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CN104882346A - Method for preparing field emission cathode of carbon nanotube array coated with carbon nanoparticles - Google Patents

Method for preparing field emission cathode of carbon nanotube array coated with carbon nanoparticles Download PDF

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CN104882346A
CN104882346A CN201510152542.5A CN201510152542A CN104882346A CN 104882346 A CN104882346 A CN 104882346A CN 201510152542 A CN201510152542 A CN 201510152542A CN 104882346 A CN104882346 A CN 104882346A
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carbon nanotube
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CN104882346B (en
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邓建华
程国安
邓丽娜
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Tianjin Normal University
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Abstract

本发明公开了一种碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法,属于纳米材料的制备和应用领域。其主要包括以下制备工艺:以热化学气相沉积法在硅单晶片上制备碳纳米管阵列;利用射频技术产生氢等离子体在低功率下长时间处理碳纳米管阵列;最后以所获得的表面包覆有碳纳米颗粒的碳纳米管阵列作为阴极组装场电子发射器。本方法所制备的包覆有碳纳米颗粒的碳纳米管阵列,颗粒直径一般为15-30纳米,其作为场发射阴极材料具有比单纯碳纳米管阵列更低的开启场和阈值场以及更好的场发射稳定性,有较高的应用价值。The invention discloses a preparation method of a carbon nanotube array field emission cathode coated with carbon nanoparticle, and belongs to the field of preparation and application of nanomaterials. It mainly includes the following preparation processes: preparing carbon nanotube arrays on silicon single wafers by thermal chemical vapor deposition; using radio frequency technology to generate hydrogen plasma to process carbon nanotube arrays at low power for a long time; Carbon nanotube arrays coated with carbon nanoparticles act as cathodes to assemble field electron emitters. The carbon nanotube array coated with carbon nanoparticle prepared by this method has a particle diameter of generally 15-30 nanometers, and it has a lower turn-on field and threshold field and a better field emission cathode material than a simple carbon nanotube array. The field emission stability has high application value.

Description

一种碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法A preparation method of carbon nanotube array field emission cathode coated with carbon nanoparticles

 本发明得到国家自然科学基金—青年基金项目资助(项目编号51302187)。得到天津市应用基础与前沿技术研究计划重点项目资助(项目编号14JCZDJC32100)。 This invention was funded by the National Natural Science Foundation of China-Youth Fund Project (Project No. 51302187). This work was supported by the Key Project of Tianjin Applied Basic and Frontier Technology Research Program (Project No. 14JCZDJC32100).

技术领域 technical field

本发明属于纳米材料制备与应用技术领域,涉及利用低功率等离子体技术制备一种具有独特结构的纳米材料,并将之用于场电子发射器件的制备方法。 The invention belongs to the technical field of preparation and application of nanometer materials, and relates to a method for preparing a nanometer material with a unique structure by using low-power plasma technology and using it for field electron emission devices.

背景技术 Background technique

开发高性能的场发射阴极材料一直是近些年研究的热点,这些材料在新一代真空管、X射线管、电镜电子枪、场致发射平板显示等诸多领域都具有良好的应用前景。碳纳米管就是一种较为理想的场发射阴极材料。首先,碳纳米管主要由SP2杂化碳原子组成,具有非常好的导电性。其次,碳纳米管还拥有许多一维、二维纳米材料难以比拟的巨大长径比,使得电子能够在其场发射点处获得极大的局域电场强度(即场增强因子较大),从而使其更易克服碳纳米管表面势垒(即逸出功函数)而逸出到真空中,这对获得低开启场和阈值场以及大场发射电流密度都是非常有利的。相比近些年得到广泛关注的石墨烯基场发射阴极材料,以碳纳米管为基的场发射阴极具有更低的开启场,一般要小于2 V/μm,而石墨烯的开启场则往往大于4 V/μm。这种低开启场的特点在实际应用中是非常重要的,能够极大幅度的降低场发射阴极的工作电压。由此可见,更进一步降低碳纳米管场发射阴极材料的工作电场,获得更大的场发射电流密度,将提升其实用价值。但是,碳纳米管由于其自身几何外形的影响,场电子发射主要发生在曲率半径较小的尖端(更尖锐),在平坦的管壁上则几乎没有场电子发射,即外电场的作用只能够在碳纳米管尖端形成足够大的局域电场,电子在这种大的局域电场的作用下能够克服碳纳米管表面势垒而逸出,但管壁上由于局域电场强度不够,场电子并不能逸出。碳纳米管这种仅仅在尖端发射场电子的特点在很大程度上减少了其有效场发射点的数目,不利于大电流密度的场电子发射。因此,如果能够通过一定的手段使得碳纳米管除了尖端之外,还有更多新的有效场发射点,就可以在一定程度上降低碳纳米管的开启场和阈值场,并增加其场发射电流密度。 The development of high-performance field emission cathode materials has been a research hotspot in recent years. These materials have good application prospects in many fields such as new generation vacuum tubes, X-ray tubes, electron guns for electron microscopy, and field emission flat panel displays. Carbon nanotubes are an ideal field emission cathode material. First, carbon nanotubes are mainly composed of SP2 hybridized carbon atoms, which have very good electrical conductivity. Secondly, carbon nanotubes also have a huge length-to-diameter ratio that is incomparable to many one-dimensional and two-dimensional nanomaterials, enabling electrons to obtain a large local electric field intensity (that is, a large field enhancement factor) at their field emission points, thereby It is easier to overcome the surface barrier of carbon nanotubes (that is, the work function) and escape into the vacuum, which is very beneficial to obtain low turn-on field and threshold field and large field emission current density. Compared with graphene-based field emission cathode materials that have received widespread attention in recent years, carbon nanotube-based field emission cathodes have a lower turn-on field, generally less than 2 V/μm, while the turn-on field of graphene is often Greater than 4 V/μm. This feature of low turn-on field is very important in practical applications, and can greatly reduce the operating voltage of the field emission cathode. It can be seen that further reducing the working electric field of the carbon nanotube field emission cathode material and obtaining a larger field emission current density will increase its practical value. However, due to the influence of its own geometric shape, the field electron emission of carbon nanotubes mainly occurs at the tip (sharper) with a smaller curvature radius, and there is almost no field electron emission on the flat tube wall, that is, the effect of the external electric field can only A sufficiently large local electric field is formed at the tip of the carbon nanotube. Under the action of this large local electric field, the electrons can overcome the surface potential barrier of the carbon nanotube and escape, but due to the insufficient strength of the local electric field on the tube wall, the field electrons and cannot escape. The characteristic of carbon nanotubes that only emit field electrons at the tip greatly reduces the number of effective field emission points, which is not conducive to field electron emission with large current density. Therefore, if some means can be used to make carbon nanotubes have more new effective field emission points besides the tip, the turn-on field and threshold field of carbon nanotubes can be reduced to a certain extent, and their field emission can be increased. current density.

以碳纳米管为基的场发射阴极由于其一维的特点,散热表面相对石墨烯这种二维材料要小,在场发射过程中更容易受到焦耳热的影响,特别是在大电流密度场发射情况下,一部分有效场发射点会因为焦耳热的大量积累而烧毁,这就会在一定程度上降低阴极材料的场电子发射能力,即碳纳米管相比于石墨烯这种二维纳米材料,其场发射稳定性较差,这在实际应用中将大幅缩短碳纳米管基场发射阴极的使用寿命。研究表明,通过等离子体处理碳纳米管可以有效去除那些富缺陷、接触不稳定的碳纳米管,而这些碳纳米管正是场发射过程中场发射电流下降的主要因素,在等离子体作用下将之去除无疑将提升场发射阴极材料的场发射稳定性。此外,长时间高温退火处理也能够在一定程度上减少富缺陷碳纳米管的数量,从而使以碳纳米管为基的场发射阴极具有更好的场发射稳定性。 Due to its one-dimensional characteristics, the field emission cathode based on carbon nanotubes has a smaller heat dissipation surface than graphene, a two-dimensional material, and is more susceptible to the influence of Joule heat during the field emission process, especially in the case of high current density field emission. Under certain circumstances, a part of the effective field emission points will be burned due to the large accumulation of Joule heat, which will reduce the field electron emission capability of the cathode material to a certain extent, that is, compared with the two-dimensional nanomaterials such as graphene, carbon nanotubes, Its field emission stability is poor, which will greatly shorten the service life of carbon nanotube-based field emission cathodes in practical applications. Studies have shown that carbon nanotubes with rich defects and unstable contacts can be effectively removed by plasma treatment of carbon nanotubes, and these carbon nanotubes are the main factors for the decrease of field emission current during the field emission process. The removal will undoubtedly improve the field emission stability of the field emission cathode material. In addition, long-time high-temperature annealing can also reduce the number of defect-rich carbon nanotubes to a certain extent, so that the field emission cathode based on carbon nanotubes has better field emission stability.

由此可见,通过引入技术手段处理碳纳米管使其具有更多的有效场发射点,以降低其开启场和阈值场、提升其场发射电流密度,并且该技术手段还能在一定程度上提升其场发射稳定性,将使所制备的以碳纳米管为基的场发射阴极材料具有更高的应用价值。 It can be seen that by introducing technical means to process carbon nanotubes to make them have more effective field emission points, in order to reduce their turn-on field and threshold field, increase their field emission current density, and this technical means can also improve to a certain extent The field emission stability will make the prepared carbon nanotube-based field emission cathode material have higher application value.

发明内容 Contents of the invention

本发明的目的在于克服现有以碳纳米管为基的场发射阴极有效场发射点数目少、开启场和阈值场相对较高、场发射电流密度相对低、场发射稳定性不好的不足,利用一种简单的低功率等离子体工艺处理碳纳米管阵列,提供一种开启场和阈值场低、场发射电流密度大、场发射稳定性好的碳纳米管基场发射阴极材料。 The purpose of the present invention is to overcome the shortcomings of existing field emission cathodes based on carbon nanotubes that the number of effective field emission points is small, the opening field and threshold field are relatively high, the field emission current density is relatively low, and the field emission stability is not good. A simple low-power plasma process is used to process carbon nanotube arrays, and a carbon nanotube-based field emission cathode material with low turn-on field and threshold field, high field emission current density, and good field emission stability is provided.

本发明的目的是通过如下措施来达到的: The object of the present invention is achieved through the following measures:

一种碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法,其特征在于利用射频技术产生氢等离子体来处理热化学气相沉积法制备的碳纳米管阵列,调整射频功率为30-50W、基底温度为1000K、反应室气压为100Pa、处理时间为10-30小时,最终获得不同形貌的碳纳米颗粒包覆的碳纳米管阵列场发射阴极材料;所述的碳纳米颗粒指的是直径一般为15-30纳米的颗粒。 A method for preparing a carbon nanotube array field emission cathode coated with carbon nanoparticles, characterized in that the radio frequency technology is used to generate hydrogen plasma to treat the carbon nanotube array prepared by thermal chemical vapor deposition, and the radio frequency power is adjusted to 30-50W , the substrate temperature is 1000K, the pressure in the reaction chamber is 100Pa, and the treatment time is 10-30 hours, and finally obtain the carbon nanotube array field emission cathode material coated with carbon nanoparticles of different shapes; the carbon nanoparticles refer to Particles typically 15-30 nm in diameter.

本发明所述的碳纳米管阵列可以用传统的热化学气相沉积法制备,也可用其它任意的可制备阵列碳纳米管的方法来制备。 The carbon nanotube array of the present invention can be prepared by the traditional thermal chemical vapor deposition method, and can also be prepared by any other method that can prepare the carbon nanotube array.

本发明所述的碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法,制备中用于产生氢等离子体的装置可以是低功率的射频源,也可以是其它任意的可产生低功率密度氢等离子体的装置。 The preparation method of the carbon nanotube array field emission cathode coated with carbon nanoparticles according to the present invention, the device used to generate hydrogen plasma in the preparation can be a low-power radio frequency source, or any other low-power generation device. Device for dense hydrogen plasma.

本发明进一步公开了碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法,其特征在于按如下步骤进行: The present invention further discloses a preparation method of a carbon nanotube array field emission cathode coated with carbon nanoparticles, which is characterized in that the steps are as follows:

(1)将硅单晶片依次在去离子水、丙酮和无水乙醇中各超声清洗10分钟,超声功率为50W,其目的在于去除硅晶片表面的有机污染物。 (1) The silicon single wafer was ultrasonically cleaned in deionized water, acetone, and absolute ethanol for 10 minutes each, and the ultrasonic power was 50W. The purpose was to remove organic pollutants on the surface of the silicon wafer.

