also through appropriately combined, can form other execution modes that it will be appreciated by those skilled in the art that.
Claims (2)
1. a fixed structure for plastic sealed IPM module DBC plate, is characterized in that: described fixed structure completes electrical connection by the mode of ultrasonic bonding.
2. a plastic sealed IPM module, it comprises lead frame, DBC plate and pcb board, it is characterized in that: described plastic sealed IPM module has the fixed structure of plastic sealed IPM module DBC plate according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410066722.7A CN104867918A (en) | 2014-02-26 | 2014-02-26 | Plastic packaging type IPM module and fixing structure for DBC board thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410066722.7A CN104867918A (en) | 2014-02-26 | 2014-02-26 | Plastic packaging type IPM module and fixing structure for DBC board thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104867918A true CN104867918A (en) | 2015-08-26 |
Family
ID=53913648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410066722.7A Pending CN104867918A (en) | 2014-02-26 | 2014-02-26 | Plastic packaging type IPM module and fixing structure for DBC board thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104867918A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109616420A (en) * | 2018-11-21 | 2019-04-12 | 杰群电子科技（东莞）有限公司 | A kind of power modules processing method and power modules |
| CN109637938A (en) * | 2018-11-21 | 2019-04-16 | 杰群电子科技（东莞）有限公司 | Power module processing method and power module |
Citations (7)
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|---|---|---|---|---|
| US20040183168A1 (en) * | 2003-03-18 | 2004-09-23 | Himeji Toshiba E.P. Corporation | Lead frame and electronic component using same |
| US20040217488A1 (en) * | 2003-05-02 | 2004-11-04 | Luechinger Christoph B. | Ribbon bonding |
| CN101165884A (en) * | 2006-10-20 | 2008-04-23 | 英飞凌科技股份公司 | Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate |
| CN101488495A (en) * | 2007-11-29 | 2009-07-22 | 英飞凌科技股份有限公司 | Semiconductor module with switching components and driver electronics |
| CN101546716A (en) * | 2008-03-25 | 2009-09-30 | 富士电机电子技术株式会社 | Semiconductor device manufacturing method |
| CN101952960A (en) * | 2008-02-15 | 2011-01-19 | 丹福斯矽电有限责任公司 | Method for low-temperature pressure sintering |
| CN102136469A (en) * | 2009-11-19 | 2011-07-27 | 英飞凌科技股份有限公司 | Power semiconductor module and method for operating a power semiconductor module |
-
2014
- 2014-02-26 CN CN201410066722.7A patent/CN104867918A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040183168A1 (en) * | 2003-03-18 | 2004-09-23 | Himeji Toshiba E.P. Corporation | Lead frame and electronic component using same |
| US20040217488A1 (en) * | 2003-05-02 | 2004-11-04 | Luechinger Christoph B. | Ribbon bonding |
| CN101165884A (en) * | 2006-10-20 | 2008-04-23 | 英飞凌科技股份公司 | Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrate |
| CN101488495A (en) * | 2007-11-29 | 2009-07-22 | 英飞凌科技股份有限公司 | Semiconductor module with switching components and driver electronics |
| CN101952960A (en) * | 2008-02-15 | 2011-01-19 | 丹福斯矽电有限责任公司 | Method for low-temperature pressure sintering |
| CN101546716A (en) * | 2008-03-25 | 2009-09-30 | 富士电机电子技术株式会社 | Semiconductor device manufacturing method |
| CN102136469A (en) * | 2009-11-19 | 2011-07-27 | 英飞凌科技股份有限公司 | Power semiconductor module and method for operating a power semiconductor module |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109616420A (en) * | 2018-11-21 | 2019-04-12 | 杰群电子科技（东莞）有限公司 | A kind of power modules processing method and power modules |
| CN109637938A (en) * | 2018-11-21 | 2019-04-16 | 杰群电子科技（东莞）有限公司 | Power module processing method and power module |
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| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150826 |
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| WD01 | Invention patent application deemed withdrawn after publication |