(2)将步骤(1)得到的硅晶片置入到体积比为4%的氢氟酸中浸泡5分钟,其目的在于去除硅晶片表面的二氧化硅覆盖层,之后自然晾干。 (2) Put the silicon wafer obtained in step (1) into hydrofluoric acid with a volume ratio of 4% and soak for 5 minutes. The purpose is to remove the silicon dioxide covering layer on the surface of the silicon wafer, and then dry it naturally.

(3)对步骤(2)得到的硅晶片在金属蒸汽真空弧离子源(MEVVA源)中进行载能铁离子轰击预处理,轰击时铁离子能量约为15keV,束流为10毫安,处理时间为15分钟,其目的在于提升碳纳米管与硅基底间的结合力。 (3) The silicon wafer obtained in step (2) is subjected to energy-carrying iron ion bombardment pretreatment in a metal vapor vacuum arc ion source (MEVVA source). The time is 15 minutes, and the purpose is to improve the binding force between the carbon nanotubes and the silicon substrate.

(4)将步骤(3)得到的载能铁离子轰击过的硅晶片置入磁控溅射装置中沉积厚度为5纳米的铁催化剂,具体方法为:将硅晶片放入磁控溅射装置内样品台上,铁源为一直径为75毫米的高纯(4N)铁靶,先抽真空至约8×10-5Pa,然后通入高纯(5N)氩气,调节沉积腔室气压为1.0Pa,沉积时,直流电源电流为60毫安,同时在样品台上加150伏负偏压,沉积时间为125秒,所获铁膜厚度为5纳米。 (4) Put the silicon wafer bombarded with energy-carrying iron ions obtained in step (3) into a magnetron sputtering device to deposit an iron catalyst with a thickness of 5 nanometers. The specific method is: put the silicon wafer into the magnetron sputtering device On the inner sample stage, the iron source is a high-purity (4N) iron target with a diameter of 75 mm. First, vacuumize to about 8×10 -5 Pa, and then pass high-purity (5N) argon to adjust the pressure of the deposition chamber. When depositing, the DC power supply current is 60 mA, and a negative bias voltage of 150 volts is applied to the sample stage at the same time, the deposition time is 125 seconds, and the thickness of the obtained iron film is 5 nanometers.

(5)将步骤(4)得到的沉积有5纳米铁催化剂的硅片放入高温石英管式炉中,先将催化剂在400sccm氢气、853K条件下热处理1小时,后在150sccm氨气、1023K条件下处理10分钟以提升催化剂活性,最后在87sccm乙炔、600sccm氢气、1023K 条件下常压生长碳纳米管阵列,生长时间为30分钟。 (5) Put the silicon wafer deposited with the 5nm iron catalyst obtained in step (4) into a high-temperature quartz tube furnace, first heat-treat the catalyst under the conditions of 400sccm hydrogen and 853K for 1 hour, and then heat-treat the catalyst under the conditions of 150sccm ammonia and 1023K. Down treatment for 10 minutes to improve the catalyst activity, and finally under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, the carbon nanotube array was grown under normal pressure, and the growth time was 30 minutes.

(6)将步骤(5)得到的碳纳米管阵列放入射频装置的处理室中,通入高纯氢气(5N),调节反应室气压为100Pa,并对基底加热至1000K,等待气压和温度稳定; (6) Put the carbon nanotube array obtained in step (5) into the processing chamber of the radio frequency device, feed high-purity hydrogen (5N), adjust the pressure of the reaction chamber to 100Pa, and heat the substrate to 1000K, wait for the pressure and temperature Stablize;

(7)在步骤(6)的基础上启动射频源,调节射频功率为30-50W,开始处理碳纳米管阵列,处理时间为10-30小时,最终所得即为碳纳米颗粒包覆的碳纳米管阵列。 (7) Start the radio frequency source on the basis of step (6), adjust the radio frequency power to 30-50W, and start processing the carbon nanotube array. The processing time is 10-30 hours, and the final result is carbon nanoparticle-coated carbon nanotubes. tube array.

(8)以步骤(7)所得到的生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片为基底按常规方法组装场电子发射器,具体如下:用导电胶将生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片粘附在厚度约为2毫米的铜金属电极上作为场发射阴极,并将阴极接地,用一厚度约为2毫米的铜板作为阳极,两电极用厚度为200微米的环装聚四氟乙烯隔离,负载正偏压在阳极板上,就可获得稳定的场电子发射,场发射电流的大小可通过改变正偏压大小来调节;以硅单晶片上生长的碳纳米颗粒包覆的碳纳米管阵列为基的场发射阴极材料的开启电场(场发射电流密度为10 μA/cm2 所需的电场)仅有0.90-1.10 V/μm,阈值电场(场发射电流密度为10 mA/cm2 所需的电场)仅有1.44-1.63 V/μm,最大场发射电流密度可达46.78 mA/cm2,且具有良好的场发射稳定性。 (8) Use the silicon single wafer grown with carbon nanotube arrays coated with carbon nanoparticles obtained in step (7) as the substrate to assemble the field electron emitter according to the conventional method, as follows: use conductive glue to grow the carbon nanoparticle The silicon single wafer of the coated carbon nanotube array is adhered to a copper metal electrode with a thickness of about 2 mm as a field emission cathode, and the cathode is grounded, and a copper plate with a thickness of about 2 mm is used as an anode. It is a 200-micron ring-mounted polytetrafluoroethylene isolation, and the load is positively biased on the anode plate to obtain stable field electron emission. The size of the field emission current can be adjusted by changing the magnitude of the positive bias; The open electric field (the electric field required for the field emission current density of 10 μA/cm 2 ) of the field emission cathode material based on the grown carbon nanoparticle-coated carbon nanotube array is only 0.90-1.10 V/μm, and the threshold electric field ( The electric field required for a field emission current density of 10 mA/cm 2 ) is only 1.44-1.63 V/μm, the maximum field emission current density can reach 46.78 mA/cm 2 , and it has good field emission stability.

本发明公开的碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法与现有技术相比其优越性在于: Compared with the prior art, the preparation method of the carbon nanotube array field emission cathode coated with carbon nanoparticles disclosed by the present invention has the following advantages:

本方法制备的碳纳米颗粒包覆的碳纳米管阵列场发射阴极具有很低的开启场(0.90-1.10 V/μm)和阈值场(1.44-1.63 V/μm),最大场发射电流密度可达46.78 mA/cm2,且场发射稳定性良好(在10小时内电流变化幅度非常小),这些指标相比原始未经处理的碳纳米管阵列均有大幅提高。所用的等离子体处理方法,工艺相对较为简单,对设备要求不高,且不会在碳纳米管中引入其它杂质,具有较高的实用价值。 The carbon nanotube array field emission cathode coated with carbon nanoparticles prepared by this method has very low turn-on field (0.90-1.10 V/μm) and threshold field (1.44-1.63 V/μm), and the maximum field emission current density can reach 46.78 mA/cm 2 , and the field emission stability is good (the current change range is very small within 10 hours), these indicators are greatly improved compared with the original untreated carbon nanotube array. The plasma treatment method used has a relatively simple process, does not require high equipment, and does not introduce other impurities into the carbon nanotubes, and has high practical value.

附图说明 Description of drawings :

图1是本发明制备碳纳米颗粒包覆碳纳米管阵列的工艺流程示意图,主要分为制备洁净硅晶片基底、磁控溅射法沉积铁催化剂、热化学气相沉积法制备碳纳米管阵列、低功率射频氢等离子体处理碳纳米管阵列等四个部分; Fig. 1 is a schematic diagram of the process flow for preparing carbon nanoparticle-coated carbon nanotube arrays in the present invention, which is mainly divided into preparation of clean silicon wafer substrates, deposition of iron catalysts by magnetron sputtering, preparation of carbon nanotube arrays by thermal chemical vapor deposition, low Power radio frequency hydrogen plasma treatment of carbon nanotube array and other four parts;

图2是按实施例1所示实验条件所制备的碳纳米管阵列的扫描电镜图片,所示碳纳米管长度约为23微米,右上角插图所示为碳纳米管阵列顶端的扫描电镜图片,右下角插图所示为碳纳米管中部的扫描电镜图片; Fig. 2 is the scanning electron microscope picture of the carbon nanotube array prepared by the experimental conditions shown in embodiment 1, and the shown carbon nanotube length is about 23 microns, and the upper right corner illustration shows the scanning electron microscope picture of the carbon nanotube array top, The inset in the lower right corner shows the scanning electron microscope image of the middle part of the carbon nanotube;

图3是本发明中所用射频装置的结构示意图;所用氢气纯度为5N,加热器为自制钼丝加热器,用“分子泵+机械泵”组合装置抽真空; Fig. 3 is the structural representation of radio frequency device used in the present invention; Used hydrogen purity is 5N, and heater is self-made molybdenum wire heater, uses " molecular pump+mechanical pump " combination device to evacuate;

图4是不同条件下制备的碳纳米颗粒包覆的碳纳米管阵列的扫描电镜图片,所得碳纳米颗粒直径大多在15-30纳米,包括: Figure 4 is a scanning electron microscope image of a carbon nanoparticle-coated carbon nanotube array prepared under different conditions. Most of the obtained carbon nanoparticles have a diameter of 15-30 nanometers, including:

41.按实施例1条件(射频功率:30W;处理时间:10小时)所制备的碳纳米颗粒包覆的碳纳米管阵列的扫描电镜图片,右上和右下角插图为相应的高倍扫描电镜图片,对应着图中方框标识部分; 41. The scanning electron microscope picture of the carbon nanotube array coated with carbon nanoparticles prepared according to the conditions of Example 1 (radio frequency power: 30W; treatment time: 10 hours). The upper right and lower right corner illustrations are the corresponding high-power scanning electron microscope pictures, Corresponding to the part marked by the box in the figure;

42.按实施例2条件(射频功率:30W;处理时间:20小时)所制备的碳纳米颗粒包覆的碳纳米管阵列的扫描电镜图片; 42. The scanning electron microscope picture of the carbon nanotube array coated with carbon nanoparticles prepared according to the conditions of Example 2 (radio frequency power: 30W; treatment time: 20 hours);

43.按实施例3条件(射频功率:30W;处理时间:30小时)所制备的碳纳米颗粒包覆的碳纳米管阵列的扫描电镜图片; 43. The scanning electron microscope picture of the carbon nanotube array coated with carbon nanoparticles prepared according to the conditions of Example 3 (radio frequency power: 30W; treatment time: 30 hours);

图5所示为高真空场发射测试仪的结构示意图,用于测试各实施例中所制备的碳纳米颗粒包覆的碳纳米管阵列的场发射性能;该装置是一个常规的二极管构型的场发射测试装置:以所制备的场发射材料为阴极,以直径约为10厘米的不锈钢板为阳极,阳极位置精确可调,两极间距保持为2毫米;测试中,将阴极接地,在阳极负载0-10kV可调正偏压;测试数据通过电脑自动记录; Fig. 5 shows the structural representation of high vacuum field emission tester, is used for testing the field emission performance of the carbon nanotube array that the prepared carbon nanoparticle wraps in each embodiment; This device is a conventional diode configuration Field emission test device: the prepared field emission material is used as the cathode, and a stainless steel plate with a diameter of about 10 cm is used as the anode. 0-10kV adjustable positive bias; test data is automatically recorded by computer;

图6是在不同条件下制备的碳纳米颗粒包覆的碳纳米管阵列的场发射性能图,具体包括实施例1、实施例2、实施例3中所制备样品与原始碳纳米管阵列场发射性能的比较,其表征的是场发射电流密度随外加电场强度增加的变化关系,其中J th表示的是阈值场发射电流密度,其大小为10 mA/cm2Fig. 6 is the field emission performance diagram of the carbon nanotube array coated with carbon nanoparticles prepared under different conditions, specifically including the sample prepared in Example 1, Example 2, Example 3 and the original carbon nanotube array field emission The performance comparison, which characterizes the change relationship of the field emission current density with the increase of the applied electric field intensity, wherein J th represents the threshold field emission current density, and its magnitude is 10 mA/cm 2 ;

图7是实施例2所制备的碳纳米颗粒包覆的碳纳米管阵列与原始碳纳米管阵列的场发射稳定性图,表征的是在外加电场恒定的情况下,场发射电流密度随时间的变化关系。 Fig. 7 is the field emission stability diagram of the carbon nanotube array coated with carbon nanoparticles prepared in Example 2 and the original carbon nanotube array, which characterizes the change of field emission current density over time under the constant external electric field alternative relation.

具体实施方式 Detailed ways

下面结合附图和实施例对本发明进一步详细说明,但本发明不限于这些实施例。其中所用到的硅单晶片、无水乙醇、丙酮、氢氟酸、高纯氢气、高纯乙炔气、高纯氨气、高纯氩气、高纯铁靶等均有市售。超声清洗、金属蒸汽真空弧离子源(MEVVA源)、磁控溅射、高温管式炉、射频、场发射测试仪等装置均有市售。 The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments, but the present invention is not limited to these embodiments. The silicon single wafer, absolute ethanol, acetone, hydrofluoric acid, high-purity hydrogen, high-purity acetylene, high-purity ammonia, high-purity argon, and high-purity iron targets used are all commercially available. Ultrasonic cleaning, metal vapor vacuum arc ion source (MEVVA source), magnetron sputtering, high temperature tube furnace, radio frequency, field emission tester and other devices are commercially available.

    图1所示即为本发明制备碳纳米颗粒包覆的碳纳米管阵列的工艺流程示意图,分为制备洁净硅晶片基底、磁控溅射法沉积铁催化剂、热化学气相沉积法制备碳纳米管阵列、低功率射频氢等离子体处理碳纳米管阵列等四个部分,以下实施例有关样品制备的部分均按这四步执行。 Shown in Fig. 1 is exactly the technological flow schematic diagram of the carbon nanotube array that the present invention prepares carbon nanoparticle coating, is divided into preparation clean silicon wafer substrate, magnetron sputtering deposition iron catalyst, thermal chemical vapor deposition method preparation carbon nanotube Array, low-power radio-frequency hydrogen plasma treatment of carbon nanotube array and other four parts, the parts related to sample preparation in the following embodiments are all executed according to these four steps.

实施例1 Example 1

(1)制备洁净硅晶片基底: (1) Preparation of clean silicon wafer substrate:

首先将硅片切成2cm×2cm小片,依次在去离子水、丙酮和无水乙醇中各超声(50W)清洗10分钟,再将硅晶片放入体积比为4%的氢氟酸中浸泡5分钟,获得干净无污染且无二氧化硅覆盖层的基底。 First, cut the silicon wafer into small pieces of 2cm×2cm, clean them with ultrasonic (50W) in deionized water, acetone and absolute ethanol for 10 minutes, and then put the silicon wafer into hydrofluoric acid with a volume ratio of 4% for 5 minutes. Minutes for clean, contamination-free substrates free of silica overlays.

(2)磁控溅射法沉积铁催化剂: (2) Deposition of iron catalyst by magnetron sputtering:

铁催化剂的沉积在磁控溅射装置(有市售)中进行。在此之前,先将硅单晶片在金属蒸汽真空弧离子源(MEVVA源,有市售)中进行载能铁离子轰击预处理,铁离子能量约为15keV,束流为10毫安,处理时间为15分钟,该处理可有效提升碳纳米管与硅基底间的结合力;然后将载能铁离子轰击过的硅晶片放置在样品台上,先对真空室抽真空至约8×10-5Pa,以排除杂质气体污染,然后通入高纯(5N)氩气,调节腔室气压为1.0Pa;沉积时,直流电源电流为60毫安,同时在样品台上加150伏负偏压,沉积时间为125秒,所获铁膜厚度为5纳米。 The deposition of the iron catalyst was carried out in a magnetron sputtering device (commercially available). Prior to this, the silicon single wafer was pretreated by bombardment with energetic iron ions in a metal vapor vacuum arc ion source (MEVVA source, commercially available). The iron ion energy was about 15keV, the beam current was 10 mA, and the processing time 15 minutes, this treatment can effectively improve the binding force between the carbon nanotubes and the silicon substrate; then place the silicon wafer bombarded by the energy-carrying iron ions on the sample stage, and first evacuate the vacuum chamber to about 8×10 -5 Pa, to eliminate impurity gas pollution, then pass high-purity (5N) argon gas, adjust the chamber pressure to 1.0Pa; during deposition, the DC power supply current is 60 mA, and a 150-volt negative bias is applied to the sample stage at the same time, The deposition time was 125 seconds, and the thickness of the obtained iron film was 5 nanometers.

(3)热化学气相沉积法制备碳纳米管阵列: (3) Preparation of carbon nanotube arrays by thermal chemical vapor deposition:

碳纳米管阵列的生长在高温管式炉(有市售)中完成,所用方法为传统的热化学气相沉积法,且整个过程在常压下完成。首先将沉积有5纳米铁催化剂的硅晶片置入管式炉石英管内样品台上,封闭好石英管后,将铁催化剂在400sccm氢气、853K条件下热处理1小时;后在150sccm氨气、1023K条件下处理10分钟以提升催化剂活性;最后在87sccm乙炔、600sccm氢气、1023K 条件下生长碳纳米管阵列,生长时间为30分钟。图2所示即为在该条件下所得碳纳米管阵列的扫描电镜图片,可以看出,碳纳米管长度约为23微米(图2),顶端弯曲(图2右上角插图),但中部阵列性较好(图2右下角插图),且表面光滑。 The growth of carbon nanotube arrays is completed in a high-temperature tube furnace (commercially available), the method used is the traditional thermal chemical vapor deposition method, and the whole process is completed under normal pressure. First, the silicon wafer deposited with 5 nanometer iron catalyst is placed on the sample stage in the quartz tube of the tube furnace, and after the quartz tube is sealed, the iron catalyst is heat-treated for 1 hour under 400 sccm hydrogen gas and 853K conditions; Down treatment for 10 minutes to improve catalyst activity; Finally, carbon nanotube arrays were grown under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, and the growth time was 30 minutes. Figure 2 is the scanning electron microscope picture of the carbon nanotube array obtained under this condition. It can be seen that the length of the carbon nanotube is about 23 microns (Figure 2), and the top is curved (the illustration in the upper right corner of Figure 2), but the middle array The properties are good (inset in the lower right corner of Figure 2), and the surface is smooth.

(4)低功率射频氢等离子体处理碳纳米管阵列: (4) Low-power RF hydrogen plasma treatment of carbon nanotube arrays:

氢等离子体处理碳纳米管阵列在射频装置(有市售)中完成,图3所示即为该装置的结构示意图。首先将所制备的碳纳米管阵列放置在石墨样品台上,对处理室预抽真空至约8×10-4Pa,然后在氢气(纯度为5N)氛围中对基底进行加热,升温速率约为60K/min,直到温度稳定在1000K为止,并调节气压为100Pa,待温度和气压均稳定后,启动射频源,调节射频功率为30W,处理时间为10小时。图4-41所示即为在该条件下所得的碳纳米颗粒包覆的碳纳米管阵列的扫描电镜图片,与图2所示原始碳纳米管相比,碳纳米管整体形貌变化不大,但表面被碳纳米颗粒所包覆,颗粒较小,直径多在15-20纳米,从图4-41右上和右下角高倍扫描电镜图片可清晰看出,与原始碳纳米管的光滑表面(图2插图)截然不同,这些碳纳米突起均可能成为潜在的有效场发射点。 Hydrogen plasma treatment of carbon nanotube arrays is completed in a radio frequency device (commercially available), and Fig. 3 is a schematic diagram of the structure of the device. First place the prepared carbon nanotube array on the graphite sample stage, pre-evacuate the processing chamber to about 8×10 -4 Pa, and then heat the substrate in a hydrogen (purity 5N) atmosphere with a heating rate of about 60K/min until the temperature stabilizes at 1000K, and adjust the air pressure to 100Pa. After the temperature and air pressure are stable, start the RF source, adjust the RF power to 30W, and the processing time is 10 hours. Figure 4-41 is the SEM picture of the carbon nanotube array coated with carbon nanoparticles obtained under this condition. Compared with the original carbon nanotubes shown in Figure 2, the overall shape of the carbon nanotubes has little change , but the surface is covered by carbon nanoparticles, the particles are small, and the diameter is mostly 15-20 nanometers. From the high-power scanning electron microscope pictures in the upper right and lower right corners of Figure 4-41, it can be clearly seen that the smooth surface of the original carbon nanotubes ( Fig. 2 inset) are completely different, and these carbon nanoprotrusions may become potential effective field emission sites.

(5)场发射性能测试: (5) Field emission performance test:

碳纳米颗粒包覆的碳纳米管阵列的场发射性能测试在高真空场发射测试仪(有市售)中完成,图5所示即为该测试装置的结构示意图。测试室中真空度维持在约1×10-7Pa(用常开的钛离子泵抽真空)。将所制备的碳纳米颗粒包覆的碳纳米管阵列样品用导电胶粘附在铜样品台上,以此作为场发射阴极,并将阴极接地;阳极为一直径约为10厘米的不锈钢圆板,阴阳极保持平行,间距为2毫米;测试时,在阳极上负载0-10kV可调正偏压,偏压增速恒定为500 V/min,测试结果通过程序自动记录到电脑中。图6所示即为在不同条件下制备的碳纳米颗粒包覆的碳纳米管阵列的场发射性能图,具体包括本实施例、实施例2、实施例3中所制备样品与原始碳纳米管阵列场发射性能的比较,其表征的是场发射电流密度随外加电场强度增加的变化关系。可以看出,30W下经氢等离子体处理10小时后所得的碳纳米颗粒包覆的碳纳米管阵列的开启场、阈值场和最大场发射电流密度分别为1.10 V/μm、1.63 V/μm和37.24 mA/cm2,要优于原始碳纳米管的1.24 V/μm、1.76 V/μm和21.90 mA/cm2。场发射性能的提升可归因于长时间低功率氢等离子体处理后碳纳米管表面有效场发射点的增多,大量的碳纳米颗粒均可成为有效场发射点,场发射电流密度相比原始碳纳米管仅有尖端发射电子无疑将大幅提升。 The field emission performance test of the carbon nanotube array coated with carbon nanoparticles is completed in a high vacuum field emission tester (commercially available), and Fig. 5 is a schematic structural diagram of the test device. The vacuum degree in the test chamber is maintained at about 1×10 -7 Pa (with a normally open titanium ion pump for vacuuming). The prepared carbon nanoparticle-coated carbon nanotube array sample is adhered on the copper sample stage with conductive glue, which is used as the field emission cathode, and the cathode is grounded; the anode is a stainless steel disc with a diameter of about 10 cm , the anode and cathode are kept parallel with a distance of 2 mm; during the test, an adjustable positive bias voltage of 0-10kV is loaded on the anode, and the bias voltage growth rate is constant at 500 V/min. The test results are automatically recorded into the computer through the program. Figure 6 shows the field emission properties of carbon nanoparticle-coated carbon nanotube arrays prepared under different conditions, specifically including the samples prepared in this example, example 2, and example 3 and the original carbon nanotubes. The comparison of the field emission performance of the arrays is characterized by the change relationship of the field emission current density with the increase of the applied electric field intensity. It can be seen that the turn-on field, threshold field, and maximum field emission current density of carbon nanoparticle-coated carbon nanotube arrays obtained after hydrogen plasma treatment at 30 W for 10 hours are 1.10 V/μm, 1.63 V/μm, and 1.63 V/μm, respectively. 37.24 mA/cm 2 , better than 1.24 V/μm, 1.76 V/μm and 21.90 mA/cm 2 of pristine carbon nanotubes. The improvement of field emission performance can be attributed to the increase of effective field emission sites on the surface of carbon nanotubes after long-term low-power hydrogen plasma treatment. A large number of carbon nanoparticles can become effective field emission sites. Compared with the original carbon Nanotubes with only tips emitting electrons will undoubtedly be greatly improved.

(6)场电子发射器组装(常规组装方法): (6) Field electron emitter assembly (conventional assembly method):

用导电胶将生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片粘附在厚度为2毫米的铜电极上,将其作为场发射阴极,并将阴极接地,阳极为一厚度为2毫米的铜板电极,阴阳极保持平行,用厚度为200微米的环装聚四氟乙烯隔开,负载正偏压在阳极板上,就可获得稳定的场电子发射,场发射电流密度大小的控制可通过调节阳极板偏压来实现。 A silicon single wafer with a carbon nanotube array coated with carbon nanoparticles is adhered to a copper electrode with a thickness of 2 mm by conductive glue, and it is used as a field emission cathode, and the cathode is grounded, and the anode is a thickness of 2 mm. mm copper plate electrodes, the anode and cathode are kept parallel, separated by a 200-micron ring-packed polytetrafluoroethylene, and the load is positively biased on the anode plate to obtain stable field electron emission and control the field emission current density This can be achieved by adjusting the anode plate bias.

实施例2 Example 2

(1)制备洁净硅晶片基底: (1) Preparation of clean silicon wafer substrate:

首先将硅片切成2cm×2cm小片,依次在去离子水、丙酮和无水乙醇中各超声(50W)清洗10分钟,再将硅晶片放入体积比为4%的氢氟酸中浸泡5分钟,获得干净无污染且无二氧化硅覆盖层的基底。 First, cut the silicon wafer into small pieces of 2cm×2cm, clean them with ultrasonic (50W) in deionized water, acetone and absolute ethanol for 10 minutes, and then put the silicon wafer into hydrofluoric acid with a volume ratio of 4% for 5 minutes. Minutes for clean, contamination-free substrates free of silica overlays.

(2)磁控溅射法沉积铁催化剂: (2) Deposition of iron catalyst by magnetron sputtering:

铁催化剂的沉积在磁控溅射装置(有市售)中进行。在此之前,先将硅单晶片在金属蒸汽真空弧离子源(MEVVA源,有市售)中进行载能铁离子轰击预处理,铁离子能量约为15keV,束流为10毫安,处理时间为15分钟,该处理可有效提升碳纳米管与硅基底间的结合力;然后将载能铁离子轰击过的硅晶片放置在样品台上,先对真空室抽真空至约8×10-5Pa,以排除杂质气体污染,然后通入高纯(5N)氩气,调节腔室气压为1.0Pa;沉积时,直流电源电流为60毫安,同时在样品台上加150伏负偏压,沉积时间为125秒,所获铁膜厚度为5纳米。 The deposition of the iron catalyst was carried out in a magnetron sputtering device (commercially available). Prior to this, the silicon single wafer was pretreated by bombardment with energetic iron ions in a metal vapor vacuum arc ion source (MEVVA source, commercially available). The iron ion energy was about 15keV, the beam current was 10 mA, and the processing time 15 minutes, this treatment can effectively improve the binding force between the carbon nanotubes and the silicon substrate; then place the silicon wafer bombarded by the energy-carrying iron ions on the sample stage, and first evacuate the vacuum chamber to about 8×10 -5 Pa, to eliminate impurity gas pollution, then pass high-purity (5N) argon gas, adjust the chamber pressure to 1.0Pa; during deposition, the DC power supply current is 60 mA, and a 150-volt negative bias is applied to the sample stage at the same time, The deposition time was 125 seconds, and the thickness of the obtained iron film was 5 nanometers.

(3)热化学气相沉积法制备碳纳米管阵列: (3) Preparation of carbon nanotube arrays by thermal chemical vapor deposition:

碳纳米管阵列的生长在高温管式炉(有市售)中完成,所用方法为传统的热化学气相沉积法,且整个过程在常压下完成。首先将沉积有5纳米铁催化剂的硅晶片置入管式炉石英管内样品台上,封闭好石英管后,将铁催化剂在400sccm氢气、853K条件下热处理1小时;后在150sccm氨气、1023K条件下处理10分钟以提升催化剂活性;最后在87sccm乙炔、600sccm氢气、1023K 条件下生长碳纳米管阵列,生长时间为30分钟。 The growth of carbon nanotube arrays is completed in a high-temperature tube furnace (commercially available), the method used is the traditional thermal chemical vapor deposition method, and the whole process is completed under normal pressure. First, the silicon wafer deposited with 5 nanometer iron catalyst is placed on the sample stage in the quartz tube of the tube furnace, and after the quartz tube is sealed, the iron catalyst is heat-treated for 1 hour under 400 sccm hydrogen gas and 853K conditions; Down treatment for 10 minutes to improve catalyst activity; Finally, carbon nanotube arrays were grown under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, and the growth time was 30 minutes.

(4)低功率射频氢等离子体处理碳纳米管阵列: (4) Low-power RF hydrogen plasma treatment of carbon nanotube arrays:

氢等离子体处理碳纳米管阵列在射频装置(有市售)中完成,图3所示即为该装置的结构示意图。首先将所制备的碳纳米管阵列放置在石墨样品台上,对处理室预抽真空至约8×10-4Pa,然后在氢气(纯度为5N)氛围中对基底进行加热,升温速率约为60K/min,直到温度稳定在1000K为止,并调节气压为100Pa,待温度和气压均稳定后,启动射频源,调节射频功率为30W,处理时间为20小时。图4-42所示即为在本实施例中所得的碳纳米颗粒包覆的碳纳米管阵列的扫描电镜图片,与图2所示原始碳纳米管相比,碳纳米管整体形貌变化不大,但表面被碳纳米颗粒所包覆,颗粒直径相比30W、10小时处理后所得的碳纳米管(图4-41)稍有增加,大多在20-30纳米,与原始碳纳米管的光滑表面(图2插图)截然不同,这些碳纳米突起均可能成为潜在的有效场发射点。 Hydrogen plasma treatment of carbon nanotube arrays is completed in a radio frequency device (commercially available), and Fig. 3 is a schematic diagram of the structure of the device. First place the prepared carbon nanotube array on the graphite sample stage, pre-evacuate the processing chamber to about 8×10 -4 Pa, and then heat the substrate in a hydrogen (purity 5N) atmosphere with a heating rate of about 60K/min, until the temperature stabilizes at 1000K, and adjust the air pressure to 100Pa. After the temperature and air pressure are stable, start the RF source, adjust the RF power to 30W, and the processing time is 20 hours. Figure 4-42 is the scanning electron microscope picture of the carbon nanotube array coated with carbon nanoparticles obtained in this example. Compared with the original carbon nanotube shown in Figure 2, the overall shape of the carbon nanotube does not change. Large, but the surface is covered by carbon nanoparticles, and the particle diameter is slightly increased compared with the carbon nanotubes obtained after 30W and 10 hours of treatment (Fig. In contrast to a smooth surface (Fig. 2 inset), these carbon nanoprotrusions could be potential effective field emission sites.

(5)场发射性能测试: (5) Field emission performance test:

碳纳米颗粒包覆的碳纳米管阵列的场发射性能测试在高真空场发射测试仪(有市售)中完成,图5所示即为该测试装置的结构示意图。测试室中真空度维持在约1×10-7Pa(用常开的钛离子泵抽真空)。将所制备的碳纳米颗粒包覆的碳纳米管阵列样品用导电胶粘附在铜样品台上,以此作为场发射阴极,并将阴极接地;阳极为一直径约为10厘米的不锈钢圆板,阴阳极保持平行,间距为2毫米;测试时,在阳极上负载0-10kV可调正偏压,偏压增速恒定为500V/min,测试结果通过程序自动记录到电脑中。从图6可以看出,30W下经氢等离子体处理20小时后所得的碳纳米颗粒包覆的碳纳米管阵列的开启场、阈值场和最大场发射电流密度分别为0.90 V/μm、1.44 V/μm和43.42 mA/cm2,要远远优于原始碳纳米管的1.24 V/μm、1.76 V/μm和21.90 mA/cm2,也要好过30W、10小时处理后碳纳米管阵列的1.10 V/μm、1.63 V/μm和37.24 mA/cm2。场发射性能的大幅提升可归因于长时间低功率氢等离子体处理后碳纳米管表面有效场发射点的增多,大量的碳纳米颗粒均可成为有效场发射点,场发射电流密度相比原始碳纳米管仅有尖端发射电子无疑将大幅提升。图7所示为本实施例中所制备的碳纳米颗粒包覆的碳纳米管阵列和原始未经处理碳纳米管阵列的场发射稳定性图,表征的是在恒定外电场作用下,场发射电流密度随时间的变化关系。可以看出,本实施例中所制备的碳纳米颗粒包覆的碳纳米管阵列具有比原始碳纳米管阵列更好的场发射稳定性,在10小时测试中(平均场发射电流密度为12.25 mA/cm2),场发射电流密度没有明显衰减,波动也很小,但原始碳纳米管样品在10小时测试中(平均场发射电流密度为9.80 mA/cm2),电流密度衰减约17%。虽然二者的平均场发射电流密度均在阈值场发射电流密度(J th,10 mA/cm2)附近,但测试中碳纳米颗粒包覆碳纳米管样品的恒定外加电场强度仅为1.50 V/μm,远小于原始碳纳米管样品的1.80 V/μm,这种工作电压的降低对实际应用是非常重要的。由此可见,长时间高温以及等离子体处理大幅提升了碳纳米管阵列的场发射稳定性。 The field emission performance test of the carbon nanotube array coated with carbon nanoparticles is completed in a high vacuum field emission tester (commercially available), and Fig. 5 is a schematic structural diagram of the test device. The vacuum degree in the test chamber is maintained at about 1×10 -7 Pa (with a normally open titanium ion pump for vacuuming). The prepared carbon nanoparticle-coated carbon nanotube array sample is adhered on the copper sample stage with conductive glue, which is used as the field emission cathode, and the cathode is grounded; the anode is a stainless steel disc with a diameter of about 10 cm , the anode and cathode are kept parallel with a distance of 2 mm; during the test, an adjustable positive bias voltage of 0-10kV is loaded on the anode, and the bias voltage growth rate is constant at 500V/min. The test results are automatically recorded into the computer through the program. It can be seen from Figure 6 that the turn-on field, threshold field and maximum field emission current density of carbon nanoparticle-coated carbon nanotube arrays obtained after hydrogen plasma treatment at 30 W for 20 hours are 0.90 V/μm and 1.44 V, respectively. /μm and 43.42 mA/cm 2 , far better than 1.24 V/μm, 1.76 V/μm and 21.90 mA/cm 2 of pristine carbon nanotubes, and better than 1.10 mA/cm 2 of carbon nanotube arrays after 30W and 10 hours treatment V/μm, 1.63 V/μm, and 37.24 mA/cm 2 . The significant improvement of field emission performance can be attributed to the increase of effective field emission sites on the surface of carbon nanotubes after long-term low-power hydrogen plasma treatment. A large number of carbon nanoparticles can become effective field emission sites, and the field emission current density is higher than that of the original Carbon nanotubes with only tip-emitting electrons will undoubtedly be greatly improved. Fig. 7 shows the field emission stability graphs of the carbon nanotube arrays coated with carbon nanoparticles prepared in this example and the original untreated carbon nanotube arrays. Variation of current density with time. It can be seen that the carbon nanoparticle-coated carbon nanotube array prepared in this example has better field emission stability than the original carbon nanotube array, and in the 10-hour test (the average field emission current density is 12.25 mA /cm 2 ), the field emission current density has no obvious attenuation, and the fluctuation is small, but the current density of the pristine carbon nanotube sample is attenuated by about 17% during the 10-hour test (the average field emission current density is 9.80 mA/cm 2 ). Although the average field emission current densities of both are near the threshold field emission current density ( J th , 10 mA/cm 2 ), the constant applied electric field strength of the carbon nanoparticle-coated carbon nanotube sample in the test is only 1.50 V/ μm, much smaller than the 1.80 V/μm of pristine CNT samples, this reduction in operating voltage is very important for practical applications. It can be seen that the long-time high temperature and plasma treatment greatly improved the field emission stability of the carbon nanotube array.

(6)场电子发射器组装(常规组装方法): (6) Field electron emitter assembly (conventional assembly method):

用导电胶将生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片粘附在厚度为2毫米的铜电极上,将其作为场发射阴极,并将阴极接地,阳极为一厚度为2毫米的铜板电极,阴阳极保持平行,用厚度为200微米的环装聚四氟乙烯隔开,负载正偏压在阳极板上,就可获得稳定的场电子发射,场发射电流密度大小的控制可通过调节阳极板偏压来实现。 A silicon single wafer with a carbon nanotube array coated with carbon nanoparticles is adhered to a copper electrode with a thickness of 2 mm by conductive glue, and it is used as a field emission cathode, and the cathode is grounded, and the anode is a thickness of 2 mm. mm copper plate electrodes, the anode and cathode are kept parallel, separated by a 200-micron ring-packed polytetrafluoroethylene, and the load is positively biased on the anode plate to obtain stable field electron emission and control the field emission current density This can be achieved by adjusting the anode plate bias.

实施例3 Example 3

(1)制备洁净硅晶片基底: (1) Preparation of clean silicon wafer substrate:

首先将硅片切成2cm×2cm小片,依次在去离子水、丙酮和无水乙醇中各超声(50W)清洗10分钟,再将硅晶片放入体积比为4%的氢氟酸中浸泡5分钟,获得干净无污染且无二氧化硅覆盖层的基底。 First, cut the silicon wafer into small pieces of 2cm×2cm, clean them with ultrasonic (50W) in deionized water, acetone and absolute ethanol for 10 minutes, and then put the silicon wafer into hydrofluoric acid with a volume ratio of 4% for 5 minutes. Minutes for clean, contamination-free substrates free of silica overlays.

(2)磁控溅射法沉积铁催化剂: (2) Deposition of iron catalyst by magnetron sputtering:

铁催化剂的沉积在磁控溅射装置(有市售)中进行。在此之前,先将硅单晶片在金属蒸汽真空弧离子源(MEVVA源,有市售)中进行载能铁离子轰击预处理,铁离子能量约为15keV,束流为10毫安,处理时间为15分钟,该处理可有效提升碳纳米管与硅基底间的结合力;然后将载能铁离子轰击过的硅晶片放置在样品台上,先对真空室抽真空至约8×10-5Pa,以排除杂质气体污染,然后通入高纯(5N)氩气,调节腔室气压为1.0Pa;沉积时,直流电源电流为60毫安,同时在样品台上加150伏负偏压,沉积时间为125秒,所获铁膜厚度为5纳米。 The deposition of the iron catalyst was carried out in a magnetron sputtering device (commercially available). Prior to this, the silicon single wafer was pretreated by bombardment with energetic iron ions in a metal vapor vacuum arc ion source (MEVVA source, commercially available). The iron ion energy was about 15keV, the beam current was 10 mA, and the processing time 15 minutes, this treatment can effectively improve the binding force between the carbon nanotubes and the silicon substrate; then place the silicon wafer bombarded by the energy-carrying iron ions on the sample stage, and first evacuate the vacuum chamber to about 8×10 -5 Pa, to eliminate impurity gas pollution, then pass high-purity (5N) argon gas, adjust the chamber pressure to 1.0Pa; during deposition, the DC power supply current is 60 mA, and a 150-volt negative bias is applied to the sample stage at the same time, The deposition time was 125 seconds, and the thickness of the obtained iron film was 5 nanometers.

(3)热化学气相沉积法制备碳纳米管阵列: (3) Preparation of carbon nanotube arrays by thermal chemical vapor deposition:

碳纳米管阵列的生长在高温管式炉(有市售)中完成,所用方法为传统的热化学气相沉积法,且整个过程在常压下完成。首先将沉积有5纳米铁催化剂的硅晶片置入管式炉石英管内样品台上,封闭好石英管后,将铁催化剂在400sccm氢气、853K条件下热处理1小时;后在150sccm氨气、1023K条件下处理10分钟以提升催化剂活性;最后在87sccm乙炔、600sccm氢气、1023K 条件下生长碳纳米管阵列,生长时间为30分钟。 The growth of carbon nanotube arrays is completed in a high-temperature tube furnace (commercially available), the method used is the traditional thermal chemical vapor deposition method, and the whole process is completed under normal pressure. First, the silicon wafer deposited with 5 nanometer iron catalyst is placed on the sample stage in the quartz tube of the tube furnace, and after the quartz tube is sealed, the iron catalyst is heat-treated for 1 hour under 400 sccm hydrogen gas and 853K conditions; Down treatment for 10 minutes to improve catalyst activity; Finally, carbon nanotube arrays were grown under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, and the growth time was 30 minutes.

(4)低功率射频氢等离子体处理碳纳米管阵列: (4) Low-power RF hydrogen plasma treatment of carbon nanotube arrays:

氢等离子体处理碳纳米管阵列在射频装置(有市售)中完成,图3所示即为该装置的结构示意图。首先将所制备的碳纳米管阵列放置在石墨样品台上,对处理室预抽真空至约8×10-4Pa,然后在氢气(纯度为5N)氛围中对基底进行加热,升温速率约为60K/min,直到温度稳定在1000K为止,并调节气压为100Pa,待温度和气压均稳定后,启动射频源,调节射频功率为30W,处理时间为30小时。图4-43所示即为在本实施例所得的碳纳米颗粒包覆的碳纳米管阵列的扫描电镜图片,与图2所示原始碳纳米管相比,碳纳米管整体形貌变化不大,但表面被碳纳米颗粒所包覆,颗粒直径相比30W、10小时(图4-41)和30W、20小时(图4-42)处理后所得的碳纳米管均要小,大多在15-20纳米,且颗粒分界不清晰,但与原始碳纳米管的光滑表面(图2插图)截然不同,这些碳纳米突起均可能成为潜在的有效场发射点。 Hydrogen plasma treatment of carbon nanotube arrays is completed in a radio frequency device (commercially available), and Fig. 3 is a schematic diagram of the structure of the device. First place the prepared carbon nanotube array on the graphite sample stage, pre-evacuate the processing chamber to about 8×10 -4 Pa, and then heat the substrate in a hydrogen (purity 5N) atmosphere with a heating rate of about 60K/min until the temperature stabilizes at 1000K, and adjust the air pressure to 100Pa. After the temperature and air pressure are stable, start the RF source, adjust the RF power to 30W, and the processing time is 30 hours. Figure 4-43 is the scanning electron microscope picture of the carbon nanotube array coated with carbon nanoparticles obtained in this example. Compared with the original carbon nanotube shown in Figure 2, the overall shape of the carbon nanotube has little change , but the surface is covered by carbon nanoparticles, and the particle diameter is smaller than that obtained after 30W, 10 hours (Fig. 4-41) and 30W, 20 hours (Fig. 4-42), mostly at 15 -20 nm, and the particle boundary is not clear, but it is quite different from the smooth surface of pristine carbon nanotubes (Fig. 2 inset), these carbon nanoprotrusions may become potential effective field emission sites.

(5)场发射性能测试: (5) Field emission performance test:

碳纳米颗粒包覆的碳纳米管阵列的场发射性能测试在高真空场发射测试仪(有市售)中完成,图5所示即为该测试装置的结构示意图。测试室中真空度维持在约1×10-7Pa(用常开的钛离子泵抽真空)。将所制备的碳纳米颗粒包覆的碳纳米管阵列样品用导电胶粘附在铜样品台上,以此作为场发射阴极,并将阴极接地;阳极为一直径约为10厘米的不锈钢圆板,阴阳极保持平行,间距为2毫米;测试时,在阳极上负载0-10kV可调正偏压,偏压增速恒定为500V/min,测试结果通过程序自动记录到电脑中。从图6可以看出,30W下经氢等离子体处理30小时后所得的碳纳米颗粒包覆的碳纳米管阵列的开启场、阈值场和最大场发射电流密度分别为1.02 V/μm、1.59 V/μm和35.44 mA/cm2,要优于原始碳纳米管的1.24 V/μm、1.76 V/μm和21.90 mA/cm2。场发射性能的提升可归因于长时间低功率氢等离子体处理后碳纳米管表面有效场发射点的增多,大量的碳纳米颗粒均可成为有效场发射点,场发射电流密度相比原始碳纳米管仅有尖端发射电子无疑将大幅提升。 The field emission performance test of the carbon nanotube array coated with carbon nanoparticles is completed in a high vacuum field emission tester (commercially available), and Fig. 5 is a schematic structural diagram of the test device. The vacuum degree in the test chamber is maintained at about 1×10 -7 Pa (with a normally open titanium ion pump for vacuuming). The prepared carbon nanoparticle-coated carbon nanotube array sample is adhered on the copper sample stage with conductive glue, which is used as the field emission cathode, and the cathode is grounded; the anode is a stainless steel disc with a diameter of about 10 cm , the anode and cathode are kept parallel with a distance of 2 mm; during the test, an adjustable positive bias voltage of 0-10kV is loaded on the anode, and the bias voltage growth rate is constant at 500V/min. The test results are automatically recorded into the computer through the program. It can be seen from Figure 6 that the turn-on field, threshold field and maximum field emission current density of carbon nanoparticle-coated carbon nanotube arrays obtained after hydrogen plasma treatment at 30 W for 30 hours are 1.02 V/μm and 1.59 V, respectively. /μm and 35.44 mA/cm 2 , which are better than 1.24 V/μm, 1.76 V/μm and 21.90 mA/cm 2 of pristine carbon nanotubes. The improvement of field emission performance can be attributed to the increase of effective field emission sites on the surface of carbon nanotubes after long-term low-power hydrogen plasma treatment. A large number of carbon nanoparticles can become effective field emission sites. Compared with the original carbon Nanotubes with only tips emitting electrons will undoubtedly be greatly improved.

(6)场电子发射器组装(常规组装方法): (6) Field electron emitter assembly (conventional assembly method):

用导电胶将生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片粘附在厚度为2毫米的铜电极上,将其作为场发射阴极,并将阴极接地,阳极为一厚度为2毫米的铜板电极,阴阳极保持平行,用厚度为200微米的环装聚四氟乙烯隔开,负载正偏压在阳极板上,就可获得稳定的场电子发射,场发射电流密度大小的控制可通过调节阳极板偏压来实现。 A silicon single wafer with a carbon nanotube array coated with carbon nanoparticles is adhered to a copper electrode with a thickness of 2 mm by conductive glue, and it is used as a field emission cathode, and the cathode is grounded, and the anode is a thickness of 2 mm. mm copper plate electrodes, the anode and cathode are kept parallel, separated by a 200-micron ring-packed polytetrafluoroethylene, and the load is positively biased on the anode plate to obtain stable field electron emission and control the field emission current density This can be achieved by adjusting the anode plate bias.

实施例4 Example 4

(1)制备洁净硅晶片基底: (1) Preparation of clean silicon wafer substrate:

首先将硅片切成2cm×2cm小片,依次在去离子水、丙酮和无水乙醇中各超声(50W)清洗10分钟,再将硅晶片放入体积比为4%的氢氟酸中浸泡5分钟,获得干净无污染且无二氧化硅覆盖层的基底。 First, cut the silicon wafer into small pieces of 2cm×2cm, clean them with ultrasonic (50W) in deionized water, acetone and absolute ethanol for 10 minutes, and then put the silicon wafer into hydrofluoric acid with a volume ratio of 4% for 5 minutes. Minutes for clean, contamination-free substrates free of silica overlays.

(2)磁控溅射法沉积铁催化剂: (2) Deposition of iron catalyst by magnetron sputtering:

铁催化剂的沉积在磁控溅射装置(有市售)中进行。在此之前,先将硅单晶片在金属蒸汽真空弧离子源(MEVVA源,有市售)中进行载能铁离子轰击预处理,铁离子能量约为15keV,束流为10毫安,处理时间为15分钟,该处理可有效提升碳纳米管与硅基底间的结合力;然后将载能铁离子轰击过的硅晶片放置在样品台上,先对真空室抽真空至约8×10-5Pa,以排除杂质气体污染,然后通入高纯(5N)氩气,调节腔室气压为1.0Pa;沉积时,直流电源电流为60毫安,同时在样品台上加150伏负偏压,沉积时间为125秒,所获铁膜厚度为5纳米。 The deposition of the iron catalyst was carried out in a magnetron sputtering device (commercially available). Prior to this, the silicon single wafer was pretreated by bombardment with energetic iron ions in a metal vapor vacuum arc ion source (MEVVA source, commercially available). The iron ion energy was about 15keV, the beam current was 10 mA, and the processing time 15 minutes, this treatment can effectively improve the binding force between the carbon nanotubes and the silicon substrate; then place the silicon wafer bombarded by the energy-carrying iron ions on the sample stage, and first evacuate the vacuum chamber to about 8×10 -5 Pa, to eliminate impurity gas pollution, then pass high-purity (5N) argon gas, adjust the chamber pressure to 1.0Pa; during deposition, the DC power supply current is 60 mA, and a 150-volt negative bias is applied to the sample stage at the same time, The deposition time was 125 seconds, and the thickness of the obtained iron film was 5 nanometers.

(3)热化学气相沉积法制备碳纳米管阵列: (3) Preparation of carbon nanotube arrays by thermal chemical vapor deposition:

碳纳米管阵列的生长在高温管式炉(有市售)中完成,所用方法为传统的热化学气相沉积法,且整个过程在常压下完成。首先将沉积有5纳米铁催化剂的硅晶片置入管式炉石英管内样品台上,封闭好石英管后,将铁催化剂在400sccm氢气、853K条件下热处理1小时;后在150sccm氨气、1023K条件下处理10分钟以提升催化剂活性;最后在87sccm乙炔、600sccm氢气、1023K 条件下生长碳纳米管阵列,生长时间为30分钟。 The growth of carbon nanotube arrays is completed in a high-temperature tube furnace (commercially available), the method used is the traditional thermal chemical vapor deposition method, and the whole process is completed under normal pressure. First, the silicon wafer deposited with 5 nanometer iron catalyst is placed on the sample stage in the quartz tube of the tube furnace, and after the quartz tube is sealed, the iron catalyst is heat-treated for 1 hour under 400 sccm hydrogen gas and 853K conditions; Down treatment for 10 minutes to improve catalyst activity; Finally, carbon nanotube arrays were grown under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, and the growth time was 30 minutes.

(4)低功率射频氢等离子体处理碳纳米管阵列: (4) Low-power RF hydrogen plasma treatment of carbon nanotube arrays:

氢等离子体处理碳纳米管阵列在射频装置(有市售)中完成,图3所示即为该装置的结构示意图。首先将所制备的碳纳米管阵列放置在石墨样品台上,对处理室预抽真空至约8×10-4Pa,然后在氢气(纯度为5N)氛围中对基底进行加热,升温速率约为60K/min,直到温度稳定在1000K为止,并调节气压为100Pa,待温度和气压均稳定后,启动射频源,调节射频功率为40W,处理时间为10小时。 Hydrogen plasma treatment of carbon nanotube arrays is completed in a radio frequency device (commercially available), and Fig. 3 is a schematic diagram of the structure of the device. First place the prepared carbon nanotube array on the graphite sample stage, pre-evacuate the processing chamber to about 8×10 -4 Pa, and then heat the substrate in a hydrogen (purity 5N) atmosphere with a heating rate of about 60K/min, until the temperature stabilizes at 1000K, and adjust the air pressure to 100Pa. After the temperature and air pressure are stable, start the RF source, adjust the RF power to 40W, and the processing time is 10 hours.

(5)场发射性能测试: (5) Field emission performance test:

碳纳米颗粒包覆的碳纳米管阵列的场发射性能测试在高真空场发射测试仪(有市售)中完成,图5所示即为该测试装置的结构示意图。测试室中真空度维持在约1×10-7Pa(用常开的钛离子泵抽真空)。将所制备的碳纳米颗粒包覆的碳纳米管阵列样品用导电胶粘附在铜样品台上,以此作为场发射阴极,并将阴极接地;阳极为一直径约为10厘米的不锈钢圆板,阴阳极保持平行,间距为2毫米;测试时,在阳极上负载0-10kV可调正偏压,偏压增速恒定为500V/min,测试结果通过程序自动记录到电脑中。本实施例所得的碳纳米颗粒包覆的碳纳米管阵列的开启场、阈值场和最大场发射电流密度分别为1.04 V/μm、1.60 V/μm和36.12 mA/cm2,要优于原始碳纳米管的1.24 V/μm、1.76 V/μm和21.90 mA/cm2。场发射性能的提升可归因于长时间低功率氢等离子体处理后碳纳米管表面有效场发射点的增多,大量的碳纳米颗粒均可成为有效场发射点,场发射电流密度相比原始碳纳米管仅有尖端发射电子无疑将大幅提升。 The field emission performance test of the carbon nanotube array coated with carbon nanoparticles is completed in a high vacuum field emission tester (commercially available), and Fig. 5 is a schematic structural diagram of the test device. The vacuum degree in the test chamber is maintained at about 1×10 -7 Pa (with a normally open titanium ion pump for vacuuming). The prepared carbon nanoparticle-coated carbon nanotube array sample is adhered on the copper sample stage with conductive glue, which is used as the field emission cathode, and the cathode is grounded; the anode is a stainless steel disc with a diameter of about 10 cm , the anode and cathode are kept parallel with a distance of 2 mm; during the test, an adjustable positive bias voltage of 0-10kV is loaded on the anode, and the bias voltage growth rate is constant at 500V/min. The test results are automatically recorded into the computer through the program. The turn-on field, threshold field, and maximum field emission current density of the carbon nanoparticle-coated carbon nanotube array obtained in this example are 1.04 V/μm, 1.60 V/μm, and 36.12 mA/cm 2 , respectively, which are better than those of the pristine carbon 1.24 V/μm, 1.76 V/μm and 21.90 mA/cm 2 for nanotubes. The improvement of field emission performance can be attributed to the increase of effective field emission sites on the surface of carbon nanotubes after long-term low-power hydrogen plasma treatment. A large number of carbon nanoparticles can become effective field emission sites. Compared with the original carbon Nanotubes with only tips emitting electrons will undoubtedly be greatly improved.

(6)场电子发射器组装(常规组装方法): (6) Field electron emitter assembly (conventional assembly method):

用导电胶将生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片粘附在厚度为2毫米的铜电极上,将其作为场发射阴极,并将阴极接地,阳极为一厚度为2毫米的铜板电极,阴阳极保持平行,用厚度为200微米的环装聚四氟乙烯隔开,负载正偏压在阳极板上,就可获得稳定的场电子发射,场发射电流密度大小的控制可通过调节阳极板偏压来实现。 A silicon single wafer with a carbon nanotube array coated with carbon nanoparticles is adhered to a copper electrode with a thickness of 2 mm by conductive glue, and it is used as a field emission cathode, and the cathode is grounded, and the anode is a thickness of 2 mm. mm copper plate electrodes, the anode and cathode are kept parallel, separated by a 200-micron ring-packed polytetrafluoroethylene, and the load is positively biased on the anode plate to obtain stable field electron emission and control the field emission current density This can be achieved by adjusting the anode plate bias.

实施例5 Example 5

(1)制备洁净硅晶片基底: (1) Preparation of clean silicon wafer substrate:

首先将硅片切成2cm×2cm小片,依次在去离子水、丙酮和无水乙醇中各超声(50W)清洗10分钟,再将硅晶片放入体积比为4%的氢氟酸中浸泡5分钟,获得干净无污染且无二氧化硅覆盖层的基底。 First, cut the silicon wafer into small pieces of 2cm×2cm, clean them with ultrasonic (50W) in deionized water, acetone and absolute ethanol for 10 minutes, and then put the silicon wafer into hydrofluoric acid with a volume ratio of 4% for 5 minutes. Minutes for clean, contamination-free substrates free of silica overlays.

(2)磁控溅射法沉积铁催化剂: (2) Deposition of iron catalyst by magnetron sputtering:

铁催化剂的沉积在磁控溅射装置(有市售)中进行。在此之前,先将硅单晶片在金属蒸汽真空弧离子源(MEVVA源,有市售)中进行载能铁离子轰击预处理,铁离子能量约为15keV,束流为10毫安,处理时间为15分钟,该处理可有效提升碳纳米管与硅基底间的结合力;然后将载能铁离子轰击过的硅晶片放置在样品台上,先对真空室抽真空至约8×10-5Pa,以排除杂质气体污染,然后通入高纯(5N)氩气,调节腔室气压为1.0Pa;沉积时,直流电源电流为60毫安,同时在样品台上加150伏负偏压,沉积时间为125秒,所获铁膜厚度为5纳米。 The deposition of the iron catalyst was carried out in a magnetron sputtering device (commercially available). Prior to this, the silicon single wafer was pretreated by bombardment with energetic iron ions in a metal vapor vacuum arc ion source (MEVVA source, commercially available). The iron ion energy was about 15keV, the beam current was 10 mA, and the processing time 15 minutes, this treatment can effectively improve the binding force between the carbon nanotubes and the silicon substrate; then place the silicon wafer bombarded by the energy-carrying iron ions on the sample stage, and first evacuate the vacuum chamber to about 8×10 -5 Pa, to eliminate impurity gas pollution, then pass high-purity (5N) argon gas, adjust the chamber pressure to 1.0Pa; during deposition, the DC power supply current is 60 mA, and a 150-volt negative bias is applied to the sample stage at the same time, The deposition time was 125 seconds, and the thickness of the obtained iron film was 5 nanometers.

(3)热化学气相沉积法制备碳纳米管阵列: (3) Preparation of carbon nanotube arrays by thermal chemical vapor deposition:

碳纳米管阵列的生长在高温管式炉(有市售)中完成,所用方法为传统的热化学气相沉积法,且整个过程在常压下完成。首先将沉积有5纳米铁催化剂的硅晶片置入管式炉石英管内样品台上,封闭好石英管后,将铁催化剂在400sccm氢气、853K条件下热处理1小时;后在150sccm氨气、1023K条件下处理10分钟以提升催化剂活性;最后在87sccm乙炔、600sccm氢气、1023K 条件下生长碳纳米管阵列,生长时间为30分钟。 The growth of carbon nanotube arrays is completed in a high-temperature tube furnace (commercially available), the method used is the traditional thermal chemical vapor deposition method, and the whole process is completed under normal pressure. First, the silicon wafer deposited with 5 nanometer iron catalyst is placed on the sample stage in the quartz tube of the tube furnace, and after the quartz tube is sealed, the iron catalyst is heat-treated for 1 hour under 400 sccm hydrogen gas and 853K conditions; Down treatment for 10 minutes to improve catalyst activity; Finally, carbon nanotube arrays were grown under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, and the growth time was 30 minutes.

(4)低功率射频氢等离子体处理碳纳米管阵列: (4) Low-power RF hydrogen plasma treatment of carbon nanotube arrays:

氢等离子体处理碳纳米管阵列在射频装置(有市售)中完成,图3所示即为该装置的结构示意图。首先将所制备的碳纳米管阵列放置在石墨样品台上,对处理室预抽真空至约8×10-4Pa,然后在氢气(纯度为5N)氛围中对基底进行加热,升温速率约为60K/min,直到温度稳定在1000K为止,并调节气压为100Pa,待温度和气压均稳定后,启动射频源,调节射频功率为40W,处理时间为20小时。 Hydrogen plasma treatment of carbon nanotube arrays is completed in a radio frequency device (commercially available), and Fig. 3 is a schematic diagram of the structure of the device. First place the prepared carbon nanotube array on the graphite sample stage, pre-evacuate the processing chamber to about 8×10 -4 Pa, and then heat the substrate in a hydrogen (purity 5N) atmosphere with a heating rate of about 60K/min until the temperature stabilizes at 1000K, and adjust the air pressure to 100Pa. After the temperature and air pressure are stable, start the RF source, adjust the RF power to 40W, and the processing time is 20 hours.

(5)场发射性能测试: (5) Field emission performance test:

碳纳米颗粒包覆的碳纳米管阵列的场发射性能测试在高真空场发射测试仪(有市售)中完成,图5所示即为该测试装置的结构示意图。测试室中真空度维持在约1×10-7Pa(用常开的钛离子泵抽真空)。将所制备的碳纳米颗粒包覆的碳纳米管阵列样品用导电胶粘附在铜样品台上,以此作为场发射阴极,并将阴极接地;阳极为一直径约为10厘米的不锈钢圆板,阴阳极保持平行,间距为2毫米;测试时,在阳极上负载0-10kV可调正偏压,偏压增速恒定为500V/min,测试结果通过程序自动记录到电脑中。本实施例所得的碳纳米颗粒包覆的碳纳米管阵列的开启场、阈值场和最大场发射电流密度分别为0.96 V/μm、1.52 V/μm和41.48 mA/cm2,要优于原始碳纳米管的1.24 V/μm、1.76 V/μm和21.90 mA/cm2。场发射性能的提升可归因于长时间低功率氢等离子体处理后碳纳米管表面有效场发射点的增多,大量的碳纳米颗粒均可成为有效场发射点,场发射电流密度相比原始碳纳米管仅有尖端发射电子无疑将大幅提升。 The field emission performance test of the carbon nanotube array coated with carbon nanoparticles is completed in a high vacuum field emission tester (commercially available), and Fig. 5 is a schematic structural diagram of the test device. The vacuum degree in the test chamber is maintained at about 1×10 -7 Pa (with a normally open titanium ion pump for vacuuming). The prepared carbon nanoparticle-coated carbon nanotube array sample is adhered on the copper sample stage with conductive glue, which is used as the field emission cathode, and the cathode is grounded; the anode is a stainless steel disc with a diameter of about 10 cm , the anode and cathode are kept parallel with a distance of 2 mm; during the test, an adjustable positive bias voltage of 0-10kV is loaded on the anode, and the bias voltage growth rate is constant at 500V/min. The test results are automatically recorded into the computer through the program. The turn-on field, threshold field and maximum field emission current density of the carbon nanoparticle-coated carbon nanotube array obtained in this example are 0.96 V/μm, 1.52 V/μm and 41.48 mA/cm 2 , which are better than those of the original carbon 1.24 V/μm, 1.76 V/μm and 21.90 mA/cm 2 for nanotubes. The improvement of field emission performance can be attributed to the increase of effective field emission sites on the surface of carbon nanotubes after long-term low-power hydrogen plasma treatment. A large number of carbon nanoparticles can become effective field emission sites. Compared with the original carbon Nanotubes with only tips emitting electrons will undoubtedly be greatly improved.

(6)场电子发射器组装(常规组装方法): (6) Field electron emitter assembly (conventional assembly method):

用导电胶将生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片粘附在厚度为2毫米的铜电极上,将其作为场发射阴极,并将阴极接地,阳极为一厚度为2毫米的铜板电极,阴阳极保持平行,用厚度为200微米的环装聚四氟乙烯隔开,负载正偏压在阳极板上,就可获得稳定的场电子发射,场发射电流密度大小的控制可通过调节阳极板偏压来实现。 A silicon single wafer with a carbon nanotube array coated with carbon nanoparticles is adhered to a copper electrode with a thickness of 2 mm by conductive glue, and it is used as a field emission cathode, and the cathode is grounded, and the anode is a thickness of 2 mm. mm copper plate electrodes, the anode and cathode are kept parallel, separated by a 200-micron ring-packed polytetrafluoroethylene, and the load is positively biased on the anode plate to obtain stable field electron emission and control the field emission current density This can be achieved by adjusting the anode plate bias.

实施例6 Example 6

(1)制备洁净硅晶片基底: (1) Preparation of clean silicon wafer substrate:

首先将硅片切成2cm×2cm小片,依次在去离子水、丙酮和无水乙醇中各超声(50W)清洗10分钟,再将硅晶片放入体积比为4%的氢氟酸中浸泡5分钟,获得干净无污染且无二氧化硅覆盖层的基底。 First, cut the silicon wafer into small pieces of 2cm×2cm, clean them with ultrasonic (50W) in deionized water, acetone and absolute ethanol for 10 minutes, and then put the silicon wafer into hydrofluoric acid with a volume ratio of 4% for 5 minutes. Minutes for clean, contamination-free substrates free of silica overlays.

(2)磁控溅射法沉积铁催化剂: (2) Deposition of iron catalyst by magnetron sputtering:

铁催化剂的沉积在磁控溅射装置(有市售)中进行。在此之前,先将硅单晶片在金属蒸汽真空弧离子源(MEVVA源,有市售)中进行载能铁离子轰击预处理,铁离子能量约为15keV,束流为10毫安,处理时间为15分钟,该处理可有效提升碳纳米管与硅基底间的结合力;然后将载能铁离子轰击过的硅晶片放置在样品台上,先对真空室抽真空至约8×10-5Pa,以排除杂质气体污染,然后通入高纯(5N)氩气,调节腔室气压为1.0Pa;沉积时,直流电源电流为60毫安,同时在样品台上加150伏负偏压,沉积时间为125秒,所获铁膜厚度为5纳米。 The deposition of the iron catalyst was carried out in a magnetron sputtering device (commercially available). Prior to this, the silicon single wafer was pretreated by bombardment with energetic iron ions in a metal vapor vacuum arc ion source (MEVVA source, commercially available). The iron ion energy was about 15keV, the beam current was 10 mA, and the processing time 15 minutes, this treatment can effectively improve the binding force between the carbon nanotubes and the silicon substrate; then place the silicon wafer bombarded by the energy-carrying iron ions on the sample stage, and first evacuate the vacuum chamber to about 8×10 -5 Pa, to eliminate impurity gas pollution, then pass high-purity (5N) argon gas, adjust the chamber pressure to 1.0Pa; during deposition, the DC power supply current is 60 mA, and a 150-volt negative bias is applied to the sample stage at the same time, The deposition time was 125 seconds, and the thickness of the obtained iron film was 5 nanometers.

(3)热化学气相沉积法制备碳纳米管阵列: (3) Preparation of carbon nanotube arrays by thermal chemical vapor deposition:

碳纳米管阵列的生长在高温管式炉(有市售)中完成,所用方法为传统的热化学气相沉积法,且整个过程在常压下完成。首先将沉积有5纳米铁催化剂的硅晶片置入管式炉石英管内样品台上,封闭好石英管后,将铁催化剂在400sccm氢气、853K条件下热处理1小时;后在150sccm氨气、1023K条件下处理10分钟以提升催化剂活性;最后在87sccm乙炔、600sccm氢气、1023K 条件下生长碳纳米管阵列,生长时间为30分钟。 The growth of carbon nanotube arrays is completed in a high-temperature tube furnace (commercially available), the method used is the traditional thermal chemical vapor deposition method, and the whole process is completed under normal pressure. First, the silicon wafer deposited with 5 nanometer iron catalyst is placed on the sample stage in the quartz tube of the tube furnace, and after the quartz tube is sealed, the iron catalyst is heat-treated for 1 hour under 400 sccm hydrogen gas and 853K conditions; Down treatment for 10 minutes to improve catalyst activity; Finally, carbon nanotube arrays were grown under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, and the growth time was 30 minutes.

(4)低功率射频氢等离子体处理碳纳米管阵列: (4) Low-power RF hydrogen plasma treatment of carbon nanotube arrays:

氢等离子体处理碳纳米管阵列在射频装置(有市售)中完成,图3所示即为该装置的结构示意图。首先将所制备的碳纳米管阵列放置在石墨样品台上,对处理室预抽真空至约8×10-4Pa,然后在氢气(纯度为5N)氛围中对基底进行加热,升温速率约为60K/min,直到温度稳定在1000K为止,并调节气压为100Pa,待温度和气压均稳定后,启动射频源,调节射频功率为50W,处理时间为20小时。 Hydrogen plasma treatment of carbon nanotube arrays is completed in a radio frequency device (commercially available), and Fig. 3 is a schematic diagram of the structure of the device. First place the prepared carbon nanotube array on the graphite sample stage, pre-evacuate the processing chamber to about 8×10 -4 Pa, and then heat the substrate in a hydrogen (purity 5N) atmosphere with a heating rate of about 60K/min until the temperature stabilizes at 1000K, and adjust the air pressure to 100Pa. After the temperature and air pressure are stable, start the RF source, adjust the RF power to 50W, and the processing time is 20 hours.

(5)场发射性能测试: (5) Field emission performance test:

碳纳米颗粒包覆的碳纳米管阵列的场发射性能测试在高真空场发射测试仪(有市售)中完成,图5所示即为该测试装置的结构示意图。测试室中真空度维持在约1×10-7Pa(用常开的钛离子泵抽真空)。将所制备的碳纳米颗粒包覆的碳纳米管阵列样品用导电胶粘附在铜样品台上,以此作为场发射阴极,并将阴极接地;阳极为一直径约为10厘米的不锈钢圆板,阴阳极保持平行,间距为2毫米;测试时,在阳极上负载0-10kV可调正偏压,偏压增速恒定为500V/min,测试结果通过程序自动记录到电脑中。本实施例所得的碳纳米颗粒包覆的碳纳米管阵列的开启场、阈值场和最大场发射电流密度分别为0.98 V/μm、1.51 V/μm和40.57 mA/cm2,要优于原始碳纳米管的1.24 V/μm、1.76 V/μm和21.90 mA/cm2。场发射性能的提升可归因于长时间低功率氢等离子体处理后碳纳米管表面有效场发射点的增多,大量的碳纳米颗粒均可成为有效场发射点,场发射电流密度相比原始碳纳米管仅有尖端发射电子无疑将大幅提升。 The field emission performance test of the carbon nanotube array coated with carbon nanoparticles is completed in a high vacuum field emission tester (commercially available), and Fig. 5 is a schematic structural diagram of the test device. The vacuum degree in the test chamber is maintained at about 1×10 -7 Pa (with a normally open titanium ion pump for vacuuming). The prepared carbon nanoparticle-coated carbon nanotube array sample is adhered on the copper sample stage with conductive glue, which is used as the field emission cathode, and the cathode is grounded; the anode is a stainless steel disc with a diameter of about 10 cm , the anode and cathode are kept parallel with a distance of 2 mm; during the test, an adjustable positive bias voltage of 0-10kV is loaded on the anode, and the bias voltage growth rate is constant at 500V/min. The test results are automatically recorded into the computer through the program. The turn-on field, threshold field and maximum field emission current density of the carbon nanoparticle-coated carbon nanotube array obtained in this example are 0.98 V/μm, 1.51 V/μm and 40.57 mA/cm 2 , which are better than those of the original carbon 1.24 V/μm, 1.76 V/μm and 21.90 mA/cm 2 for nanotubes. The improvement of field emission performance can be attributed to the increase of effective field emission sites on the surface of carbon nanotubes after long-term low-power hydrogen plasma treatment. A large number of carbon nanoparticles can become effective field emission sites. Compared with the original carbon Nanotubes with only tips emitting electrons will undoubtedly be greatly improved.

(6)场电子发射器组装(常规组装方法): (6) Field electron emitter assembly (conventional assembly method):

用导电胶将生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片粘附在厚度为2毫米的铜电极上,将其作为场发射阴极,并将阴极接地,阳极为一厚度为2毫米的铜板电极,阴阳极保持平行,用厚度为200微米的环装聚四氟乙烯隔开,负载正偏压在阳极板上,就可获得稳定的场电子发射,场发射电流密度大小的控制可通过调节阳极板偏压来实现。 A silicon single wafer with a carbon nanotube array coated with carbon nanoparticles is adhered to a copper electrode with a thickness of 2 mm by conductive glue, and it is used as a field emission cathode, and the cathode is grounded, and the anode is a thickness of 2 mm. mm copper plate electrodes, the anode and cathode are kept parallel, separated by a 200-micron ring-packed polytetrafluoroethylene, and the load is positively biased on the anode plate to obtain stable field electron emission and control the field emission current density This can be achieved by adjusting the anode plate bias.

实施例7 Example 7

(1)制备洁净硅晶片基底: (1) Preparation of clean silicon wafer substrate:

首先将硅片切成2cm×2cm小片,依次在去离子水、丙酮和无水乙醇中各超声(50W)清洗10分钟,再将硅晶片放入体积比为4%的氢氟酸中浸泡5分钟,获得干净无污染且无二氧化硅覆盖层的基底。 First, cut the silicon wafer into small pieces of 2cm×2cm, clean them with ultrasonic (50W) in deionized water, acetone and absolute ethanol for 10 minutes, and then put the silicon wafer into hydrofluoric acid with a volume ratio of 4% for 5 minutes. Minutes for clean, contamination-free substrates free of silica overlays.

(2)磁控溅射法沉积铁催化剂: (2) Deposition of iron catalyst by magnetron sputtering:

铁催化剂的沉积在磁控溅射装置(有市售)中进行。在此之前,先将硅单晶片在金属蒸汽真空弧离子源(MEVVA源,有市售)中进行载能铁离子轰击预处理,铁离子能量约为15keV,束流为10毫安,处理时间为15分钟,该处理可有效提升碳纳米管与硅基底间的结合力;然后将载能铁离子轰击过的硅晶片放置在样品台上,先对真空室抽真空至约8×10-5Pa,以排除杂质气体污染,然后通入高纯(5N)氩气,调节腔室气压为1.0Pa;沉积时,直流电源电流为60毫安,同时在样品台上加150伏负偏压,沉积时间为125秒,所获铁膜厚度为5纳米。 The deposition of the iron catalyst was carried out in a magnetron sputtering device (commercially available). Prior to this, the silicon single wafer was pretreated by bombardment with energetic iron ions in a metal vapor vacuum arc ion source (MEVVA source, commercially available). The iron ion energy was about 15keV, the beam current was 10 mA, and the processing time 15 minutes, this treatment can effectively improve the binding force between the carbon nanotubes and the silicon substrate; then place the silicon wafer bombarded by the energy-carrying iron ions on the sample stage, and first evacuate the vacuum chamber to about 8×10 -5 Pa, to eliminate impurity gas pollution, then pass high-purity (5N) argon gas, adjust the chamber pressure to 1.0Pa; during deposition, the DC power supply current is 60 mA, and a 150-volt negative bias is applied to the sample stage at the same time, The deposition time was 125 seconds, and the thickness of the obtained iron film was 5 nanometers.

(3)热化学气相沉积法制备碳纳米管阵列: (3) Preparation of carbon nanotube arrays by thermal chemical vapor deposition:

碳纳米管阵列的生长在高温管式炉(有市售)中完成,所用方法为传统的热化学气相沉积法,且整个过程在常压下完成。首先将沉积有5纳米铁催化剂的硅晶片置入管式炉石英管内样品台上,封闭好石英管后,将铁催化剂在400sccm氢气、853K条件下热处理1小时;后在150sccm氨气、1023K条件下处理10分钟以提升催化剂活性;最后在87sccm乙炔、600sccm氢气、1023K 条件下生长碳纳米管阵列,生长时间为30分钟。 The growth of carbon nanotube arrays is completed in a high-temperature tube furnace (commercially available), the method used is the traditional thermal chemical vapor deposition method, and the whole process is completed under normal pressure. First, the silicon wafer deposited with 5 nanometer iron catalyst is placed on the sample stage in the quartz tube of the tube furnace, and after the quartz tube is sealed, the iron catalyst is heat-treated for 1 hour under 400 sccm hydrogen gas and 853K conditions; Down treatment for 10 minutes to improve catalyst activity; Finally, carbon nanotube arrays were grown under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, and the growth time was 30 minutes.

(4)低功率射频氢等离子体处理碳纳米管阵列: (4) Low-power RF hydrogen plasma treatment of carbon nanotube arrays:

氢等离子体处理碳纳米管阵列在射频装置(有市售)中完成,图3所示即为该装置的结构示意图。首先将所制备的碳纳米管阵列放置在石墨样品台上,对处理室预抽真空至约8×10-4Pa,然后在氢气(纯度为5N)氛围中对基底进行加热,升温速率约为60K/min,直到温度稳定在1000K为止,并调节气压为100Pa,待温度和气压均稳定后,启动射频源,调节射频功率为35W,处理时间为15小时。 Hydrogen plasma treatment of carbon nanotube arrays is completed in a radio frequency device (commercially available), and Fig. 3 is a schematic diagram of the structure of the device. First place the prepared carbon nanotube array on the graphite sample stage, pre-evacuate the processing chamber to about 8×10 -4 Pa, and then heat the substrate in a hydrogen (purity 5N) atmosphere with a heating rate of about 60K/min, until the temperature stabilizes at 1000K, and adjust the air pressure to 100Pa. After the temperature and air pressure are stable, start the RF source, adjust the RF power to 35W, and the processing time is 15 hours.

(5)场发射性能测试: (5) Field emission performance test:

碳纳米颗粒包覆的碳纳米管阵列的场发射性能测试在高真空场发射测试仪(有市售)中完成,图5所示即为该测试装置的结构示意图。测试室中真空度维持在约1×10-7Pa(用常开的钛离子泵抽真空)。将所制备的碳纳米颗粒包覆的碳纳米管阵列样品用导电胶粘附在铜样品台上,以此作为场发射阴极,并将阴极接地;阳极为一直径约为10厘米的不锈钢圆板,阴阳极保持平行,间距为2毫米;测试时,在阳极上负载0-10kV可调正偏压,偏压增速恒定为500V/min,测试结果通过程序自动记录到电脑中。本实施例所得的碳纳米颗粒包覆的碳纳米管阵列的开启场、阈值场和最大场发射电流密度分别为0.93 V/μm、1.46 V/μm和46.78 mA/cm2,要优于原始碳纳米管的1.24 V/μm、1.76 V/μm和21.90 mA/cm2。场发射性能的提升可归因于长时间低功率氢等离子体处理后碳纳米管表面有效场发射点的增多,大量的碳纳米颗粒均可成为有效场发射点,场发射电流密度相比原始碳纳米管仅有尖端发射电子无疑将大幅提升。 The field emission performance test of the carbon nanotube array coated with carbon nanoparticles is completed in a high vacuum field emission tester (commercially available), and Fig. 5 is a schematic structural diagram of the test device. The vacuum degree in the test chamber is maintained at about 1×10 -7 Pa (with a normally open titanium ion pump for vacuuming). The prepared carbon nanoparticle-coated carbon nanotube array sample is adhered on the copper sample stage with conductive glue, which is used as the field emission cathode, and the cathode is grounded; the anode is a stainless steel disc with a diameter of about 10 cm , the anode and cathode are kept parallel with a distance of 2 mm; during the test, an adjustable positive bias voltage of 0-10kV is loaded on the anode, and the bias voltage growth rate is constant at 500V/min. The test results are automatically recorded into the computer through the program. The turn-on field, threshold field and maximum field emission current density of the carbon nanoparticle-coated carbon nanotube array obtained in this example are 0.93 V/μm, 1.46 V/μm and 46.78 mA/cm 2 , which are better than those of the pristine carbon 1.24 V/μm, 1.76 V/μm and 21.90 mA/cm 2 for nanotubes. The improvement of field emission performance can be attributed to the increase of effective field emission sites on the surface of carbon nanotubes after long-term low-power hydrogen plasma treatment. A large number of carbon nanoparticles can become effective field emission sites. Compared with the original carbon Nanotubes with only tips emitting electrons will undoubtedly be greatly improved.

(6)场电子发射器组装(常规组装方法): (6) Field electron emitter assembly (conventional assembly method):

用导电胶将生长有碳纳米颗粒包覆的碳纳米管阵列的硅单晶片粘附在厚度为2毫米的铜电极上,将其作为场发射阴极,并将阴极接地,阳极为一厚度为2毫米的铜板电极,阴阳极保持平行,用厚度为200微米的环装聚四氟乙烯隔开,负载正偏压在阳极板上,就可获得稳定的场电子发射,场发射电流密度大小的控制可通过调节阳极板偏压来实现。 A silicon single wafer with a carbon nanotube array coated with carbon nanoparticles is adhered to a copper electrode with a thickness of 2 mm by conductive glue, and it is used as a field emission cathode, and the cathode is grounded, and the anode is a thickness of 2 mm. mm copper plate electrodes, the anode and cathode are kept parallel, separated by a 200-micron ring-packed polytetrafluoroethylene, and the load is positively biased on the anode plate to obtain stable field electron emission and control the field emission current density This can be achieved by adjusting the anode plate bias.

最后需说明的是,以上仅列举了本发明的典型实施例。但显然本发明并不限于上述实施例,还有许多其它的实验参数组合方法,本研究领域内的普通技术人员可从本发明公开的内容中直接导出或联想到的所有情形,均应当认为是本发明的保护范围。 Finally, it should be noted that the above only exemplifies typical embodiments of the present invention. But obviously the present invention is not limited to above-mentioned embodiment, also has many other experimental parameter combination methods, all situations that those of ordinary skill in this research field can directly derive or associate from the content disclosed by the present invention, all should be considered as protection scope of the present invention.

Claims (4)

1.一种碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法,其特征在于利用射频技术产生氢等离子体来处理热化学气相沉积法制备的碳纳米管阵列,调整射频功率为30-50W、基底温度为1000K、反应室气压为100Pa、处理时间为10-30小时,最终获得不同形貌的碳纳米颗粒包覆的碳纳米管阵列场发射阴极材料;所述的碳纳米颗粒指的是直径一般为15-30纳米的颗粒。 1. A preparation method of a carbon nanotube array field emission cathode coated with carbon nanoparticles, characterized in that the carbon nanotube array prepared by the thermal chemical vapor deposition method is processed by utilizing radio frequency technology to generate hydrogen plasma, and the radio frequency power is adjusted to be 30 -50W, substrate temperature of 1000K, reaction chamber pressure of 100Pa, and treatment time of 10-30 hours, and finally obtain carbon nanotube array field emission cathode materials coated with carbon nanoparticles of different shapes; the carbon nanoparticles refer to These are particles typically 15-30 nm in diameter. 2.权利要求1所述的碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法,其特征是:所述的碳纳米管阵列可以用传统的热化学气相沉积法制备,也可用其它任意的可制备阵列碳纳米管的方法来制备。 2. The preparation method of the carbon nanotube array field emission cathode coated by carbon nanoparticles as claimed in claim 1 is characterized in that: the described carbon nanotube array can be prepared by traditional thermal chemical vapor deposition, and can also be prepared by other methods. It can be prepared by any method that can prepare arrayed carbon nanotubes. 3.权利要求1所述的碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法,其特征是:用于产生氢等离子体的装置可以是低功率的射频源,也可以是其它任意的可产生低功率密度氢等离子体的装置。 3. The preparation method of the carbon nanotube array field emission cathode coated by carbon nanoparticles as claimed in claim 1 is characterized in that: the device for generating hydrogen plasma can be a low-power radio frequency source, or any other A device that can generate low power density hydrogen plasma. 4.权利要求1 所述的碳纳米颗粒包覆的碳纳米管阵列场发射阴极的制备方法,其特征在于按如下步骤进行: 4. the preparation method of the carbon nanotube array field emission cathode of carbon nanoparticle coating described in claim 1 is characterized in that carrying out as follows: (1)将硅单晶片依次在去离子水、丙酮和无水乙醇中各超声清洗10分钟,超声功率为50W; (1) Ultrasonic clean the silicon single wafer in deionized water, acetone and absolute ethanol for 10 minutes respectively, and the ultrasonic power is 50W; (2)将步骤(1)得到的硅晶片置入到体积比为4%的氢氟酸中浸泡5分钟; (2) Put the silicon wafer obtained in step (1) into hydrofluoric acid with a volume ratio of 4% and soak for 5 minutes; (3)对步骤(2)得到的硅晶片在金属蒸汽真空弧离子源(MEVVA源)中进行载能铁离子轰击预处理,轰击时铁离子能量约为15keV,束流为10毫安,处理时间为15分钟; (3) The silicon wafer obtained in step (2) is subjected to energy-carrying iron ion bombardment pretreatment in a metal vapor vacuum arc ion source (MEVVA source). The time is 15 minutes; (4)将步骤(3)得到的载能铁离子轰击过的硅晶片置入磁控溅射装置中沉积厚度为5纳米的铁催化剂; (4) placing the silicon wafer bombarded with energy-carrying iron ions obtained in step (3) into a magnetron sputtering device to deposit an iron catalyst with a thickness of 5 nanometers; (5)将步骤(4)得到的沉积有5纳米铁催化剂的硅片放入高温石英管式炉中,先将催化剂在400sccm氢气、853K条件下热处理1小时,后在150sccm氨气、1023K条件下处理10分钟,最后在87sccm乙炔、600sccm氢气、1023K 条件下常压生长碳纳米管阵列,生长时间为30分钟; (5) Put the silicon wafer deposited with the 5nm iron catalyst obtained in step (4) into a high-temperature quartz tube furnace, first heat-treat the catalyst under the conditions of 400sccm hydrogen and 853K for 1 hour, and then heat-treat the catalyst under the conditions of 150sccm ammonia and 1023K. Under low temperature treatment for 10 minutes, and finally under the conditions of 87sccm acetylene, 600sccm hydrogen, and 1023K, the carbon nanotube array was grown under normal pressure, and the growth time was 30 minutes; (6)将步骤(5)得到的碳纳米管阵列放入射频装置的处理室中,通入高纯氢气(5N),调节反应室气压为100Pa,并对基底加热至1000K,等待气压和温度稳定; (6) Put the carbon nanotube array obtained in step (5) into the processing chamber of the radio frequency device, feed high-purity hydrogen (5N), adjust the pressure of the reaction chamber to 100Pa, and heat the substrate to 1000K, wait for the pressure and temperature Stablize; (7)在步骤(6)的基础上启动射频源,调节射频功率为30-50W,开始处理碳纳米管阵列,处理时间为10-30小时,最终所得即为碳纳米颗粒包覆的碳纳米管阵列,并将其作为场发射阴极材料按常规方法组装场电子发射器件。 (7) Start the radio frequency source on the basis of step (6), adjust the radio frequency power to 30-50W, and start processing the carbon nanotube array. The processing time is 10-30 hours, and the final result is carbon nanoparticle-coated carbon nanotubes. tube array, and use it as a field emission cathode material to assemble field electron emission devices by conventional methods.
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CN105244249A (en) * 2015-10-20 2016-01-13 天津师范大学 Graphene sheet-carbon nanotube film flexible composite material, preparation method and application thereof
CN108987215A (en) * 2018-01-31 2018-12-11 天津师范大学 A method of promoting graphene film-carbon nano-tube array composite material field emission performance
CN112242279A (en) * 2019-07-16 2021-01-19 清华大学 Carbon nanotube field emitter and preparation method thereof
CN113336220A (en) * 2021-06-28 2021-09-03 西南石油大学 Preparation method of carbon quantum dot-carbon nanotube composite material with high adsorption performance
CN113336220B (en) * 2021-06-28 2022-03-22 西南石油大学 A kind of preparation method of carbon quantum dot-carbon nanotube composite material with high adsorption performance

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